CN112969314A

CN112969314A - Roll-to-roll production process of FPC (Flexible printed Circuit) multilayer board

Info

Publication number: CN112969314A
Application number: CN202110166016.XA
Authority: CN
Inventors: 吴义涛; 胡宗敏; 叶天雄
Original assignee: Suzhou Mflex Electronic Co ltd
Current assignee: Suzhou Mflex Electronic Co ltd
Priority date: 2021-02-03
Filing date: 2021-02-03
Publication date: 2021-06-15
Anticipated expiration: 2041-02-03
Also published as: CN112969314B

Abstract

The application discloses FPC multiply wood roll-to-roll production technology includes following step: s1, providing a composite single-sided board, wherein the composite single-sided board comprises a first copper foil layer, a first insulating layer, an adhesive layer and lining paper which are sequentially arranged; s2, punching a board dividing line on the composite single-sided board in an RTR punching mode, wherein the board dividing line is cut from the first copper foil layer to the adhesive layer; s3, providing a double-sided board, wherein the double-sided board comprises a second insulating layer and second copper foil layers arranged on two sides of the second insulating layer; s4, separating the glued single-sided board from the lining paper in an RTR bending mode to obtain the glued single-sided board; s5, positioning and attaching the single panel with the adhesive to the double-sided board in an RTR (real time reactor) attaching mode; and S6, pressing and attaching the single-sided board with the adhesive and the double-sided board together in an RTR (real time reactor) quick pressing mode to obtain the FPC (flexible printed circuit) multilayer board. The FPC multilayer board roll-to-roll production process can effectively improve the production efficiency and the product yield.

Description

Roll-to-roll production process of FPC (Flexible printed Circuit) multilayer board

Technical Field

The application relates to the technical field of flexible circuit board production, in particular to a roll-to-roll production process of a Flexible Printed Circuit (FPC) multilayer board.

Background

Roll-to-Roll (RTR) production process is a high-efficiency, continuous production method, and has been widely applied to the production and processing of single and double layers of FPC (flexible circuit board) and the processing of inner layers of multi-layer boards (three or more). The flexible copper clad laminate is subjected to FPC manufacturing in a continuous rolling mode by adopting a roll-to-roll process, so that the production automation degree can be effectively improved, the labor cost is reduced, the production efficiency is improved, and the influence of human factors on the product quality is avoided, thereby improving the yield of products.

The FPC can be divided into a single panel, a double-sided board, a multilayer board, and the like. The multilayer board is a board type with three or more layers of copper foils formed by combining a single-sided board and/or a double-sided board. At present, single-layer and double-layer boards can be effectively produced by a production mode of FPC roll-to-roll, and the roll-to-roll process has technical difficulty in the production of FPC multilayer boards. The reason is that the multilayer board needs to be cut into sheets to be stacked, and the laminator is used for laminating, and under the existing technical conditions, the laminator is used for sheet operation, so that laminating and subsequent outer layer processing are sheet production.

Disclosure of Invention

Aiming at the defects in the technology, the application provides the FPC multilayer board roll-to-roll production process, which can effectively improve the production efficiency of FPC.

In order to solve the technical problem, the technical scheme adopted by the application is as follows: a roll-to-roll production process of an FPC multi-layer board comprises the following steps:

s1, providing a rolled composite single-sided board, wherein the composite single-sided board comprises a first copper foil layer, a first insulating layer, a glue layer and lining paper which are sequentially arranged;

s2, punching a board dividing line on the composite single-sided board in an RTR punching mode, wherein the board dividing line is cut from the first copper foil layer to the adhesive layer;

s3, providing a rolled double-sided board, wherein the double-sided board comprises a second insulating layer and second copper foil layers arranged on two sides of the second insulating layer;

s4, separating the glued single-sided board from the lining paper in an RTR bending mode to obtain the glued single-sided board;

s5, positioning and attaching the single panel with the adhesive to the double-sided board in an RTR (real time reactor) attaching mode;

and S6, pressing and attaching the single-sided board with the adhesive and the double-sided board together in an RTR (real time reactor) quick pressing mode to obtain the rolled FPC (flexible printed circuit) multilayer board.

Further, in step S4, the separated adhesive-backed veneer is conveyed by a robot with a suction cup.

Further, step S2 adopts the dyestripping device to go on, the dyestripping device includes that compound veneer unreels axle, jackshaft and slip sheet rolling shaft, rolled compound veneer by unreel the axle, the process the jackshaft is bent the back, the veneer with glue with slip sheet separation, the slip sheet rolling is extremely on the slip sheet rolling shaft.

Further, in step S5, the single-sided board with the adhesive is sucked by the manipulator with the suction cup and then positioned and attached to the double-sided board.

Further, the step S5 includes the following steps:

s50, heating the sucker to 50-70 ℃, and attaching the single-sided board with the adhesive to the double-sided board for 2-10 s under the pressure of 0.1-0.4 MPa.

Further, the step S5 further includes the following steps:

s51, pre-pressing the single-sided board and the double-sided board, wherein the temperature range is 60-100 ℃, the pressure range is 0.2-0.8 MPa, and the pressing time is 1-6 seconds.

Further, in the step S6, the pressing temperature is 150-200 ℃, and the pressure is 80-130 kgf/cm²The preheating time is 10-30 s, and the pressing time is 150-350 s.

Further, the press stacking structure during the pressing in the step S6 includes a first baked iron plate, a first fiberglass cloth, a first fiberglass paper, a first adhesive-resistant release film, an unfettered FPC multilayer board, a second adhesive-resistant release film, a second fiberglass paper, a second fiberglass cloth, and a second baked iron plate, which are sequentially disposed.

Further, the step S6 further includes the following steps:

and S60, after the FPC multilayer board is unwound by using an unwinding machine, baking the FPC multilayer board to enable the adhesive layer to be completely cured.

Further, the FPC multilayer board roll-to-roll production process further comprises the following steps:

s7, positioning and attaching the single-sided board with the adhesive to a FPC (flexible printed circuit) multilayer board in an RTR (real time resistance) attaching mode, and then pressing the FPC multilayer board in an RTR quick pressing mode, so that the number of layers of the FPC multilayer board is increased;

and S8, repeating the step S7 until the layer number of the FPC multilayer board meets the requirement.

Compared with the prior art, the application has the beneficial effects that:

according to the FPC multilayer board roll-to-roll production process, the board lines are punched on the composite single panel, so that the glued single panel can be separated from the lining paper in an RTR bending mode, and then the glued single panel is moved and attached to the double-sided board, and a three-layer board is obtained; the number of layers of the multilayer board can be increased by repeatedly attaching the single-sided board with the adhesive to the multilayer board at most, so that the FPC multilayer board with the required number of layers is obtained, the production efficiency is effectively improved, the influence of human factors on the product quality is avoided, and the yield of the product is powerfully guaranteed.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:

fig. 1 is a schematic structural view of a composite single panel in the present application.

Fig. 2 is a schematic structural diagram of a composite single-sided board provided with a board dividing line in the application.

Fig. 3 is a schematic view of the structure of the composite single panel shown in fig. 2 with an auxiliary film.

Fig. 4 is a schematic view of the roll blanking apparatus of the present application.

Fig. 5 is a schematic structural diagram of a single panel with adhesive in the present application.

Fig. 6 is a schematic structural view of a double-sided board in the present application.

Fig. 7 is a schematic view of the structure of the film tearing device in the present application.

Fig. 8 is a schematic structural diagram of a laminating and pre-pressing device in the present application.

FIG. 9 is a schematic view of a three-layer plate of the present application.

Fig. 10 is a schematic structural diagram of a rapid-compaction apparatus in the present application.

Fig. 11 is a schematic view of a press stack during pressing by the rapid press of the present application.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be further noted that, for the convenience of description, only some of the structures related to the present application are shown in the drawings, not all of the structures. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "comprising" and "having," as well as any variations thereof, in this application are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

The roll-to-roll production process of the FPC multilayer board corresponding to a preferred embodiment of the application comprises the following steps:

s1, providing a rolled composite single-sided board 1, wherein the composite single-sided board 1 comprises a first copper foil layer 10, a first insulating layer 11, an adhesive layer 12 and lining paper 13 which are sequentially arranged as shown in figure 1;

in step S1, the composite single-sided board 1 can be obtained by attaching tape slip sheets to the single-sided board, and specifically, it can be obtained by the following steps:

s10, bonding the tape slip sheet and the single panel together in an RTR hot rolling mode, wherein the tape slip sheet comprises a slip sheet 13 and a glue layer 12 arranged on the slip sheet 13, the single panel 1 comprises a first insulating layer 11 and a first copper foil layer 10 arranged on the first insulating layer 11, and after hot rolling, the glue layer 12 is adhered to the first insulating layer 11 of the single panel.

Anti-sticking materials such as teflon can be arranged on the surfaces of the lining paper 13, which are in contact with the adhesive layers 12, so that the lining paper 13 can be separated from the adhesive layers 12 conveniently. The adhesive layer 12 is made of high temperature thermosetting pure adhesive, and the first insulating layer 11 is preferably made of Polyimide (PI).

S2.rtr die-cut the composite single panel 1, as shown in fig. 2, a parting line 1a is die-cut on the composite single panel 1, the parting line 1a being in a half-cut form, which cuts the first copper foil layer 10, the first insulating layer 11 and the adhesive layer 12 without cutting the interleaving paper 13.

As a preferred embodiment, in order to prevent the interleaving paper 13 from being punched due to improper control of the punching process and improve the fault tolerance and the operation window of the punching process, as shown in fig. 3, the composite single-sided board 1 may further be provided with an auxiliary film 130 connected to the interleaving paper 13, the auxiliary film 130 and the adhesive layer 12 are respectively located on two sides of the interleaving paper 13 and may be a PET film, a PP film, or a PE film, and after the auxiliary film 130 is provided, even if the interleaving paper 13 is inadvertently cut, the auxiliary film 130 is still connected to the interleaving paper, so that the smooth operation of the RTR production process can be effectively ensured. The auxiliary film 130 may be removed simultaneously with the interleaving paper 13 in the subsequent step S4.

In step S2, when punching the composite single-sided board 1, the air vent hole and the alignment hole penetrating the composite single-sided board 1 may be simultaneously punched in the non-wiring region.

Steps S1 and S2 may be performed by a roll punching apparatus as shown in fig. 4, which includes a single-panel unwinding shaft 15, a tape backing paper unwinding shaft 16, a hot-pressing roller set 17, a punching device 18, and a composite single-panel winding shaft 19, wherein the wound single-panel and tape backing paper are unwound from the respective unwinding shafts, are bonded together by hot-pressing via the hot-pressing roller set 17, are punched by the punching device 18, and are wound onto the composite single-panel winding shaft 19. In this way, the attaching and punching operations in steps S10 and S2 are completed in a roll-to-roll manner, and the production efficiency and quality can be effectively improved.

And S3, providing a roll-shaped double-sided board 2, wherein the double-sided board 2 comprises a second insulating layer 20 and second copper foil layers 21 arranged on two sides of the second insulating layer 20, as shown in FIG. 5.

The double-sided board 2 may be obtained as it is or may be attached to the second insulating layer 20 and the second copper foil layer 21 by means of RTR attachment.

Step S3 may further include the steps of:

s30, processing an exposure alignment hole for manufacturing a circuit on the double-sided board 2 in an RTR laser mode;

and S31, manufacturing a circuit of the double-sided board 2 according to the exposure alignment hole.

In the step S30, the alignment holes machined by the laser method have high position and size accuracy, which is beneficial to ensuring that the circuit manufactured in the step S31 meets the design requirements, thereby ensuring the product quality.

The specific way of manufacturing the circuit in step S31 may be a conventional roll-to-roll processing way, that is, a way of pressing a dry film, exposing, developing, etching, and removing a film by RTR, so as to manufacture the circuit, and at the same time, an exhaust groove, a CCD alignment target, and the like may be manufactured.

In step S31, the surface of the double-sided board 2 to which the single-sided board 14 with adhesive is attached in step S5 may be processed to form a circuit, and the circuit on the other surface may be processed after step S6, so that the circuit exposed to the outside is not adversely affected during the subsequent processing.

The vent holes are punched on the single panel 14 with the adhesive, and the exhaust grooves are etched on the double-sided board 2, so that when the single panel 14 with the adhesive is attached and pressed on the double-sided board 2 in the subsequent process, the exhaust can be discharged through the vent holes and the exhaust grooves, the attachment is smoother, and the product yield is favorably improved.

And S4, removing the lining paper 13 on the composite single-sided board 1 in an RTR mode to obtain a glued single-sided board 14, wherein the glued single-sided board 14 comprises a first copper foil layer 10, a first insulating layer 11 and a glue layer 12 which are sequentially arranged as shown in figure 6.

In step S4, the glued single-sided board 14 is automatically cut off at the board dividing line 1a by bending the composite single-sided board 1, so that the glued single-sided board 14 is conveniently separated from the lining paper 13. Further, the composite single-sided board 1 is automatically bent during the movement, so that the glued single-sided board 14 is automatically separated while the composite single-sided board 1 is moving.

Specifically, the above-mentioned separation mode can be realized by a film tearing device as shown in fig. 7, which comprises a composite single-panel unwinding shaft 22, an intermediate shaft 23 and a backing paper winding shaft 24, wherein the composite single-panel 1 is placed on the composite single-panel unwinding shaft 22 in a roll-like manner, and after the glued single-panel 14 is separated at the intermediate shaft 23, the backing paper 13 is wound on the backing paper winding shaft 24. The mount 13 is bent at the intermediate shaft 23, and preferably, the bending angle a is an acute angle, preferably 30 to 60 degrees, so that the glued single-sided board 14 can be reliably separated from the mount 13. The separated adhesive single-sided board 14 can be picked by the robot 33 with suction cup and then moved to another platform or the double-sided board 2. In order to facilitate grabbing of the single panel 14 with glue, a bearing plate 25 is arranged at the position, corresponding to the separated single panel 14 with glue, of the middle shaft 23, and the separated single panel 14 with glue is moved to the position of the bearing plate 25 to facilitate sucking of the manipulator 33. Therefore, the adhesive single-sided board 14 can be automatically separated from the lining paper 13 in a roll-to-roll mode, and the production efficiency is higher.

As described above, for the interleaving paper 13 having the auxiliary film 130, the interleaving paper 13 and the auxiliary film 130 can be simultaneously wound up on the interleaving paper winding shaft 24, thereby separately separating the adhesive veneer 14.

And S5, positioning and attaching the adhesive single-sided board 14 to the double-sided board 2 in an RTR (real time reactor) attaching mode, so that the adhesive layer 12 of the adhesive single-sided board 14 is connected to the second copper foil layer 21 of the double-sided board 2.

In step S5, the single-sided board 14 with adhesive and the double-sided board 2 can be positioned by the holes opened in advance: when the composite single-sided board 1 is punched in the step S2, a first aligning hole may be punched at the same time; in step S31, a second alignment hole corresponding to the first alignment hole may be formed, and the second alignment hole may be a CCD alignment target, so that the alignment may be achieved by the cooperation of the first alignment hole and the second alignment hole.

In step S5, the manipulator 33 with the suction cup sucks the first copper foil layer 10 of the adhesive-carrying single-sided board 1, and then the CCD camera shoots, determines and positions the first copper foil layer, and moves the adhesive-carrying single-sided board 1 to place the double-sided board 2, so that the adhesive layer 12 adheres to the surface of the first copper foil layer 10.

Further, step S5 includes step S50 of preliminary bonding: the sucker has a heating function, can be heated to 50-70 ℃, and is attached to the double-sided board 2 for 2-10 s under the pressure of 0.1-0.4 MPa, so that the single-sided board 14 with the adhesive is initially attached to the double-sided board 2, and the single-sided board 14 with the adhesive cannot warp or fall off in the subsequent moving process.

Step S5 may further include the steps of: and S51, pre-pressing the single-sided board 14 with the adhesive and the double-sided board 2.

In step S51, a false press can be used for pre-pressing, the temperature range is 60-100 ℃, the pressure range is 0.2-0.8 MPa, and the pressing time is 1-6 seconds.

In a preferred embodiment, the double-sided boards 2 move along a straight line, and when they reach the bonding position, the movement is stopped, and the robot 33 bonds the single-sided boards with adhesive 14 to the double-sided boards 2, and then moves the double-sided boards 2 bonded with the single-sided boards with adhesive 14 by a predetermined distance, and moves the double-sided boards to the dummy press, and the dummy press performs the pre-pressing. Specifically, the lamination pre-pressing device shown in fig. 8 may be implemented, and includes a double-sided board unwinding shaft 3, a carrying platform 30, a false pressing machine 31, and a multilayer board winding shaft 32, which are sequentially disposed. The rolled double-sided board 2 is placed on the double-sided board unwinding shaft 3, and is wound on the multilayer board winding shaft 32 after sequentially passing through the stage 30 and the dummy press 31. At the carrying stage 30, the manipulator 33 aligns and attaches the adhesive single-layer board 14 and the double-sided board 2, and then pre-presses the adhesive single-layer board 14 on the double-sided board 2 at the false pressing machine 31 to preliminarily form an FPC multilayer board 4 (three-layer board) which is wound on the multilayer board winding shaft 32, as shown in fig. 9, the FPC multilayer board 4 includes the adhesive single-layer board 14 and the double-sided board 2 connected together by the adhesive layer 12, and there are three layers of copper foils in total.

The steps S4 and S5 can be performed by using an automatic film sticking machine in the prior art, additional design and production equipment are not needed, and the method is very convenient.

And S6, pressing and attaching the single-sided board 14 with the adhesive and the double-sided board 2 together in an RTR quick pressing mode.

In a preferred embodiment, in step S6, an RTR rapid press is used for pressing, wherein the pressing temperature is 150-200 ℃ and the pressure is 80-130 kgf/cm²The preheating time is 10-30 s, and the pressing time is 150-350 s. Specifically, as shown in fig. 10, the fast pressing device includes a first unwinding shaft 40 for placing the pre-pressed FPC multilayer board 4, a first winding shaft 41 for winding the pressed FPC multilayer board 4, and a fast press 42 for pressing the FPC multilayer board 4, and the FPC multilayer board 4 is drawn out from the first unwinding shaft 40, and is wound on the first winding shaft 41 after being pressed by the fast press 42, thereby obtaining the rolled FPC multilayer board 4.

Further, a press lamination shown in fig. 11 is preferably adopted when the fast press performs pressing, and the press lamination includes a first baked iron plate 5, a first fiberglass cloth 50, a first fiberglass paper 51, a first adhesive-resistant release film 52, an unpressurized FPC multilayer plate 4, a second adhesive-resistant release film 53, a second fiberglass paper 54, a second fiberglass cloth 55, and a second baked iron plate 56, which are sequentially arranged from top to bottom. Wherein fine paper of glass and the fine cloth of glass can play the effect of buffering, can guarantee that three-layer board 4 is by reliable pressfitting, and hinder gluey from type membrane both guarantee that the pressfitting closely can make things convenient for the pressfitting back to take out three-layer board 4, prevent the adhesion again. Through the press stacking shown in fig. 11 and the cooperation of the pressing parameters, the pressing effect can be effectively improved, and the product quality can be ensured.

Step S6 may further include the following steps after stitching: and S60, baking the laminated FPC multilayer board 4 to completely cure the adhesive layer 12.

In step S60, the FPC multilayer board 4 after being pressed may be unwound using an unwinder, and then baked in a nitrogen oven at a baking temperature of 150 to 200 ℃ for 2 to 4 hours. Because the FPC multilayer board 4 prepared in the step S6 is in a roll shape, the glue layer 12 positioned inside is difficult to be heated during baking, after the FPC multilayer board 4 is uncoiled through an uncoiling machine, the FPC multilayer board 4 can be heated more uniformly, and the high-temperature thermosetting glue layer 12 can be cured more fully and quickly, so that the reliability of connection among all layers in the FPC multilayer board 4 is enhanced, and the quality of products is ensured.

Through the above steps, an FPC multilayer board having three layers of copper foil, i.e., a three-layer board, can be obtained, and for an FPC multilayer board having a larger number of layers, the following steps can be added:

s7, positioning and adhering the single-sided board 14 with the adhesive to a FPC multilayer board in an RTR (real time resistance) adhering mode to obtain the FPC multilayer board with the number of layers increased, and then pressing the FPC multilayer board in an RTR quick pressing mode;

Preferably, the FPC multilayer board is pressed and dried in step S7, and then the adhesive-coated single-sided board 14 is attached to increase the number of layers.

For example, if four layers are to be prepared, four layers can be obtained by attaching the glued single-layer panel 14 to three layers and then pressing the four layers; the glued single panel 14 can be obtained through the above steps S1 to S3, and the three-layer board can be obtained through the above steps S1 to S6, and the RTR can be applied in the manner described in the above step S5.

If five-layer boards are to be prepared, four-layer boards may be prepared, and then five-layer boards may be obtained by attaching the glued single-layer board 14 to the four-layer boards, and then laminating the five-layer boards.

The manner of preparing six and more plies can be analogized.

In addition, the final form of the FPC multilayer board produced by the roll-to-roll process is in a roll shape, and compared with the sheet-shaped FPC multilayer board in the prior art, the roll-to-roll process is beneficial to containing, transporting and using the FPC multilayer board, and has stronger product competitiveness.

The above description is only for the purpose of illustrating embodiments of the present invention and is not intended to limit the scope of the present invention, and all modifications, equivalents, and equivalent structures or equivalent processes that can be used directly or indirectly in other related fields of technology shall be encompassed by the present invention.

Claims

1. A production process of FPC multi-layer board roll-to-roll is characterized by comprising the following steps:

s1, providing a rolled composite single-sided board (1), wherein the composite single-sided board (1) comprises a first copper foil layer (10), a first insulating layer (11), an adhesive layer (12) and lining paper (13) which are sequentially arranged;

s2, punching a board dividing line (1a) on the composite single-sided board (1) in an RTR punching mode, wherein the board dividing line (1a) is cut from the first copper foil layer (10) to the adhesive layer (12);

s3, providing a rolled double-sided board (2), wherein the double-sided board (2) comprises a second insulating layer (20) and second copper foil layers (21) arranged on two sides of the second insulating layer (20);

s4, separating the glued single-sided board (14) from the lining paper (13) in an RTR bending mode to obtain the glued single-sided board (14);

s5, positioning and attaching the single-sided board (14) with the adhesive to the double-sided board (2) in an RTR (real time reactor) attaching manner;

and S6, pressing and attaching the single-sided board (14) with the adhesive and the double-sided board (2) together in an RTR (real time reactor) quick pressing mode to obtain the rolled FPC (flexible printed circuit) multilayer board.

2. The FPC multilayer board roll-to-roll production process according to claim 1, wherein in step S4, the separated adhesive-backed single panel (14) is carried by a robot arm (33) with a suction cup.

3. The FPC multilayer board roll-to-roll production process according to claim 1, wherein the step S2 is performed by using a film tearing device, the film tearing device comprises a composite single-panel unreeling shaft (22), an intermediate shaft (23) and a lining paper reeling shaft (24), the coiled composite single panel (1) is unreeled from the unreeling shaft (22), the glued single panel (14) is separated from the lining paper (13) after being bent by the intermediate shaft (23), and the lining paper (13) is reeled onto the lining paper reeling shaft (24).

4. The FPC multilayer board roll-to-roll production process according to claim 1, wherein in step S5, the glued single-sided board (14) is sucked by a mechanical arm with a sucker and then positioned and attached to the double-sided board (2).

5. The FPC multilayer board roll-to-roll production process according to claim 4, wherein said step S5 comprises the steps of:

s50, heating the sucker to 50-70 ℃, and attaching the single-sided board (14) with the adhesive to the double-sided board (2) for 2-10 s under the pressure of 0.1-0.4 MPa.

6. The FPC multilayer board roll-to-roll production process according to claim 5, wherein said step S5 further comprises the steps of:

s51, pre-pressing the single-sided board (14) and the double-sided board (2), wherein the temperature range is 60-100 ℃, the pressure range is 0.2-0.8 MPa, and the pressing time is 1-6 seconds.

7. The FPC multilayer board roll-to-roll production process according to any one of claims 1 to 6, wherein in the step S6, the pressing temperature is 150-200 ℃ and the pressure is 80-130 kgf/cm²The preheating time is 10-30 s, and the pressing time is 150-350 s.

8. The FPC multilayer board roll-to-roll production process according to claim 7, wherein the pressing stack during the pressing in step S6 includes a first baked iron plate (5), a first fiberglass cloth (50), a first fiberglass paper (51), a first adhesive release film (52), an unpressed FPC multilayer board (4), a second adhesive release film (53), a second fiberglass paper (54), a second fiberglass cloth (55), and a second baked iron plate (56) which are sequentially arranged.

9. The FPC multilayer board roll-to-roll production process according to any one of claims 1 to 6, wherein said step S6 further comprises the steps of:

and S60, after the FPC multilayer board is unwound by using an unwinding machine, baking the FPC multilayer board to enable the adhesive layer (12) to be completely cured.

10. The FPC multilayer board roll-to-roll production process according to any one of claims 1 to 6, characterized by further comprising the steps of:

s7, positioning and gluing the single panel (14) with the adhesive on the FPC multilayer board in an RTR (real time reactor) gluing mode, and then pressing the FPC multilayer board in an RTR fast pressing mode, so that the number of layers of the FPC multilayer board is increased;