CN213152461U - Copper-clad plate with heat dissipation telescopic column - Google Patents
Copper-clad plate with heat dissipation telescopic column Download PDFInfo
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- CN213152461U CN213152461U CN202022098493.0U CN202022098493U CN213152461U CN 213152461 U CN213152461 U CN 213152461U CN 202022098493 U CN202022098493 U CN 202022098493U CN 213152461 U CN213152461 U CN 213152461U
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Abstract
The utility model relates to a copper-clad plate technical field, concretely relates to copper-clad plate with flexible post of heat dissipation. Including the copper-clad plate body, copper-clad plate body below is provided with the heating panel, goes up the heating panel below and is provided with down the heating panel, goes up the heating panel lower extreme and is fixed with a plurality of sleeves, lower heating panel upper end be fixed with the concentric inner tube of sleeve pipe, the inner tube upper portion is pegged graft in the sleeve pipe of its top. The utility model discloses in, the heat that the copper-clad plate body produced in the course of the work can be conducted to supreme heating panel, upper plate and hypoplastron, can be through upper plate, hypoplastron, sleeve pipe and inner tube conduction to down on the heating panel simultaneously, heat radiating area is big to improve the radiating efficiency of copper-clad plate body at the during operation, because the sleeve pipe can stretch out and draw back the location, can carry out effectual whole support to the copper-clad plate body, the stability can be good after the copper-clad plate body is installed, the copper-clad plate body can be in arbitrary height.
Description
Technical Field
The utility model relates to a copper-clad plate technical field, concretely relates to copper-clad plate with flexible post of heat dissipation.
Background
The copper clad laminate is a plate-shaped material formed by hot pressing reinforcing material soaked with resin and one or two surfaces covered with copper foil. It is used as the basic material of PCB, often called substrate, and when it is used in the production of multi-layer board, it is also called core board. The copper-clad plate is a basic material in the electronic industry, is mainly used for processing and manufacturing printed circuit boards, is widely applied to electronic products such as televisions, radios, computers, mobile communication and the like, has the problem of heat dissipation of the existing copper-clad plate, does not have enough support when being installed, is easy to deform after being pressed in the installation process, mainly dissipates heat by air circulation, has small heat dissipation area and low heat dissipation efficiency, and is easy to cause the problem that the copper-clad plate cannot be well dissipated and damaged under high working strength.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a support performance is good, and the radiating efficiency is high, stable in structure.
In order to realize the purpose, the utility model provides a technical scheme is:
a copper-clad plate with heat dissipation telescopic columns comprises a copper-clad plate body, wherein an upper heat dissipation plate is arranged below the copper-clad plate body and is connected with the copper-clad plate body through an upper heat conduction silica gel layer, a lower heat dissipation plate is arranged below the upper heat dissipation plate, a plurality of vertical sleeves which are transversely and uniformly distributed are fixed at the lower end of the upper heat dissipation plate, an inner pipe concentric with the sleeves is fixed at the upper end of the lower heat dissipation plate, the upper part of the inner pipe is inserted into the sleeves above the inner pipe, a plurality of vertical upper long grooves are uniformly distributed on the circumference of the upper end of the inner pipe, inner columns are arranged in the inner pipe in a sliding mode, arc-shaped convex blocks are fixed on the inner wall of the inner pipe between every two adjacent upper long grooves above the inner columns, vertical lower long grooves are formed in the left side and the right side of the lower end of the inner pipe, the right end of the lower heat dissipation plate is fixed with a fixing plate, and a screw penetrates through the fixing plate and then is in threaded connection with the right end of the connecting rod.
Specifically, a lower heat conduction silica gel layer is fixed on the lower end face of the lower heat dissipation plate.
Specifically, two upper plates which are symmetrical left and right are fixed at the lower ends of the upper heat dissipation plates between two adjacent sleeves, a lower plate is arranged between the two upper plates in a sliding mode and fixed at the upper end of the lower heat dissipation plate, and a connecting rod penetrates through the lower plate and is in sliding fit with the lower plate.
Specifically, the lower end face of the inner column is an inclined plane with the left end inclined upwards.
Specifically, the outer edge of the inner column is movably contacted with the inner edge of the sleeve.
Specifically, the upper plate and the lower plate are both aluminum plates.
Specifically, the upper heat dissipation plate and the lower heat dissipation plate are both aluminum plates.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses in, the heat that the copper-clad plate body produced in the course of the work can be conducted to supreme heating panel, upper plate and hypoplastron, can be through upper plate, hypoplastron, sleeve pipe and inner tube conduction to down on the heating panel simultaneously, heat radiating area is big to improve the radiating efficiency of copper-clad plate body at the during operation, because the sleeve pipe can stretch out and draw back the location, can carry out effectual whole support to the copper-clad plate body, the stability can be good after the copper-clad plate body is installed, the copper-clad plate body can be in arbitrary height.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is an enlarged view of the area a in fig. 1.
Detailed Description
As shown in figure 1-2, a copper-clad plate with heat dissipation telescopic columns comprises a copper-clad plate body 1, wherein an upper heat dissipation plate 3 is arranged below the copper-clad plate body 1, the upper heat dissipation plate 3 is connected with the copper-clad plate body 1 through an upper heat conduction silica gel layer 2, a lower heat dissipation plate 4 is arranged below the upper heat dissipation plate 3, the upper heat dissipation plate 3 and the lower heat dissipation plate 4 are both aluminum plates, a lower heat conduction silica gel layer 5 is fixed on the lower end surface of the lower heat dissipation plate 4, a plurality of vertical sleeves 6 which are transversely and uniformly distributed are fixed at the lower end of the upper heat dissipation plate 3, an inner pipe 9 which is concentric with the sleeves 6 is fixed at the upper end of the lower heat dissipation plate 4, the upper part of the inner pipe 9 is inserted in the sleeves 6 above the inner pipe 9, a plurality of vertical upper long grooves 10 are uniformly distributed on the circumference of the upper end of the inner pipe 9, inner columns 12 are arranged in the inner pipes, vertical lower long grooves 15 are formed in the left side and the right side of the lower end of the inner pipe 9, a connecting rod 13 penetrates through the lower long grooves 15 of the inner pipe 9, wedge blocks 14 are fixed to the upper ends of the connecting rod 13 inside the inner pipe 9, the inclined surfaces of the wedge blocks 14 are in contact with the lower end face of the inner column 12, the lower end face of the inner column 12 is an inclined surface with the left end inclined upwards, the left end of the inclined surface of the wedge block 14 is inclined upwards, a fixing plate 16 is fixed to the right end of the lower heat dissipation plate 4, and a screw 17 penetrates through the.
The lower end of the upper heat dissipation plate 3 between two adjacent sleeves 6 is fixed with two upper plates 7 which are symmetrical left and right, a lower plate 8 is arranged between the two upper plates 7 in a sliding mode, the upper plates 7 and the lower plate 8 are both aluminum plates, the lower plate 8 is fixed at the upper end of the lower heat dissipation plate 4, and the connecting rod 13 penetrates through the lower plate 8 and is in sliding fit with the lower plate 8.
The utility model discloses during the use, will lower heating panel 4 installs in the casing, peg graft inner tube 9 in sleeve pipe 6, peg graft 8 down between two upper plates 7 with the hypoplastron, adjust the height of copper-clad plate body 1, then twist screw 17 and make connecting rod 13 move to the right side direction, connecting rod 13 moves to the in-process of right side direction, voussoir 14 makes inner column 12 go upward in sleeve pipe 6, the in-process that inner column 12 went upward, under the effect that blocks of arc lug 11, the inside pipe 9 part between the adjacent two upper elongated slots 10 outwards expands and tightly supports sleeve pipe 6 inner edge, rely on the frictional force between the inside pipe 9 part between the adjacent two upper elongated slots 10 and the sleeve pipe 6 inner edge to realize sleeve pipe 6's stable positioning, thereby make copper-clad plate body 1 stabilized. The utility model discloses in, the heat that copper-clad plate body 1 produced in the course of the work can be conducted to supreme heating panel 3, on upper plate 7 and the hypoplastron 8, simultaneously can be through sleeve pipe 6, inner tube 9, upper plate 7 and hypoplastron 8 conduct to heating panel 4 down on, heat radiating area is big, thereby improve the radiating efficiency of copper-clad plate body 1 at the during operation, because sleeve pipe 6 can flexible location, can carry out effectual whole support to copper-clad plate body 1, copper-clad plate body 1 installation back stability can be good, copper-clad plate body 1 can be in arbitrary height, the installation is nimble, upper plate 7 and hypoplastron 8's cooperation can increase the stability when copper-clad plate body 1 altitude.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. A copper-clad plate with heat dissipation telescopic columns comprises a copper-clad plate body (1), wherein an upper heat dissipation plate (3) is arranged below the copper-clad plate body (1), the upper heat dissipation plate (3) is connected with the copper-clad plate body (1) through an upper heat conduction silica gel layer (2), and the copper-clad plate is characterized in that a lower heat dissipation plate (4) is arranged below the upper heat dissipation plate (3), a plurality of vertical sleeves (6) which are transversely and uniformly distributed are fixed at the lower end of the upper heat dissipation plate (3), an inner tube (9) which is concentric with the sleeves (6) is fixed at the upper end of the lower heat dissipation plate (4), the upper part of the inner tube (9) is inserted into the sleeves (6) above the inner tube, a plurality of vertical upper elongated slots (10) are uniformly distributed at the circumference of the upper end of the inner tube (9), inner columns (12) are arranged in the inner tube (9) in a sliding manner, vertical lower long grooves (15) are formed in the left side and the right side of the lower end of the inner pipe (9), the connecting rod (13) penetrates through the lower long grooves (15) of the inner pipe (9), wedge blocks (14) are fixed to the upper ends of the connecting rod (13) inside the inner pipe (9), the inclined surfaces of the wedge blocks (14) are in contact with the lower end face of the inner column (12), the left ends of the inclined surfaces of the wedge blocks (14) incline upwards, a fixing plate (16) is fixed to the right end of the lower heat dissipation plate (4), and screws (17) penetrate through the fixing plate (16) and then are in threaded connection with the.
2. The copper-clad plate with the heat dissipation telescopic columns according to claim 1, wherein a lower heat conduction silica gel layer (5) is fixed on the lower end face of the lower heat dissipation plate (4).
3. The copper-clad plate with the heat dissipation telescopic columns according to claim 1 is characterized in that two upper plates (7) which are symmetrical left and right are fixed at the lower ends of the upper heat dissipation plates (3) between two adjacent sleeves (6), a lower plate (8) is arranged between the two upper plates (7) in a sliding mode, the lower plate (8) is fixed at the upper end of the lower heat dissipation plate (4), and a connecting rod (13) penetrates through the lower plate (8) and is in sliding fit with the lower plate.
4. The copper-clad plate with the heat dissipation telescopic columns according to claim 1, wherein the lower end surface of the inner column (12) is an inclined surface with the left end inclined upwards.
5. The copper-clad plate with the heat dissipation telescopic columns according to claim 1, wherein the outer edges of the inner columns (12) are movably contacted with the inner edges of the sleeves (6).
6. The copper-clad plate with the heat dissipation telescopic column according to claim 3, wherein the upper plate (7) and the lower plate (8) are both aluminum plates.
7. The copper-clad plate with the heat dissipation telescopic columns according to claim 1, wherein the upper heat dissipation plate (3) and the lower heat dissipation plate (4) are both aluminum plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022098493.0U CN213152461U (en) | 2020-09-23 | 2020-09-23 | Copper-clad plate with heat dissipation telescopic column |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022098493.0U CN213152461U (en) | 2020-09-23 | 2020-09-23 | Copper-clad plate with heat dissipation telescopic column |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213152461U true CN213152461U (en) | 2021-05-07 |
Family
ID=75717689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022098493.0U Active CN213152461U (en) | 2020-09-23 | 2020-09-23 | Copper-clad plate with heat dissipation telescopic column |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213152461U (en) |
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2020
- 2020-09-23 CN CN202022098493.0U patent/CN213152461U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210716 Address after: 333000 Yuli Industrial Park, Changjiang District, Jingdezhen City, Jiangxi Province (factory building of Jingdezhen Xinxiang steel plate Co., Ltd.) Patentee after: Jingdezhen HengYao Electronic Technology Co.,Ltd. Address before: 519180 area a, workshop 201, building 13, No.5, Fushan 2nd Road, Qianwu Town, Doumen District, Zhuhai City, Guangdong Province Patentee before: Guangdong Yingfan circuit Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210916 Address after: 336000 No. 20, Dayuan natural village, Heping Village, Yangwei Town, Gao'an City, Yichun City, Jiangxi Province Patentee after: Li Zhengjun Address before: 333000 Yuli Industrial Park, Changjiang District, Jingdezhen City, Jiangxi Province (factory building of Jingdezhen Xinxiang steel plate Co., Ltd.) Patentee before: Jingdezhen HengYao Electronic Technology Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211216 Address after: 516000 floor 3, building C, No. 111, south of Lianfa Avenue, Tongqiao town industrial base, Zhongkai high tech Zone, Huizhou, Guangdong Patentee after: HUIZHOU YINGFAN INDUSTRIAL Co.,Ltd. Address before: 336000 No. 20, Dayuan natural village, Heping Village, Yangwei Town, Gao'an City, Yichun City, Jiangxi Province Patentee before: Li Zhengjun |