CN217985512U - High-heat-conductivity anodized aluminum ceramic membrane aluminum substrate - Google Patents
High-heat-conductivity anodized aluminum ceramic membrane aluminum substrate Download PDFInfo
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- CN217985512U CN217985512U CN202221256330.3U CN202221256330U CN217985512U CN 217985512 U CN217985512 U CN 217985512U CN 202221256330 U CN202221256330 U CN 202221256330U CN 217985512 U CN217985512 U CN 217985512U
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Abstract
The utility model discloses a high heat conduction anodic alumina ceramic membrane aluminum substrate, which comprises an aluminum substrate body, wherein the aluminum substrate body comprises an aluminum substrate, an anodic alumina ceramic membrane and a copper foil circuit layer, the anodic alumina ceramic membrane is wrapped on the outer surface of the aluminum substrate, and the copper foil circuit layer is arranged outside the anodic alumina ceramic membrane; the LED lamp beads are arrayed on the front surface of the aluminum substrate body, the heat conduction layer is arranged on the back surface of the aluminum substrate body, and the fixing and installing mechanism is arranged on the side surface of the aluminum substrate body. The whole thermal resistance of aluminium base board reduce, improved the heat conductivility of aluminium base board, the side of aluminium base board body is equipped with fixed mounting mechanism moreover, is convenient for install aluminium base board or maintain, work efficiency is high, can not cause the damage to aluminium base board body moreover, aluminium base board still can guarantee the installation fastness after dismantling the equipment many times.
Description
Technical Field
The utility model relates to an aluminium base board technical field is an aluminium base board of high heat conduction anodic alumina ceramic membrane.
Background
The aluminum substrate is a low-alloying high-plasticity alloy plate and has good thermal conductivity, electrical insulation and mechanical properties, and compared with the traditional FR-4 aluminum substrate, the aluminum substrate has the same thickness and line width and can bear higher current. Along with semiconductor chip encapsulation power's continuous rising, the thermal power consumption of chip unit area is bigger and bigger, higher requirement has been proposed to the heat conductivility of the aluminium base board that bears semiconductor components and parts, ordinary aluminium base board is when using, heat dispersion is relatively poor, can't ensure the normal life of aluminium base board, current aluminium base board carries out fixed mounting through adopting the screw simultaneously, when installation or maintenance, the dismouting is inconvenient, be unfavorable for work efficiency's promotion, and the aluminium base board through the screw installation is installed once more after the dismantlement, the screw takes place to become flexible easily, influence the installation fastness of aluminium base board.
SUMMERY OF THE UTILITY MODEL
Utility model purpose: to the problem and not enough of existence among the above-mentioned prior art, the utility model aims at providing a high heat conduction anodic aluminum oxide ceramic membrane aluminium base board. The heat-conducting property and the film toughness of the anodic aluminum oxide ceramic film are good, and an insulating glue film in the aluminum substrate is replaced, so that the overall thermal resistance of the aluminum substrate is reduced, and the heat-conducting property of the aluminum substrate is improved.
The technical scheme is as follows: in order to achieve the above object, the utility model discloses a high heat conduction anodic alumina ceramic membrane aluminum substrate, including the aluminum substrate body, the aluminum substrate body includes aluminum base material, anodic alumina ceramic membrane and copper foil circuit layer, the anodic alumina ceramic membrane wraps up on the surface of aluminum base material, the copper foil circuit layer sets up the outside at the anodic alumina ceramic membrane; the LED lamp beads are arrayed on the front surface of the aluminum substrate body, the heat conduction layer is arranged on the back surface of the aluminum substrate body, and the fixing and installing mechanism is arranged on the side surface of the aluminum substrate body.
Furthermore, the heat conducting layer is formed by cross connection of a plurality of metal rib plates. This design not only can carry out the heat conduction, in the heat conduction in-process moreover, can dispel the heat with partial heat, further improves the heat conductivility of aluminium base board.
Further, the membrane layer of the anodic alumina ceramic membrane is in a porous structure.
Further, fixed mounting mechanism includes U type package piece and connecting block, U type package piece sets up in the edge of aluminium base board body, and the connecting block setting is on U type package piece, be equipped with the inserting groove on the connecting block, be equipped with spacing step in the inserting groove.
Furthermore, a counter bore is formed in the aluminum substrate body, a mounting hole is formed in the U-shaped wrapping sheet, and a screw penetrates through the mounting hole and the counter bore to fix the U-shaped wrapping sheet on the aluminum substrate body. Counter bore on the aluminium base board body, during aluminium base board assembly, put into the counter bore with the screw, and the nut of screw is less than the face or levels with the face, is convenient for assemble aluminium base board fixedly.
Furthermore, a locking device is arranged on the insertion groove and comprises a locking nut, a locking rod and a locking block, the locking block is arranged on the inner side of the insertion groove and is connected with one end of the locking rod, and the other end of the locking rod penetrates out of the insertion groove and is connected with the locking nut. The locking device can lock or unscrew the plugging block of the equipment to be installed, which extends into the plugging groove, and the operation is simple and rapid.
Furthermore, a compression spring is arranged between the inner wall of the insertion groove and the locking block on the locking rod. The compression spring expands the locking block tightly, ensures the fitting tightness of the locking block and the inserting block and prevents the locking block from loosening.
Furthermore, an arc-shaped groove is formed in the inner side of the locking block, and an elastic cushion is arranged in the arc-shaped groove.
Above-mentioned technical scheme can see out, the beneficial effects of the utility model are that:
(1) A high heat conduction aluminium base board of anodic oxide ceramic membrane, structural design is reasonable, aluminum plate's surface parcel one deck aluminium oxide ceramic membrane has replaced the insulating glued membrane in the aluminium base board for this aluminium base board's whole thermal resistance reduces, has improved the heat conductivility of aluminium base board, aluminium oxide ceramic membrane's corrosion resisting property is good moreover, the copper foil layer is at the in-process of etching the circuit, can not destroy aluminium oxide ceramic membrane's insulating properties yet.
(2) A high heat conduction aluminium base board of anodic oxide ceramic membrane, aluminium base board's side is equipped with fixed mounting mechanism, is convenient for install aluminium base board or maintain, work efficiency is high, can not cause the damage to aluminium base board in addition, aluminium base board still can guarantee the installation fastness after dismantling the equipment many times.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the fixing and mounting mechanism of the present invention;
fig. 3 is a schematic structural view of the heat conducting layer of the present invention;
fig. 4 is a schematic structural diagram of the locking device of the present invention.
Detailed Description
The invention will be further elucidated with reference to the drawings and the specific embodiments.
As shown in fig. 1-4, the high thermal conductivity anodized aluminum ceramic film aluminum substrate comprises an aluminum substrate body 1, wherein the aluminum substrate body 1 comprises an aluminum substrate 11, an anodized aluminum ceramic film 12 and a copper foil circuit layer 13, the anodized aluminum ceramic film 12 is arranged on the outer surface of the aluminum substrate 11, and the copper foil circuit layer 13 is arranged on the outer side of the anodized aluminum ceramic film 12; the LED lamp beads 2 are arrayed on the front surface of the aluminum substrate body 1, the heat conducting layer 3 is arranged on the back surface of the aluminum substrate body 1, and the fixing and installing mechanism 4 is arranged on the side surface of the aluminum substrate body 1.
Wherein, the heat conduction layer 3 is formed by cross-connecting a plurality of metal rib plates 31.
In this embodiment, the membrane layer of the anodized aluminum ceramic membrane 12 is porous.
In this embodiment, the fixing and mounting mechanism 4 includes a U-shaped wrapping sheet 41 and a connecting block 42, the U-shaped wrapping sheet 41 is disposed at the edge of the aluminum substrate body 1, the connecting block 42 is disposed on the U-shaped wrapping sheet 41, an inserting groove 421 is disposed on the connecting block 42, and a limiting step 422 is disposed in the inserting groove 421.
In this embodiment, the aluminum substrate body 1 is provided with a counter bore, the U-shaped wrapping sheet 41 is provided with a mounting hole, and a screw penetrates through the mounting hole and the counter bore to fix the U-shaped wrapping sheet 41 on the aluminum substrate body 1.
In this embodiment, the inserting groove 421 is provided with the locking device 43, the locking device 43 includes a locking nut 431, a locking rod 432 and a locking block, the locking block 433 is disposed on the inner side of the inserting groove 421, the locking block 433 is connected with one end of the locking rod 432, and the other end of the locking rod 432 passes through the inserting groove 421 and then is connected with the locking nut 431.
In this embodiment, a compression spring 434 is disposed between the inner wall of the insertion groove 421 and the locking block 433 of the locking lever 432.
In this embodiment, an arc-shaped groove 4331 is formed in the inner side of the locking block 433, and an elastic pad 435 is disposed in the arc-shaped groove.
The examples are given solely for the purpose of illustration and are not intended to limit the scope of the invention, which is to be determined by those skilled in the art after reading the present disclosure, and all such equivalents are intended to fall within the scope of the invention as defined in the claims appended hereto.
Claims (8)
1. The utility model provides a high heat conduction anodic alumina ceramic membrane aluminium base board which characterized in that: the aluminum base plate comprises an aluminum base plate body (1), wherein the aluminum base plate body (1) comprises an aluminum base material (11), an anodic aluminum oxide ceramic film (12) and a copper foil circuit layer (13), the anodic aluminum oxide ceramic film (12) is arranged on the outer surface of the aluminum base material (11), and the copper foil circuit layer (13) is arranged on the outer side of the anodic aluminum oxide ceramic film (12); the LED lamp beads are arrayed on the front surface of the aluminum substrate body (1), the heat conducting layer (3) is arranged on the back surface of the aluminum substrate body (1), and the fixing and installing mechanism (4) is arranged on the side surface of the aluminum substrate body (1).
2. The high thermal conductivity anodized aluminum ceramic film aluminum substrate as recited in claim 1, wherein: the heat conducting layer (3) is formed by cross connection of a plurality of metal rib plates (31).
3. The high thermal conductivity anodized aluminum ceramic membrane aluminum substrate as claimed in claim 1, wherein: the membrane layer of the anodic alumina ceramic membrane (12) is in a porous structure.
4. The high thermal conductivity anodized aluminum ceramic membrane aluminum substrate as claimed in claim 1, wherein: fixed mounting mechanism (4) include U type package piece (41) and connecting block (42), U type package piece (41) set up in the edge of aluminium base board body (1), and connecting block (42) set up on U type package piece (41), be equipped with inserting groove (421) on connecting block (42), be equipped with spacing step (422) in inserting groove (421).
5. The high thermal conductivity anodized aluminum ceramic membrane aluminum substrate as claimed in claim 1, wherein: the aluminum substrate body (1) is provided with counter bores, the U-shaped wrapping sheet (41) is provided with mounting holes, and screws penetrate through the mounting holes and the counter bores to fix the U-shaped wrapping sheet (41) on the aluminum substrate body (1).
6. The high thermal conductivity anodized aluminum ceramic membrane aluminum substrate as claimed in claim 4, wherein: the locking device (43) is arranged on the inserting groove (421), the locking device (43) comprises a locking nut (431), a locking rod (432) and a locking block, the locking block (433) is arranged on the inner side of the inserting groove (421), the locking block (433) is connected with one end of the locking rod (432), and the other end of the locking rod (432) penetrates through the inserting groove (421) and then is connected with the locking nut (431).
7. The high thermal conductivity anodized aluminum ceramic membrane aluminum substrate as claimed in claim 6, wherein: and a compression spring (434) is arranged between the inner wall of the insertion groove (421) and the locking block (433) on the locking rod (432).
8. The high thermal conductivity anodized aluminum ceramic membrane aluminum substrate as claimed in claim 6, wherein: an arc-shaped groove (4331) is formed in the inner side of the locking block (433), and an elastic cushion (435) is arranged in the arc-shaped groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221256330.3U CN217985512U (en) | 2022-05-24 | 2022-05-24 | High-heat-conductivity anodized aluminum ceramic membrane aluminum substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221256330.3U CN217985512U (en) | 2022-05-24 | 2022-05-24 | High-heat-conductivity anodized aluminum ceramic membrane aluminum substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217985512U true CN217985512U (en) | 2022-12-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221256330.3U Active CN217985512U (en) | 2022-05-24 | 2022-05-24 | High-heat-conductivity anodized aluminum ceramic membrane aluminum substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217985512U (en) |
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2022
- 2022-05-24 CN CN202221256330.3U patent/CN217985512U/en active Active
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