CN214014629U - Multilayer board circuit board with heat dissipation function - Google Patents
Multilayer board circuit board with heat dissipation function Download PDFInfo
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- CN214014629U CN214014629U CN202021756880.2U CN202021756880U CN214014629U CN 214014629 U CN214014629 U CN 214014629U CN 202021756880 U CN202021756880 U CN 202021756880U CN 214014629 U CN214014629 U CN 214014629U
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Abstract
The utility model discloses a multiply wood circuit board with heat dissipation function, including multiply wood circuit board body, connecting plate, erection column, support body, circuit board and heat dissipation layer, multiply wood circuit board body top fixed mounting has the connecting plate, heat dissipation layer top fixedly connected with cooling tube, and cooling tube through connection board is connected to heat dissipation layer top, heat conduction layer bottom fixedly connected with heat conduction silicone grease, and the horizontal heating panel of one end fixedly connected with of heat conduction layer is kept away from to heat conduction silicone grease, and the vertical heating panel of one end fixedly connected with of heat conduction silicone grease is kept away from to horizontal heating panel. This multiply wood circuit board with heat dissipation function has increased the radiating effect of multilayer circuit board through setting up on the basis of original circuit board, makes multilayer circuit board can high-efficient timely heat dissipation, and also obtains timely effectual heat dissipation through setting up the circuit board that makes the inlayer, and simple structure, can avoid the circuit board too to concentrate and the heat that arouses gathers the problem, has prolonged the life of circuit board.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a multiply wood circuit board with heat dissipation function.
Background
The circuit board is divided into a single-sided circuit board, a double-sided circuit board and a multilayer circuit board, the most fundamental difference is that the number of the circuit layers is different, the multilayer circuit board refers to a circuit board with three or more layers, the manufacturing process of the multilayer circuit board is that a manufacturing procedure of inner layer pressing is added on the basis of a single-sided panel and a double-sided panel, the manufacturing method generally comprises the steps of firstly manufacturing inner layer patterns, then manufacturing a single-sided or double-sided substrate by a printing and etching method, incorporating the single-sided or double-sided substrate into a specified layer, heating, pressurizing and bonding, and then drilling the hole after the drilling is the same as the plating through hole method of the double-sided panel. The multilayer circuit board generally has high assembly density and small volume; the connecting line between the electronic components is shortened, and the signal transmission speed is improved; wiring is convenient; for a high-frequency circuit, a ground plane is added to ensure that a signal line pair forms constant low impedance; the shielding effect is good, so the shielding device is widely used in electronic equipment.
To electronic equipment, the during operation all can produce certain heat to make the inside temperature of equipment rise rapidly, if not in time distribute away this heat, the intensification that equipment will last, the device will be because of overheated and become invalid, electronic equipment's reliable performance will descend, consequently need provide a multiply wood circuit board with heat dissipation function in present stage urgently, can in time dispel the heat, the radiating effect of promotion circuit board is in order to solve above-mentioned problem.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a multiply wood circuit board with heat dissipation function to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a multi-layer circuit board with a heat dissipation function comprises a multi-layer circuit board body, a connecting plate, mounting columns, a frame body, a circuit board and a heat dissipation layer, wherein the top of the multi-layer circuit board body is fixedly provided with the connecting plate, the inner side of the connecting plate is fixedly provided with a heat dissipation pipe, the top of the heat dissipation pipe is fixedly provided with an upper heat dissipation hole, the bottom of the heat dissipation pipe is fixedly provided with a lower heat dissipation hole, the upper heat dissipation hole is fixedly arranged at the joint of the connecting plate and the heat dissipation pipe, the lower heat dissipation hole is fixedly connected to the top of the heat dissipation layer, the two ends of the multi-layer circuit board body are fixedly provided with the mounting columns, the two ends of the circuit board body are fixedly provided with the frame body, the mounting columns penetrate through the connecting plate and are fixedly connected to the inner cavity of the frame body, the connecting plate is fixedly connected with the frame body through the mounting columns, the inner side of the middle of the multi-layer circuit board body is fixedly provided with the circuit board, the two ends of the circuit board are fixedly provided with elastic rubber pads, and the insulating heat conduction rubber is fixedly arranged on the surface of the circuit board, multiply wood circuit board body bottom fixed mounting has the heat dissipation layer, heat dissipation layer top fixedly connected with connecting plate, heat dissipation layer top fixedly connected with cooling tube, the cooling tube runs through the connecting plate and is connected to heat dissipation layer top, heat dissipation layer top fixed mounting has the heat-conducting layer, heat-conducting layer bottom fixedly connected with heat conduction silicone grease, the horizontal heating panel of one end fixedly connected with of heat-conducting layer is kept away from to heat conduction silicone grease, the vertical heating panel of one end fixedly connected with of heat conduction silicone grease is kept away from to horizontal heating panel.
Preferably, cooling tube fixed mounting is inboard at the mounting panel, and the louvre is connected to the mounting panel inboard on the cooling tube top is seted up the multiunit, and the louvre is connected with the cooling layer under the multiunit is seted up to the cooling tube bottom, has promoted the inside radiating effect of multiply wood circuit board body through setting up, and high-efficient heat absorption has avoided the multiply wood circuit board body damage that heat transfer leads to at a slow pace.
Preferably, the mounting panel bottom is through two sets of support bodies of erection column fixedly connected with, and two sets of support bodies are symmetrical the setting for the line of symmetry along the central line of mounting panel, through setting up two sets of support body symmetries, has guaranteed the stability of multiply wood circuit board body, has avoided the later stage installation to lead to the slope because of the atress is uneven to multiply wood circuit board body function causes the influence.
Preferably, four groups of mounting columns are fixedly mounted on the inner side of the mounting plate, and the four groups of mounting columns are dispersedly arranged around the mounting plate by taking the midpoint of the mounting plate as the center.
Preferably, the bottom of the transverse radiating fin is fixedly connected with a plurality of groups of vertical radiating fins, and the vertical radiating fins are arranged on the inner side of the bottom of the transverse radiating fin in a surrounding manner by taking the midpoint of the transverse radiating fin as a central point.
Compared with the prior art, the utility model discloses possess following beneficial effect: this multiply wood circuit board with heat dissipation function is not good for solving current multilayer circuit board radiating effect, can not satisfy user demand's problem, this multiply wood circuit board with heat dissipation function has increased multilayer circuit board's radiating effect through setting up on the basis of original circuit board, make multilayer circuit board can high-efficient timely heat dissipation, and also obtain timely effectual heat dissipation through setting up the circuit board that makes the inlayer, and simple structure, can avoid the circuit board too to concentrate and the heat that arouses accumulates the problem, the life of circuit board has been prolonged.
Drawings
FIG. 1 is a schematic front view of the present invention;
FIG. 2 is an enlarged schematic view of the structure at A in FIG. 1;
fig. 3 is a schematic view of the top view structure of the present invention.
In the figure: 1 multilayer board circuit board body, 2 connecting plates, 21 radiating pipes, 211 upper radiating holes, 212 lower radiating holes, 3 mounting posts, 4 frame bodies, 5 circuit boards, 51 elastic rubber mats, 52 insulating heat-conducting glue, 6 radiating layers, 61 heat-conducting layers, 62 heat-conducting silicone grease, 63 horizontal radiating plates and 64 vertical radiating plates.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a multi-layer circuit board with a heat dissipation function comprises a multi-layer circuit board body 1, a connecting plate 2, mounting columns 3, a frame body 4, a circuit board 5 and a heat dissipation layer 6, wherein the top of the multi-layer circuit board body 1 is fixedly provided with the connecting plate 2, the inner side of the connecting plate 2 is fixedly provided with a heat dissipation pipe 21, the top of the heat dissipation pipe 21 is fixedly provided with an upper heat dissipation hole 211, the bottom of the heat dissipation pipe 21 is fixedly provided with a lower heat dissipation hole 212, the heat dissipation pipe 21 is fixedly arranged at the inner side of the mounting plate 2, the top of the heat dissipation pipe 21 is provided with a plurality of groups of upper heat dissipation holes 211 which are connected to the inner side of the mounting plate 2, the bottom of the heat dissipation pipe 21 is provided with a plurality of groups of lower heat dissipation holes 212 which are connected with the heat dissipation layer 6, the heat dissipation effect in the multi-layer circuit board body 1 is improved through arrangement, the heat is absorbed efficiently, the damage of the multi-layer circuit board body 1 caused by slow heat transfer is avoided, the upper heat dissipation holes 211 are fixedly arranged at the connecting part between the connecting plate 2 and the heat dissipation pipe 21, the lower heat dissipation holes 212 are fixedly connected to the top of the heat dissipation layer 6, the mounting posts 3 are fixedly mounted at two ends of the multilayer board circuit board body 1, four groups of mounting posts 3 are fixedly mounted on the inner side of the mounting plate 2, the four groups of mounting posts 3 are dispersedly arranged around the mounting plate 2 by taking the midpoint of the mounting plate 2 as the center, the frame bodies 4 are fixedly mounted at two ends of the multilayer board circuit board body 1, the mounting posts 3 penetrate through the connecting plate 2 and are fixedly connected to the inner cavity of the frame body 4, the bottom of the mounting plate 2 is fixedly connected with two groups of frame bodies 4 through the mounting posts 3, the two groups of frame bodies 4 are symmetrically arranged along the central line of the mounting plate 2, the stability of the multilayer board circuit board body 1 is ensured by arranging the two groups of frame bodies 4 symmetrically, the inclination caused by uneven stress in the later-stage installation is avoided, so that the function of the multilayer board circuit board body 1 is influenced, and the connecting plate 2 is fixedly connected with the frame body 4 through the mounting posts 3, the circuit board 5 is fixedly installed on the inner side of the middle part of the multilayer circuit board body 1, elastic rubber pads 51 are fixedly arranged at two ends of the circuit board 5, insulating heat-conducting glue 52 is fixedly arranged on the surface of the circuit board 5, a heat dissipation layer 6 is fixedly installed at the bottom of the multilayer circuit board body 1, a connecting plate 5 is fixedly connected to the top of the heat dissipation layer 6, a heat dissipation pipe 21 is fixedly connected to the top of the heat dissipation layer 6 by penetrating through the connecting plate 5, a heat conduction layer 61 is fixedly installed at the top of the heat dissipation layer 6, heat-conducting silicone grease 62 is fixedly connected to the bottom of the heat conduction layer 61, a transverse heat dissipation plate 63 is fixedly connected to one end of the heat-conducting silicone grease 62 away from the heat conduction layer 61, and the vertical radiating fins 64 are arranged around the inner side of the bottom of the transverse radiating fin 63 with the midpoint of the transverse radiating fin 63 as the center point.
The working principle is as follows: this multiply wood circuit board of heat dissipation function, in use, through setting up heat dissipation layer 6, can effectively dispel the heat of multiply wood circuit board body 1, be connected to bottom heat dissipation layer 6 through setting up cooling tube 21 and last louvre 211 and louvre 211 down, let the circuit board 5 of inlayer obtain timely effectual heat dissipation, horizontal heating panel 63 can 62 cover in 5 circuit board bottoms through the heat conduction silicone grease of bottom, better laminating is to circuit board 5's surface, let the heat derive, can avoid the circuit board too concentrate and the heat that arouses gathers the problem, the life of circuit board has been prolonged, the radiating effect of heat promotion circuit board.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a multiply wood circuit board with heat dissipation function, includes multiply wood circuit board body (1), connecting plate (2), erection column (3), support body (4), circuit board (5) and heat dissipation layer (6), its characterized in that: the heat dissipation structure is characterized in that a connecting plate (2) is fixedly mounted at the top of the multilayer board circuit board body (1), a heat dissipation pipe (21) is fixedly mounted at the inner side of the connecting plate (2), an upper heat dissipation hole (211) is fixedly formed in the top of the heat dissipation pipe (21), a lower heat dissipation hole (212) is fixedly formed in the bottom of the heat dissipation pipe (21), the upper heat dissipation hole (211) is fixedly arranged at the joint of the connecting plate (2) and the heat dissipation pipe (21), the lower heat dissipation hole (212) is fixedly connected to the top of a heat dissipation layer (6), mounting columns (3) are fixedly mounted at two ends of the multilayer board circuit board body (1), frame bodies (4) are fixedly mounted at two ends of the multilayer board circuit board body (1), the mounting columns (3) penetrate through the connecting plate (2) and are fixedly connected to inner cavities of the frame bodies (4), and the connecting plate (2) is fixedly connected with the frame bodies (4) through the mounting columns (3), inboard fixed mounting has circuit board (5) in middle part of multiply wood circuit board body (1), circuit board (5) both ends are fixed and are provided with elastic rubber pad (51), circuit board (5) fixed surface is provided with insulating heat conduction glue (52), multiply wood circuit board body (1) bottom fixed mounting has heat dissipation layer (6), heat dissipation layer (6) top fixedly connected with connecting plate (2), heat dissipation layer (6) top fixedly connected with cooling tube (21), cooling tube (21) run through connecting plate (2) and are connected to heat dissipation layer (6) top, heat dissipation layer (6) top fixed mounting has heat-conducting layer (61), heat-conducting layer (61) bottom fixedly connected with heat conduction silicone grease (62), the one end fixedly connected with horizontal heat dissipation board (63) of heat-conducting layer (61) is kept away from in heat conduction silicone grease (62), the vertical heat dissipation board (64) of one end fixedly connected with of heat conduction silicone grease (62) is kept away from in horizontal heat dissipation board (63) .
2. The multilayer board circuit board with heat dissipation function of claim 1, wherein: the radiating pipe (21) is fixedly arranged on the inner side of the connecting plate (2), multiple groups of upper radiating holes (211) are formed in the top of the radiating pipe (21) and are connected to the inner side of the connecting plate (2), and multiple groups of lower radiating holes (212) are formed in the bottom of the radiating pipe (21) and are connected with the radiating layer (6).
3. The multilayer board circuit board with heat dissipation function of claim 1, wherein: the bottom of the connecting plate (2) is fixedly connected with two groups of frame bodies (4) through mounting columns (3), and the two groups of frame bodies (4) are symmetrically arranged along the central line of the connecting plate (2) along the symmetrical line.
4. The multilayer board circuit board with heat dissipation function of claim 1, wherein: four groups of mounting columns (3) are fixedly mounted on the inner side of the connecting plate (2), and the four groups of mounting columns (3) are dispersedly arranged around the connecting plate (2) by taking the midpoint of the connecting plate (2) as the center.
5. The multilayer board circuit board with heat dissipation function of claim 1, wherein: the bottom of the transverse heat dissipation plate (63) is fixedly connected with a plurality of groups of vertical heat dissipation plates (64), and the vertical heat dissipation plates (64) are arranged on the inner side of the bottom of the transverse heat dissipation plate (63) in a surrounding mode by taking the middle point of the transverse heat dissipation plate (63) as a central point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021756880.2U CN214014629U (en) | 2020-08-20 | 2020-08-20 | Multilayer board circuit board with heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021756880.2U CN214014629U (en) | 2020-08-20 | 2020-08-20 | Multilayer board circuit board with heat dissipation function |
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| Publication Number | Publication Date |
|---|---|
| CN214014629U true CN214014629U (en) | 2021-08-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021756880.2U Active CN214014629U (en) | 2020-08-20 | 2020-08-20 | Multilayer board circuit board with heat dissipation function |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117460149A (en) * | 2023-10-31 | 2024-01-26 | 同扬光电（江苏）有限公司 | High-efficient integrated flexible line way board of multilayer structure |
-
2020
- 2020-08-20 CN CN202021756880.2U patent/CN214014629U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117460149A (en) * | 2023-10-31 | 2024-01-26 | 同扬光电（江苏）有限公司 | High-efficient integrated flexible line way board of multilayer structure |
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