CN215582438U - Thermoelectric separation copper substrate with excellent heat dissipation performance - Google Patents
Thermoelectric separation copper substrate with excellent heat dissipation performance Download PDFInfo
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- CN215582438U CN215582438U CN202121851455.6U CN202121851455U CN215582438U CN 215582438 U CN215582438 U CN 215582438U CN 202121851455 U CN202121851455 U CN 202121851455U CN 215582438 U CN215582438 U CN 215582438U
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- connecting rod
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Abstract
The utility model relates to the technical field of copper substrate products, and discloses a thermoelectric separation copper substrate with excellent heat dissipation performance, which comprises a side support plate, a connecting rod and a main plate, wherein the connecting rod is arranged on one side of the side support plate, the side supporting plate is fixedly connected with the connecting rod, two ends of the connecting rod are respectively fixedly connected with the side supporting plate and the main plate, one side of the main plate is provided with a through hole, the main plate is provided with a groove, the utility model, through the interaction of the heat conducting plate, the limiting hole, the insulating pad, the electrode, the heat conducting column and the heat dissipation back plate, when the device is used, the heat generated by the electrode can enter the heat dissipation rear plate through the heat conduction plate and the heat conduction column and then be dissipated, thereby improving the heat dissipation performance of the equipment to a certain extent, and operating personnel can take off the mainboard of required quantity as required, and operating personnel accessible is rotatory takes off the mainboard from the connecting rod, has improved the suitability of equipment to a certain extent.
Description
Technical Field
The utility model relates to the technical field of copper substrate products, in particular to a thermoelectric separation copper substrate with excellent heat dissipation performance.
Background
The copper substrate is the most expensive one of the metal substrates, the heat conduction effect is many times better than that of the aluminum substrate and the iron substrate, and the copper substrate is suitable for high-frequency circuits, areas with large high and low temperature changes and the heat dissipation and architectural decoration industries of precise communication equipment, but the heat conduction and heat dissipation substrate cannot be rapidly dissipated in the prior art, and the heat dissipation performance of the substrate cannot be further improved.
Therefore, a thermoelectric separation copper substrate with excellent heat dissipation performance is designed.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model provides the thermoelectric separation copper substrate with excellent heat dissipation performance, and solves the problem that the existing equipment is inconvenient to dissipate heat.
In order to achieve the purpose, the utility model adopts the technical scheme that: the utility model provides a thermoelectric separation copper base plate that heat dispersion is good, includes side branch board, connecting rod and mainboard, side branch board one side is equipped with the connecting rod, and side branch board and connecting rod fixed connection, the connecting rod both ends respectively with side branch board and mainboard fixed connection, the through-hole has been seted up to mainboard one side, and has seted up the recess on the mainboard.
Further, the mainboard includes heat-conducting plate, spacing hole, insulating pad, electrode, heat conduction post and heat dissipation back plate, the heat-conducting plate is located the connecting rod inboard, and heat-conducting plate both ends and connecting rod fixed connection, set up fluted and spacing hole on the heat-conducting plate, insulating pad is located inside the recess of setting up on the heat-conducting plate, and insulating pad and heat-conducting plate fixed connection, insulating pad one side is located to the electrode, and electrode and insulating pad fixed connection, heat conduction post is located heat-conducting plate one side, and heat conduction post and heat-conducting plate fixed connection, heat dissipation back plate is located heat conduction post one side, and heat dissipation back plate and heat conduction post fixed connection.
Furthermore, a plurality of groups of connecting rods and a main board are respectively arranged on one side of the side branch board.
Furthermore, the heat conducting plate is respectively provided with a plurality of groups of insulating pads and electrodes.
Furthermore, a plurality of groups of heat conducting columns are respectively arranged on the rear side of the heat conducting plate.
The utility model has the beneficial effects that: 1. the utility model discloses a, through the interact of heat-conducting plate, spacing hole, insulating pad, electrode, heat conduction post and heat dissipation back plate for equipment when using, the heat accessible heat-conducting plate that its electrode produced and heat conduction post spill after getting into the heat dissipation back plate, have improved the thermal diffusivity of equipment to a certain extent.
2. The utility model discloses a, through the interact of side extension board, connecting rod and mainboard for equipment when using, operating personnel can take off the mainboard of required quantity as required, and operating personnel accessible is rotatory to take off the mainboard from the connecting rod, has improved the suitability of equipment to a certain extent.
Drawings
FIG. 1 is a schematic structural view of the present invention; FIG. 2 is a schematic front view of the present invention; fig. 3 is a side cross-sectional view of the present invention.
In the figure: 1. a side support plate; 2. a connecting rod; 3. a main board; 4. a heat conducting plate; 5. a limiting hole; 6. an insulating pad; 7. an electrode; 8. a heat-conducting column; 9. and a heat dissipation rear plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, a thermoelectric separation copper substrate with excellent heat dissipation performance includes a side supporting plate 1, a connecting rod 2 and a main board 3, wherein the connecting rod 2 is arranged on one side of the side supporting plate 1, the side supporting plate 1 is fixedly connected with the connecting rod 2, two ends of the connecting rod 2 are fixedly connected with the side supporting plate 1 and the main board 3 respectively, a through hole is formed in one side of the main board 3, a groove is formed in the main board 3, and a plurality of groups of connecting rods 2 and the main board 3 are arranged on one side of the side supporting plate 1 respectively.
Referring to fig. 2 and 3, the main board 3 includes a heat conducting plate 4, a limiting hole 5, an insulating pad 6, an electrode 7, a heat conducting post 8 and a heat dissipating rear plate 9, the heat conducting plate 4 is disposed inside the connecting rod 2, two ends of the heat conducting plate 4 are fixedly connected with the connecting rod 2, the heat conducting plate 4 is provided with a groove and the limiting hole 5, the insulating pad 6 is disposed inside the groove formed on the heat conducting plate 4, the insulating pad 6 is fixedly connected with the heat conducting plate 4, the electrode 7 is disposed on one side of the insulating pad 6, the electrode 7 is fixedly connected with the insulating pad 6, the heat conducting post 8 is disposed on one side of the heat conducting plate 4, the heat dissipating rear plate 9 is disposed on one side of the heat conducting post 8, the heat dissipating rear plate 9 is fixedly connected with the heat conducting post 8, the heat conducting plate 4 is respectively provided with a plurality of groups of insulating pads 6 and electrodes 7, and the rear side of the heat conducting plate 4 is respectively provided with a plurality of groups of heat conducting posts 8.
In summary, when the heat dissipation device is used, through the interaction of the heat conduction plate 4, the limiting hole 5, the insulating pad 6, the electrode 7, the heat conduction column 8 and the heat dissipation rear plate 9, when the device is used, heat generated by the electrode 7 can enter the heat dissipation rear plate 9 through the heat conduction plate 4 and the heat conduction column 8 and be dissipated, so that the heat dissipation performance of the device is improved to a certain extent, through the interaction of the side support plate 1, the connecting rod 2 and the main plate 3, when the device is used, an operator can take down the required number of main plates 3 as required, and the operator can take down the main plates 3 from the connecting rod 2 through rotation, so that the applicability of the device is improved to a certain extent.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (5)
1. The utility model provides a thermoelectric separation copper base plate that heat dispersion is good, includes side extension board (1), connecting rod (2) and mainboard (3), its characterized in that: the side support plate (1) is provided with a connecting rod (2) on one side, the side support plate (1) is fixedly connected with the connecting rod (2), two ends of the connecting rod (2) are fixedly connected with the side support plate (1) and the main plate (3) respectively, a through hole is formed in one side of the main plate (3), and a groove is formed in the main plate (3).
2. The copper substrate for thermoelectric separation having excellent heat dissipation performance as set forth in claim 1, wherein: the main board (3) comprises a heat conducting plate (4), a limiting hole (5), an insulating pad (6), an electrode (7), a heat conducting column (8) and a heat dissipation back plate (9), the heat conducting plate (4) is arranged on the inner side of the connecting rod (2), two ends of the heat conducting plate (4) are fixedly connected with the connecting rod (2), the heat conducting plate (4) is provided with a groove and a limiting hole (5), the insulating pad (6) is arranged in a groove arranged on the heat conducting plate (4), the insulating pad (6) is fixedly connected with the heat conducting plate (4), the electrode (7) is arranged on one side of the insulating pad (6), the electrode (7) is fixedly connected with the insulating pad (6), the heat conducting column (8) is arranged on one side of the heat conducting plate (4), the heat conducting column (8) is fixedly connected with the heat conducting plate (4), the heat dissipation rear plate (9) is arranged on one side of the heat conducting column (8), and the heat dissipation rear plate (9) is fixedly connected with the heat conducting column (8).
3. The copper substrate for thermoelectric separation having excellent heat dissipation performance as set forth in claim 1, wherein: and one side of the side support plate (1) is respectively provided with a plurality of groups of connecting rods (2) and a main plate (3).
4. The copper substrate for thermoelectric separation having excellent heat dissipation performance as set forth in claim 2, wherein: the heat conducting plate (4) is respectively provided with a plurality of groups of insulating pads (6) and electrodes (7).
5. The copper substrate for thermoelectric separation having excellent heat dissipation performance as set forth in claim 2, wherein: the rear sides of the heat conducting plates (4) are respectively provided with a plurality of groups of heat conducting columns (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121851455.6U CN215582438U (en) | 2021-08-10 | 2021-08-10 | Thermoelectric separation copper substrate with excellent heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121851455.6U CN215582438U (en) | 2021-08-10 | 2021-08-10 | Thermoelectric separation copper substrate with excellent heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215582438U true CN215582438U (en) | 2022-01-18 |
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ID=79833920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121851455.6U Active CN215582438U (en) | 2021-08-10 | 2021-08-10 | Thermoelectric separation copper substrate with excellent heat dissipation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215582438U (en) |
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2021
- 2021-08-10 CN CN202121851455.6U patent/CN215582438U/en active Active
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