CN210694484U - Multilayer flexible circuit board that combination precision is high - Google Patents
Multilayer flexible circuit board that combination precision is high Download PDFInfo
- Publication number
- CN210694484U CN210694484U CN201921779560.6U CN201921779560U CN210694484U CN 210694484 U CN210694484 U CN 210694484U CN 201921779560 U CN201921779560 U CN 201921779560U CN 210694484 U CN210694484 U CN 210694484U
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- Prior art keywords
- circuit board
- flexible circuit
- positioning
- heat dissipation
- fixedly connected
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Abstract
The utility model relates to a circuit board technical field, and a multilayer flexible circuit board that combination precision is high is disclosed, including a plurality of flexible circuit board bodies, jack and jack interpolation have all been seted up to the surperficial four corners department of flexible circuit board body and have been connected the location post of inserting, be equipped with four difference covers between two adjacent flexible circuit board bodies and establish the support sleeve outside four location posts of inserting, through positioning mechanism location connection between support sleeve and the location post of inserting, the equal fixedly connected with in upper and lower both ends of support sleeve contradicts at the heat dissipation layer board on two flexible circuit board body surfaces, even a plurality of fin of fixedly connected with between two upper and lower heat dissipation layer boards, the outside of two upper and lower heat dissipation layer boards all is equipped with the position sleeve who cup joints outside the post of inserting in the location, position sleeve is close to the one end fixedly connected with contact of. The utility model discloses can realize spacing, the installation of being convenient for use multilayer flexible circuit board body fast and stable's support.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a combine multilayer flexible circuit board that precision is high.
Background
The flexible printed circuit board is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent performance. The high-density light-weight LED lamp has the characteristics of high wiring density, light weight, thin thickness and good bending property.
In order to improve the performance and structure of the circuit board, a rigid PCB and a flexible FPC are usually adopted to make the circuit board have the strength of the PCB and the flexibility of the FPC so as to improve the wiring density and the assembly flexibility.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving among the prior art multilayer circuit board and being most through gluing integratively, just appear the not enough problem of bonding precision very easily at the adhesive in-process, the multilayer flexible circuit board's of not being convenient for problem of combining the use, and the multilayer flexible circuit board that the combination precision is high that proposes.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a combine multilayer flexible circuit board that precision is high, includes a plurality of flexible circuit board bodies, jack and jack interpolation have been all seted up to the surperficial four corners department of flexible circuit board body have the location to insert the post, adjacent two be equipped with four between the flexible circuit board body and establish respectively the cover and insert the outer support sleeve of four location insert the post, through positioning mechanism location connection between support sleeve and the location insert the post, the equal fixedly connected with in both ends about the support sleeve is contradicted at the heat dissipation layer board on two flexible circuit board body surfaces, two from top to bottom even a plurality of fin of fixedly connected with between the heat dissipation layer board, two from top to bottom the outside of heat dissipation layer board all is equipped with the position sleeve who cup joints outside the post is inserted in the location, the position sleeve is close to the one end fixedly connected with contact of.
Preferably, the positioning mechanism comprises a positioning rod movably inserted into the side wall of the supporting sleeve through a through hole formed in the side wall of the supporting sleeve, a positioning hole correspondingly inserted into the positioning rod is formed in the column wall of the positioning insertion column, a pulling plate is fixedly connected to one end of the positioning rod, and a return spring sleeved outside the positioning rod is fixedly connected between the pulling plate and the cylinder wall of the supporting sleeve.
Preferably, the heat dissipation supporting plate and the heat dissipation fins are made of copper.
Preferably, the radiating fin is composed of a plurality of bending parts, and a plurality of radiating through holes are uniformly formed in the surface of the radiating fin.
Preferably, the surfaces of the positioning sleeve and the positioning insertion column are symmetrically provided with limiting screw holes, and the limiting screw holes are connected with hexagon bolts in an internal thread mode.
Compared with the prior art, the utility model provides a combine high multilayer flexible circuit board of precision possesses following beneficial effect:
1. the multilayer flexible circuit board with high combination precision can realize rapid and accurate combination and insertion by sequentially sleeving a plurality of flexible circuit board bodies on the positioning insertion columns through the positioning insertion columns, the supporting sleeve sleeved outside the positioning insertion columns is arranged between the two flexible circuit board bodies, the upper end and the lower end of the supporting sleeve are fixedly connected with the heat dissipation supporting plate, the flexible circuit board bodies can be effectively supported and lifted, the heat dissipation supporting plate can quickly dissipate heat dissipated when the surfaces of the flexible circuit board bodies work, the service life of the flexible circuit board bodies is ensured, and the positioning sleeve is stably fixed on the positioning insertion columns through the positioning sleeve and the limiting pressing plate which are arranged, so that the limiting pressing plate can stably limit the outer flexible circuit board bodies, and the rapid and stable support and limit of the multilayer flexible circuit board bodies can be realized, the installation and the use are convenient;
2. this multilayer flexible circuit board that combination precision is high, through a plurality of fin of connecting between the heat dissipation layer board, the fin comprises a plurality of kinks and can increase heat radiating area as far as in limited space for area on the heat dissipation layer board can distribute the radiating efficiency who guarantees the flexible circuit board body fast.
And the part that does not relate to among the device all is the same with prior art or can adopt prior art to realize, the utility model discloses can realize that the support to multilayer flexible circuit board body fast and stable is spacing, the installation of being convenient for is used.
Drawings
Fig. 1 is a schematic structural diagram of a multilayer flexible circuit board with high bonding precision according to the present invention;
fig. 2 is the utility model provides a combine the high multilayer flexible circuit board's of precision location to insert post and the section structure schematic diagram of positioning sleeve grafting.
In the figure: the flexible printed circuit board comprises a flexible printed circuit board body 1, a positioning insertion column 2, a supporting sleeve 3, a positioning mechanism 4, a positioning rod 41, a positioning hole 42, a pulling plate 43, a reset spring 44, a heat dissipation supporting plate 5, a heat dissipation fin 6, a positioning sleeve 7, a limiting pressing plate 8 and a hexagon bolt 9.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Referring to fig. 1-2, a multilayer flexible circuit board that combination precision is high, including a plurality of flexible circuit board bodies 1, jack and jack interpolation have been all seted up to the surperficial four corners department of flexible circuit board body 1 and the location post 2 is inserted to the jack, be equipped with four between two adjacent flexible circuit board bodies 1 and establish respectively the cover and insert the support sleeve 3 outside four location post 2, support sleeve 3 and location are inserted and are connected through positioning mechanism 4 location between the post 2, the equal fixedly connected with in upper and lower both ends of support sleeve 3 contradicts at the heat dissipation layer board 5 on two flexible circuit board bodies 1 surfaces, even fixedly connected with a plurality of fin 6 between two upper and lower heat dissipation layer boards 5, the outside of two upper and lower heat dissipation layer boards 5 all is equipped with the position sleeve 7 that cup joints outside the post 2 is inserted in the location, the position sleeve 7 is close to the one end fixedly connected with.
The positioning mechanism 4 comprises a positioning rod 41 movably inserted into the side wall of the supporting sleeve 3 through a through hole formed in the side wall of the supporting sleeve 3, a positioning hole 42 correspondingly inserted into the positioning rod 41 is formed in the column wall of the positioning insertion column 2, a pulling plate 43 is fixedly connected to one end of the positioning rod 41, and a same reset spring 44 sleeved outside the positioning rod 41 is fixedly connected between the pulling plate 43 and the cylinder wall of the supporting sleeve 3.
The heat dissipation supporting plate 5 and the heat dissipation fins 6 are made of copper.
The radiating fin 6 is composed of a plurality of bending parts, and a plurality of radiating through holes are uniformly formed in the surface of the radiating fin.
The positioning sleeve 7 and the positioning inserting column 2 are symmetrically provided with limiting screw holes on the surfaces, and the limiting screw holes are internally threaded with hexagon bolts 9.
In the utility model, when in use, a plurality of flexible circuit board bodies 1 are sequentially sleeved on the positioning insertion column 2 through the positioning insertion column 2, so as to realize rapid and accurate combination insertion, a supporting sleeve 3 sleeved outside the positioning insertion column 2 is arranged between the two flexible circuit board bodies 1, the upper end and the lower end of the supporting sleeve 3 are fixedly connected with a heat dissipation supporting plate 5, not only can the flexible circuit board bodies 1 be effectively supported and lifted, but also the heat dissipation supporting plate 5 can rapidly dissipate the heat dissipated when the surface of the flexible circuit board bodies 1 work, so as to ensure the service life of the flexible circuit board bodies 1, and the positioning sleeve 7 is stably fixed on the positioning insertion column 2 through the hexagonal bolt 9 by the positioning sleeve 7 and the limiting pressing plate 8, so that the limiting pressing plate 8 can stably limit the outer flexible circuit board bodies 1, thereby realizing rapid and stable supporting and limiting of the multilayer flexible circuit board bodies 1, being convenient for install and use, through a plurality of fin 6 of connecting between the heat dissipation layer board 5, fin 6 comprises a plurality of kinks and can increase heat radiating area as far as in limited space for area on the heat dissipation layer board 5 can distribute fast and guarantee the radiating efficiency to flexible circuit board body 1.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (5)
1. A multilayer flexible circuit board with high combination precision comprises a plurality of flexible circuit board bodies (1) and is characterized in that jacks are formed in four corners of the surface of each flexible circuit board body (1), positioning insertion columns (2) are inserted in the jacks, four supporting sleeves (3) which are respectively sleeved outside the four positioning insertion columns (2) are arranged between every two adjacent flexible circuit board bodies (1), the supporting sleeves (3) and the positioning insertion columns (2) are connected in a positioning mode through positioning mechanisms (4), heat dissipation supporting plates (5) which are abutted to the surfaces of the two flexible circuit board bodies (1) are fixedly connected to the upper ends and the lower ends of the supporting sleeves (3), a plurality of cooling fins (6) are uniformly and fixedly connected between the upper heat dissipation supporting plates (5) and the lower heat dissipation supporting plates (5), and positioning sleeves (7) which are sleeved outside the positioning insertion columns (2) are arranged on the outer sides of the upper heat dissipation supporting plates and the lower heat, one end of the positioning sleeve (7) close to the flexible circuit board body (1) is fixedly connected with a limiting pressing plate (8) which is in contact with the outside of the flexible circuit board body (1).
2. The multilayer flexible circuit board with high combination precision according to claim 1, wherein the positioning mechanism (4) comprises a positioning rod (41) movably inserted into the side wall of the supporting sleeve (3) through a through hole formed in the side wall of the supporting sleeve (3), a positioning hole (42) correspondingly inserted into the positioning rod (41) is formed in the column wall of the positioning insertion column (2), one end of the positioning rod (41) is fixedly connected with a pulling plate (43), and a return spring (44) sleeved outside the positioning rod (41) is fixedly connected between the pulling plate (43) and the column wall of the supporting sleeve (3).
3. The multilayer flexible circuit board with high bonding precision as claimed in claim 1, wherein the heat dissipation supporting plate (5) and the heat dissipation fins (6) are made of copper.
4. The multi-layer flexible circuit board with high bonding precision as claimed in claim 1, wherein the heat sink (6) comprises a plurality of bent portions and has a plurality of heat dissipating through holes uniformly formed on the surface thereof.
5. The multilayer flexible circuit board with high combination precision as claimed in claim 1, wherein the positioning sleeve (7) and the positioning insertion column (2) are symmetrically provided with limiting screw holes on the surfaces, and hexagonal bolts (9) are connected with the limiting screw holes in an internal thread manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921779560.6U CN210694484U (en) | 2019-10-23 | 2019-10-23 | Multilayer flexible circuit board that combination precision is high |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921779560.6U CN210694484U (en) | 2019-10-23 | 2019-10-23 | Multilayer flexible circuit board that combination precision is high |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210694484U true CN210694484U (en) | 2020-06-05 |
Family
ID=70887336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921779560.6U Expired - Fee Related CN210694484U (en) | 2019-10-23 | 2019-10-23 | Multilayer flexible circuit board that combination precision is high |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210694484U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114585206A (en) * | 2022-03-17 | 2022-06-03 | 伊斯特电子科技(东台)有限公司 | Lateral assembly adjusting mechanism for flexible circuit board |
-
2019
- 2019-10-23 CN CN201921779560.6U patent/CN210694484U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114585206A (en) * | 2022-03-17 | 2022-06-03 | 伊斯特电子科技(东台)有限公司 | Lateral assembly adjusting mechanism for flexible circuit board |
| CN114585206B (en) * | 2022-03-17 | 2023-12-15 | 伊斯特电子科技(东台)有限公司 | Lateral assembly adjusting mechanism for flexible circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200605 Termination date: 20211023 |