CN220569401U - Long-life embedded memory chip - Google Patents

Abstract

The utility model discloses a long-life embedded memory chip in the technical field of memory chips, which comprises a core body, a bottom plate and a circuit board, wherein the bottom plate is positioned below the core body, the circuit board is positioned below the bottom plate, connecting cotton is adhered to the bottom of the core body, connecting blocks are fixedly connected to the front side and the rear side of the left side and the right side of the bottom plate, a clamping groove is formed in the middle of the top of the circuit board, radiating holes are formed in the middle of the bottom of the circuit board and are uniformly distributed, and the long-life embedded memory chip is reasonable in structural design, so that kinetic energy generated by electrons of the embedded memory chip during use is buffered, and the influence on the service life of the electrons of the embedded memory chip due to continuous high-temperature use can be effectively avoided; when the memory chip is installed, the memory chip can be tightly installed and connected, so that the memory chip is more stable and easy to install, and the use of the memory chip is not easily affected.

Description

Long-life embedded memory chip

Technical Field

The utility model relates to the technical field of memory chips, in particular to a long-service-life embedded memory chip.

Background

The memory chip is a chip for storing data in a dust collecting circuit, and is also a specific application of the concept of an embedded system chip in the memory industry, the embedded memory chip is a chip embedded in an electronic product, and the embedded memory chip has service life limitation after production.

The existing embedded memory chip electrons have kinetic energy in motion, namely 'electron migration', and the flow of electrons impacts metal atoms, so that the metal surface becomes uneven, and meanwhile, the service life of the embedded memory chip electrons is also influenced when the embedded memory chip electrons are used at a continuous high temperature; and when the memory chip is installed, the memory chip is usually directly clamped on a PCB, the installation is not stable enough, and the use of the chip is easily affected, so that the embedded memory chip with long service life is provided.

Disclosure of Invention

The utility model aims to provide a long-life embedded memory chip, which aims to solve the problems that in the prior art, electrons of the existing embedded memory chip have kinetic energy in motion, namely 'electron migration', and the flow of electrons impacts metal atoms, so that the metal surface becomes uneven, and meanwhile, the embedded memory chip is continuously used at high temperature; and when the memory chip is installed, the memory chip is usually directly clamped on a PCB, so that the problem of insufficient stability in installation is solved.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a high life's embedded memory chip, includes core, bottom plate and circuit board, the bottom plate is located the below of core, the circuit board is located the below of bottom plate, the bottom bonding of core has the connection cotton, both sides fixedly connected with connecting block around the side of bottom plate, open in the middle of the top of circuit board has the draw-in groove, open in the middle of the bottom of circuit board has the louvre, and is evenly distributed.

As a further description of the above technical solution:

the connecting cotton is made of copper foil special-shaped sponge materials.

As a further description of the above technical solution:

the bottom plate is made of aluminum alloy materials.

As a further description of the above technical solution:

and a mounting hole is formed in the middle of the top of the inner cavity of the connecting block.

As a further description of the above technical solution:

the connecting blocks are sequentially clamped in the middle of the inner cavity of the clamping groove.

As a further description of the above technical solution:

the clamping groove is in an I-shaped shape.

Compared with the prior art, the utility model has the beneficial effects that:

1. this embedded memory chip of high life, through connecting cotton, bottom plate and the louvre of addding, copper foil dysmorphism sponge material that can adopt through connecting cotton has loose elasticity, reduce the impact that produces with PCB board fixed connection when can dispel the heat well and being convenient for the electron motion of core, the aluminum alloy material that the bottom plate adopted has good radiating effect simultaneously, cooperation a plurality of louvres can strengthen the radiating effect of bottom plate for the kinetic energy that the embedded memory chip electron produced when using buffers, also can effectively avoid lasting high temperature use and influence the life of embedded memory chip electron.

2. This embedded memory chip of high life, through the bottom plate of setting up, the connecting block and the mounting hole and the draw-in groove of seting up, can be inside the draw-in groove through a plurality of connecting blocks card on the bottom plate, adopt the connection of draw-in groove to the connecting block of I shape for the chip on the bottom plate is more stable be difficult for droing with being connected of circuit board, the setting up of cooperation mounting hole can make the connecting block be inseparabler stable with being connected of draw-in groove, make when installing memory chip, can carry out inseparable erection joint to the chip, make its use of installing more stable easy, difficult influence chip.

Drawings

FIG. 1 is a schematic perspective view of an embedded memory chip with a long lifetime according to the present utility model;

FIG. 2 is a schematic diagram of a schematic cross-sectional front view of a long-life embedded memory chip according to the present utility model;

FIG. 3 is a schematic diagram of a right-side cross-sectional structure of a long-life embedded memory chip according to the present utility model;

fig. 4 is a schematic top view of a long-life embedded memory chip according to the present utility model.

In the figure: 100. a core; 110. connecting cotton; 200. a bottom plate; 210. a connecting block; 220. a mounting hole; 300. a circuit board; 310. a clamping groove; 320. and the heat dissipation holes.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model. Furthermore, features defining "first", "second" may include one or more such features, either explicitly or implicitly. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

The utility model provides the embedded memory chip with long service life, so that kinetic energy generated by the embedded memory chip electrons in use is buffered, and the influence on the service life of the embedded memory chip electrons due to continuous high-temperature use can be effectively avoided; when the memory chip is installed, the chip can be tightly installed and connected, so that the installation is more stable and easy, and the use of the chip is not easily affected, and referring to fig. 1-4, the memory chip comprises a core 100, a bottom plate 200 and a circuit board 300;

referring to fig. 1 to 4 again, connecting cotton 110 is adhered to the bottom of the core 100, the connecting cotton 110 is used for facilitating buffering and cooling of the core 100, and the core 100 is used for installing the connecting base plate 200 and the circuit board 300;

referring to fig. 1 to 4 again, connecting blocks 210 are fixedly connected to the front and rear sides of the left and right sides of the base plate 200, the connecting blocks 210 are used for mounting and connecting the base plate 200 with the circuit board 300, the base plate 200 is located below the core 100, specifically, the base plate 200 is mounted and connected with the core 100 through the connecting cotton 110, the base plate 200 is adhered to the bottom of the connecting cotton 110, and the base plate 200 is used for mounting and connecting the core 100;

referring to fig. 1-4 again, a clamping groove 310 is formed in the middle of the top of the circuit board 300, the clamping groove 310 is used for installing and connecting the circuit board 300 and the bottom plate 200, heat dissipation holes 320 are formed in the middle of the bottom of the circuit board 300 and are uniformly distributed, the heat dissipation holes 320 are used for facilitating the heat dissipation of the circuit board 300, the circuit board 300 is located below the bottom plate 200, and specifically, the circuit board 300 is installed and connected with the bottom plate 200 through the clamping groove 310 and the connecting block 210, and the circuit board 300 is used for installing and using a memory chip.

In summary, the connecting cotton 110, the bottom plate 200 and the heat dissipation holes 320 are added to buffer the kinetic energy generated by the embedded memory chip electrons during use, so as to effectively avoid the influence on the service life of the embedded memory chip electrons due to continuous high temperature use.

Referring to fig. 1 to 4 again, the connection cotton 110 is made of a copper foil special-shaped sponge material, and the connection cotton 110 has elasticity and heat dissipation effect due to the copper foil special-shaped sponge material.

Referring to fig. 1 to 4 again, the base plate 200 is made of an aluminum alloy material, so that the heat dissipation effect of the base plate 200 is good.

Referring to fig. 1-4 again, a mounting hole 220 is formed in the middle of the top of the inner cavity of the connection block 210, and the connection block 210 is conveniently fastened to the circuit board 300 through the mounting hole 220.

Referring to fig. 1-4 again, the connection blocks 210 are sequentially clamped in the middle of the inner cavity of the clamping groove 310, and the connection between the connection blocks 210 and the clamping groove 310 facilitates the installation connection between the bottom plate 200 and the circuit board 300.

Referring to fig. 1-4 again, the clamping groove 310 has an i-shape, and the connection between the clamping groove 310 and the connection block 210 is more compact due to the i-shape.

In summary, by adding the base plate 200, the connecting block 210, the mounting hole 220 and the clamping groove 310, the chip can be tightly mounted and connected when the memory chip is mounted, so that the mounting is more stable and easy, and the use of the chip is not easy to be affected.

When specific use, the technical field first will block in proper order at the draw-in groove 310 inside through a plurality of connecting blocks 210 on the bottom plate 200, the setting up of cooperation mounting hole 220 can make the connecting block 210 and the connection of draw-in groove 310 in the circuit board 300 inseparabler stable, the copper foil dysmorphism sponge material that the rethread is connected cotton 110 and is adopted has loose elasticity, reduce the impact that produces with PCB board fixed connection when can dispel the heat well and be convenient for the electron motion of core 100, the aluminum alloy material that bottom plate 200 adopted has good radiating effect simultaneously, cooperation a plurality of louvres 320 can strengthen the radiating effect of bottom plate 200, begin to use promptly.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although the utility model has been described hereinabove with reference to embodiments, various modifications thereof may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. In particular, the features of the disclosed embodiments may be combined with each other in any manner so long as there is no structural conflict, and the exhaustive description of these combinations is not given in this specification merely for the sake of brevity and resource saving. Therefore, it is intended that the utility model not be limited to the particular embodiment disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.

Claims (6)

1. The utility model provides a embedded memory chip of high life which characterized in that: including core (100), bottom plate (200) and circuit board (300), bottom plate (200) are located the below of core (100), circuit board (300) are located the below of bottom plate (200), the bottom bonding of core (100) has connecting cotton (110), both sides fixedly connected with connecting block (210) around the left and right sides of bottom plate (200), open in the middle of the top of circuit board (300) has draw-in groove (310), open in the middle of the bottom of circuit board (300) has louvre (320), and is evenly distributed.

2. The high lifetime embedded memory chip of claim 1, wherein: the connecting cotton (110) is made of copper foil special-shaped sponge materials.

3. The high lifetime embedded memory chip of claim 1, wherein: the bottom plate (200) is made of aluminum alloy materials.

4. The high lifetime embedded memory chip of claim 1, wherein: and a mounting hole (220) is formed in the middle of the top of the inner cavity of the connecting block (210).

5. The high lifetime embedded memory chip of claim 1, wherein: the connecting blocks (210) are sequentially clamped in the middle of the inner cavity of the clamping groove (310).

6. The high lifetime embedded memory chip of claim 1, wherein: the clamping groove (310) is in an I-shaped shape.