CN211702530U - Surface-mounted element heat dissipation structure - Google Patents

Abstract

The utility model provides a patch element heat radiation structure belongs to circuit board technical field, install the pin including the radiator lower extreme, the radiator passes through the pin and vertically sets up on the PCB board for the radiator is close to in patch element, and the rational utilization space of direction of height between the patch element saves the installation space of patch element on the PCB board, can make patch element obtain good heat dissipation simultaneously. The utility model provides a patch element heat radiation structure, the pin is installed to the radiator lower extreme, and the radiator passes through the pin and vertically sets up on the PCB board for the radiator is close to in patch element, and the rational utilization the space of direction of height between the patch element, the installation space of the patch element on saving the PCB board can make patch element obtain good radiating effect simultaneously.

Description

Surface-mounted element heat dissipation structure

Technical Field

The utility model belongs to the technical field of the circuit board, more specifically say, relate to a patch element heat radiation structure.

Background

When the high power density machine adopts the design of two-sided paster PCB board, conventional paster component uses the paster copper to dispel the heat, because the heat that the paster component of high power produced is great, often needs a large amount of copper sheets or massive copper sheet to locate the surface of PCB board and dispels the heat, occupies a large amount of surface areas of PCB board, reduces the space utilization of PCB board.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a patch element heat radiation structure aims at solving and can occupy a large amount of surface areas of PCB board to patch element heat dissipation, reduces the problem of the space usage rate of PCB board.

In order to achieve the above object, the utility model adopts the following technical scheme: provided is a chip component heat dissipation structure for mounting on a PCB board, including:

the lower end of the radiator is provided with a pin;

the radiator is longitudinally arranged on the PCB through the pins and is used for being close to the patch element;

the heat radiator is used for conducting the heat of the patch element outwards.

As another embodiment of the present application, two pins are disposed at the lower end of the heat sink, and the two pins are disposed vertically;

the radiator is longitudinally arranged on the PCB through the two pins and is used for being close to two adjacent sides of the patch element.

As another embodiment of the present application, the lower end of the heat sink is provided with three pins, the adjacent pins are vertically arranged, and the three pins are enclosed to form a U-shaped structure;

the radiator is longitudinally arranged on the PCB through the three pins and is used for being close to three adjacent sides of the patch element.

As another embodiment of the present application, there are two heat sinks;

the two radiators are longitudinally arranged on the PCB through the pins respectively and are used for being close to two adjacent sides of the patch element.

As another embodiment of the present application, there are two heat sinks;

the two radiators are longitudinally arranged on the PCB through the pins respectively and are used for being close to two opposite side edges of the patch element.

As another embodiment of the present application, the number of the heat sinks is three;

the three radiators are longitudinally arranged on the PCB through the pins respectively and are used for being close to three adjacent sides of the patch element.

As another embodiment of the present application, the pin is soldered on the PCB.

As another embodiment of the present application, the heat sink is integrally formed with the leads.

The utility model provides a patch element heat radiation structure's beneficial effect lies in: compared with the prior art, the utility model discloses patch element heat radiation structure, the pin is installed to the radiator lower extreme, and the radiator passes through the pin and vertically sets up on the PCB board for the radiator is close to in patch element, and the rational utilization space of direction of height between the patch element saves the installation space of patch element on the PCB board, can make patch element obtain good radiating effect simultaneously.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a heat sink and a pin according to an embodiment of the present invention;

fig. 2 is a schematic structural view illustrating a heat sink and pins mounted on a PCB according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a heat dissipation structure of a patch element according to a first embodiment of the present invention;

fig. 4 is a schematic structural diagram of a heat dissipation structure of a patch element provided in the second embodiment of the present invention;

fig. 5 is a schematic structural view of a heat dissipation structure of a patch element provided in the third embodiment of the present invention;

fig. 6 is a schematic structural view of a heat dissipation structure of a patch element provided in the fourth embodiment of the present invention;

fig. 7 is a schematic structural diagram of a patch element heat dissipation structure according to a fifth embodiment of the present invention.

In the figure: 100. a PCB board; 200. a patch element; 300. a heat sink; 400. and (7) a pin.

Detailed Description

In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Referring to fig. 1 to 7, a heat dissipation structure of a patch element according to the present invention will now be described. The chip component heat dissipation structure, for mounting on the PCB board 100, includes a heat sink 300 and pins 400.

The lower end of the heat sink 300 is provided with a pin 400; the heat sink 300 is longitudinally disposed on the PCB board 100 through the pins 400 for being close to the chip element 200; heat spreader 300 serves to conduct heat of patch element 200 to the outside.

The utility model provides a patch element heat radiation structure, compared with the prior art, pin 400 is installed to radiator 300 lower extreme, and radiator 300 vertically sets up on PCB board 100 through pin 400 for radiator 300 is close to in patch element 200, and the rational utilization space of direction of height between patch element 200 saves the installation space of patch element 200 on PCB board 100, can make patch element 200 obtain good radiating effect simultaneously.

The shape of the heat sink 300 is not limited, and the heat sink can be designed according to the layout requirement of the PCB, and the heat sink can also be designed into a special shape. The number and size of the pins 400, the distance between the pins 400, the size of the heat sink, the material, and the shape of the heat sink fins of the heat sink 300 are not limited. Optionally, the heat sink 300 is made of a heat dissipation fan or a plastic material; the heat sink 300 is a heat sink with heat dissipating fins and is made of aluminum alloy.

In the first embodiment, referring to fig. 3, two pins 400 are disposed at the lower end of the heat sink 300, and the two pins 400 are disposed vertically; heat spreader 300 is longitudinally disposed on PCB board 100 by two pins 400 for being adjacent to two adjacent sides of chip element 200. In this embodiment, the heat sink 300 is an integral structure and includes two vertical straight sections, and the two pins 400 are respectively mounted at the lower portions of the two straight sections, so that the heat sink 300 is close to two adjacent sides of the patch element 200 to dissipate heat of the patch element 200. The heat sink 300 is provided in the structure in this embodiment according to the condition of the space reserved around the chip element 200 on the PCB board 100.

In the second embodiment, referring to fig. 4, the lower end of the heat sink 300 is provided with three pins 400, adjacent pins 400 are vertically arranged, and the three pins 400 are enclosed into a U-shaped structure; heat spreader 300 is longitudinally disposed on PCB board 100 by three pins 400 for proximity to three adjacent sides of chip element 200. In this embodiment, the heat sink 300 is an integral structure and includes three mutually perpendicular straight sections, the three straight sections may form a U shape, a pi shape, an F shape, or the like, and the three pins 400 are respectively installed at the lower portions of the three straight sections, so that the heat sink 300 is close to three adjacent sides of the patch element 200 to dissipate heat of the patch element 200. The heat sink 300 is provided in the structure in this embodiment according to the condition of the space reserved around the chip element 200 on the PCB board 100.

In the third embodiment, referring to fig. 5, there are two heat sinks 300; two heat sinks 300 are respectively and longitudinally arranged on the PCB board 100 through pins 400, and are used to be close to two adjacent sides of the chip component 200. In this embodiment, the heat sinks 300 are in a split structure, that is, the lower end of each heat sink 300 is provided with one pin 400, and the two heat sinks 300 are respectively installed through the respective pins 400, so that the heat sinks 300 are close to two adjacent sides of the patch element 200 to dissipate heat of the patch element 200. The heat sink 300 is provided in the structure in this embodiment according to the condition of the space reserved around the chip element 200 on the PCB board 100.

In the fourth embodiment, referring to fig. 6, there are two heat sinks 300; two heat sinks 300 are respectively and longitudinally disposed on the PCB board 100 through pins 400, and are used to be close to two opposite sides of the chip element 200. In this embodiment, the heat sinks 300 are in a split structure, that is, the lower end of each heat sink 300 is provided with one pin 400, and the two heat sinks 300 are respectively installed through the respective pins 400, so that the heat sinks 300 are close to two opposite sides of the patch element 200 to dissipate heat of the patch element 200. The heat sink 300 is provided in the structure in this embodiment according to the condition of the space reserved around the chip element 200 on the PCB board 100.

In the fifth embodiment, referring to fig. 7, three heat sinks 300 are provided; three heat sinks 300 are respectively and longitudinally arranged on the PCB board 100 through pins 400 for being close to three adjacent sides of the chip element 200. In this embodiment, the heat sink 300 is a split structure, that is, the lower end of each heat sink 300 is provided with one pin 400, the three heat sinks 300 may form a U shape, a pi shape, an F shape, or the like, and the three heat sinks 300 are respectively installed through their respective pins 400, so that the heat sinks 300 are close to three adjacent sides of the patch element 200 to dissipate heat of the patch element 200. The heat sink 300 is provided in the structure in this embodiment according to the condition of the space reserved around the chip element 200 on the PCB board 100.

As a specific embodiment of the heat dissipation structure of the patch element provided in the present invention, the pin 400 is welded on the PCB board 100. In this embodiment, the lead 400 penetrates the PCB 100 and is vertically soldered to the PCB 100 by soldering. Soldering is a welding method in which a low-melting-point metal solder is melted by heating and then penetrates into and fills a gap at a joint of metal parts. Is widely used in the electronic industry.

As a specific embodiment of the patch element heat dissipation structure provided by the present invention, the heat sink 300 and the pin 400 are integrally formed. In this embodiment, the integrally formed heat sink 300 and the pins 400 can ensure the stability of the heat sink 300 after being soldered on the PCB.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims (8)

1. Paster element heat radiation structure for install on the PCB board, its characterized in that includes:

the lower end of the radiator is provided with a pin;

the radiator is longitudinally arranged on the PCB through the pins and is used for being close to the patch element;

the heat radiator is used for conducting the heat of the patch element outwards.

2. A patch element heat dissipation structure as defined in claim 1, wherein the lower end of the heat sink is provided with two of the pins, the two pins being arranged vertically;

the radiator is longitudinally arranged on the PCB through the two pins and is used for being close to two adjacent sides of the patch element.

3. A patch element heat dissipation structure as recited in claim 1, wherein the lower end of the heat sink has three of the leads, and wherein the leads are vertically disposed adjacent to each other, and wherein the three leads are enclosed in a U-shaped configuration;

the radiator is longitudinally arranged on the PCB through the three pins and is used for being close to three adjacent sides of the patch element.

4. A patch element heat dissipation structure as recited in claim 1, wherein the number of heat sinks is two;

the two radiators are longitudinally arranged on the PCB through the pins respectively and are used for being close to two adjacent sides of the patch element.

5. A patch element heat dissipation structure as recited in claim 1, wherein the number of heat sinks is two;

the two radiators are longitudinally arranged on the PCB through the pins respectively and are used for being close to two opposite side edges of the patch element.

6. A patch element heat dissipation structure as recited in claim 1, wherein there are three of the heat sinks;

the three radiators are longitudinally arranged on the PCB through the pins respectively and are used for being close to three adjacent sides of the patch element.

7. A patch element heat dissipation structure as recited in any one of claims 1-6, wherein the leads are soldered to the PCB.

8. A patch element heat dissipation structure as recited in claim 7, wherein the heat sink is integrally formed with the leads.

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