CN213522905U

CN213522905U - High-frequency multilayer circuit board

Info

Publication number: CN213522905U
Application number: CN202022828822.2U
Authority: CN
Inventors: 曹建奇; 沈绍伦; 叶洪发
Original assignee: Shenzhen Xingda Pcb Co ltd
Current assignee: Shenzhen Xingda Pcb Co ltd
Priority date: 2020-12-01
Filing date: 2020-12-01
Publication date: 2021-06-22
Anticipated expiration: 2030-12-01

Abstract

The utility model discloses a high-frequency multilayer circuit board, which comprises a multilayer circuit board main body, wherein two ends of four sides of the multilayer circuit board main body are fixedly provided with buffer sliding columns, one ends of eight buffer sliding columns are respectively connected with one side of buffer sliding chutes arranged on four sides of the inner wall of a protective outer frame in a sliding way, the centers of two sides of the multilayer circuit board main body are respectively fixedly provided with a plurality of heat conducting thin sheets, and one ends of two sides of the protective outer frame are respectively hinged with a clamping frame, greatly prolongs the service life of the device and has high practical value.

Description

High-frequency multilayer circuit board

Technical Field

The utility model relates to a circuit board technical field specifically is high frequency multilayer circuit board.

Background

Multilayer wiring boards are manufactured by stacking two or more circuits on top of each other with a reliable predetermined interconnection between them. This technique violates the conventional fabrication process from the outset because drilling and plating are completed before all layers are laminated together. The innermost two layers are composed of conventional double-sided panels, while the outer layers are different and are composed of separate single-sided panels. Before lamination, the inner substrate is drilled, through hole plated, pattern transferred, developed and etched, with a double-sided board being a medium layer in between and routing layers on both sides. The multilayer board is a multilayer wiring layer, and a dielectric layer is arranged between every two layers and can be made very thin. The multilayer circuit board has at least three conductive layers, two of which are on the outer surface and the remaining one is incorporated in an insulating board. The electrical connections between them are usually made through plated-through holes in the cross-section of the circuit board.

The existing multilayer circuit board can generate more dust on the surface due to the action of static after being used for a long time, has poor heat dissipation effect, seriously influences the normal operation of a high-frequency circuit, does not have a buffering protection function, and is easily damaged by external force.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high frequency multilayer circuit board to solve the current multilayer circuit board that proposes in the above-mentioned background art and after long-time the use, because the effect of static, the surface can produce more dust, and the radiating effect is also not good simultaneously, seriously influences the normal operation of high frequency circuit, and does not possess buffering safeguard function, receives the problem of external force damage easily.

In order to achieve the above object, the utility model provides a following technical scheme: a high-frequency multilayer circuit board comprises a multilayer circuit board main body, wherein two ends of four lateral sides of the multilayer circuit board main body are fixedly provided with buffer sliding posts, one ends of the eight buffer sliding posts are respectively in sliding connection with one side of a buffer sliding groove formed in the four lateral sides of the inner wall of a protective outer frame, the centers of two sides of the multilayer circuit board main body are respectively fixedly provided with a plurality of heat conducting sheets, one ends of two sides of the protective outer frame are respectively hinged with a clamping frame, the positive centers of the two clamping frames are respectively fixedly provided with a dust-isolating filter screen, the other ends of two sides of the protective outer frame are respectively provided with a plurality of clamping hole grooves, the centers of two ends of the protective outer frame are respectively fixedly provided with a plurality of heat radiating sheets, the top of the protective outer frame and the bottom of the protective outer frame are respectively fixedly provided with a plurality of interface terminals, the inner side of the first routing layer is fixedly connected with the outer side of the second routing layer, the inner side of the second routing layer is fixedly connected with the outer side of the third routing layer, and a medium layer is fixedly arranged at the joint of the first routing layer and the second routing layer and the joint of the second routing layer and the third routing layer.

As an optimal technical scheme of the utility model, eight the outer lane of buffering traveller and multilayer circuit board main part junction is the fixed buffer spring that is provided with all, and eight buffer spring establishes respectively on the surface of eight buffering travelers.

As a preferred technical scheme of the utility model, it is a plurality of joint hole groove is detained with the fixed block that sets up in two block frame back one side respectively and is corresponded the setting.

As an optimal technical scheme of the utility model, a plurality of the heat dissipation thin slice corresponds the setting with a plurality of heat conduction thin slice respectively, and a plurality of heat dissipation through-hole has all been seted up at the top of heat dissipation thin slice and the top of a plurality of heat conduction thin slice.

As an optimal technical scheme of the utility model, it is a plurality of the interface terminal all with multilayer circuit board main part electric connection.

Compared with the prior art, the beneficial effects of the utility model are that: this multilayer circuit board has increased the area of contact with the air heat transfer, can be fast with the heat effluvium, has add the dust-separation filter screen simultaneously, can the long-time use of effectual separation, the accumulation of external dust on circuit board surface to ensured the steady operation of circuit, and possessed better buffering protective capability, can cushion external force such as falling the impact collision, reduced the probability of circuit board damage, promoted its life by a wide margin, had very high practical value.

Drawings

FIG. 1 is a schematic view of the front view of the main body of the present invention;

FIG. 2 is a schematic structural view of a main body of the present invention in front view;

FIG. 3 is a schematic structural view of a main body side view cross section of the present invention;

fig. 4 is a schematic view of the front view of the fastening frame of the present invention;

fig. 5 is an enlarged schematic structural view of part a of the present invention.

In the figure: 1. a dust-proof filter screen; 2. a protective outer frame; 3. an interface terminal; 4. clamping the frame; 5. a buffer strut; 6. a heat dissipating sheet; 7. a multilayer wiring board main body; 8. a heat conductive sheet; 9. a buffer chute; 10. a heat dissipating through hole; 11. a buffer spring; 12. clamping a hole groove; 13. a first routing layer; 14. a second routing layer; 15. and a third routing layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the utility model provides a high frequency multilayer circuit board, including multilayer circuit board main part 7, the both ends of four avris of multilayer circuit board main part 7 are all fixed and are provided with buffering traveller 5, one end of eight buffering travellers 5 all with one side sliding connection of buffering spout 9 that four avris of protection frame 2 inner wall were seted up, the center of multilayer circuit board main part 7 both sides is all fixed and is provided with a plurality of heat conduction thin slice 8, the one end of protection frame 2 both sides all articulates there is block frame 4, the positive center of two block frames 4 is all fixed and is provided with dust-proof filter screen 1, a plurality of joint hole grooves 12 have all been seted up to the other end of protection frame 2 both sides, the center at protection frame 2 both ends is all fixed and is provided with a plurality of heat dissipation thin slice 6, the top of protection frame 2 and the bottom of protection frame 2 are all fixed and are provided with a, Second routing layer 14 and third routing layer 15 constitute, the inboard of first routing layer 13 and the outside fixed connection of second routing layer 14, the inboard of second routing layer 14 and the outside fixed connection of third routing layer 15, the junction of first routing layer 13 and second routing layer 14 and the junction of second routing layer 14 and third routing layer 15 all are fixed and are provided with the dielectric layer.

Preferably, the outer lane of eight

buffering travelers

5 and 7 junctions of multilayer circuit board main part is all fixed and is provided with buffer spring 11, and eight buffer spring 11 overlap respectively and establish on eight buffering travelers 5's surface, makes multilayer circuit board main part 7 possess better buffering protective capacities, can cushion external force such as falling impact collision, reduces the probability of circuit board damage, has promoted its life by a wide margin, has very high practical value.

Preferably, a plurality of joint hole grooves 12 correspond the setting with the fixed block knot that sets up in two block frames 4 back one side respectively, and simple structure is reasonable, makes multilayer circuit board main part 7 install convenient fast.

Preferably, a plurality of heat dissipation thin slice 6 corresponds the setting with a plurality of heat conduction thin slice 8 respectively, and a plurality of heat dissipation through-hole 10 has all been seted up at the top of a plurality of heat dissipation thin slice 6 and the top of a plurality of heat conduction thin slice 8, make multilayer circuit board main part 7 increase the area of contact with the air heat transfer through heat conduction thin slice 8, can give heat dissipation thin slice 6 with the form of heat radiation with the heat fast transfer, thereby reach circuit board rapid cooling's purpose, and heat dissipation thin slice 6 then discharges the heat with the external world.

Preferably, a plurality of interface terminals 3 all with multilayer circuit board main part 7 electric connection, connect convenient to use swiftly, practical value is higher.

When the high-frequency multilayer circuit board is used, the circuit board is taken out firstly, then the circuit board is directly connected into a used circuit through the interface terminal 3, in the using process, the dust-proof filter screen 1 can be effectively used for a long time in a blocking way, external dust is accumulated on the surface of the circuit board, so that the stable operation of the circuit is ensured, a user can lift the clamping frame 4 at intervals of one end, and the dust on the dust-proof filter screen 1 can be cleaned, meanwhile, the high-frequency multilayer circuit board has good buffering and protecting capacity, the buffering sliding column 5 can slide in the buffering sliding groove 9 when stressed, the absorption of energy is carried out by the buffering spring 11 at the outer side, the external forces such as falling collision and the like can be buffered, the probability of circuit board damage is reduced, the service life of the high-frequency multilayer circuit board is greatly prolonged, the heat dissipation thin sheet 6 and the heat conduction thin sheet 8 enable the heat dissipation performance to be, can give heat dissipation thin slice 6 with the form of heat radiation with heat fast transfer to reach circuit board rapid cooling's purpose, heat dissipation thin slice 6 then discharges the heat with the external world, has very high practical value, is worth using widely.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. High frequency multilayer circuit board, including multilayer circuit board main part (7), its characterized in that: the multilayer circuit board is characterized in that two ends of four sides of a multilayer circuit board main body (7) are fixedly provided with buffer sliding columns (5), one ends of the buffer sliding columns (5) are in sliding connection with one sides of buffer sliding grooves (9) formed in the four sides of the inner wall of a protective outer frame (2), the centers of two sides of the multilayer circuit board main body (7) are fixedly provided with a plurality of heat-conducting thin sheets (8), one ends of two sides of the protective outer frame (2) are hinged with clamping frames (4), the positive centers of the two clamping frames (4) are fixedly provided with dust-isolating filter screens (1), the other ends of two sides of the protective outer frame (2) are respectively provided with a plurality of clamping hole grooves (12), the centers of two ends of the protective outer frame (2) are fixedly provided with a plurality of heat-radiating thin sheets (6), the top of the protective outer frame (2) and the bottom of the protective outer frame (2, multilayer circuit board main part (7) comprise first routing layer (13), second routing layer (14) and third routing layer (15), the inboard of first routing layer (13) and the outside fixed connection of second routing layer (14), the inboard of second routing layer (14) and the outside fixed connection of third routing layer (15), the junction of first routing layer (13) and second routing layer (14) and the junction of second routing layer (14) and third routing layer (15) are all fixed and are provided with the dielectric layer.

2. The high-frequency multilayer wiring board according to claim 1, characterized in that: the buffer slide columns (5) and the outer rings of the joints of the multilayer circuit board main bodies (7) are fixedly provided with buffer springs (11), and the buffer springs (11) are respectively sleeved on the surfaces of the buffer slide columns (5).

3. The high-frequency multilayer wiring board according to claim 1, characterized in that: a plurality of clamping hole grooves (12) are respectively arranged corresponding to the clamping buckles fixedly arranged on one side of the back of the two clamping frames (4).

4. The high-frequency multilayer wiring board according to claim 1, characterized in that: the heat dissipation sheets (6) are respectively arranged corresponding to the heat conduction sheets (8), and the heat dissipation sheets (6) and the heat conduction sheets (8) are provided with a plurality of heat dissipation through holes (10).

5. The high-frequency multilayer wiring board according to claim 1, characterized in that: the plurality of interface terminals (3) are electrically connected with the multilayer circuit board main body (7).