CN211808218U - High-toughness heat dissipation laminated plate - Google Patents
High-toughness heat dissipation laminated plate Download PDFInfo
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- CN211808218U CN211808218U CN202020014534.0U CN202020014534U CN211808218U CN 211808218 U CN211808218 U CN 211808218U CN 202020014534 U CN202020014534 U CN 202020014534U CN 211808218 U CN211808218 U CN 211808218U
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Abstract
The utility model belongs to the laminated plate field, it discloses a high tenacity heat dissipation laminated plate, including laying first copper foil, the second copper foil at both ends, from first copper foil to the first tie coat, first heat dissipation shockproof layer, the shockproof layer of second heat dissipation, the second tie coat that arrange in proper order in the second copper foil, its characterized in that, the first heat dissipation shockproof layer all be equipped with a plurality of heat dissipation sand grips with the shockproof layer relative department of the second heat dissipation, the shockproof layer of first heat dissipation and the shockproof layer of second heat dissipation on heat dissipation dislocation arrangement, the shockproof layer of first heat dissipation and second heat dissipation make for heat conduction elastic material; the first bonding layer and the second bonding layer are both of a dense grid structure formed by interweaving elastic fibers; an object of the utility model is to provide a high tenacity heat dissipation laminated plate, toughness is strong, and the heat dissipation is fast and has good antidetonation effect.
Description
Technical Field
The utility model relates to a laminated plate technical field specifically is a high tenacity heat dissipation laminated plate.
Background
The laminated board is a basic material in the electronic industry, is mainly used for processing and manufacturing printed circuit boards, and is widely used in electronic products such as televisions, radios, computers, mobile communication and the like. The existing common laminated plate has the defects of poor toughness and poor heat dissipation effect, so that the laminated plate is easy to damage, and the heat in the laminated plate is accumulated too much to cause fire.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high tenacity heat dissipation laminated plate, toughness is strong, and the heat dissipation is fast and has good antidetonation effect.
The utility model adopts the technical proposal that: a high-toughness heat dissipation laminated plate comprises a first copper foil and a second copper foil which are arranged at two ends, and a first bonding layer, a first heat dissipation shockproof layer, a second heat dissipation shockproof layer and a second bonding layer which are sequentially arranged from the first copper foil to the second copper foil, wherein a plurality of heat dissipation convex strips are arranged at the opposite positions of the first heat dissipation shockproof layer and the second heat dissipation shockproof layer, the heat dissipation convex strips on the first heat dissipation shockproof layer and the second heat dissipation shockproof layer are arranged in a staggered mode, and the first heat dissipation shockproof layer and the second heat dissipation shockproof layer are made of heat conduction elastic materials; the first bonding layer and the second bonding layer are both of a dense grid structure formed by interweaving elastic fibers.
In the high-toughness heat dissipation laminated plate, the connection surface of the first heat dissipation shockproof layer and the first bonding layer is in a honeycomb shape, a heat dissipation interlayer is arranged in the middle of the first heat dissipation shockproof layer, two ends of the heat dissipation interlayer are flush with two ends of the first heat dissipation shockproof layer, and the heat dissipation interlayer is made of hard heat conduction materials; the second heat dissipation shockproof layer and the first heat dissipation shockproof layer are also provided with the same heat dissipation interlayer at the same position.
In the high-toughness heat dissipation laminated plate, the heat dissipation interlayer is internally provided with a plurality of heat dissipation channels which are communicated with the two ends of the heat dissipation interlayer and the outside, the upper end surface of the heat dissipation interlayer is provided with a plurality of heat dissipation strip holes, and the heat dissipation strip holes divide the heat dissipation channels into a plurality of sections and are communicated with the heat dissipation channels.
In the above high-toughness heat-dissipating laminated plate, the outer side surfaces of the first copper foil and the second copper foil are coated with an anti-corrosion layer.
In the above-mentioned high-toughness heat-dissipating laminate, the elastic fiber is a polyurethane fiber.
Compared with the prior art, the beneficial effects of the utility model are that: the first bonding layer and the second bonding layer are both of dense grid structures formed by elastic fibers, so that the toughness of the laminated plate can be improved, and the heat of the layers can be effectively transferred; the first heat dissipation shockproof layer and the second heat dissipation shockproof layer are both provided with heat dissipation interlayers, the heat dissipation interlayers are provided with heat dissipation channels and heat dissipation strip holes, convection is formed by contact of the heat dissipation interlayers and outside air, heat is taken away, and the heat dissipation speed is greatly accelerated.
Drawings
Figure 1 is a cross-sectional view of a laminate of the present invention;
fig. 2 is an exploded view of the sandwich panel of the present invention;
fig. 3 is an overall view of the sandwich panel of the present invention;
fig. 4 is a schematic structural view of a first adhesive layer according to the present invention;
in the drawings are labeled: 1-first copper foil, 2-first bonding layer, 3-first heat dissipation shockproof layer, 4-second heat dissipation shockproof layer, 5-second bonding layer, 6-second copper foil, 7-heat dissipation strip hole, 8-heat dissipation interlayer, 9-heat dissipation channel and 10-heat dissipation convex strip.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example (b): as shown in fig. 1-4, a high-toughness heat dissipation laminated plate comprises a first copper foil 1 and a second copper foil 6 which are arranged at two ends, a first bonding layer 2, a first heat dissipation shockproof layer 3, a second heat dissipation shockproof layer 4 and a second bonding layer 5 which are sequentially arranged from the first copper foil 1 to the second copper foil 6, wherein a plurality of heat dissipation convex strips 10 are respectively arranged at the positions of the first heat dissipation shockproof layer 3 opposite to the second heat dissipation shockproof layer 4, the heat dissipation convex strips 10 on the first heat dissipation shockproof layer 3 and the second heat dissipation shockproof layer 4 are arranged in a staggered manner, and the first heat dissipation shockproof layer 3 and the second heat dissipation shockproof layer 4 are made of heat-conducting elastic materials; the first bonding layer 2 and the second bonding layer 5 are both of a dense grid structure formed by interweaving elastic fibers.
A plurality of heat dissipation convex strips 10 are arranged at the positions, opposite to the first heat dissipation shockproof layer 3 and the second heat dissipation shockproof layer 4, so that the heat dissipation area can be effectively increased, and the heat dissipation is accelerated; the heat dissipation convex strips 10 on the first heat dissipation shockproof layer 3 and the second heat dissipation shockproof layer 4 are arranged in a staggered mode and are made of elastic materials, when the first heat dissipation shockproof layer 3 and the second heat dissipation shockproof layer 4 are extruded, the first heat dissipation shockproof layer 3 and the second heat dissipation shockproof layer 4 deform to play a certain role in shock resistance protection, and when an external force is removed, the first heat dissipation shockproof layer and the second heat dissipation shockproof layer can restore to the original state; the first bonding layer 2 is connected with the first copper foil 1 and is a dense screen plate structure made of elastic fibers, on one hand, the first copper foil 1 is connected with the first bonding layer 2, and the first bonding layer 2 has better elasticity and toughness, so that the toughness and tension of the first copper foil 1 can be enhanced, and the first copper foil is not easy to break during drilling; on the other hand, the structural design of the grid is beneficial to the heat generated by the first copper foil 1 to be diffused to the first heat dissipation shockproof layer 3 through the grid holes, so that the heat dissipation speed is accelerated; the connecting structure between the second bonding layer 5 and the second copper foil 6 is the same as the connecting structure between the first bonding layer 2 and the first copper foil 1.
In this embodiment, the connection surface between the first heat dissipation anti-vibration layer 3 and the first bonding layer 2 is honeycomb-shaped, a heat dissipation interlayer 8 is disposed in the middle of the first heat dissipation anti-vibration layer 3, two ends of the heat dissipation interlayer 8 are flush with two ends of the first heat dissipation anti-vibration layer 3, and the heat dissipation interlayer 8 is made of hard heat conduction material; the second heat dissipation and vibration prevention layer 4 and the first heat dissipation and vibration prevention layer 3 are also provided with the same heat dissipation interlayer 8 at the same position.
A heat dissipation interlayer 8 is arranged between the first heat dissipation shockproof layer 3 and the second heat dissipation shockproof layer 4, the heat dissipation interlayer 8 is made of hard materials, and the situation that when the heat dissipation interlayer 8 is extruded, the heat dissipation channel 9 is closed and cannot dissipate heat in time is avoided; the two ends of the heat dissipation interlayer 8 are flush with the two ends of the first heat dissipation shockproof layer 3, and heat can be conducted to the outside.
In this embodiment, the heat dissipation interlayer 8 is provided with a plurality of heat dissipation channels 9 penetrating through the two ends of the heat dissipation interlayer 8 to communicate with the outside, the upper end surface of the heat dissipation interlayer 8 is provided with a plurality of heat dissipation strip holes 7, and the heat dissipation channels 9 are divided into a plurality of sections by the heat dissipation strip holes 7 and communicated with the heat dissipation channels 9.
A plurality of heat dissipation channels 9 are arranged in the heat dissipation interlayer 8 and penetrate through two ends of the heat dissipation interlayer 8 to be communicated with the outside, so that convection is formed, and heat can be taken away more quickly through exchange with outside air; the upper end face of the heat dissipation interlayer 8 is provided with a plurality of heat dissipation strip holes 7, the heat dissipation channel 9 is divided into a plurality of sections by the heat dissipation strip holes 7 and is communicated with the heat dissipation channel 9, the heat dissipation strip holes 7 can better bring heat into the heat dissipation channel 9, and the heat dissipation speed is further improved.
In this embodiment, the outer surfaces of the first copper foil 1 and the second copper foil 6 are coated with an anti-corrosion layer.
The corrosion prevention layer can prevent foreign substances from damaging the first copper foil 1 and the second copper foil 6.
In this embodiment, the elastic fiber is a polyurethane fiber.
The polyurethane fiber, also called spandex, has good elasticity and good thermal stability, and can better improve the toughness of the first copper foil 1 and the second copper foil 6 connected with the polyurethane fiber.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (5)
1. A high-toughness heat-dissipation laminated plate comprises a first copper foil and a second copper foil which are arranged at two ends, and a first bonding layer, a first heat-dissipation shockproof layer, a second heat-dissipation shockproof layer and a second bonding layer which are sequentially arranged from the first copper foil to the second copper foil, wherein a plurality of heat-dissipation convex strips are arranged at the positions, opposite to the first heat-dissipation shockproof layer and the second heat-dissipation shockproof layer, of the first heat-dissipation shockproof layer, the heat-dissipation convex strips on the first heat-dissipation shockproof layer and the second heat-dissipation shockproof layer are arranged in a staggered mode, and the first heat-dissipation shockproof layer and the second heat-dissipation shockproof layer are made of heat-conducting elastic materials; the first bonding layer and the second bonding layer are both of a dense grid structure formed by interweaving elastic fibers.
2. The high toughness heat dissipation laminate according to claim 1, wherein the junction surface between said first heat dissipation and vibration prevention layer and said first bonding layer is honeycomb-shaped, a heat dissipation interlayer is provided in the middle of said first heat dissipation and vibration prevention layer, both ends of said heat dissipation interlayer are flush with both ends of said first heat dissipation and vibration prevention layer, and said heat dissipation interlayer is made of hard heat conduction material; the second heat dissipation shockproof layer and the first heat dissipation shockproof layer are also provided with the same heat dissipation interlayer at the same position.
3. The high toughness heat dissipating laminate as claimed in claim 2, wherein a plurality of heat dissipating channels are formed in said heat dissipating laminate to communicate with the outside through both ends of said heat dissipating laminate, and a plurality of heat dissipating bar holes are formed in the upper surface of said heat dissipating laminate, said heat dissipating bar holes dividing said heat dissipating channels into a plurality of sections and communicating with said heat dissipating channels.
4. The high toughness heat dissipating laminate of claim 1 wherein the outer sides of said first copper foil and said second copper foil are coated with an anti-corrosion layer.
5. The high tenacity heat dissipation laminate of claim 1, wherein said elastic fibers are polyurethane fibers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020014534.0U CN211808218U (en) | 2020-01-06 | 2020-01-06 | High-toughness heat dissipation laminated plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020014534.0U CN211808218U (en) | 2020-01-06 | 2020-01-06 | High-toughness heat dissipation laminated plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211808218U true CN211808218U (en) | 2020-10-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020014534.0U Active CN211808218U (en) | 2020-01-06 | 2020-01-06 | High-toughness heat dissipation laminated plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211808218U (en) |
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2020
- 2020-01-06 CN CN202020014534.0U patent/CN211808218U/en active Active
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