CN216852486U

CN216852486U - High-frequency high-density interconnection multilayer circuit board

Info

Publication number: CN216852486U
Application number: CN202122370622.1U
Authority: CN
Inventors: 张志强; 赵俊; 王东府
Original assignee: Shenzhen Jinshengda Electronics & Technology Co ltd
Current assignee: Shenzhen Jinshengda Electronics & Technology Co ltd
Priority date: 2021-09-28
Filing date: 2021-09-28
Publication date: 2022-06-28
Anticipated expiration: 2031-09-28

Abstract

The utility model discloses a high-frequency high-density interconnection multilayer circuit board, which belongs to the technical field of circuit boards and comprises a mainboard, radiating holes, a radiating fin mounting rack and radiating fins, wherein the radiating holes are arranged at the upper end and the lower end of one side of the mainboard and are positioned at the two ends of the top and the bottom of the radiating fin mounting rack; the radiating fin mounting rack is positioned in the center of one side of the main board; the radiating fins are positioned inside the radiating fin mounting frame, and grooves are formed in the periphery of the other side of the main board; the main board, the heat dissipation holes, the heat dissipation plate mounting rack, the heat dissipation plates and other components are arranged, so that a high-strength heat dissipation effect is achieved on the multilayer circuit board, the service life of the multilayer circuit board is prolonged, and loss is reduced; through setting up parts such as dust guard, installation pole, fixed block, spout, cross ditch piece, fixture block, draw-in groove and dust screen to play dirt-proof effect to the mainboard, and also play the effect that the dismouting of being convenient for was changed to the dust screen.

Description

High-frequency high-density interconnection multilayer circuit board

Technical Field

The utility model relates to a circuit board technical field specifically is a high frequency high density interconnection multilayer circuit board.

Background

Along with the continuous development of the electronic equipment industry, the circuit board manufacturing technology is also greatly improved, the circuit board can be miniaturized and visualized more by using the circuit board, the circuit board plays a key role in the layout of an electric appliance, and along with the wide application of the circuit board, the circuit board can be divided into ceramic circuit boards, alumina ceramic circuit boards, printed circuit boards and the like.

At present, because of long-time use, the existing high-frequency high-density interconnection multilayer circuit board is easy to generate high temperature, so that the high-frequency high-density interconnection multilayer circuit board is directly damaged, and the economic loss is increased; and the common multilayer circuit board has poor dustproof effect, so that the multilayer circuit board is easy to cause short circuit and economic loss.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high frequency high density interconnection multilayer circuit board is through setting up parts such as mainboard, louvre, fin mounting bracket and fin to play the radiating effect of high strength to the multilayer circuit board, and then prolong the life of multilayer circuit board, reduce the loss, with the problem of proposing in solving above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a high-frequency high-density interconnection multilayer circuit board comprises a main board, radiating holes, a radiating fin mounting rack and radiating fins, wherein the radiating holes are formed in the upper end and the lower end of one side of the main board and are positioned at the two ends of the top and the bottom of the radiating fin mounting rack; the radiating fin mounting rack is positioned in the center of one side of the main board; the cooling fin is located the inside of cooling fin mounting bracket, the opposite side of mainboard is equipped with the recess all around, the inside fixed block of pegging graft of recess, the top fixed mounting of fixed block has the installation pole, the top fixed mounting of installation pole has the dust guard.

Preferably, the top center of dust guard is equipped with the mounting groove, the inside both sides of mounting groove are equipped with the spout.

Preferably, the inside sliding connection cross type ditch piece of spout, the bottom fixed mounting of cross type ditch piece has the fixture block.

Preferably, the clamping block is clamped with a clamping groove matched with the clamping block, the clamping groove is located at the bottom in the sliding groove, and a dust screen is fixedly connected to one side of the cross-shaped groove block.

Preferably, the upper end and the lower end of the heat dissipation hole are provided with jacks, and the jacks are internally inserted with insertion blocks matched with the jacks.

Preferably, the top of the inserting block is fixedly provided with an installing block, and the top of the installing block is fixedly provided with a fixing rod.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model is provided with the mainboard, the heat dissipation holes, the heat dissipation fin mounting rack, the heat dissipation fins and other parts, and the heat dissipation holes are arranged at the upper end and the lower end of one side of the mainboard, thereby playing a role of auxiliary heat dissipation for the mainboard; the radiating fin mounting rack is arranged between the radiating holes, so that the radiating fins in the radiating fin mounting rack are mounted and supported by the radiating fin mounting rack; the radiating fins are arranged, so that high-strength heat radiation is performed on the multilayer circuit board, the service life of the circuit board is prolonged, and economic loss is reduced;

the utility model is provided with the dustproof plate, the installation rod, the fixed block, the sliding groove, the cross-shaped groove block, the fixture block, the clamping groove, the dustproof net and other parts, and the dustproof plate is arranged, thereby playing the role of installation and support for the dustproof net on the dustproof plate; the installation rod is fixedly installed on the periphery of one side of the dustproof plate, so that the installation rod plays a role in installing and supporting the dustproof plate; through the arrangement of the fixing block, the dust-proof plate is conveniently fixed on the groove matched with the main board; the sliding grooves are formed in the two ends of the top of the dustproof plate, so that the dustproof net is convenient to mount; the cross-shaped groove block is connected in the sliding groove in a sliding manner, so that the cross-shaped groove block can move in the sliding groove, and the dust screen on the sliding groove can be conveniently installed, detached and replaced; through fixture block and draw-in groove joint to be convenient for fix the dust screen, and also be convenient for dismantle the change to the dust screen.

Drawings

FIG. 1 is a schematic view of the structure of the multi-layer circuit board of the present invention;

FIG. 2 is a schematic view of the structure of the dust-proof board of the present invention;

FIG. 3 is an enlarged view of the structure at A in FIG. 2;

fig. 4 is a schematic view of the structure of the fixing rod of the present invention.

In the figure: 1. a main board; 2. a dust-proof plate; 21. mounting a rod; 22. a fixed block; 3. a chute; 31. a cross-shaped trench block; 32. a clamping block; 33. a card slot; 34. a dust screen; 4. heat dissipation holes; 5. a heat sink mounting bracket; 51. a heat sink; 6. fixing the rod; 61. mounting blocks; 62. inserting a block; 63. and (7) inserting the jack.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 4, the present invention provides a technical solution: a high-frequency high-density interconnection multilayer circuit board comprises a main board 1, heat dissipation holes 4, a heat dissipation fin mounting frame 5 and heat dissipation fins 51, wherein the main board 1, the heat dissipation holes 4, the heat dissipation fin mounting frame 5, the heat dissipation fins 51 and other components are arranged, so that the high-strength heat dissipation effect is achieved on the multilayer circuit board, the service life of the multilayer circuit board is prolonged, the loss is reduced, the heat dissipation holes 4 are formed in the upper end and the lower end of one side of the main board 1, the heat dissipation holes 4 mainly achieve the auxiliary heat dissipation effect on the main board 1, and the heat dissipation holes 4 are located at the top and the two ends of the bottom of the heat dissipation fin mounting frame 5; the radiating fin mounting rack 5 is positioned in the center of one side of the mainboard 1; the heat radiating fin mounting frame 5 mainly plays a role in mounting and protecting the heat radiating fins 51 in the heat radiating fin mounting frame 5, the heat radiating fins 51 are positioned in the heat radiating fin mounting frame 5, a groove is formed in the periphery of the other side of the mainboard 1, a fixing block 22 is inserted in the groove, the fixing block 22 mainly plays a role in fixing and supporting the mounting rod 21 on the fixing block 22, the mounting rod 21 is fixedly mounted at the top of the fixing block 22, a dust-proof plate 2 is fixedly mounted at the top of the mounting rod 21, and the dust-proof plate 2 mainly plays a certain dust-proof effect on the mainboard 1 and also plays a role in protecting the mainboard 1;

the center of the top of the dust guard 2 is provided with a mounting groove, two sides of the interior of the mounting groove are provided with sliding grooves 3, the interior of the sliding groove 3 is slidably connected with a cross-shaped groove block 31, the bottom of the cross-shaped groove block 31 is fixedly provided with a clamping block 32, the clamping block 32 is clamped with a clamping groove 33 matched with the clamping block, the clamping groove 33 is positioned at the bottom of the sliding groove 3, one side of the cross-shaped groove block 31 is fixedly connected with a dust guard 34, when the dust guard 34 needs to be replaced, the cross-shaped groove block 31 is buckled to move upwards in the sliding groove 3, so that the clamping block 32 at the bottom of the cross-shaped groove block is separated from the clamping groove 33, the dust guard 34 moves upwards, the dust guard moves out of the mounting groove, and the dust guard 34 is convenient to replace;

the upper and lower end of louvre 4 is equipped with jack 63, and jack 63 mainly plays fixed effect to inserted block 62 in it, and the inside grafting of jack 63 has assorted inserted block 62 with it, and the top fixed mounting of inserted block 62 has installation piece 61, and the top fixed mounting of installation piece 61 has dead lever 6, thereby dead lever 6 mainly makes mainboard 1 fix a position it through dead lever 6 when the installation to the reduction produces unnecessary damage to mainboard 1.

When the mainboard 1 is used for a long time, high temperature is easy to generate, and the heat dissipation holes 4 are formed in the upper end and the lower end of one side of the mainboard 1, so that the mainboard 1 is subjected to auxiliary heat dissipation; and the heat sink mounting bracket 5 is installed at the position between the heat dissipation holes 4, so that the heat sink 51 therein is installed and supported by the heat sink mounting bracket 5; by arranging the radiating fins 51, the multi-layer circuit board is subjected to high-strength radiation, so that the service life of the circuit board is prolonged, and the economic loss is reduced; the dustproof plate 2 is arranged on the other side of the mainboard 1, so that the dustproof net 34 on the mainboard 1 plays a dustproof role on the electronic elements on the mainboard 1, the service life of the electronic elements on the mainboard 1 is indirectly prolonged, and certain loss is reduced; when the dust screen 34 needs to be replaced, the cross-shaped groove block 31 is buckled at the moment and moves upwards in the sliding groove 3, so that the clamping block 32 on the bottom of the cross-shaped groove block is separated from the clamping groove 33, the dust screen 34 moves upwards, the dust screen 34 moves out of the mounting groove, and the dust screen 34 is convenient to replace.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a high frequency high density interconnect multilayer circuit board, includes mainboard (1), louvre (4), fin mounting bracket (5) and fin (51), its characterized in that:

the upper end and the lower end of one side of the main board (1) are provided with heat dissipation holes (4), and the heat dissipation holes (4) are positioned at the two ends of the top and the bottom of the heat dissipation fin mounting rack (5);

the radiating fin mounting rack (5) is positioned in the center of one side of the main board (1);

the heat dissipation fin (51) is located the inside of heat dissipation fin mounting bracket (5), the opposite side of mainboard (1) is equipped with the recess all around, fixed block (22) are pegged graft to the inside of recess, the top fixed mounting of fixed block (22) has installation pole (21), the top fixed mounting of installation pole (21) has dust guard (2).

2. A high-frequency high-density interconnection multilayer wiring board according to claim 1, wherein: the top center of dust guard (2) is equipped with the mounting groove, the inside both sides of mounting groove are equipped with spout (3).

3. A high-frequency high-density interconnection multilayer wiring board according to claim 2, wherein: the inner part of the sliding groove (3) is connected with a cross-shaped groove block (31) in a sliding mode, and a clamping block (32) is fixedly installed at the bottom of the cross-shaped groove block (31).

4. A high-frequency high-density interconnection multilayer wiring board according to claim 3, wherein: the clamping block (32) is clamped with a clamping groove (33) matched with the clamping block, the clamping groove (33) is located at the bottom of the sliding groove (3), and a dustproof net (34) is fixedly connected to one side of the cross-shaped groove block (31).

5. A high-frequency high-density interconnection multilayer wiring board according to claim 1, wherein: the upper end and the lower end of the heat dissipation hole (4) are provided with insertion holes (63), and insertion blocks (62) matched with the insertion holes (63) are inserted into the insertion holes (63).

6. The high-frequency high-density interconnection multilayer wiring board according to claim 5, wherein: the top fixed mounting of inserted block (62) has installation piece (61), the top fixed mounting of installation piece (61) has dead lever (6).