CN212278536U - Tin spraying circuit board - Google Patents
Tin spraying circuit board Download PDFInfo
- Publication number
- CN212278536U CN212278536U CN202021031517.4U CN202021031517U CN212278536U CN 212278536 U CN212278536 U CN 212278536U CN 202021031517 U CN202021031517 U CN 202021031517U CN 212278536 U CN212278536 U CN 212278536U
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- circuit board
- tin
- heat
- air vent
- layer
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Abstract
The utility model discloses a hot air solder leveling circuit board, including first circuit board, the lower extreme of first circuit board is equipped with the insulating layer, and the lower extreme of insulating layer is equipped with the second circuit board, and the outside of second circuit board is equipped with the tin bar, and the other end of first circuit board is located to the other end of tin bar, is equipped with horizontal air vent and vertical air vent on first circuit board and the second circuit board. This circuit board can accelerate thermal giveaway through horizontal air vent and vertical air vent to heat-conducting plate and the heat conduction piece through the downside go out the quick conduction of heat, avoid the circuit board high temperature to influence its normal life, can also provide effectual high temperature resistant protection to the circuit board through the resistant high temperature layer of ferroferric oxide, provide effectual anticorrosive protection to the circuit board through the tin spraying layer, and connect between first circuit board and the second circuit board through the tin bar, make first circuit board and second circuit board can effectual contact.
Description
Technical Field
The utility model belongs to the technical field of the circuit board, specifically be a hot air solder leveling circuit board.
Background
In recent decades, the printed circuit board manufacturing industry in China has been developed rapidly, the total output and the total output are the first in the world, the price changes the structure of a supply chain due to the change of electronic products, the price becomes the most important global production base of the printed circuit board, the printed circuit board is developed from a single layer to a double-sided board, a multilayer board and a flexible board and is continuously developed towards high precision, high density and high reliability, and the development trend of the production and manufacturing technology of the printed circuit board in the future is the development towards high density, fine pore diameter, fine lead, high reliability, multilayering, light weight and thin type in performance.
But the existing tin spraying circuit board can not well dissipate heat, so that the service life of the circuit board is easily influenced when the circuit board is in a high temperature condition for a long time, and the connection and protection of the double-layer circuit board are not in place, so that the using effect of the circuit board is not good.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a hot air solder leveling circuit board to solve the not long problem of circuit board life.
In order to achieve the above object, the utility model provides a following technical scheme: a tin spraying circuit board comprises a first circuit board, wherein an insulating layer is arranged at the lower end of the first circuit board, the insulating layer separates the first circuit board from a second circuit board, so that short circuit cannot occur between the first circuit board and the second circuit board, the first circuit board is bonded at the upper end of the insulating layer, and the second circuit board is bonded at the lower end of the insulating layer; the lower end of the insulating layer is provided with a second circuit board, the outer side of the second circuit board is provided with a tin bar, the first circuit board and the second circuit board can be connected through the tin bar, the first circuit board and the second circuit board can be conveniently connected, the other end of the tin bar is arranged on the first circuit board, the first circuit board and the second circuit board are provided with transverse vent holes and longitudinal vent holes, the transverse vent holes are arranged on the first circuit board and the second circuit board at equal intervals, the transverse vent holes are transversely arranged, the longitudinal vent holes are arranged on the first circuit board and the second circuit board at equal intervals, the longitudinal vent holes are longitudinally arranged, the upper end of the first circuit board is provided with a ferroferric oxide high-temperature resistant layer, the ferroferric oxide high-temperature resistant layer is uniformly sprayed on the upper surface of the first circuit board, the upper end of the ferroferric oxide high-temperature resistant layer is provided with a tin spraying layer, and the tin spraying layer is uniformly, the lower extreme of second circuit board is equipped with the heat-conducting plate, and the heat-conducting plate bonds the lower extreme at the second circuit board.
Preferably, the lower extreme of heat-conducting plate is equipped with the bottom plate, and the bottom plate bonds in the lower extreme of heat-conducting plate, and the bottom plate adopts hard rubber to make, has certain elasticity, can take place small deformation.
Preferably, the bottom plate is provided with through holes, the through holes are uniformly distributed on the bottom plate, and the distance between every two adjacent through holes is the same.
Preferably, a heat conduction block is arranged in the through opening, and the cross section area of the heat conduction block is the same as that of the through opening in size, so that the heat conduction block can penetrate through the through opening.
Preferably, the heat-conducting plate is located to the upper end of heat conduction piece, and heat conduction piece and heat-conducting plate adopt the same material to make to both integrative settings can lead out the heat that the circuit board produced fast.
Compared with the prior art, the beneficial effects of the utility model are that: 1. this circuit board can be through horizontal air vent and vertical air vent with higher speed thermal giving off to heat-conducting plate and the heat conduction piece through the downside go out the quick conduction of heat, avoid the circuit board high temperature to influence its normal life.
2. The circuit board can provide effective high-temperature-resistant protection for the circuit board through the ferroferric oxide high-temperature-resistant layer, provide effective anticorrosion protection for the circuit board through the tin spraying layer, and connect the first circuit board and the second circuit board through the tin strips, so that the first circuit board and the second circuit board can be effectively connected.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a bottom view of the present invention;
fig. 3 is a top plan view of the present invention.
In the figure: 1. a first circuit board; 2. an insulating layer; 3. a second circuit board; 4. tin bars; 5. a transverse vent; 6. a longitudinal vent; 7. a ferroferric oxide high-temperature resistant layer; 8. spraying a tin layer; 9. a heat conducting plate; 10. a base plate; 11. a port; 12. a heat conducting block.
Detailed Description
Referring to fig. 1-3, a tin-spraying circuit board includes a first circuit board 1, an insulating layer 2 is disposed at a lower end of the first circuit board 1, the insulating layer 2 separates the first circuit board 1 from a second circuit board 3, so that short circuit does not occur between the first circuit board 1 and the second circuit board 3, the first circuit board 1 is bonded to an upper end of the insulating layer 2, and the second circuit board 3 is bonded to a lower end of the insulating layer 2; the lower end of the insulating layer 2 is provided with a second circuit board 3, the outer side of the second circuit board 3 is provided with a tin bar 4, the first circuit board 1 and the second circuit board 3 can be connected by the tin bar 4, the first circuit board 1 and the second circuit board 3 can be conveniently connected, the first circuit board 1 and the second circuit board 3 are conveniently connected, the other end of the tin bar 4 is arranged on the first circuit board 1, the first circuit board 1 and the second circuit board 3 are provided with transverse vent holes 5 and longitudinal vent holes 6, the transverse vent holes 5 are equidistantly arranged on the first circuit board 1 and the second circuit board 3, the longitudinal vent holes 6 are longitudinally arranged, the upper end of the first circuit board 1 is provided with a ferroferric oxide high temperature resistant layer 7, the ferroferric oxide high temperature resistant layer 7 is uniformly sprayed on the upper surface of the first circuit board 1, the upper end of the ferroferri, the tin spraying layer 8 is uniformly sprayed on the upper surface of the ferroferric oxide high-temperature resistant layer 7, the lower end of the second circuit board 3 is provided with a heat conducting plate 9, and the heat conducting plate 9 is bonded at the lower end of the second circuit board 3.
Referring to fig. 1 and 2, a bottom plate 10 is disposed at a lower end of the heat conducting plate 9, the bottom plate 10 is bonded to the lower end of the heat conducting plate 9, and the bottom plate 10 is made of hard rubber, has a certain elasticity, and can be slightly deformed.
Referring to fig. 1 and 2, the bottom plate 10 is provided with through holes 11, the through holes 11 are uniformly distributed on the bottom plate 10, and the distances between adjacent through holes 11 are the same.
Referring to fig. 1 and 2, a heat-conducting block 12 is disposed in the through hole 11, and a cross-sectional area of the heat-conducting block 12 is equal to a cross-sectional area of the through hole 11, such that the heat-conducting block 12 can pass through the through hole 11.
Referring to fig. 1 and 2, the upper end of the heat conducting block 12 is disposed on the heat conducting plate 9, and the heat conducting block 12 and the heat conducting plate 9 are made of the same material and are integrally disposed, so that heat generated by the circuit board can be rapidly conducted out.
The working principle of the scheme is as follows: during the use, horizontal air vent 5 and vertical air vent 6 can accelerate giving off of the heat that first circuit board 1 and second circuit board 3 produced, and heat-conducting plate 9 and heat conduction piece 12 can go out the heat conduction of production as fast as possible, provide effectual heat dissipation protection for the circuit board, ferriferrous oxide high temperature resistant layer 7 can provide effectual high temperature resistant protection for the circuit board, tin spraying layer 8 can provide effectual corrosion resistant protection for the circuit board, insulating layer 2 can carry out effectual separation with first circuit board 1 and second circuit board 3, make can not take place the short circuit between first circuit board 1 and the second circuit board 3, tin bar 4 is connected first circuit board 1 and second circuit board 3, make first circuit board 1 and second circuit board 3 can effectual contact.
Claims (5)
1. The utility model provides a hot air solder leveling circuit board, includes first circuit board (1), its characterized in that: the lower extreme of first circuit board (1) is equipped with insulating layer (2), the lower extreme of insulating layer (2) is equipped with second circuit board (3), the outside of second circuit board (3) is equipped with tin bar (4), the other end of tin bar (4) is located on first circuit board (1), be equipped with horizontal air vent (5) and vertical air vent (6) on first circuit board (1) and second circuit board (3), the upper end of first circuit board (1) is equipped with ferriferrous oxide high temperature resistant layer (7), the upper end of ferriferrous oxide high temperature resistant layer (7) is equipped with spouts tin layer (8), the lower extreme of second circuit board (3) is equipped with heat-conducting plate (9).
2. The tin-sprayed circuit board of claim 1, wherein: the lower end of the heat conducting plate (9) is provided with a bottom plate (10).
3. The tin-sprayed circuit board of claim 2, wherein: the bottom plate (10) is provided with a through hole (11).
4. The tin-sprayed wiring board of claim 3, wherein: the through opening (11) is internally provided with a heat conducting block (12).
5. The tin-sprayed circuit board of claim 4, wherein: the upper end of the heat conducting block (12) is arranged on the heat conducting plate (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021031517.4U CN212278536U (en) | 2020-06-08 | 2020-06-08 | Tin spraying circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021031517.4U CN212278536U (en) | 2020-06-08 | 2020-06-08 | Tin spraying circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212278536U true CN212278536U (en) | 2021-01-01 |
Family
ID=73882250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021031517.4U Active CN212278536U (en) | 2020-06-08 | 2020-06-08 | Tin spraying circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212278536U (en) |
-
2020
- 2020-06-08 CN CN202021031517.4U patent/CN212278536U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |