CN117279225B - FPC suitable for intelligent wearing and quick pressing process thereof - Google Patents
FPC suitable for intelligent wearing and quick pressing process thereof Download PDFInfo
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- CN117279225B CN117279225B CN202311562714.7A CN202311562714A CN117279225B CN 117279225 B CN117279225 B CN 117279225B CN 202311562714 A CN202311562714 A CN 202311562714A CN 117279225 B CN117279225 B CN 117279225B
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- 238000003825 pressing Methods 0.000 title claims abstract description 95
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000003475 lamination Methods 0.000 claims abstract description 206
- 239000000758 substrate Substances 0.000 claims abstract description 68
- 238000010030 laminating Methods 0.000 claims abstract description 49
- 238000010438 heat treatment Methods 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 16
- 238000001816 cooling Methods 0.000 claims abstract description 4
- 239000006185 dispersion Substances 0.000 claims description 9
- 229910000976 Electrical steel Inorganic materials 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims 2
- 238000012797 qualification Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a quick pressing process of an FPC (flexible printed circuit) suitable for intelligent wearing, which relates to the technical field of pressing of FPCs and comprises the following steps of: laminating the substrate and the lamination structure of the FPC and placing the substrate and the lamination structure under a lamination station of a lamination machine; the laminating machine is used for laminating the FPC laminated base materials under the control of the laminating control system; and cooling the FPC stack after pressing, blanking after the FPC stack reaches a preset temperature, calculating a pressing temperature factor alpha and a pressing pressure factor beta based on the pressing temperature and the pressure, acquiring the temperature of the heating plate in real time through a temperature sensor when the temperature changes in the pressing process, and calculating to obtain a pressing pressure value.
Description
Technical Field
The invention relates to the technical field of FPC lamination, in particular to an FPC suitable for intelligent wearing and a quick-pressing process thereof.
Background
Chinese patent publication No. CN110519909A discloses a pressing method for reinforcing FPC products with different thicknesses, and relates to the field of FPC, comprising the following steps: s1: attaching a reinforcing plate to the to-be-reinforced position of the FPC in advance; s2: laminating, namely laminating the FPC with the reinforcing plate; s3: and transmitting pressure, and placing the laminated FPC on a transmitting press for pressing.
However, when the FPC is pressed fast, the temperature of the heating disc changes when the pressing machine works continuously, and when the subsequent FPC lamination is pressed, the condition that the pressing is not in place easily occurs, so that the condition that the pressing is disqualified occurs, and when the temperature is adjusted, the time consumption is long, and the pressing rate is influenced.
Disclosure of Invention
The invention aims to provide an FPC suitable for intelligent wearing and a quick pressing process thereof, so as to solve the problems in the background.
The aim of the invention can be achieved by the following technical scheme:
a quick pressing process suitable for intelligent wearable FPC comprises the following steps:
step one:
laminating the substrate and the lamination structure of the FPC and placing the substrate and the lamination structure under a lamination station of a lamination machine;
step two:
the laminating machine is used for laminating the FPC laminated base materials under the control of the laminating control system; wherein, include:
step S1: collecting an initial state value of the FPC laminated substrate, and obtaining a laminated representation value Db based on the initial state value;
comparing the stack representation value Db with an initial height threshold value Gz;
if the lamination appearance value is smaller than the initial height threshold value, the FPC lamination base material accords with the lamination standard;
if the lamination appearance value is larger than the initial height threshold value, marking the FPC lamination substrate as a lamination to be interfered, pre-pressing, and then obtaining the FPC lamination substrate meeting the lamination standard;
step S2: acquiring historical lamination state data of the FPC laminated substrate, fitting a lamination factor value J according to the historical lamination state data, then combining the lamination appearance value Db, the lamination factor value J, a lamination temperature value Ty and a standard average value Hyzj to obtain a lamination pressure value Ny, and laminating the FPC laminated substrate; wherein, the pressing factor value J comprises a pressing temperature factor alpha and a pressing pressure factor beta;
s3: acquiring a pressed value Hx of the pressed FPC stack, and comparing the pressed value Hx with a standard threshold Hyz;
if the press fit value of the pressed FPC stack is not in the standard threshold range, the press fit is not qualified, and then the press fit factor value J under the press fit temperature value Ty is fitted and updated;
if the pressed value of the pressed FPC stack is in the standard threshold range, the pressed value is qualified;
step three:
and cooling the pressed FPC stack, and blanking after the FPC stack reaches a preset temperature.
As a further scheme of the invention: in the step S1:
the initial state value of the FPC laminated substrate comprises a laminated value C of the FPC laminated substrate and laminated laminating data Cs, wherein the laminated laminating data comprises a laminated laminating area Cm and a laminated laminating height dispersion value Cmh of the FPC laminated substrate;
obtaining a lamination appearance value Db of the FPC lamination substrate based on the lamination area and the lamination height dispersion value in the lamination data;
acquiring an initial height threshold value of the corresponding FPC laminated substrate based on the laminated value;
the stack representation value is then compared to an initial height threshold.
As a further scheme of the invention: the fitting step of the compressing factor value J in the step S2 is as follows:
step A1: obtaining lamination values Dbs and qualified lamination values Hxs of a plurality of groups of FPC laminated base materials in the historical lamination state data, and laminating temperature values Tys and laminating pressure values Nys when lamination values in the historical lamination state data are laminated to the lamination values;
step A2: and C, respectively fitting the plurality of groups of historical press fit state data in the step A1 into the formula:and obtaining the lamination temperature factor alpha and the lamination pressure factor beta.
As a further scheme of the invention: in the step S2:
the pressing pressure value Ny is calculated byWherein the standard mean Hyzj is the maximum standard threshold Hyz max And a minimum standard threshold Hyz min Is a mean value of (c).
As a further scheme of the invention: the laminating temperature value Ty is the real-time temperature of the heating plate when the laminating machine is laminating, and is obtained in real time through the temperature sensor.
As a further scheme of the invention: in the step S3:
obtaining a lamination appearance value Db, a lamination temperature value Ty, a standard average value Hyzj, a lamination pressure value Ny and a lamination factor value J when lamination is unqualified;
according toCalculating to obtain the lamination temperature factor +.>；
Based onThat is, the lamination temperature factor is +.>Is +.>；
At this time, when the bonded laminate is represented by the Db and the Ty, the Ny value of the bonding pressure bonded to the standard average Hyzj is calculated by；
Then the value of the pressing temperature factor alpha is as follows when the heating plate is TyAnd updating the database at the same time.
As a further scheme of the invention: in the step S1, the step of obtaining the bottom layer representation value Db includes:
obtaining a lamination bonding area Cm, dividing a grid area with a unit length of i by a horizontal plane, respectively measuring bonding height Di of each grid area, and obtaining a lamination bonding height dispersion value Cmh which is the sum of areas with the bonding height Di being greater than an initial height threshold value Gz;
by passing throughThe laminate representation value Db is calculated.
As a further scheme of the invention: the pre-pressing treatment is to pre-press the lamination to be interfered from the middle part to two sides through a pressing machine, and the distance between a heating disc for supporting the FPC lamination substrate and a silicon steel plate for pressing is an initial height threshold value Gz during pressing.
FPC suitable for intelligent wearing, this intelligent wearing FPC is prepared by above-mentioned quick-press technology.
The invention has the beneficial effects that:
(1) According to the invention, before the FPC laminated substrate is pressed, the height of the laminated FPC laminated substrate is measured to obtain whether the area of the thickness exceeding the initial height threshold value on the FPC laminated substrate is larger than half of the total area, if the area of the thickness exceeding the initial height threshold value on the FPC laminated substrate is larger than half of the total area, more internal air can appear in the pressing process, and the situation of unqualified pressing can appear; the thickness of the FPC laminated substrate is detected, so that the initially unqualified FPC can be rapidly discharged and processed, and the qualification rate of subsequent lamination is ensured.
(2) According to the invention, the lamination appearance value and the qualified lamination value in the historical lamination state data are obtained, and the lamination temperature value, the lamination pressure value and the like when the lamination appearance value is laminated to the lamination value are calculated, so that the influence of the FPC lamination base material based on temperature and pressure, namely the lamination temperature factor and the lamination pressure factor, when the laminating machine is used for laminating the FPC lamination base material is obtained; then according to the data values of the pressing temperature factor and the pressing pressure factor, the temperature of a heating disc on the pressing machine is obtained at the same time, and then the pressing pressure value required by pressing the initial lamination representation value to the standard threshold value can be calculated; then pressing the FPC laminated substrate through the control module; the problem that the pressed FPC laminated base material cannot meet the standard threshold value after being pressed due to the change of the temperature of the heating disc in the continuous pressing process of the pressing machine can be effectively solved, and meanwhile, the influence on the FPC laminated base material caused by the change of the room temperature can be solved; further ensuring the qualification of the lamination of FPC laminated base materials.
(3) In the invention, the value of the pressing temperature factor alpha is the value of the pressing temperature factor alpha when the heating plate is Ty ， At the same time updating the database, then obtaining the lamination temperature factor when laminating the lamination expression value to the standard average value under the temperature condition>That is, if the press-fit temperature value Ty is used for press-fitting during the press-fitting process, the press-fit pressure value actually required can be calculated, and then the press-fit temperature factor is calculated>Sending the temperature information to a database for storage and updating, and ensuring that the temperature information can be obtained through accurate lamination temperature factors +.>And the press-fit pressure value is obtained through calculation, so that the qualification rate of the FPC laminated substrate in the press-fit process is further ensured.
(4) According to the invention, the calculation of the pressing temperature factor and the pressing pressure factor is performed based on the pressing temperature and the pressing pressure, and when the temperature changes in the pressing process, the temperature of the heating plate is acquired in real time through the temperature sensor, and then the pressing pressure value is calculated, so that compared with the temperature of the heating plate, the time is shortened, the speed of the calculated and adjusted pressing pressure value is improved, the interval time in the pressing process is saved, and the pressing efficiency is ensured.
Drawings
The invention is further described below with reference to the accompanying drawings.
FIG. 1 is a schematic illustration of a process flow in the present invention;
FIG. 2 is a block diagram of a pressure regulation system of the present invention;
FIG. 3 is a schematic diagram of a calculation flow of the pressure value in the third embodiment of the present invention;
fig. 4 is a schematic diagram of a calculation flow of the press-fit temperature factor in the fourth embodiment of the invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, the present invention provides the following embodiments:
examples
A quick pressing process suitable for intelligent wearable FPC comprises the following steps:
step one: laminating the substrate and the lamination structure of the FPC and placing the substrate and the lamination structure under a lamination station of a lamination machine;
step two: the laminating machine is used for laminating the FPC laminated base materials under the control of the laminating control system; wherein, include:
s1: collecting an initial state value of the FPC laminated substrate, and obtaining a laminated representation value Db based on the initial state value;
comparing the stack representation value Db with an initial height threshold value Gz;
if the lamination appearance value is smaller than the initial height threshold value, the FPC lamination base material accords with the lamination standard;
if the lamination appearance value is larger than the initial height threshold value, marking the FPC lamination substrate as a lamination to be interfered, pre-pressing, and then obtaining the FPC lamination substrate meeting the lamination standard;
s2: acquiring historical lamination state data of the FPC laminated substrate, fitting a lamination factor value J according to the historical lamination state data, then combining the lamination appearance value Db, the lamination factor value J, a lamination temperature value Ty and a standard average value Hyzj to obtain a lamination pressure value Ny, and laminating the FPC laminated substrate; wherein, the pressing factor value J comprises a pressing temperature factor alpha and a pressing pressure factor beta;
s3: acquiring a pressed value Hx of the pressed FPC stack, and comparing the pressed value Hx with a standard threshold Hyz;
if the press fit value of the pressed FPC stack is not in the standard threshold range, the press fit is not qualified, and then the press fit factor value J under the press fit temperature value Ty is fitted and updated;
if the pressed value of the pressed FPC stack is in the standard threshold range, the pressed value is qualified;
step three: and cooling the pressed FPC stack, and blanking after the FPC stack reaches a preset temperature.
The press fit regulation system comprises a data acquisition module, a data processing module, a control module and a server as shown in fig. 2.
Examples
S1:
the initial state value of the FPC laminated substrate comprises a laminated value C of the FPC laminated substrate and laminated laminating data Cs, wherein the laminated laminating data comprises a laminated laminating area Cm and a laminated laminating height dispersion value Cmh of the FPC laminated substrate; the lamination value C is different according to different FPC types and is not limited to a certain type of FPC; the lamination bonding area Cm is the lamination overlapping area of the FPC in the lamination process;
specifically, a lamination numerical value C and a lamination area Cm are obtained through a data acquisition module;
obtaining a lamination appearance value Db of the FPC lamination substrate based on the lamination area and the lamination height dispersion value in the lamination data;
dividing a lamination bonding area Cm into grid areas with unit length of i by a horizontal plane through a data processing module, respectively measuring bonding height Di of each grid area, and obtaining a lamination bonding height dispersion value Cmh which is the sum of areas with the bonding height Di being greater than an initial height threshold value Gz;
by passing throughCalculating to obtain a laminated representation value Db;
acquiring an initial height threshold value of the corresponding FPC laminated substrate based on the laminated value;
then comparing the stack representation value with an initial height threshold;
if the lamination appearance value is smaller than the initial height threshold value, the FPC lamination base material accords with the lamination standard;
if the lamination appearance value is larger than the initial height threshold value, marking the FPC lamination substrate as a lamination to be interfered, pre-pressing, and then obtaining the FPC lamination substrate meeting the lamination standard;
the prepressing treatment is to prepress the lamination to be interfered from the middle part to two sides through a pressing machine, and the distance between a heating disc for supporting the FPC lamination substrate and a silicon steel plate for pressing down is an initial height threshold value Gz during pressing.
Before laminating the FPC laminated substrate, carrying out height measurement on the laminated FPC laminated substrate to obtain whether the area of the thickness exceeding the initial height threshold value on the FPC laminated substrate is larger than half of the total area, and if the area of the thickness exceeding the initial height threshold value on the FPC laminated substrate is larger than half of the total area, more internal air and unqualified pressing can occur in the pressing process; the thickness of the FPC laminated substrate is detected, so that the initially unqualified FPC can be rapidly discharged and processed, and the qualification rate of subsequent lamination is ensured.
Examples
The technical scheme is that the step S2 is further recorded as follows on the basis of the second embodiment:
referring to fig. 3, the fitting step of the compressing factor value J in step S2 is as follows:
acquiring lamination values Dbs and qualified lamination values Hxs of a plurality of groups of FPC laminated substrates in the historical lamination state data through a data acquisition module, and sending the lamination values Tys and Nys to a data processing module when the lamination values in the historical lamination state data are laminated to the lamination values;
the data processing module respectively fits the plurality of groups of historical press fit state data in the step A1 into the formula:obtaining a lamination temperature factor alpha and a lamination pressure factor beta;
it should be noted that, the lamination temperature factor α and the lamination pressure factor β are calculated according to the lamination value Hxs, the lamination temperature value Tys and the lamination pressure value Nys when the lamination of the plurality of groups of lamination expression values Dbs is qualified;
when a new FPC laminated substrate is pressed, the called pressing temperature factor alpha and pressing pressure factor beta are calculated when Dbs=Db and Ty= Tys;
acquiring historical lamination state data of FPC laminated substrates in a server, fitting a lamination factor value J according to the historical lamination state data, and then combining a lamination representation value Db, the lamination factor value J, a lamination temperature value Ty and a standard average value Hyzj to obtain a lamination pressure value Ny; the pressing pressure value Ny is calculated byWherein the standard mean Hyzj is the maximum standard threshold Hyz max And a minimum standard threshold Hyz min Is the average value of (2); the laminating temperature value Ty is the real-time temperature of the heating plate when the laminating machine is laminating, and is obtained in real time through a temperature sensor; sending the calculated pressing pressure value Ny to a control module;
the control module performs lamination on the FPC laminated substrate;
then, a data acquisition module acquires a pressed value Hx of the pressed FPC stack, and the pressed value Hx is compared with a standard threshold Hyz;
if the press fit value of the pressed FPC stack is not in the standard threshold range, the press fit is not qualified, and then the press fit factor value J under the press fit temperature value Ty is fitted and updated;
if the pressed value of the pressed FPC stack is in the standard threshold range, the pressed value is qualified;
the method comprises the steps of obtaining lamination appearance values Dbs and qualified lamination values Hxs in historical lamination state data, and calculating data by using lamination temperature values Tys, lamination pressure values Nys and the like when lamination appearance values Dbs in the historical lamination state data are laminated to the lamination values, so that when an FPC lamination substrate is laminated by a laminating machine, the FPC lamination substrate is subjected to influence of temperature and pressure, namely a lamination temperature factor alpha and a lamination pressure factor beta;
then according to the data values of the pressing temperature factor alpha and the pressing pressure factor beta, the temperature of a heating disc on the pressing machine is obtained at the same time, and then the pressing pressure value Ny required by pressing the initial lamination representation value Db to the standard threshold Hyz can be calculated; then pressing the FPC laminated substrate through the control module;
the problem that the laminated FPC laminated substrate cannot meet the standard threshold Hyz after lamination due to the temperature change of the heating disc in the continuous lamination process of the lamination machine can be effectively solved, and meanwhile, the influence on the laminated FPC substrate due to the room temperature change can be solved; further ensuring the qualification of the lamination of FPC laminated base materials.
Examples
The following description is further made on the basis of the third embodiment:
the effect achieved by pressing the FPC laminated substrate is not in a linear relation of fixed proportion due to the change of temperature in the pressing process of the FPC laminated substrate; therefore, in order to further ensure the qualified rate of lamination of the FPC laminated substrate, in the lamination process in the third embodiment, the calculation is performed under the condition that the lamination is unqualified, specifically, as shown in fig. 4:
the data processing module acquires a lamination representation value Db, a lamination temperature value Ty, a standard average value Hyzj, a lamination pressure value Ny and a lamination factor value J when lamination is unqualified;
according toCalculating to obtain the lamination temperature factor +.>；
Based onThat is, the temperature change is obtainedIn the case of chemical transformation, its pressfitting temperature factor +.>Is +.>；
At this time, when the bonded laminate is represented by the Db and the Ty, the Ny value of the bonding pressure bonded to the standard average Hyzj is calculated by；
Then the value of the pressing temperature factor alpha is as follows when the heating plate is Ty ， At the same time, updating the database, and obtaining the lamination temperature factor when laminating the lamination expression value Db to the standard mean value Hyzj under the temperature condition>That is, if the press-fit temperature value Ty is used for press-fit during press-fit, the press-fit temperature value Ty can be used for press-fitCalculating to obtain the actually required pressing pressure value, and then adding the pressing temperature factor +.>Sending the temperature information to a database for storage and updating, and ensuring that the temperature information can be obtained through accurate lamination temperature factors +.>And the press-fit pressure value is obtained through calculation, so that the qualification rate of the FPC laminated substrate in the press-fit process is further ensured.
In this application, carry out the calculation of pressfitting temperature factor alpha and pressfitting pressure factor beta based on pressfitting temperature and pressure size, in the pressing process, when the change of temperature appears, obtain the temperature of heating plate in real time through temperature sensor, then calculate and obtain pressfitting pressure value, compare in the temperature of adjustment heating plate, shortened time, improved the speed of calculating and the pressfitting pressure value of adjustment, saved the interval time in the pressfitting process, guaranteed pressfitting efficiency.
While the invention has been described in detail in connection with the preferred embodiments thereof, it is to be understood that the invention is not limited to the specific embodiments thereof, but is intended to cover modifications and variations within the scope of the invention.
Claims (6)
1. The quick pressing process of the FPC suitable for intelligent wearing is characterized by comprising the following steps of:
step one:
laminating the substrate and the lamination structure of the FPC and placing the substrate and the lamination structure under a lamination station of a lamination machine;
step two:
the laminating machine is used for laminating the FPC laminated base materials under the control of the laminating control system; wherein, include:
step S1: collecting an initial state value of the FPC laminated substrate, and obtaining a laminated representation value Db based on the initial state value;
comparing the stack representation value Db with an initial height threshold value Gz;
if the lamination appearance value is smaller than the initial height threshold value, the FPC lamination base material accords with the lamination standard;
if the lamination appearance value is larger than the initial height threshold value, marking the FPC lamination substrate as a lamination to be interfered, pre-pressing, and then obtaining the FPC lamination substrate meeting the lamination standard;
step S2: acquiring historical lamination state data of the FPC laminated substrate, fitting a lamination factor value J according to the historical lamination state data, then combining the lamination appearance value Db, the lamination factor value J, a lamination temperature value Ty and a standard average value Hyzj to obtain a lamination pressure value Ny, and laminating the FPC laminated substrate; wherein, the pressing factor value J comprises a pressing temperature factor alpha and a pressing pressure factor beta;
step S3: acquiring a pressed value Hx of the pressed FPC stack, and comparing the pressed value Hx with a standard threshold Hyz;
if the press fit value of the pressed FPC stack is not in the standard threshold range, the press fit is not qualified, and then the press fit factor value J under the press fit temperature value Ty is fitted and updated;
if the pressed value of the pressed FPC stack is in the standard threshold range, the pressed value is qualified;
step three: cooling the pressed FPC stack, and blanking after the FPC stack reaches a preset temperature;
the fitting step of the compressing factor value J in the step S2 is as follows:
step A1: obtaining lamination values Dbs and qualified lamination values Hxs of a plurality of groups of FPC laminated base materials in the historical lamination state data, and laminating temperature values Tys and laminating pressure values Nys when lamination values in the historical lamination state data are laminated to the lamination values;
step A2: and C, respectively fitting the plurality of groups of historical press fit state data in the step A1 into the formula:obtaining a lamination temperature factor alpha and a lamination pressure factor beta;
in the step S2: the pressing pressure value Ny is calculated by；
In the step S3:
obtaining a lamination appearance value Db, a lamination temperature value Ty, a standard average value Hyzj, a lamination pressure value Ny and a lamination factor value J when lamination is unqualified;
according toCalculating to obtain the lamination temperature factor +.>；
Based onThat is, the lamination temperature factor is +.>Is +.>；
At this time, when the bonded laminate is represented by the Db and the Ty, the Ny value of the bonding pressure bonded to the standard average Hyzj is calculated by；
Then the value of the pressing temperature factor alpha is as follows when the heating plate is Ty ， Updating the database at the same time;
in S1, the step of obtaining the lamination representation value Db includes:
obtaining a lamination bonding area Cm, dividing a grid area with a unit length of i by a horizontal plane, respectively measuring bonding height Di of each grid area, and obtaining a lamination bonding height dispersion value Cmh which is the sum of areas with the bonding height Di being greater than an initial height threshold value Gz;
by passing throughThe laminate representation value Db is calculated.
2. The rapid compression process of an FPC adapted for smart wear according to claim 1, wherein in step S1:
the initial state value of the FPC laminated substrate comprises a laminated value C of the FPC laminated substrate and laminated laminating data Cs, wherein the laminated laminating data comprises a laminated laminating area Cm and a laminated laminating height dispersion value Cmh of the FPC laminated substrate;
obtaining a lamination appearance value Db of the FPC lamination substrate based on the lamination area and the lamination height dispersion value in the lamination data;
acquiring an initial height threshold value of the corresponding FPC laminated substrate based on the laminated value;
the stack representation value is then compared to an initial height threshold.
3. The rapid pressing process of the intelligent wearable FPC according to claim 2, wherein the standard average Hyzj is a maximum standard threshold Hyz max And a minimum standard threshold Hyz min Is a mean value of (c).
4. The rapid pressing process of the intelligent wearable FPC according to claim 3, wherein the pressing temperature value Ty is the real-time temperature of a heating disc of the pressing machine during pressing, and the real-time temperature is obtained through a temperature sensor.
5. The rapid pressing process of the FPC suitable for intelligent wearing according to claim 1, wherein the pre-pressing treatment is to pre-press the lamination to be interfered from the middle part to two sides by a pressing machine, and the distance between a heating disc for supporting the FPC lamination substrate and a silicon steel plate for pressing down by the pressing machine during pressing is an initial height threshold value Gz.
6. An FPC suitable for intelligent wear, characterized in that it is prepared by the rapid compression process according to any one of the preceding claims 1-5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311562714.7A CN117279225B (en) | 2023-11-22 | 2023-11-22 | FPC suitable for intelligent wearing and quick pressing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311562714.7A CN117279225B (en) | 2023-11-22 | 2023-11-22 | FPC suitable for intelligent wearing and quick pressing process thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117279225A CN117279225A (en) | 2023-12-22 |
| CN117279225B true CN117279225B (en) | 2024-01-26 |
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