CN221081625U - Multilayer printed circuit board with heat dissipation function - Google Patents
Multilayer printed circuit board with heat dissipation function Download PDFInfo
- Publication number
- CN221081625U CN221081625U CN202322859665.5U CN202322859665U CN221081625U CN 221081625 U CN221081625 U CN 221081625U CN 202322859665 U CN202322859665 U CN 202322859665U CN 221081625 U CN221081625 U CN 221081625U
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- Prior art keywords
- heat dissipation
- multilayer printed
- circuit board
- dissipation function
- layer
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 39
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 71
- 229910052802 copper Inorganic materials 0.000 claims abstract description 70
- 239000010949 copper Substances 0.000 claims abstract description 70
- 238000002955 isolation Methods 0.000 claims abstract description 31
- 230000001681 protective effect Effects 0.000 claims abstract description 29
- 238000003475 lamination Methods 0.000 abstract description 3
- 238000005452 bending Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a multilayer printed circuit board with a heat dissipation function, relates to the field of multilayer printed circuit boards, and aims to solve the problems that in the prior art, the heat dissipation of an internal circuit layer is poor due to the adoption of a multilayer lamination design, so that the temperature of the internal circuit layer is not easy to dissipate during working, and the temperature is further increased rapidly to damage the circuit board. The inner circuit board outside is provided with the isolation layer, both ends all are provided with outer circuit layer about the isolation layer, inner circuit board isolation layer and two the inside common array of outer circuit layer is provided with a plurality of heat conduction copper pipes, the isolation layer with two the common fixedly connected with protective housing in outer circuit layer outside, both ends all are connected with the spliced pole around the both sides of protective housing lower extreme, every spliced pole upper end is connected with the telescopic link, every the common fixedly connected with heat dissipation copper in spliced pole upper end outside, heat dissipation copper upper end array is provided with a plurality of rectangle fin.
Description
Technical Field
The utility model relates to the field of multilayer printed circuit boards, in particular to a multilayer printed circuit board with a heat dissipation function.
Background
The circuit board determines the process difficulty and the processing price according to the number of wiring surfaces, the common circuit board is divided into a single-sided wiring and a double-sided wiring, commonly called a single panel and a double-sided board, but high-end electronic products are restricted by product space design factors, multiple layers of circuits can be stacked inside the circuit board except for surface wiring, and in the production process, after each layer of circuits is manufactured, the optical equipment is used for positioning and pressing, so that the multiple layers of circuits are stacked in one circuit board. Commonly known as multilayer circuit boards. All circuit boards with more than or equal to 2 layers can be called as multi-layer circuit boards. The multi-layer circuit board can be divided into a multi-layer hard circuit board, a multi-layer soft and hard circuit board and a multi-layer soft and hard combined circuit board.
The multilayer circuit board adopts a multilayer lamination design to cause poor heat dissipation of the inner circuit layer, so that the temperature of the inner circuit layer is not easy to be dispersed during working, and the temperature is further increased rapidly to cause damage to the circuit board; therefore, there is an urgent need in the market to develop a multi-layer printed circuit board with heat dissipation function to help people solve the existing problems.
Disclosure of utility model
The utility model aims to provide a multilayer printed circuit board with a heat dissipation function, so as to solve the problem that the multilayer printed circuit board provided in the background art has poor heat dissipation of an internal circuit layer due to the adoption of a multilayer lamination design, so that the temperature of the internal circuit layer is not easy to dissipate during working, and the temperature is further increased rapidly to damage the circuit board.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a multilayer printed wiring board with heat dissipation function, includes inlayer circuit board, inlayer circuit board outside is provided with the isolation layer, both ends all are provided with outer circuit layer about the isolation layer, inlayer circuit board isolation layer and two the inside common array of outer circuit layer is provided with a plurality of heat conduction copper pipes, every the heat conduction copper pipe lower extreme is provided with the heat conduction copper sheet jointly, the isolation layer with two the common fixedly connected with protective housing in outer circuit layer outside, both ends all are provided with circular spacing groove around the both sides of terminal surface under the protective housing, circular spacing groove upper end middle part is connected with the bolt hole, both ends all are connected with the spliced pole around the both sides of protective housing lower extreme, every the spliced pole upper end is connected with the telescopic link, the inside screw thread groove that is provided with in telescopic link upper end, every the annular limiting plate of telescopic link upper end outside fixedly connected with, every the common fixedly connected with heat dissipation copper in the spliced pole upper end outside, the copper upper end array is provided with a plurality of rectangle pieces.
Preferably, each connecting column is internally provided with a circular groove, and a spring is arranged in each circular groove.
Preferably, the lower end of the telescopic rod is inserted into the circular groove in the connecting column for limiting connection.
Preferably, the annular limiting plate at the upper end of the telescopic rod is inserted into the circular limiting groove at the lower end of the protective shell for limiting connection.
Preferably, the upper end of the bolt hole extends to the upper end face of the protective shell, and the protective shell and the telescopic rod are inserted into the thread groove at the upper end of the telescopic rod through the bolt hole through a screw rod to be fixedly connected with each other in a threaded mode.
Preferably, the heat conducting copper sheet is fixedly arranged between the lower end of the isolation layer and the upper end of the lower outer circuit layer.
Preferably, an annular isolation layer is arranged between the outer side of each heat conduction copper pipe and the inner layer circuit board.
Preferably, the rectangular radiating fins at the upper end of the radiating copper plate are the same in number and in one-to-one correspondence with the heat conducting copper tubes.
Preferably, rectangular limiting grooves are formed in two sides of the inner portion of each heat conduction copper pipe.
Preferably, the upper end of each rectangular radiating fin is inserted into each heat conducting copper pipe respectively, and two ends of each rectangular radiating fin slide into the rectangular limiting groove respectively for limiting connection.
Compared with the prior art, the utility model has the beneficial effects that:
1. According to the utility model, through the arrangement of the heat conduction copper pipes, the inner circuit board, the isolation layer and the inner parts of the two outer circuit layers are arranged in an array mode, the lower end of each heat conduction copper pipe is provided with a heat conduction copper sheet, the heat conduction copper sheets are fixedly arranged between the lower end of the isolation layer and the upper end of the lower outer circuit layer, heat generated by the inner circuit board is conducted to the heat conduction copper pipes through the heat conduction copper sheets, the outer sides of the upper ends of the connecting columns are fixedly connected with a heat dissipation copper plate in an array mode, the upper ends of the heat dissipation copper plates are provided with a plurality of rectangular heat dissipation fins in an array mode, the upper ends of the rectangular heat dissipation fins are respectively inserted into the heat conduction copper pipes and enable two ends of the rectangular heat dissipation fins to slide into the rectangular limit grooves to be connected in a limiting mode, and heat on the heat conduction copper plates are transmitted through the rectangular heat dissipation fins, so that the inner circuit board is prevented from being damaged due to heat dissipation difficulty.
2. According to the utility model, through the arrangement of the telescopic rods, the front end and the rear end of the two sides of the lower end of the protective shell are connected with the connecting columns, the upper end of each connecting column is connected with the telescopic rod, the lower end of the telescopic rod is inserted into the circular groove in the connecting column for limiting connection, so that the lower end of the telescopic rod can slide in the circular groove in the connecting column, and the telescopic rod is buffered through the springs, so that the whole multilayer circuit board is buffered through the springs when being pressed, and bending damage is prevented.
3. According to the utility model, through the arrangement of the rectangular limiting grooves, the inner circuit board, the isolation layer and the two outer circuit layers are provided with a plurality of heat conduction copper pipes in a common array, both sides of the interior of each heat conduction copper pipe are provided with the rectangular limiting grooves, the upper end of each rectangular radiating fin is respectively inserted into the interior of each heat conduction copper pipe, and both ends of each rectangular radiating fin are respectively slid into the rectangular limiting grooves for limiting connection, so that the upper end of each rectangular radiating fin can move up and down on the heat conduction copper pipe through the rectangular limiting grooves when the whole circuit board is pressed down.
Drawings
Fig. 1 is a front view of a multilayer printed wiring board with heat dissipation function according to the present utility model;
FIG. 2 is a front cross-sectional view of the present utility model;
FIG. 3 is a top cross-sectional view of the present utility model;
FIG. 4 is an enlarged view of detail A of the present utility model;
Fig. 5 is an enlarged view of detail B of the present utility model.
In the figure: 1. an inner layer circuit board; 2. an isolation layer; 201. an annular isolation layer; 3. an outer circuit layer; 4. a protective shell; 401. a circular limit groove; 402. bolt holes; 5. a heat conducting copper pipe; 501. rectangular limit grooves; 502. a thermally conductive copper sheet; 6. a connecting column; 601. a circular groove; 602. a spring; 7. a telescopic rod; 701. a thread groove; 702. an annular limiting plate; 8. a screw; 9. a heat-dissipating copper plate; 901. rectangular heat sink.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1-5, an embodiment of the present utility model is provided: the utility model provides a multilayer printed wiring board with heat dissipation function, including inlayer circuit board 1, inlayer circuit board 1 outside is provided with isolation layer 2, both ends all are provided with outer circuit layer 3 about isolation layer 2, inlayer circuit board 1, isolation layer 2 and the inside common array of two outer circuit layers 3 are provided with a plurality of heat conduction copper pipes 5, every heat conduction copper pipe 5 lower extreme is provided with heat conduction copper sheet 502 jointly, isolation layer 2 and the common fixedly connected with protective housing 4 in two outer circuit layer 3 outsides, both ends all are provided with circular spacing groove 401 around the both sides of the terminal surface under the protective housing 4, circular spacing groove 401 upper end middle part is connected with bolt hole 402, both ends all are connected with spliced pole 6 around the both sides of protective housing 4 lower extreme, every spliced pole 6 upper end is connected with telescopic link 7, telescopic link 7 upper end inside is provided with thread groove 701, every telescopic link 7 upper end outside fixedly connected with annular limiting plate 702, every spliced pole 6 upper end outside is fixedly connected with heat dissipation 9 jointly, heat dissipation copper 9 upper end array is provided with a plurality of rectangle pieces 901.
Further, a circular groove 601 is provided inside each connecting post 6, and a spring 602 is provided inside the circular groove 601.
Further, the lower end of the telescopic rod 7 is inserted into the circular groove 601 inside the connecting column 6 for limiting connection, so that the lower end of the telescopic rod 7 can slide in the circular groove 601 inside the connecting column 6 and is buffered through the spring 602, and the whole multilayer circuit board is buffered through the spring 602 when being pressed to prevent bending damage.
Further, the annular limiting plate 702 on the upper end of the telescopic rod 7 is inserted into the circular limiting groove 401 at the lower end of the protective shell 4 for limiting connection, and the upper end of the telescopic rod 7 is limited through the circular limiting groove 401, so that movement is prevented.
Further, the upper end of the bolt hole 402 extends the upper end face of the protective housing 4, the protective housing 4 and the telescopic rod 7 are inserted into the threaded groove 701 at the upper end of the telescopic rod 7 through the bolt hole 402 through the screw rod 8 to be fixedly connected with each other through threads, and the protective housing 4 and the telescopic rod 7 are fixed through the screw rod 8.
Further, the heat conducting copper sheet 502 is fixedly arranged between the lower end of the isolation layer 2 and the upper end of the lower outer circuit layer 3, and heat generated by the inner circuit board 1 is conducted to the heat conducting copper tube 5 through the heat conducting copper sheet 502.
Further, an annular isolation layer 201 is arranged between the outer side of each heat conduction copper pipe 5 and the inner layer circuit board 1, and the heat conduction copper pipes 5 are isolated from the inner layer circuit board 1 through the annular isolation layer 201, so that short circuits are prevented.
Further, the rectangular heat radiating fins 901 at the upper end of the heat radiating copper plate 9 are the same in number and in one-to-one correspondence with the heat conducting copper tubes 5.
Further, rectangular limiting grooves 501 are formed in two sides of the inside of each heat conduction copper pipe 5.
Further, the upper end of each rectangular radiating fin 901 is inserted into each heat conducting copper pipe 5 respectively, two ends of each rectangular radiating fin 901 slide into the rectangular limiting grooves 501 respectively for limiting connection, when the whole circuit board is pressed down, the upper ends of the rectangular radiating fins 901 can move up and down on the heat conducting copper pipes 5 through the rectangular limiting grooves 501, and heat on the heat conducting copper pipes 5 is transmitted to the heat radiating copper plates 9 through the rectangular radiating fins 901 for radiating.
Working principle: when in use, the outer side of the inner circuit board 1 is provided with an isolation layer 2, the upper end and the lower end of the isolation layer 2 are respectively provided with an outer circuit layer 3, a plurality of heat conduction copper pipes 5 are arranged in the inner circuit board 1, the isolation layer 2 and the two outer circuit layers 3 in a common array, the lower end of each heat conduction copper pipe 5 is provided with a heat conduction copper sheet 502, the heat conduction copper sheets 502 are fixedly arranged between the lower end of the isolation layer 2 and the upper end of the lower outer circuit layer 3, the heat generated by the inner circuit board 1 is conducted to the heat conduction copper pipes 5 through the heat conduction copper sheets 502, the isolation layer 2 and the outer sides of the two outer circuit layers 3 are fixedly connected with a protective shell 4 together, the front end and the rear ends of the two sides of the lower end face of the protective shell 4 are respectively provided with a circular limiting groove 401, the middle part of the upper end of the circular limiting groove 401 is connected with a bolt hole 402, the front end and the rear ends of the two sides of the lower end of the protective shell 4 are respectively connected with a connecting post 6, the upper end of each connecting post 6 is connected with a telescopic rod 7, the lower end of the telescopic rod 7 is inserted into the circular groove 601 in the connecting column 6 for limiting connection, so that the lower end of the telescopic rod 7 can slide in the circular groove 601 in the connecting column 6 and is buffered by the spring 602, the whole multi-layer circuit board is buffered by the spring 602 to prevent bending damage when being pressed, a threaded groove 701 is arranged in the upper end of the telescopic rod 7, an annular limiting plate 702 is fixedly connected to the outer side of the upper end of each telescopic rod 7, the annular limiting plate 702 on the upper end of the telescopic rod 7 is inserted into the circular limiting groove 401 in the lower end of the protective shell 4 for limiting connection, the upper end of the telescopic rod 7 is limited by the circular limiting groove 401 to prevent movement, the protective shell 4 and the telescopic rod 7 are inserted into the threaded groove 701 in the upper end of the telescopic rod 7 through the bolt hole 402 for threaded connection and fixed, a heat dissipation copper plate 9 is fixedly connected to the outer side of the upper end of each connecting column 6 together, a plurality of rectangular heat dissipation fins 901 are arranged on the upper end array of the heat dissipation copper plate 9, the upper end of each rectangular radiating fin 901 is inserted into each heat conducting copper pipe 5 respectively, two ends of each rectangular radiating fin 901 slide into the rectangular limiting grooves 501 respectively for limiting connection, when the whole circuit board is pressed down, the upper end of each rectangular radiating fin 901 can move up and down on the heat conducting copper pipe 5 through the rectangular limiting grooves 501, and heat on the heat conducting copper pipe 5 is transmitted to the heat radiating copper plate 9 through the rectangular radiating fin 901 for radiating.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (10)
1. The utility model provides a multilayer printed wiring board with heat dissipation function, includes inlayer circuit board (1), its characterized in that: the utility model discloses a heat dissipation device, including inner circuit board (1), protective housing (4) both ends all are provided with outside circuit layer (3), inner circuit board (1) isolation layer (2) and two the inside common array of outside circuit layer (3) is provided with a plurality of heat conduction copper pipe (5), every heat conduction copper pipe (5) lower extreme is provided with heat conduction copper sheet (502) jointly, isolation layer (2) and two the common fixedly connected with protective housing (4) in outside circuit layer (3), both ends all are provided with circular spacing groove (401) around the both sides of protective housing (4) lower extreme, circular spacing groove (401) upper end middle part is connected with bolt hole (402), both ends all are connected with spliced pole (6) around the both sides of protective housing (4) lower extreme, every spliced pole (6) upper end is connected with telescopic link (7), telescopic link (7) upper end inside is provided with thread groove (701), every telescopic link (7) upper end fixedly connected with rectangle plate (901) each copper (9) are connected with copper (9) in the common heat dissipation device.
2. The multilayer printed wiring board with heat dissipation function according to claim 1, wherein: a circular groove (601) is formed in each connecting column (6), and a spring (602) is arranged in each circular groove (601).
3. The multilayer printed wiring board with heat dissipation function according to claim 2, wherein: the lower end of the telescopic rod (7) is inserted into the circular groove (601) in the connecting column (6) for limiting connection.
4. The multilayer printed wiring board with heat dissipation function according to claim 1, wherein: the annular limiting plate (702) at the upper end of the telescopic rod (7) is inserted into the circular limiting groove (401) at the lower end of the protective shell (4) for limiting connection.
5. The multilayer printed wiring board with heat dissipation function according to claim 1, wherein: the upper end of the bolt hole (402) extends to the upper end face of the protective shell (4), and the protective shell (4) and the telescopic rod (7) are inserted into a threaded groove (701) at the upper end of the telescopic rod (7) through the bolt hole (402) by a screw rod (8) to be fixedly connected with each other through threads.
6. The multilayer printed wiring board with heat dissipation function according to claim 1, wherein: the heat conducting copper sheet (502) is fixedly arranged between the lower end of the isolation layer (2) and the upper end of the lower end outer circuit layer (3).
7. The multilayer printed wiring board with heat dissipation function according to claim 1, wherein: an annular isolation layer (201) is arranged between the outer side of each heat conduction copper pipe (5) and the inner layer circuit board (1).
8. The multilayer printed wiring board with heat dissipation function according to claim 1, wherein: the rectangular radiating fins (901) at the upper end of the radiating copper plate (9) are the same in number and correspond to the heat conducting copper tubes (5) one by one.
9. The multilayer printed wiring board with heat dissipation function according to claim 1, wherein: rectangular limiting grooves (501) are formed in two sides of the inner portion of each heat conduction copper pipe (5).
10. The multilayer printed wiring board with heat dissipation function according to claim 9, wherein: the upper end of each rectangular radiating fin (901) is inserted into each heat conducting copper pipe (5) respectively, and two ends of each rectangular radiating fin (901) slide into the rectangular limiting grooves (501) respectively for limiting connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322859665.5U CN221081625U (en) | 2023-10-25 | 2023-10-25 | Multilayer printed circuit board with heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322859665.5U CN221081625U (en) | 2023-10-25 | 2023-10-25 | Multilayer printed circuit board with heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221081625U true CN221081625U (en) | 2024-06-04 |
Family
ID=91263185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322859665.5U Active CN221081625U (en) | 2023-10-25 | 2023-10-25 | Multilayer printed circuit board with heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221081625U (en) |
-
2023
- 2023-10-25 CN CN202322859665.5U patent/CN221081625U/en active Active
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