CN211831332U - Multilayer printed circuit board - Google Patents
Multilayer printed circuit board Download PDFInfo
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- CN211831332U CN211831332U CN202020841178.XU CN202020841178U CN211831332U CN 211831332 U CN211831332 U CN 211831332U CN 202020841178 U CN202020841178 U CN 202020841178U CN 211831332 U CN211831332 U CN 211831332U
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Abstract
The utility model relates to a circuit board technical field, especially, relate to a multilayer printed circuit board, the bottom fixedly connected with medium plate of equipment mainboard, the bottom middle part fixedly connected with equipment bottom plate of medium plate, and the thickness of equipment bottom plate is greater than the medium plate thickness, the inside fixedly connected with heat absorption metal of medium plate, the heat absorption metal is a style of calligraphy range, and the bottom of heat absorption metal and the top electric connection of equipment bottom plate, the gomphosis groove has been seted up in the top of medium plate through running through, the appearance profile in gomphosis groove is the rectangle, through the medium plate that sets up in equipment mainboard bottom, can be through the heat absorption metal that sets up on the medium plate, the heat that will give off on the equipment mainboard in operating condition absorbs the heat through the heat absorption metal, the rethread sets up outside the circuit board will be discharged the.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a multilayer printed circuit board.
Background
For the production of printed boards, the circuit diagram of the design is only the most basic circuit diagram and cannot be directly used for production because many designers do not know the production process of the circuit board. Therefore, the line file needs to be modified and edited before actual production, and not only a film (film) suitable for the production process of the factory needs to be made, but also corresponding punching data and die sinking data, and other data useful for production need to be made. It is directly related to each subsequent production engineering.
The existing circuit board can generate a large amount of heat in a working state, so that the circuit board is easy to damage due to overhigh temperature.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a multilayer printed circuit board.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the heat absorption device comprises an equipment main board and heat absorption metal, wherein a middle board is fixedly connected to the bottom end of the equipment main board, the outline of the equipment main board is rectangular, the cross section size of the equipment main board is larger than that of the middle board, an equipment bottom board is fixedly connected to the middle portion of the bottom end of the middle board, the outline of the equipment bottom board is consistent with that of the equipment main board, the thickness of the equipment bottom board is larger than that of the middle board, the heat absorption metal is fixedly connected to the inner portion of the middle board and arranged in a straight line shape, the cross section size of the heat absorption metal is smaller than that of the middle board, the bottom end of the heat absorption metal is electrically connected with the top end of the equipment bottom board, an embedding groove is formed in the top end of the middle board in a penetrating mode.
Preferably, the bottom of the equipment bottom plate is connected with heat dissipation holes in a penetrating manner, the appearance profiles of the heat dissipation holes are rectangular, the section sizes of the heat dissipation holes are smaller than the section sizes of the equipment bottom plate, one side of the equipment main plate is fixedly connected with a pressing plate, the appearance profiles of the pressing plate are rectangular, and the section sizes of the pressing plate are smaller than the section sizes of the equipment main plate.
Preferably, one side of the pressing plate is fixedly connected with a fixing plate, the inside of the fixing plate is fixedly connected with one side of the equipment main board, the outline of the fixing plate is rectangular, and the cross-sectional dimension of the fixing plate is larger than that of the pressing plate.
Preferably, the fixed plate is fixedly connected with wire rods on one side far away from the pressing plate, the contour of each wire rod is circular, the plurality of wire rods are uniformly arranged in a straight line shape, the wire rods on one side far away from the pressing plate are fixedly connected with butt joints, the contour of each butt joint is trapezoidal, and the thickness of each butt joint is larger than the sum of the thicknesses of the equipment main board, the middle board and the equipment bottom board.
Preferably, the top end electric connection of equipment mainboard has main electroplax, the top fixed connection of main electroplax has the chip groove, and the appearance profile that is main electroplax is the rectangle, the cross sectional dimension of main electroplax is less than the cross sectional dimension of equipment mainboard, the cross sectional dimension of chip groove is less than the cross sectional dimension of main electroplax, the top electric connection of equipment mainboard has the electric wire board.
Preferably, the top middle part fixedly connected with lines of equipment mainboard, the cross sectional dimension of lines is less than the cross sectional dimension of equipment mainboard, the top electric connection of equipment mainboard has the stopper, one side fixedly connected with line board of stopper, the bottom of line board and the top electric connection of equipment mainboard.
Advantageous effects
1. The utility model discloses in, through setting up the medium plate in equipment mainboard bottom, can be through the heat absorption metal that sets up on the medium plate, the heat that will give off on the equipment mainboard in operating condition absorbs the heat through the heat absorption metal, and the rethread setting will be outside the heat discharge circuit board of heat absorption metal absorption through the louvre at the equipment bottom plate of medium plate bottom.
Drawings
Fig. 1 is an axial view structural schematic diagram of a multilayer printed circuit board according to the present invention;
fig. 2 is a schematic side view of a multilayer printed circuit board according to the present invention;
fig. 3 is a schematic diagram of a structure of a middle plate of a multilayer printed circuit board according to the present invention;
fig. 4 is a schematic structural diagram of a bottom plate of a multilayer printed circuit board device according to the present invention.
Illustration of the drawings:
1. an equipment main board; 2. a middle plate; 3. an equipment backplane; 4. a butt joint port; 5. a wire rod; 6. a fixing plate; 7. A line board; 8. a limiting block; 9. lines; 10. pressing a plate; 11. a chip slot; 12. a main electric board; 13. a wiring board; 14. a fitting groove; 15. a heat absorbing metal; 16. and (4) heat dissipation holes.
Detailed Description
In order to make the technical means, the creation features, the achievement purposes and the functions of the present invention easy to understand, the present invention will be further explained below with reference to the following embodiments and the accompanying drawings, but the following embodiments are only the preferred embodiments of the present invention, and not all embodiments are included. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative work belong to the protection scope of the present invention.
Specific embodiments of the present invention will be described below with reference to the accompanying drawings.
The first embodiment is as follows:
referring to fig. 1-2, a multilayer printed circuit board comprises an equipment main board 1 and a heat absorbing metal 15, wherein the bottom end of the equipment main board 1 is fixedly connected with a middle plate 2, the outline of the equipment main board 1 is rectangular, the cross-sectional dimension of the equipment main board 1 is larger than that of the middle plate 2, the middle part of the bottom end of the middle plate 2 is fixedly connected with an equipment bottom plate 3, the outline of the equipment bottom plate 3 is consistent with that of the equipment main board 1, the thickness of the bottom plate 3 is larger than that of the middle plate 2, the inner part of the middle plate 2 is fixedly connected with heat absorbing metal 15, the heat absorbing metal 15 is arranged in a straight line shape, the cross-sectional dimension of the heat absorbing metal 15 is smaller than that of the middle plate 2, the bottom end of the heat absorbing metal 15 is electrically connected with the top end of the equipment bottom plate 3, the top end of the middle plate 2 is provided with a tabling groove 14 in a penetrating mode, the shape outline of the tabling groove 14 is rectangular, and the cross-sectional dimension of the tabling groove 14 is smaller than that of the middle plate 2.
The second embodiment is as follows:
referring to fig. 3-4, a multi-layer printed circuit board, a heat dissipation hole 16 is penetratingly connected to a bottom end of an equipment bottom plate 3, an outline of the heat dissipation hole 16 is rectangular, a cross-sectional dimension of the heat dissipation hole 16 is smaller than a cross-sectional dimension of the equipment bottom plate 3, a pressing plate 10 is fixedly connected to one side of an equipment main plate 1, the outline of the pressing plate 10 is rectangular, the cross-sectional dimension of the pressing plate 10 is smaller than the cross-sectional dimension of the equipment main plate 1, a fixing plate 6 is fixedly connected to one side of the pressing plate 10, an inner portion of the fixing plate 6 is fixedly connected to one side of the equipment main plate 1, the outline of the fixing plate 6 is rectangular, the cross-sectional dimension of the fixing plate 6 is larger than the cross-sectional dimension of the pressing plate 10, a wire rod 5 is fixedly connected to one side of the fixing plate 6 away from the pressing plate 10, the appearance profile to interface 4 is trapezoidal, the thickness to interface 4 is greater than equipment mainboard 1, the sum of the thickness of medium plate 2 and equipment bottom plate 3, the top electric connection of equipment mainboard 1 has main electroplax 12, the top fixed connection of main electroplax 12 has chip groove 11, it is the rectangle that the appearance profile of main electroplax 12, the cross sectional dimension of main electroplax 12 is less than the cross sectional dimension of equipment mainboard 1, the cross sectional dimension of chip groove 11 is less than the cross sectional dimension of main electroplax 12, the top electric connection of equipment mainboard 1 has electric wire board 13, the top middle part fixedly connected with lines 9 of equipment mainboard 1, the cross sectional dimension of lines 9 is less than the cross sectional dimension of equipment mainboard 1, the top electric connection of equipment mainboard 1 has stopper 8, one side fixedly connected with line board 7 of stopper 8, the bottom of line board 7 and the top electric connection of equipment mainboard 1.
The utility model discloses a theory of operation: firstly, through the middle plate 2 arranged at the bottom end of the equipment main board 1, the heat emitted from the equipment main board 1 in the working state can be absorbed through the heat absorbing metal 15 by the heat absorbing metal 15 arranged on the middle plate 2, and then the heat absorbed by the heat absorbing metal 15 is discharged out of the circuit board through the heat radiating holes 16 by the equipment bottom plate 3 arranged at the bottom end of the middle plate 2.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A multilayer printed wiring board comprising an apparatus main board (1) and a heat absorbing metal (15), characterized in that: the bottom end of the equipment main board (1) is fixedly connected with a middle board (2), the outline of the equipment main board (1) is rectangular, the sectional dimension of the equipment main board (1) is larger than that of the middle board (2), the middle part of the bottom end of the middle board (2) is fixedly connected with an equipment bottom board (3), the outline of the equipment bottom board (3) is consistent with that of the equipment main board (1), the thickness of the equipment bottom board (3) is larger than that of the middle board (2), heat absorption metal (15) is fixedly connected inside the middle board (2), the heat absorption metal (15) is arranged in a straight line shape, the sectional dimension of the heat absorption metal (15) is smaller than that of the middle board (2), the bottom end of the heat absorption metal (15) is electrically connected with the top end of the equipment bottom board (3), and an embedding groove (14) is formed in a penetrating manner at the top end of the middle, the outer contour of the embedding groove (14) is rectangular, and the cross section size of the embedding groove (14) is smaller than that of the middle plate (2).
2. A multilayer printed wiring board according to claim 1, wherein: the bottom through connection of equipment bottom plate (3) has louvre (16), the appearance profile of louvre (16) is the rectangle, the cross sectional dimension of louvre (16) is less than the cross sectional dimension of equipment bottom plate (3), one side fixedly connected with clamp plate (10) of equipment mainboard (1), the appearance profile of clamp plate (10) is the rectangle, and the cross sectional dimension of clamp plate (10) is less than the cross sectional dimension of equipment mainboard (1).
3. A multilayer printed wiring board according to claim 2, wherein: one side fixedly connected with fixed plate (6) of clamp plate (10), and the inside of fixed plate (6) and one side fixed connection of equipment mainboard (1), the appearance profile of fixed plate (6) is the rectangle, the cross sectional dimension of fixed plate (6) is greater than the cross sectional dimension of clamp plate (10).
4. A multilayer printed wiring board according to claim 3, wherein: one side fixedly connected with line pole (5) of clamp plate (10) are kept away from in fixed plate (6), the appearance profile of line pole (5) is circular, and is a plurality of line pole (5) be a style of calligraphy align to grid, one side fixedly connected with to interface (4) of clamp plate (10) are kept away from in line pole (5), the appearance profile to interface (4) is trapezoidal, the thickness to interface (4) is greater than the sum of the thickness of equipment mainboard (1), medium plate (2) and equipment bottom plate (3).
5. A multilayer printed wiring board according to claim 1, wherein: the top electric connection of equipment mainboard (1) has main electroplax (12), the top fixed connection of main electroplax (12) has chip groove (11), and the appearance profile that is main electroplax (12) is the rectangle, the cross sectional dimension of main electroplax (12) is less than the cross sectional dimension of equipment mainboard (1), the cross sectional dimension of chip groove (11) is less than the cross sectional dimension of main electroplax (12), the top electric connection of equipment mainboard (1) has wire board (13).
6. A multilayer printed wiring board according to claim 1, wherein: the top middle part fixedly connected with lines (9) of equipment mainboard (1), the cross sectional dimension of lines (9) is less than the cross sectional dimension of equipment mainboard (1), the top electric connection of equipment mainboard (1) has stopper (8), one side fixedly connected with line board (7) of stopper (8), the bottom of line board (7) and the top electric connection of equipment mainboard (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020841178.XU CN211831332U (en) | 2020-05-19 | 2020-05-19 | Multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020841178.XU CN211831332U (en) | 2020-05-19 | 2020-05-19 | Multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211831332U true CN211831332U (en) | 2020-10-30 |
Family
ID=73022065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020841178.XU Active CN211831332U (en) | 2020-05-19 | 2020-05-19 | Multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211831332U (en) |
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2020
- 2020-05-19 CN CN202020841178.XU patent/CN211831332U/en active Active
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