CN210053641U - Novel communication high-density single-sided circuit board with mounting structure - Google Patents
Novel communication high-density single-sided circuit board with mounting structure Download PDFInfo
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- CN210053641U CN210053641U CN201920467145.0U CN201920467145U CN210053641U CN 210053641 U CN210053641 U CN 210053641U CN 201920467145 U CN201920467145 U CN 201920467145U CN 210053641 U CN210053641 U CN 210053641U
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- circuit board
- board body
- mounting
- fixed
- plate
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Abstract
The utility model discloses a novel communication high density single face circuit board with mounting structure, including circuit board body, mounting plate and spacing fixed subassembly, the surface of circuit board body is provided with wiring layer, and the both sides of circuit board body are fixed with the concatenation subassembly, mounting plate sets up in the below of circuit board body, spacing fixed unit mount is in the both sides of mounting plate, circuit board body inboard is including the copper foil, and the below of copper foil is provided with the buffer layer, the internally mounted of buffer layer has buffer spring, and the below of buffer layer is fixed with the insulation board, the below of insulation board is fixed with the base plate. This novel communication high density single face circuit board with mounting structure is provided with the density that the base plate of honeycomb structure can the reinforcing circuit board body, improves the compressive capacity of circuit board body, and the inside buffer spring of buffer layer can play the absorbing effect of buffering to improve the antidetonation degree of circuit board body.
Description
Technical Field
The utility model relates to a single face circuit board technical field specifically is a novel communication high density single face circuit board with mounting structure.
Background
In the most basic PCB, the components are concentrated on one side and the conductors are concentrated on the other side, so we call this PCB a single-sided board because the conductors are present on only one side. Single-sided circuit boards are used in many cases in household electrical appliances such as radios and washing machines, and in commercial machines such as vending machines and electronic components. With the rapid development of the electronic industry and the low price of the single-sided circuit board, the single-sided printed circuit board production enterprises can be rapidly expanded.
The existing single-sided circuit board is poor in general structural strength, does not have an anti-seismic and anti-compression assembly, is inconvenient to install, is easy to separate from an installation mechanism, and is not convenient for mutual splicing and assembling, so that a novel communication high-density single-sided circuit board with an installation structure is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a novel communication high density single face circuit board with mounting structure to the general structural strength of single face circuit board that proposes in solving above-mentioned background art is relatively poor, does not possess antidetonation resistance to compression subassembly, and installs inconveniently, breaks away from installation mechanism easily, the problem of the mutual concatenation equipment of also being convenient for.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a novel communication high density single face circuit board with mounting structure, includes circuit board body, mounting plate and spacing fixed subassembly, the surface of circuit board body is provided with wiring layer, and the both sides of circuit board body are fixed with the concatenation subassembly, mounting plate sets up in the below of circuit board body, spacing fixed subassembly is installed in the both sides of mounting plate, circuit board body inboard is including the copper foil, and the below of copper foil is provided with the buffer layer, the internally mounted of buffer layer has buffer spring, and the below of buffer layer is fixed with the insulation board, the below of insulation board is fixed with the base plate, the inside of mounting plate is provided with the mounting groove, and the thermovent has been seted up to the bottom surface of mounting groove.
Preferably, the splicing assembly comprises a clamping plate, an expansion spring and a clamping groove, the clamping plate is fixed on one side of the circuit board body, the expansion spring is fixed on the upper side and the lower side of the clamping plate, and the clamping groove is installed on the other side of the circuit board body.
Preferably, the telescopic springs are symmetrical about the transverse center line of the clamping plate, the top end of the clamping plate is of a trapezoidal structure, and a clamping structure is formed between the clamping plate and the clamping groove.
Preferably, spacing fixed subassembly is including loose axle, movable rod, constant head tank and insulating liner, mounting plate's both sides are provided with the loose axle, and the top inboard of loose axle installs the movable rod, mounting plate's inside both sides are provided with the constant head tank, the bottom surface of circuit board body is fixed with insulating liner.
Preferably, the movable rod forms a rotating structure through the movable shaft, and the movable rod and the movable shaft are symmetrical about a vertical center line of the mounting base plate.
Preferably, the insulating pads are uniformly distributed in a symmetrical manner about the central line of the circuit board body, and the sizes of the insulating pads and the positioning grooves are matched.
Compared with the prior art, the beneficial effects of the utility model are that: the novel communication high-density single-sided circuit board with the mounting structure is provided with the substrate with the honeycomb structure, so that the density of the circuit board body can be enhanced, the compression resistance of the circuit board body is improved, the buffer spring in the buffer layer can play a role in buffering and damping, the shock resistance degree of the circuit board body is improved, the insulation board can play a role in insulation protection, the mounting groove is convenient for mounting the circuit board body, and the heat dissipation port on the bottom surface can effectively dissipate heat of the circuit board body;
the sizes of the insulating liner and the positioning groove are matched, so that the insulating liner is clamped into the positioning groove to achieve smooth installation of the circuit board body, the movable shaft is convenient for rotating the movable rod to adjust the position of the movable rod, the movable rod is located above the circuit board body, the movable rod limits the circuit board body installed inside the installation bottom plate, and the circuit board body is prevented from falling out of an installation groove in the installation bottom plate;
the splicing assembly can be used when being convenient for splicing among the multi-group circuit board bodies, the top end of the clamping plate is of a trapezoidal structure, so that the top end of the clamping plate can be inserted into the clamping groove, splicing between the two groups of circuit board bodies is realized through mutual matching between the clamping plate and the clamping groove, and the splicing structure of the splicing assembly is more compact due to the fact that the telescopic springs on the two sides extrude the inner wall of the clamping groove in an elastic mode through the telescopic springs on the two sides in a symmetrical mode between the telescopic springs.
Drawings
Fig. 1 is a schematic top view of the present invention;
FIG. 2 is a schematic side view of the cross-sectional structure of the present invention;
FIG. 3 is a schematic view of the splicing structure of the splicing assembly of the present invention;
fig. 4 is a schematic top view of the mounting base plate of the present invention;
fig. 5 is a schematic view of the bottom structure of the circuit board body of the present invention.
In the figure: 1. a circuit board body; 2. a wiring layer; 3. splicing the components; 301. clamping a plate; 302. a tension spring; 303. a card slot; 4. mounting a bottom plate; 5. a limiting and fixing component; 501. a movable shaft; 502. a movable rod; 503. positioning a groove; 504. an insulating spacer; 6. copper foil; 7. a buffer layer; 8. a buffer spring; 9. an insulating plate; 10. a substrate; 11. mounting grooves; 12. and a heat dissipation port.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: a novel communication high-density single-sided circuit board with a mounting structure comprises a circuit board body 1, wiring layers 2, splicing assemblies 3, a clamping plate 301, an expansion spring 302, a clamping groove 303, a mounting bottom plate 4, a limiting fixing assembly 5, a movable shaft 501, a movable rod 502, a positioning groove 503, an insulating gasket 504, a copper foil 6, a buffer layer 7, a buffer spring 8, an insulating plate 9, a substrate 10, a mounting groove 11 and a heat dissipation opening 12, wherein the wiring layers 2 are arranged on the surface of the circuit board body 1, and the splicing assemblies 3 are fixed on two sides of the circuit board body 1;
the splicing component 3 comprises a clamping plate 301, a telescopic spring 302 and a clamping groove 303, the clamping plate 301 is fixed on one side of the circuit board body 1, and the upper and lower sides of the snap-gauge 301 are both fixed with a telescopic spring 302, the other side of the circuit board body 1 is provided with a snap-in groove 303, the telescopic springs 302 are symmetrical with respect to the transverse central line of the snap-gauge 301, the top end of the snap-gauge 301 is in a trapezoidal structure, and a clamping structure is formed between the clamping plate 301 and the clamping groove 303, the telescopic springs 302 are symmetrical about the transverse center line of the clamping plate 301, so that the splicing structure of the splicing component 3 is more compact by elastically extruding the inner walls of the clamping groove 303 through the telescopic springs 302 at two sides, the top end of the clamping plate 301 is in a trapezoidal structure so as to insert the top end of the clamping plate 301 into the clamping groove 303, the clamping structure formed between the clamping plate 301 and the clamping groove 303 can realize the splicing of the two groups of circuit board bodies 1 through the mutual matching between the clamping plate 301 and the clamping groove 303;
the mounting bottom plate 4 is arranged below the circuit board body 1, the limiting fixing assemblies 5 are mounted on two sides of the mounting bottom plate 4, each limiting fixing assembly 5 comprises a movable shaft 501, a movable rod 502, a positioning groove 503 and an insulating gasket 504, the movable shafts 501 are arranged on two sides of the mounting bottom plate 4, the movable rods 502 are mounted on the inner sides above the movable shafts 501, the positioning grooves 503 are arranged on two sides inside the mounting bottom plate 4, and the insulating gaskets 504 are fixed on the bottom surface of the circuit board body 1;
the movable rod 502 forms a rotating structure through the movable shaft 501, the movable rod 502 and the movable shaft 501 are symmetrical about a vertical center line of the installation bottom plate 4, the movable rod 502 forms a rotating structure through the movable shaft 501, so that the movable rod 502 can be rotated through the movable shaft 501 to adjust the position of the movable rod 502, the movable rod 502 can limit the circuit board body 1 installed inside the installation bottom plate 4, the movable rod 502 and the movable shaft 501 are symmetrical about the vertical center line of the installation bottom plate 4, so that two sides of the circuit board body 1 inside the installation bottom plate 4 can be uniformly limited, and the circuit board body 1 is prevented from falling out of the installation groove 11 inside the installation bottom plate 4;
the insulating pads 504 are symmetrically and uniformly distributed about the central line of the circuit board body 1, the insulating pads 504 are matched with the positioning grooves 503 in size, the insulating pads 504 are symmetrically and uniformly distributed about the central line of the circuit board body 1, so that the insulating pads 504 on the bottom surface of the circuit board body 1 can be uniformly distributed, the circuit board body 1 can be uniformly fixed by the insulating pads 504 and the positioning grooves 503, and the insulating pads 504 are matched with the positioning grooves 503 in size, so that the insulating pads 504 are clamped in the positioning grooves 503 to smoothly mount the circuit board body 1;
the inboard of circuit board body 1 is including copper foil 6, and the below of copper foil 6 is provided with buffer layer 7, and the internally mounted of buffer layer 7 has buffer spring 8, and the below of buffer layer 7 is fixed with insulation board 9, and the below of insulation board 9 is fixed with base plate 10, and the inside of mounting plate 4 is provided with mounting groove 11, and the thermovent 12 has been seted up to the bottom surface of mounting groove 11.
The working principle is as follows: for the novel communication high-density single-sided circuit board with the mounting structure, firstly, the circuit board body 1 can be mounted in the mounting groove 11 in the mounting base plate 4, the insulating gasket 504 on the bottom surface of the circuit board body 1 is aligned to the position of the positioning groove 503 in the mounting groove 11, then the insulating gasket 504 is clamped in the positioning groove 503 to realize the smooth mounting of the circuit board body 1, and then the movable rod 502 is rotated by the movable shaft 501 to enable the movable rod 502 to be positioned above the circuit board body 1, so that the movable rod 502 limits the circuit board body 1 mounted in the mounting base plate 4, and the circuit board body 1 is prevented from falling out of the mounting groove 11 in the mounting base plate 4;
when a plurality of groups of circuit board bodies 1 need to be spliced, the splicing assembly 3 can be used for splicing, firstly, the clamping plate 301 fixed on one side of one circuit board body 1 is embedded into the clamping groove 303 arranged on the other side of the other circuit board body 1, the top end of the clamping plate 301 is in a trapezoidal structure, so that the top end of the clamping plate 301 is inserted into the clamping groove 303, the telescopic springs 302 on the two sides of the clamping plate 301 elastically extrude the inner wall of the clamping groove 303, and the splicing between the two groups of circuit board bodies 1 is realized through the mutual matching between the clamping plate 301 and the clamping groove 303;
in the use process, the wiring layer 2 that the copper foil 6 surface was provided with in the wire is used for the conduction of circuit, the inside buffer spring 8 of buffer layer 7 can play buffering absorbing effect, thereby improve circuit board body 1's antidetonation degree, insulation board 9 can play insulation protection's effect, base plate 10 is cellular structure can strengthen circuit board body 1's density, improve circuit board body 1's compressive capacity, and the thermovent 12 of mounting groove 11 bottom surface can effectively dispel the heat to circuit board body 1, just so accomplish the use of whole novel communication high density single face circuit board that has mounting structure.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a novel communication high density single face circuit board with mounting structure, includes circuit board body (1), mounting plate (4) and spacing fixed subassembly (5), its characterized in that: the surface of circuit board body (1) is provided with wiring layer (2), and the both sides of circuit board body (1) are fixed with concatenation subassembly (3), mounting plate (4) set up in the below of circuit board body (1), install in the both sides of mounting plate (4) spacing fixed subassembly (5), circuit board body (1) inboard is including copper foil (6), and the below of copper foil (6) is provided with buffer layer (7), the internally mounted of buffer layer (7) has buffer spring (8), and the below of buffer layer (7) is fixed with insulation board (9), the below of insulation board (9) is fixed with base plate (10), the inside of mounting plate (4) is provided with mounting groove (11), and thermovent (12) have been seted up to the bottom surface of mounting groove (11).
2. The novel communication high-density single-sided circuit board with the mounting structure of claim 1, wherein: splicing assembly (3) are including cardboard (301), expanding spring (302) and draw-in groove (303), one side of circuit board body (1) is fixed with cardboard (301), and the upper and lower both sides of cardboard (301) all are fixed with expanding spring (302), draw-in groove (303) are installed to the opposite side of circuit board body (1).
3. The novel communication high-density single-sided circuit board with the mounting structure of claim 2, wherein: the telescopic springs (302) are symmetrical about the transverse center line of the clamping plate (301), the top end of the clamping plate (301) is of a trapezoidal structure, and a clamping structure is formed between the clamping plate (301) and the clamping groove (303).
4. The novel communication high-density single-sided circuit board with the mounting structure of claim 1, wherein: spacing fixed subassembly (5) are including loose axle (501), movable rod (502), constant head tank (503) and insulating liner (504), the both sides of mounting plate (4) are provided with loose axle (501), and the top inboard of loose axle (501) installs movable rod (502), the inside both sides of mounting plate (4) are provided with constant head tank (503), the bottom surface of circuit board body (1) is fixed with insulating liner (504).
5. The novel communication high-density single-sided circuit board with the mounting structure as claimed in claim 4, wherein: the movable rod (502) forms a rotating structure through the movable shaft (501), and the movable rod (502) and the movable shaft (501) are symmetrical relative to the vertical center line of the installation bottom plate (4).
6. The novel communication high-density single-sided circuit board with the mounting structure as claimed in claim 4, wherein: the insulating pads (504) are uniformly distributed in a symmetrical mode about the center line of the circuit board body (1), and the sizes of the insulating pads (504) and the positioning grooves (503) are matched.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920467145.0U CN210053641U (en) | 2019-04-09 | 2019-04-09 | Novel communication high-density single-sided circuit board with mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920467145.0U CN210053641U (en) | 2019-04-09 | 2019-04-09 | Novel communication high-density single-sided circuit board with mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210053641U true CN210053641U (en) | 2020-02-11 |
Family
ID=69379263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920467145.0U Expired - Fee Related CN210053641U (en) | 2019-04-09 | 2019-04-09 | Novel communication high-density single-sided circuit board with mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210053641U (en) |
-
2019
- 2019-04-09 CN CN201920467145.0U patent/CN210053641U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200211 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |