KR102330332B1 - Method for manufacturing flexible printed circuit board - Google Patents

Abstract

A flexible printed circuit board manufacturing method is disclosed, wherein the flexible printed circuit board manufacturing method comprises: (a) a first laminate and a second laminate including a polyimide layer and copper layers formed on both surfaces of the polyimide layer; Laminating the first laminate and the second laminate and the tape so that one side faces each of the one side and the other side, and the other side faces each other with the tape interposed therebetween to prepare a main laminate; (b) patterning one surface and the other surface of the main laminate; (c) laminating an outer layer on one surface and the other surface of the main laminate; and (d) separating the main laminate into the first laminate and the second laminate, wherein the steps (a) and (b) are performed by a roll-to-roll method.

Description

Flexible printed circuit board manufacturing method {METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD}

The present application relates to a method for manufacturing a flexible printed circuit board.

Recently, smartphone functions and performance are rapidly evolving, and 5G mobile communication (5G), folder phones, and triple cameras are being developed. They are being reviewed together.

As such, as the performance and thinning of flexible printed circuit boards progresses, an expensive method is being applied to the manufacture of flexible printed circuit boards. , productivity is low and expensive via fill copper plating is applied, making it difficult to secure price competitiveness.

In addition, recently, as high flexibility is required, flexible printed circuit boards are manufactured by applying multiple single-sided FCCL raw materials or by combining double-sided FCCL + single-sided FCCL raw materials. There are difficulties in lowering productivity and reducing costs due to the rise in unit price and production of sheets + one core.

Specifically, to describe the conventional method for manufacturing a flexible printed circuit board, the inner layer bvh + copper plating type involves processing bvh (blind via hole) in raw materials (polyimide and Cu layer formed on one side and the other side of polyimide) and pretreatment (plasma or desmear), chemical copper, via fill processing or general plating, dry film coating, exposure, development, etching, peeling, and lamination of coverlays and outer layers.

In addition, the normal type (Normal Type) may be formed through dry film coating of raw materials, exposure, development, etching, peeling, and lamination of a coverlay and an outer layer.

However, in conventional flexible printed circuit board manufacturing methods, copper plating, exposure, etching, and lamination processes are processes that take a lot of time in expensive equipment, high process cost and lead time than other processes. Since it is possible to proceed with only one raw material (polyimide and one in which a Cu layer is formed on one and the other side of polyimide), there was a low productivity.

In addition, in the conventional method of manufacturing a flexible printed circuit board, as copper plating is applied to both Cu surfaces of the raw material, plating deviation occurs, which causes difficulty in implementing a fine pattern and occurrence of circuit defects. In addition, there was an aspect that the flexibility was lowered due to the influence of copper plating. For example, the higher the copper plating condition, the greater the top-bottom plating deviation. In general, there is a 4~8um deviation, which may cause difficulties in circuit implementation. Under etching, where plating was low, over etching failure appeared, which could be the cause of low yield.

In addition, the conventional flexible printed circuit board manufacturing method had a problem in terms of sheet production. In order to increase productivity in a single raw material production method, two sheets of raw material are produced using adhesive tape, but when the thermosetting tape is closely adhered, The raw materials had to be attached separately to each of the one and the other sides of the thermosetting tape, so the attachment of the raw materials had to be done in two steps, and an additional removal process was required after copper plating. there was

The technology that is the background of the present application is disclosed in Korean Patent Application Laid-Open No. 10-2018-0130907.

An object of the present application is to solve the problems of the prior art, and to provide a method for manufacturing a flexible printed circuit board that can improve productivity and reduce costs compared to a conventional method for manufacturing a flexible printed circuit board.

However, the technical problems to be achieved by the embodiment of the present application are not limited to the technical problems as described above, and other technical problems may exist.

As a technical means for achieving the above technical problem, the method for manufacturing a flexible printed circuit board according to the first aspect of the present application includes (a) a first laminate including a polyimide layer and a copper layer formed on both surfaces of the polyimide layer processing bvh on one side of each of the sieve and the second laminate; (b) the first laminate and the second laminate so that one surface of each of the first and second laminates processed by bvh faces one side and the other side, and the other surfaces face each other with a tape interposed therebetween and laminating a tape to prepare a main laminate in which the bvh is processed on one side and the other side; (c) applying chemical copper to one surface and the other surface of the main laminate; (d) performing copper plating on one surface and the other surface of the main laminate; (e) patterning one surface and the other surface of the main laminate; (f) laminating an outer layer on one surface and the other surface of the main laminate; and (g) separating the main laminate into the first and second laminates, wherein steps (a) to (e) may be performed by a roll-to-roll method.

In the method for manufacturing a flexible printed circuit board according to an embodiment of the present application, the step (a) includes bvh on one surface of the first laminate unwound from the unwinding roller and bvh on one surface of the second laminate unwound from the unwinding roller. It can be carried out in a roll-to-roll method of processing.

In the method for manufacturing a flexible printed circuit board according to an embodiment of the present application, in step (b), the first laminate, the second laminate, and the tape, one side of the first laminate is directed to one side , One side of the second stacked body faces the other side, and between the first and second rollers positioned on the other side and the first roller positioned on one side with the tape disposed between the first and second stacked bodies can pass through

In the method for manufacturing a flexible printed circuit board according to an embodiment of the present application, in step (b), each of the first laminate, the second laminate, and the tape is unwound from each unwinding roller, and the first side It may be carried out in a roll-to-roll method that is supplied between the roller and the first other side roller.

In the method for manufacturing a flexible printed circuit board according to an embodiment of the present application, step (b) is performed at a temperature of 40°C or higher and 80°C or lower, and in step (b), the first roller and the first The other roller may apply a pressure of 4 kg or more and 20 kg or less to the first laminate, the second laminate, and the tape.

In the method for manufacturing a flexible printed circuit board according to an embodiment of the present application, the step (e) includes (e1) coating a dry film on one side and the other side of the main laminate, wherein the step (e1) of the main laminate, the first dry film, and the second dry film, one side and the other side of the main laminate each facing one side and the other side, and the first dry film on one side and the other side of the main laminate, respectively and a second one-side roller positioned on one side and a second other-side roller positioned on the other side in a state in which each of the second dry films are disposed.

In the method of manufacturing a flexible printed circuit board according to an embodiment of the present application, in step (e1), each of the main laminate, the first dry film, and the second dry film is unwound from each unwinding roller, and the second dry film is unwound. 2 It may be carried out in a roll-to-roll method that is supplied between the roller on one side and the second roller on the other side.

In the method of manufacturing a flexible printed circuit board according to an embodiment of the present application, the step (e) is, after the step (e1), (e2) the main lamination layer on which the first dry film and the second dry film are coated. exposing the sieve; (e3) developing the main laminate on which the first dry film and the second dry film are coated; (e4) etching the main laminate on which the first dry film and the second dry film are coated; and (e5) removing the first dry film and the second dry film from the main laminate on which the first dry film and the second dry film are coated. Step e5) may be performed in a roll-to-roll method in which the main laminate coated with the first dry film and the second dry film is unwound from its unwinding roller.

The method of manufacturing a flexible printed circuit board according to an embodiment of the present application may further include cutting the main laminate between steps (e) and (f).

As a technical means for achieving the above technical problem, the method for manufacturing a flexible printed circuit board according to the second aspect of the present application includes (a) a first laminate including a polyimide layer and a copper layer formed on both surfaces of the polyimide layer The first and second laminates and the tape are laminated so that one side of each of the sieve and the second laminate is directed to one side and the other side, respectively, and the other surfaces are opposed to each other with the tape interposed therebetween, to prepare a main laminate to do; (b) patterning one surface and the other surface of the main laminate; (c) laminating an outer layer on one surface and the other surface of the main laminate; and (d) separating the main laminate into the first laminate and the second laminate, wherein the steps (a) and (b) may be performed by a roll-to-roll method.

In the method for manufacturing a flexible printed circuit board according to an embodiment of the present application, in step (a), the first laminate, the second laminate, and the tape, one side of the first laminate is directed to one side , One side of the second stacked body faces the other side, and between the first and second rollers positioned on the other side and the first roller positioned on one side with the tape disposed between the first and second stacked bodies can pass through

In the method for manufacturing a flexible printed circuit board according to an embodiment of the present application, in step (a), each of the first laminate, the second laminate, and the tape is unwound from each unwinding roller, and the first side It may be carried out in a roll-to-roll method that is supplied between the roller and the first other side roller.

In the method for manufacturing a flexible printed circuit board according to an embodiment of the present application, the step (a) is performed at a temperature of 40°C or higher and 80°C or lower, and in step (a), the first roller and the first The other roller may apply a pressure of 4 kg or more and 20 kg or less to the first laminate, the second laminate, and the tape.

In the method for manufacturing a flexible printed circuit board according to an embodiment of the present application, the step (b) includes (b1) coating a dry film on one side and the other side of the main laminate, wherein the step (b1) of the main laminate, the first dry film, and the second dry film, one side and the other side of the main laminate each facing one side and the other side, and the first dry film on one side and the other side of the main laminate, respectively and a second one-side roller positioned on one side and a second other-side roller positioned on the other side in a state in which each of the second dry films are disposed.

In the method of manufacturing a flexible printed circuit board according to an embodiment of the present application, in step (b1), each of the main laminate, the first dry film, and the second dry film is unwound from each unwinding roller, and the second dry film is unwound. 2 It may be carried out in a roll-to-roll method that is supplied between the roller on one side and the second roller on the other side.

In the method of manufacturing a flexible printed circuit board according to an embodiment of the present application, the step (b) includes, after the step (b1), (b2) a main lamination layer on which the first dry film and the second dry film are coated. exposing the sieve; (b3) developing the main laminate on which the first dry film and the second dry film are coated; (b4) etching the main laminate on which the first dry film and the second dry film are coated; and (b5) removing the first dry film and the second dry film from the main laminate on which the first dry film and the second dry film are coated. Step b5) may be performed in a roll-to-roll method in which the main laminate coated with the first and second dry films is unwound from its unwinding roller.

The method for manufacturing a flexible printed circuit board according to an embodiment of the present application may further include cutting the main laminate between steps (b) and (c).

The above-described problem solving means are merely exemplary, and should not be construed as limiting the present application. In addition to the exemplary embodiments described above, additional embodiments may exist in the drawings and detailed description.

According to the above-described problem solving means of the present application, each of the first and second laminates comprising a polyimide layer and a copper layer formed on both surfaces of the polyimide layer is simultaneously applied to one side and the other side of the tape by a roll-to-roll process. It can be attached, and the efficiency can be increased compared to the method in which the process of attaching the raw material to each of the one and the other surfaces of the conventional tape was carried out over two times. In addition, according to the above-described problem solving means of the present application, since copper plating, dry film coating, exposure, development, etching, peeling and cutting can be performed by a roll-to-roll process, productivity can be improved compared to the conventional flexible printed circuit board manufacturing method. can

In addition, in the prior art, both sides of the raw material were plated with copper, resulting in plating deviation. Since the process proceeds in this state, the other surface of each of the first and second laminates is not plated, so circuits can be implemented on the Cu layer (copper layer) on the other surface, so fine pattern implementation ability can be increased, and yield improvement effect can be exercised

1 and 2 are schematic conceptual views for explaining the step of forming bvh in each of the first and second laminates of the method for manufacturing a flexible printed circuit board according to the first embodiment of the present application.
3 is a cross-sectional view taken along lines A1 and A2 of FIG. 1 .
4 is a cross-sectional view of B1 and B2 of FIG. 2 .
5 is a schematic conceptual diagram for explaining a step of manufacturing a main laminate of the flexible printed circuit board manufacturing method according to the first embodiment of the present application.
FIG. 6 is a cross-sectional view of FIG. 5C .
7 is a schematic conceptual diagram for explaining a step of performing chemical copper of the method for manufacturing a flexible printed circuit board according to the first embodiment of the present application.
FIG. 8 is a cross-sectional view taken along line D of FIG. 7 .
9 is a schematic conceptual diagram for explaining a step of performing copper plating in the method for manufacturing a flexible printed circuit board according to the first embodiment of the present application.
FIG. 10 is a cross-sectional view of FIG. 9E .
11 is a schematic conceptual diagram for explaining the step of coating the dry film in the patterning step of the flexible printed circuit board manufacturing method according to the first embodiment of the present application.
FIG. 12 is a cross-sectional view taken along line F of FIG. 11 .
13 is a schematic conceptual diagram for explaining the exposure step of the patterning step of the flexible printed circuit board manufacturing method according to the first embodiment of the present application.
14 is a cross-sectional view taken along line G of FIG. 13 .
15 is a schematic conceptual diagram for explaining the developing step of the patterning step of the flexible printed circuit board manufacturing method according to the first embodiment of the present application.
16 is a cross-sectional view taken along line H of FIG. 15 .
17 is a schematic conceptual diagram for explaining the etching step of the patterning step of the flexible printed circuit board manufacturing method according to the first embodiment of the present application.
Fig. 18 is a cross-sectional view taken along line I of Fig. 17;
19 is a schematic conceptual diagram for explaining the step of removing the dry film in the patterning step of the flexible printed circuit board manufacturing method according to the first embodiment of the present application.
FIG. 20 is a cross-sectional view taken along line J of FIG. 19 .
21 is a schematic cross-sectional view for explaining a step of loading an outer layer and forming a coverlay layer in the method for manufacturing a flexible printed circuit board according to the first embodiment of the present application.
22 is a schematic cross-sectional view for explaining the step of separating the first laminate and the second laminate of the method for manufacturing a flexible printed circuit board according to the first embodiment of the present application.
23 is a schematic conceptual diagram for explaining a cutting step of the method for manufacturing a flexible printed circuit board according to the first embodiment of the present application.
24 is a schematic conceptual diagram for explaining a step of manufacturing a main laminate of a method for manufacturing a flexible printed circuit board according to a second embodiment of the present application.
25 is a cross-sectional view taken along lines A1 and A2 of FIG. 24 .
FIG. 26 is a cross-sectional view of FIG. 24B.
27 is a schematic conceptual diagram for explaining the step of coating the dry film in the patterning step of the flexible printed circuit board manufacturing method according to the second embodiment of the present application.
Fig. 28 is a cross-sectional view of Fig. 27C.
29 is a schematic conceptual diagram for explaining the exposure step of the patterning step of the flexible printed circuit board manufacturing method according to the second embodiment of the present application.
FIG. 30 is a cross-sectional view of FIG. 29D .
31 is a schematic conceptual diagram for explaining the developing step of the patterning step of the flexible printed circuit board manufacturing method according to the second embodiment of the present application.
FIG. 32 is a cross-sectional view of FIG. 31E .
33 is a schematic conceptual diagram for explaining the etching step of the patterning step of the flexible printed circuit board manufacturing method according to the second embodiment of the present application.
FIG. 34 is a cross-sectional view taken along F of FIG. 33 .
35 is a schematic conceptual diagram for explaining the step of removing the dry film in the patterning step of the flexible printed circuit board manufacturing method according to the second embodiment of the present application.
FIG. 36 is a cross-sectional view taken along line G of FIG. 35 .
37 is a schematic cross-sectional view for explaining a step of loading an outer layer and forming a coverlay layer in a method for manufacturing a flexible printed circuit board according to a second embodiment of the present application.
38 is a schematic cross-sectional view for explaining the step of separating the first laminate and the second laminate of the method for manufacturing a flexible printed circuit board according to the second embodiment of the present application.
39 is a schematic conceptual diagram for explaining a cutting step of a method for manufacturing a flexible printed circuit board according to a second embodiment of the present application.
40 is a table showing the bending degrees of five flexible printed circuit board samples (#1 to #5) manufactured by a conventional manufacturing method.
41 is a table showing the bending degrees of five flexible printed circuit board samples (#1 to #5) manufactured by the flexible printed circuit board manufacturing method according to the first and second embodiments of the present application.

Hereinafter, embodiments of the present application will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art to which the present application pertains can easily implement them. However, the present application may be embodied in several different forms and is not limited to the embodiments described herein. And in order to clearly explain the present application in the drawings, parts irrelevant to the description are omitted, and similar reference numerals are attached to similar parts throughout the specification.

Throughout this specification, when a part is "connected" to another part, it is not only "directly connected" but also "indirectly connected" or "electrically connected" with another element interposed therebetween. "Including cases where

Throughout this specification, when it is said that a member is positioned "on", "on", "on", "under", "under", or "under" another member, this means that a member is positioned on the other member. It includes not only the case where they are in contact, but also the case where another member exists between two members.

Throughout this specification, when a part "includes" a component, it means that other components may be further included, rather than excluding other components, unless otherwise stated.

The present application relates to a method for manufacturing a flexible printed circuit board.

First, a method for manufacturing a flexible printed circuit board (hereinafter referred to as 'this first manufacturing method') according to a first embodiment of the present application will be described.

Referring to FIGS. 1 and 2 , the first manufacturing method includes processing bvh (Blind Via Hole) 13 on one surface of each of the first laminate 1a and the second laminate 1b (first step) is included. Referring to FIG. 3 , each of the first laminate 1a and the second laminate 1b includes a polyimide layer 11 and a copper layer 12 formed on both surfaces of the polyimide layer 11 .

Also, referring to FIG. 4 , in the first step, bvh 13 penetrating the copper layer 12 and the polyimide layer 11 on one surface of the first laminate 1a may be formed. Also, in the first step, the bvh 13 penetrating the copper layer 12 and the polyimide layer 11 on one surface of the second laminate 1b may be formed. In addition, the first step can form the bvh (13) using a UV laser. Since bvh and bvh formation are obvious to those skilled in the art, detailed descriptions thereof will be omitted.

In addition, the first step is performed by a roll-to-roll method.

For example, referring to FIGS. 1 and 2 , in the first step, one surface of the first laminate 1a is unwound from the unwinding roller 9a and the second laminate 1b is unwound from the unwinding roller 9b. It can be performed in a roll-to-roll method of processing bVh (13) on one side of the

Specifically, the first laminate 1a may be unwound from the unwinding roller 9a and wound on a take-up roller (not shown). At this time, bvh (13) processing may be performed on a portion that is unwound from the unwinding roller 9a of the first laminate 1a and moves toward the take-up roller. In other words, bvh (13) processing can be made between the unwinding roller (9a) and the winding roller. In addition, the second laminate 1b may be unwound from the unwinding roller 9b and wound on a take-up roller (not shown). At this time, bvh (13) processing may be performed on the portion that is unwound from the unwinding roller 9b of the second laminate 1b and moves toward the take-up roller. In other words, bvh (13) processing can be made between the unwinding roller (9b) and the winding roller.

For reference, in the present application, each configuration may be a direction in which the moving direction in a direction away from the unwinding roller is unwound.

In addition, referring to FIG. 5 , the first manufacturing method includes a step (second step) of manufacturing the main laminate 2 in which bvh is processed on one surface and the other surface. Referring to FIG. 6 , in the second step, one surface of each of the first laminate 1a in which the bvh 13 is processed and the second laminate 1b in which the bvh 13 is processed faces one side and the other side, respectively , The main laminate 2 is manufactured by stacking the first laminate 1a, the second laminate 1b, and the tape 21 so that the other surfaces face each other with the tape 21 interposed therebetween.

The tape 21 may be a thermosetting tape. For example, the tape 21 may be made of a material including PET. In addition, the tape 21 may have a thickness of 20 μm or more and 70 μm or less. In this case, the tape 21 may be interposed between the first laminate 1a and the second laminate 1b in the main laminate 2 to serve as an inner support, roll among the steps to be described later. This may be to prevent the main laminate 2 from being wrinkled and to make the main laminate 2 flexible in steps performed in a two-roll manner.

In addition, the second step is performed by a roll-to-roll method.

Specifically, referring to FIG. 5 , in the second step, the first stacked body 1a, the second stacked body 1b and the tape 21 are applied to the first one side roller 9p and the first other side roller 9q. can pass through. At this time, one surface of the first laminate (1a) faces one side, one surface of the second laminate (1b) faces the other side, and the tape 21 is the first laminate (1a) and the second laminate (1b). The first laminate 1a, the second laminate 1b, and the tape 21 may pass between the first one side roller 9p and the first other side roller 9q in a state disposed therebetween. Accordingly, referring to FIG. 6 , one surface of the first laminate 1a faces one side and one surface of the second laminate 1b faces the other side, and the first laminate 1a and the second laminate 1b) The first laminated body 1a, the second laminated body 1b and the tape 21 are pressed against the first one side roller 9p and the first other side roller 9q with the tape 21 positioned therebetween, and the main A laminate 2 may be formed. In other words, in the main laminate 2, the first laminate 1a is positioned on one side of the tape 21 with one side facing one side, and the second laminate 1b has one side facing the other side. It may be positioned on the other surface of the tape 21 in a state of being.

At this time, the second step is performed at a temperature of 40 ℃ or more and 80 ℃ or less, and in the second step, the first one side roller 9p and the first other side roller 9q are one side roller 9p and the first other side roller ( 9q), a pressure of 4 kg or more and 20 kg may be applied to the first laminate 1a, the second laminate 1b, and the tape 21 passing between them. Also, the second step may apply a vacuum according to the bubble. In addition, in the second step, when the first laminate 1a, the second laminate 1b, and the tape 21 pass between the one roller 9p and the first roller 9q, 40° C. or more Heat up to 80°C can be applied.

In this way, the second step is to use the first one side roller 9p and the first other side roller 9q as an adherent to adhere the first laminate 1a, the second laminate 1b and the tape 21 to each other. can In other words, in the second step, the first laminated body 1a and the second laminated body 1b are simultaneously applied on both sides of the tape 21 using the first one side roller 9p and the first other side roller 9q. can proceed closely.

In addition, referring to FIG. 6 , in the second step, each of the first laminate 1a, the second laminate 1b, and the tape 21 is unwound from each of the unwinding rollers 9c, 9e, and 9d, and the first It may be carried out in a roll-to-roll method supplied between the one side roller (9p) and the first other side roller (9q).

Specifically, the first laminate 1a is unwound from the unwinding roller 9c, the second laminate 1b is unwound from the unwinding roller 9e, and the tape 21 is unwound from the unwinding roller 9d. Can be laminated by the first one side roller (9p) and the first other side roller (9q) can be the main stacked body (2), between the first one side roller (9p) and the first other side roller (9q) The main laminate 2 formed while passing may be wound on a winding roller (winding roller of the second stage).

Accordingly, the first one side roller (9p) and the first other side roller (9q) are the first laminate (1a), the second laminate (1b) and the tape 21, respectively, the unwinding rollers (9c, 9e, 9d) and the winding roller of the second step may be disposed while looking at each other in one and the other direction (the first one roller 9p and the first other roller 9q are in the front-rear direction reference (for example, see FIG. 1 3 ) The direction opposite to the direction in which the unwinding roller is disposed may be the front, and the direction opposite to the direction in which the unwinding roller is disposed in each drawing may be the front-rear direction, and the unwinding rollers 9c, 9d, 9e) and may be located between the winding roller of the second step, the first one side roller (9p) may be located on one side, the first other side roller (9q) may be located on the other side).

In addition, referring to FIGS. 7 and 8 , the first manufacturing method may include a step (third step) of applying chemical copper to one surface and the other surface of the main laminate 2 . For reference, in FIGS. 7 and 8 , a portion formed according to chemical copper is indicated by reference numeral 3 . Conductivity may be imparted to the bvh 13 by the third step.

Referring to FIG. 7 , in the third step, the main laminate 2 unwound from the unwinding roller 9f is wound by a winding roller (not shown), and the winding roller 9f of the main laminate 2 is unwound from the winding roller. Chemical copper can be applied to one side and the other side of the part facing to the side. Accordingly, chemical copper may be simultaneously applied to one surface and the other surface of the main laminate 2 . The chemical copper-treated portion of the main laminate 2 may be wound on a winding roller. In other words, the main laminate 2 may be wound on a winding roller when chemical copper is applied.

Also, for reference, the main laminate 2 wound on the unwinding roller 9f of the third step may be the main laminate 2 wound on the winding roller of the second stage in the second step.

Also, referring to FIG. 9 , the first manufacturing method may include a step (fourth step) of performing copper plating on one surface and the other surface of the main laminate 2 . Accordingly, referring to FIG. 10 , the copper plating layer 4 may be formed on one surface and the other surface of the main laminate 2 . Since the copper plating layer 4 and the method of performing the copper plating are obvious to those skilled in the art, a detailed description thereof will be omitted.

The fourth step is performed by a roll-to-roll method.

Referring to FIG. 9 , in the fourth step, the main laminated body 2 unwound from the unwinding roller 9g is wound by a winding roller (not shown), and the winding roller 9g from the unwinding roller 9g of the main laminated body 2 is wound. Copper plating can be applied to one side and the other side of the part facing to the side. Accordingly, the copper plating layer may be simultaneously formed on one surface and the other surface of the main laminate 2 . A portion of the main laminate 2 on which the copper plating layer 4 is formed may be wound on a winding roller. In other words, the main laminate 2 may be wound on a winding roller when the copper plating layer 4 is formed.

Also, for reference, the main laminate 2 wound on the unwinding roller 9f of the third step may be the main laminate 2 wound on the winding roller of the second stage in the second step.

Also, the first method includes a step (fifth step) of patterning one side and the other side of the main laminate 1 . The fifth step is performed by a roll-to-roll method.

Specifically, referring to FIG. 11 , the fifth step may include coating the dry film 5 on one surface and the other surface of the main laminate 2 (Step 5-1).

Referring to FIG. 11 , in step 5-1, the main laminate 2 , the first dry film 5 , and the second dry film 5 are applied to the second one side roller 9r and the second other side roller 9s ). can pass through. At this time, the main laminate 2 has one side and the other side facing one side and the other side, respectively, and each of the first dry film 5 and the second dry film 5 is disposed on one side and the other side of the main laminate 2 , respectively. It can pass between the second one side roller (9r) and the second other side roller (9s) in this state. Accordingly, referring to FIG. 12 , one surface of the main laminate 2 faces one side, the other surface of the main laminate 2 faces the other side, and the first dry film 5 and the second dry film 5 are the main The main laminate 2, the first dry film 5, and the second dry film 5 are disposed on the second side in a state in which the laminate 2 is positioned on one side and the other side, respectively, of the main laminate 2 with the laminate 2 interposed therebetween. The main laminate 2 coated on the dry film 5 may be formed by being pressed against the roller 9r and the second other side roller 9r.

In addition, referring to FIG. 11 , in step 5-1, the main laminate 2 , the first dry film 5 , and the second dry film 5 are unwinding rollers 9h, 9i, and 9j, respectively. It may be performed in a roll-to-roll method that is unwound from and supplied between the second one side roller 9r and the second other side roller 9s.

Specifically, the main laminate 2 is unwound from its unwinding roller 9h, the first dry film 5 is unwound from its unwinding roller 9i, and the second dry film 5 is unwound from its unwinding roller ( 9j) may be unwound, and may be laminated by the second one side roller (9r) and the second other side roller (9s). In addition, the main laminate 2 passing between the first one side roller 9p and the first other side roller 9q and coated with a dry film 5 on one side and the other side, respectively, is a winding roller (step 5-1) winding roller).

Accordingly, the second one side roller 9r and the second other side roller 9s are the main laminate 2, the first dry film 5, and the second dry film 5, respectively, the unwinding rollers 9h, 9i, 9j) and the winding roller of step 5-1 may be disposed while facing each other in one and the other direction (the second one roller 9r and the second other roller 9s are the unwinding rollers based on the front-rear direction) (9h, 9i, 9j) and located between the winding roller of step 2-1, the second one side roller (9r) may be located on one side, the second other side roller (9s) may be located on the other side).

In addition, referring to FIGS. 13 and 14 , in the fifth step, after step 5-1, the main laminate 2 coated with the first dry film 5 and the second dry film 5 is exposed. It may include a step (Step 5-2). For reference, in FIG. 14 , an exposed portion is illustrated by reference numeral 5a, and an unexposed portion is illustrated by reference numeral 5b.

13, step 5-2 is a roll-to-roll method in which the main laminate 2 coated with the first dry film 5 and the second dry film 5 is unwound from its unwinding roller 9k. can be performed. In step 5-2, the main laminated body 2 unwound from the unwinding roller 9k is wound by a winding roller, and one side of the portion that is unwound from the unwinding roller 9k of the main laminated body 2 toward the winding roller side and On the other side, each of the first dry film 5 and the second dry film 5 may be exposed. Accordingly, the exposed portion of the first dry film 5 and the second dry film 5 of the main laminate 2 may be wound on a winding roller. In other words, the main laminate 2 unwound from the unwinding roller 9k may be exposed and wound on the take-up roller.

In addition, referring to FIGS. 15 and 16 , the fifth step is a step of developing the main laminate 2 on which the first dry film 5 and the second dry film 5 are coated (Step 5-3) ) may be included.

15 , step 5-3 is a roll-to-roll method in which the main laminate 2 coated with the first dry film 5 and the second dry film 5 is unwound from its unwinding roller 9l. can be performed. In step 5-3, the main laminated body 2 unwound from the unwinding roller 9l is wound with a winding roller, and one side of the portion that is unwound from the unwinding roller 9l of the main laminated body 2 toward the winding roller side and On the other hand, each of the first dry film 5 and the second dry film 5 may be developed. Accordingly, the developed portion of the first dry film 5 and the second dry film 5 of the main laminate 2 may be wound on the winding roller. In other words, the main laminate 2 unwound from the unwinding roller 9l may be developed and wound on the take-up roller.

In addition, referring to FIGS. 17 and 18 , the fifth step is a step of etching the main laminate 2 on which the first dry film 5 and the second dry film 5 are coated (Steps 5-4) ) may be included.

Referring to FIG. 17 , step 5-4 is a roll-to-roll method in which the main laminate 2 coated with the first dry film 5 and the second dry film 5 is unwound from its unwinding roller 9m. can be performed. In step 5-4, the main laminated body 2 unwound from the unwinding roller 9m is wound with a winding roller, and one side of the portion that is unwound from the unwinding roller 9m of the main laminated body 2 toward the winding roller side and On the other side, each of the first dry film 5 and the second dry film 5 may be etched. Accordingly, portions of the main laminate 2 on which the first dry film 5 and the second dry film 5 are etched may be wound on a winding roller. In other words, the main laminate 2 unwound from the unwinding roller 9l may be etched and wound around the take-up roller.

In addition, referring to FIGS. 19 and 20 , in the fifth step, the first dry film 5 and the second dry film 5 and the second dry film 5 from the main laminate 2 coated with the first dry film 5 and the second dry film 5 2 It may include a step of removing the dry film (5) (steps 5-5).

Referring to FIG. 19 , in step 5-5, the main laminate 2 unwound from the unwinding roller 9n is wound by a winding roller, and the main laminate 2 is unwound from the unwinding roller 9n of the main laminate 2 by the winding roller. The first dry film 5 and the second dry film 5, respectively, from one surface and the other surface of the portion facing to the side may be removed. Accordingly, portions of the main laminate 2 from which the first dry film 5 and the second dry film 5 are removed may be wound on a winding roller. In other words, the main laminate 2 unwound from the unwinding roller 9l may be wound on the take-up roller after the first and second dry films 5 are removed.

As such, in steps 5-2 to 5-5, the main laminate 2 coated with the first dry film 5 and the second dry film 5 has its unwinding roller 9k, 9l, 9m, 9n) may be performed in a roll-to-roll method unwinding.

The fifth step relates to a patterning method used in manufacturing a conventional flexible printed circuit board, and since patterning is obvious to those skilled in the art, detailed descriptions related to steps 5-1 to 5-5 will be omitted.

Also, referring to FIG. 21 , the first manufacturing method includes a step (sixth step) of laminating outer layers 6 and 7 on one surface and the other surface of the main laminate 2 . In addition, in the sixth step, a coverlay (C/L) 8 may be laminated on the main laminate 2 . For example, the outer layers 6 and 7 may include a prepreg layer and a copper foil layer.

In the sixth step, in order to laminate the outer layers 6 and 7 and the coverlay 8 on the main laminate 2, heat and pressure at a temperature of 140° C. or more and 180° C. or less may be applied. In other words, the heat and pressure may be applied in a state in which the outer layers 6 and 7 and the coverlay 8 are disposed on the main laminate 2 . Accordingly, the main laminate 2 may be separated into the first laminate 1a and the second laminate 1b without a separate additional process (seventh step to be described later). In other words, the tape 21 may be removed from the first laminate 1a and the second laminate 1b.

Also, referring to FIG. 22 , the first manufacturing method may include a step (seventh step) of separating the main laminate 2 into a first laminate 1a and a second laminate 1b. . For example, the seventh step is to prepare the main laminate 2 by removing the tape 21 , that is, by peeling each of the first laminate 1a and the second laminate 1b from the tape 21 . It is separable into the 1st laminated body 1a and the 2nd laminated body 1b. At this time, one surface of the first laminate 1a, which was one surface of the main laminate 2, may be in a state in which the outer layers 6 and 7 are laminated and the coverlay 8 is disposed, and the other surface of the laminate 2 One surface of the second laminate 1b may be in a state in which the outer layers 6 and 7 are laminated and the coverlay 8 is disposed.

This seventh step may be made without a separate additional process by the heat or pressure applied in the sixth step described above.

Also, referring to FIG. 23 , the first manufacturing method may include cutting the main laminate 2 (the eighth step) between the fifth and sixth steps. In the eighth step, the main laminate 2 may be cut to a preset size (appropriate size). In addition, each of the sixth and seventh steps may be performed on each of one or more of the cut main laminates 2 (the main laminates 2 divided by the eighth stage). In addition, the eighth step may be performed by a roll-to-roll method. For example, after performing the above-described fifth step, the main laminate 2 may be in a state wound on the winding roller wound in steps 5-5, and the unwinding roller ( 9o) and cutting can be done.

Hereinafter, a method for manufacturing a flexible printed circuit board according to a second embodiment of the present application (hereinafter referred to as 'this second manufacturing method') will be described. However, in relation to the description of the second manufacturing method, the same reference numerals are used for the same or similar components as those described in the first manufacturing method salpin above, and the overlapping description will be simplified or omitted.

Referring to FIG. 24 , the second method includes a step (first step) of manufacturing the main laminate 2 . Referring to FIGS. 25 and 26 , in the first step, one side of each of the first and second laminates 1a and 1b faces one side and the other side, respectively, and the other side of each of the tapes 21 is interposed therebetween. The main laminate 2 is manufactured by laminating the first laminate 1a, the second laminate 1b, and the tape 21 so as to face each other. Referring to FIG. 25 , the first laminate 1a includes a polyimide layer 11 and a copper layer 12 formed on both surfaces of the polyimide layer 11 . Further, the second laminate 1b includes a polyimide layer 11 and a copper layer 12 formed on both surfaces of the polyimide layer 11 .

The tape 21 may be a thermosetting tape. For example, the tape 21 may be made of a material including PET. In addition, the tape 21 may have a thickness of 20 μm or more and 70 μm or less. In this case, the tape 21 may be interposed between the first laminate 1a and the second laminate 1b in the main laminate 2 to serve as an inner support, roll among the steps to be described later. This may be to prevent the main laminate 2 from being wrinkled and to make the main laminate 2 flexible in steps performed in a two-roll manner.

The first step is performed by a roll-to-roll method.

Specifically, referring to Figure 24, the first step, the first laminate (1a), the second laminate (1b), and the tape 21 on the first one side roller (9p) and the first other side roller (9q) can pass through. At this time, one surface of the first laminate (1a) faces one side, one surface of the second laminate (1b) faces the other side, and the tape 21 is the first laminate (1a) and the second laminate (1b). The first laminate 1a, the second laminate 1b, and the tape 21 may pass between the first one side roller 9p and the first other side roller 9q in a state disposed therebetween. Accordingly, referring to FIG. 24 , one surface of the first laminate 1a faces one side and one surface of the second laminate 1b faces the other side, and the first laminate 1a and the second laminate 1b) The first laminated body 1a, the second laminated body 1b and the tape 21 are pressed against the first one side roller 9p and the first other side roller 9q with the tape 21 positioned therebetween, and the main A laminate 2 may be formed. In other words, in the main laminate 2, the first laminate 1a is positioned on one side of the tape 21 with one side facing one side, and the second laminate 1b has one side facing the other side. It may be positioned on the other surface of the tape 21 in a state of being.

At this time, the first step is performed at a temperature of 40 ℃ or more and 80 ℃ or less, and in the first step, the first one side roller 9p and the first other side roller 9q are one side roller 9p and the first other side roller ( 9q), a pressure of 4 kg or more and 20 kg may be applied to the first laminate 1a, the second laminate 1b, and the tape 21 passing between them. Also, the second step may apply a vacuum according to the bubble. In addition, the first step is when the first laminate (1a), the second laminate (1b) and the tape 21 pass between the one roller (9p) and the first roller (9q) on the other side, 40 ℃ or more Heat up to 80°C can be applied.

In this way, the first step is to use the first one side roller (9p) and the first other side roller (9q) as an adherent to adhere the first laminate (1a), the second laminate (1b) and the tape (21). can In other words, in the first step, the first laminated body 1a and the second laminated body 1b are simultaneously applied on both sides of the tape 21 using the first one side roller 9p and the first other side roller 9q. can proceed closely.

In addition, referring to FIG. 24 , in the first step, each of the first laminate 1a , the second laminate 1b and the tape 21 is unwound from each of the unwinding rollers 9a , 9b , 9c and the first It may be carried out in a roll-to-roll method supplied between the one side roller (9p) and the first other side roller (9q).

Specifically, the first laminate 1a is unwound from the unwinding roller 9a, the second laminate 1b is unwound from the unwinding roller 9b, and the tape 21 is unwound from the unwinding roller 9c. Can be laminated by the first one side roller (9p) and the first other side roller (9q) can be the main stacked body (2), between the first one side roller (9p) and the first other side roller (9q) The main laminate 2 formed while passing may be wound on a winding roller (the winding roller of the first stage).

Accordingly, the first one side roller (9p) and the first other side roller (9q) are the first laminate (1a), the second laminate (1b) and the tape 21, respectively, the unwinding rollers (9a, 9b, 9c) and the winding roller of the first step may be disposed facing each other in one and the other direction (the first one roller 9p and the first other roller 9q are the unwinding rollers 9c, 9d, 9e) and may be located between the winding roller of the second step, the first one side roller (9p) may be located on one side, the first other side roller (9q) may be located on the other side).

Also, the second method includes a step (second step) of patterning one surface and the other surface of the main laminate 1 . The second step is performed by a roll-to-roll method.

Specifically, referring to FIG. 27 , the second step may include coating the dry film 5 on one side and the other side of the main laminate 2 (step 2-1).

Referring to FIG. 27 , in step 2-1, the main laminate 2 , the first dry film 5 , and the second dry film 5 are applied to the second one side roller 9r and the second other side roller 9s ). can pass through. At this time, the main laminate 2 has one side and the other side facing one side and the other side, respectively, and each of the first dry film 5 and the second dry film 5 is disposed on one side and the other side of the main laminate 2 , respectively. It can pass between the second one side roller (9r) and the second other side roller (9s) in this state. Accordingly, referring to FIG. 28 , one surface of the main laminate 2 faces one side, the other surface of the main laminate 2 faces the other side, and the first dry film 5 and the second dry film 5 are the main The main laminate 2, the first dry film 5, and the second dry film 5 are disposed on the second side in a state in which the laminate 2 is positioned on one side and the other side, respectively, of the main laminate 2 with the laminate 2 interposed therebetween. The main laminate 2 coated on the dry film 5 may be formed by being pressed against the roller 9r and the second other side roller 9r.

Also, referring to FIG. 27 , in step 2-1, the main laminate 2 , the first dry film 5 , and the second dry film 5 are each unwinding rollers 9f, 9g, and 9h. It may be performed in a roll-to-roll method that is unwound from and supplied between the second one side roller 9r and the second other side roller 9s.

Specifically, the main laminate 2 is unwound from its unwinding roller 9f, the first dry film 5 is unwound from its unwinding roller 9g, and the second dry film 5 is unwound from its unwinding roller ( 9h), and may be laminated by the second one-side roller 9r and the second other-side roller 9s. In addition, the main laminate 2 passing between the second one side roller 9r and the second other side roller 9s and coated with a dry film 5 on one side and the other side, respectively, is a winding roller (step 2-1). winding roller).

Accordingly, the second one side roller 9r and the second other side roller 9s are the main laminate 2, the first dry film 5, and the second dry film 5, respectively, the unwinding rollers 9f, 9g, 9h) and the winding roller of step 2-1 may be disposed facing each other in one and the other direction (the second one roller 9r and the second other roller 9s are the unwinding rollers based on the front-rear direction) (9h, 9i, 9j) and located between the winding roller of step 2-1, the second one side roller (9r) may be located on one side, the second other side roller (9s) may be located on the other side).

In addition, referring to FIGS. 29 and 30 , in the second step, after step 2-1, the main laminate 2 coated with the first dry film 5 and the second dry film 5 is exposed. (Step 2-2) may include. For reference, in FIG. 30 , the exposed portion is illustrated by reference numeral 5a, and the non-exposed portion is illustrated by reference numeral 5b.

Referring to FIG. 29 , step 2-2 is a roll-to-roll method in which the main laminate 2 coated with the first dry film 5 and the second dry film 5 is unwound from its unwinding roller 9k. can be performed. In step 2-2, the main laminated body 2 unwound from the unwinding roller 9k is wound with a winding roller, and one side of the portion that is unwound from the unwinding roller 9k of the main laminated body 2 toward the winding roller side and On the other side, each of the first dry film 5 and the second dry film 5 may be exposed. Accordingly, the exposed portion of the first dry film 5 and the second dry film 5 of the main laminate 2 may be wound on a winding roller. In other words, the main laminate 2 unwound from the unwinding roller 9k may be exposed and wound on the take-up roller.

In addition, referring to FIGS. 31 and 32 , the second step is a step of developing the main laminate 2 on which the first dry film 5 and the second dry film 5 are coated (Step 2-3) ) may be included.

Referring to FIG. 30 , step 2-3 is a roll-to-roll method in which the main laminate 2 coated with the first dry film 5 and the second dry film 5 is unwound from its unwinding roller 9l. can be performed. In step 2-3, the main laminated body 2 unwound from the unwinding roller 9l is wound by a winding roller, and one side of the portion which is unwound from the unwinding roller 9l of the main laminated body 2 toward the winding roller side and On the other hand, each of the first dry film 5 and the second dry film 5 may be developed. Accordingly, the developed portion of the first dry film 5 and the second dry film 5 of the main laminate 2 may be wound on the winding roller. In other words, the main laminate 2 unwound from the unwinding roller 9l may be developed and wound on the take-up roller.

In addition, referring to FIGS. 33 and 34 , the second step is a step of etching the main laminate 2 on which the first dry film 5 and the second dry film 5 are coated (Steps 2-4) ) may be included.

Referring to FIG. 33 , step 2-4 is a roll-to-roll method in which the main laminate 2 coated with the first dry film 5 and the second dry film 5 is unwound from its unwinding roller 9m. can be performed. In step 2-4, the main laminated body 2 unwound from the unwinding roller 9m is wound with a winding roller, and one side of the portion which is unwound from the unwinding roller 9m of the main laminated body 2 and is directed toward the winding roller side and On the other side, each of the first dry film 5 and the second dry film 5 may be etched. Accordingly, portions of the main laminate 2 on which the first dry film 5 and the second dry film 5 are etched may be wound on a winding roller. In other words, the main laminate 2 unwound from the unwinding roller 9l may be etched and wound around the take-up roller.

In addition, referring to FIGS. 35 and 36 , in the second step, the first dry film 5 and the second dry film 5 and the second dry film 5 from the main laminate 2 coated with the second dry film 5 . 2 It may include a step of removing the dry film (5) (steps 2-5).

Referring to FIG. 35 , in step 2-5, the main laminate 2 unwound from the unwinding roller 9n is wound by a winding roller, and the main laminate 2 is unwound from the unwinding roller 9n of the main laminate 2 by the winding roller. The first dry film 5 and the second dry film 5, respectively, from one surface and the other surface of the portion facing to the side may be removed. Accordingly, portions of the main laminate 2 from which the first dry film 5 and the second dry film 5 are removed may be wound on a winding roller. In other words, the main laminate 2 unwound from the unwinding roller 9l may be wound on the take-up roller after the first and second dry films 5 are removed.

In this way, in steps 2-2 to 2-5, the main laminate 2 coated with the first dry film 5 and the second dry film 5 has its unwinding roller 9k, 9l, 9m, 9n) may be performed in a roll-to-roll method unwinding.

The second step relates to a patterning method used in manufacturing a conventional flexible printed circuit board, and since patterning is obvious to those skilled in the art, detailed descriptions related to steps 2-1 to 2-5 will be omitted.

In addition, referring to FIG. 37 , the second manufacturing method includes laminating the outer layers 6 and 7 on one surface and the other surface of the main laminate 2 (the third step). Also, in the third step, a coverlay (C/L) 8 may be laminated on the main laminate 2 . For example, the outer layers 6 and 7 may include a prepreg layer and a copper foil layer.

In addition, in the third step, in order to laminate the outer layers 6 and 7 and the coverlay 8 on the main laminate 2 , heat and pressure at a temperature of 140° C. or more and 180° C. or less may be applied. In other words, the heat and pressure may be applied in a state in which the outer layers 6 and 7 and the coverlay 8 are disposed on the main laminate 2 . Accordingly, the main laminate 2 may be separated into the first laminate 1a and the second laminate 1b without a separate additional process (a fourth step to be described later). In other words, the tape 21 may be removed from the first laminate 1a and the second laminate 1b.

Further, referring to FIG. 38 , the second manufacturing method may include a step (fourth step) of separating the main laminate 2 into a first laminate 1a and a second laminate 1b. . For example, the fourth step is to prepare the main laminate 2 by removing the tape 21 , that is, by peeling each of the first laminate 1a and the second laminate 1b from the tape 21 . It is separable into the 1st laminated body 1a and the 2nd laminated body 1b. At this time, one surface of the first laminate 1a, which was one surface of the main laminate 2, may be in a state in which the outer layers 6 and 7 are laminated and the coverlay 8 is disposed, and the other surface of the laminate 2 One surface of the second laminate 1b may be in a state in which the outer layers 6 and 7 are laminated and the coverlay 8 is disposed.

This fourth step may be performed without a separate additional process by the heat or pressure applied in the third step described above.

Also, referring to FIG. 39 , the first manufacturing method may include cutting the main laminate 2 (a fifth step) between the second and third steps. In the fifth step, the main laminate 2 may be cut to a preset size (appropriate size). Further, each of the third step and the fourth step may be performed on each of one or more of the cut main laminates 2 (the main laminates 2 divided by the eighth step). In addition, the fifth step may be performed by a roll-to-roll method. For example, after performing the above-described second step, the main laminate 2 may be in a state wound around the winding roller wound in steps 2-5, and the unwinding roller ( 9o) and cutting can be done.

According to the first manufacturing method and the second manufacturing method described above, it is changed from the existing sheet production to the roll-to-roll production, which is continuous production, and 30% productivity improvement effect can be exhibited compared to the existing one, and the first one-side roller 9p and the first Since the attachment of the first stacked body 1a and the second stacked body 1b to the tape 21 required for double core production by the other side roller 9q (double core sheet production method) can be made at the same time, the conventional When attaching raw materials to thermocompression tape, one side is carried out one side at a time, so the productivity can be doubled compared to the method that had to be done twice in total. There was a problem of re-progressing afterward, but these problems can be solved.

In addition, according to the first manufacturing method and the second manufacturing method described above, from the existing manufacturing method of one raw material to the double-core manufacturing method, raw materials from chemical copper, copper plating, coating, exposure, development, etching, peeling, and C/L lamination The two-sheet manufacturing method has the effect of increasing the productivity of the processes by two times, and also it is possible to secure expensive equipment or twice the capacity compared to other processes, thus reducing the investment in equipment.

In addition, in the existing double-core sheet method, the limited technology of improving productivity only in the copper plating process could be overcome. Since a temperature of 140° C. or more and 180° C. or less can be applied to the main laminate 2 during lamination (because it works), the tape 21 is removed without a separate additional process, that is, the first laminate from the tape 21 Separation of (1a) and the second laminate (1b) is possible.

In addition, in the past, circuits were implemented on both sides of the double-sided FCCL, and the double core was manufactured until copper plating and then separated. While applying the method of proceeding to single-sided FCCL lamination again, roll-to-roll double-core manufacturing method is possible before C/L lamination, and double-core effect and natural removal after C/L lamination after cutting can be achieved.

In addition, in the prior art, both surfaces of the raw material were plated with copper, so that plating deviation occurred, but according to the first and second manufacturing methods, the first laminate 1a and Since the process proceeds with the second laminate 1b attached, the other surfaces of the first laminate 1a and the second laminate 1b are not plated, so that the Cu layer (copper layer) 12 on the other surface is not plated. ), the ability to implement fine pattern) can be increased, and the effect of improving the yield can be exhibited.

In addition, when comparing FIGS. 40 and 41, the flexibility was lowered due to the effect of the rigidity of the copper plating structure during the conventional both copper plating, but according to the first and second manufacturing methods, the first laminate 1a and the second laminate ( 1b) Since copper plating is made on only one side of each surface, the flexibility can be improved by more than twice, and wrinkling was severe during the progress of the existing thin plate. can That is, plating deviation and quality (bendability and wrinkling) can be improved.

In addition, additional investment can be reduced by reducing personnel and securing expensive facility capacity. In the past, carrier film or dry film shielding was performed before image work, but the shielding can be replaced by attaching the tape 21 (thermosetting tape), so the cost is lowered. can be reduced

The above description of the present application is for illustration, and those of ordinary skill in the art to which the present application pertains will understand that it can be easily modified into other specific forms without changing the technical spirit or essential features of the present application. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. For example, each component described as a single type may be implemented in a dispersed form, and likewise components described as distributed may be implemented in a combined form.

The scope of the present application is indicated by the following claims rather than the above detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present application.

1a: first laminate
1b: second laminate
11: polyimide layer
12: copper layer
13: bvh
2: main laminate
21: tape
3: Part formed by chemical copper
4: copper plating layer
5: dry film
6, 7: outer layer
8: Coverlay

Claims (8)

A method for manufacturing a flexible printed circuit board, comprising:
(a) one side of each of the first laminate and the second laminate including a polyimide layer and a copper layer formed on both surfaces of the polyimide layer faces one side and the other side, and each other side faces each other with a tape interposed therebetween stacking the first laminate and the second laminate and the tape to face each other to prepare a main laminate;
(b) patterning one surface and the other surface of the main laminate;
(c) laminating an outer layer including a prepreg layer and a copper foil layer on one surface and the other surface of the main laminate; and
(d) separating the main laminate into the first laminate and the second laminate,
Steps (a) and (b) are performed by a roll-to-roll method,
In step (c), the outer layer of step (c) is laminated on one side and the other side of the main laminate, and each of the first laminate and the second laminate of step (d) is formed from the tape. The separation occurs at the same time, heat is applied,
Wherein the tape is provided to serve as an inner supporter of each of the first and second laminates in the roll-to-roll method of steps (a) and (b). According to claim 1,
The step (a) is,
In the first laminate, the second laminate, and the tape, one side of the first laminate faces one side, and one side of the second laminate faces the other side, and the first and second laminates of The method of manufacturing a flexible printed circuit board by passing between the first roller positioned on one side and the first roller positioned on the other side with the tape disposed therebetween. 3. The method of claim 2,
The step (a) is,
The first laminate, the second laminate, and each of the tape is unwound from each unwinding roller and is performed in a roll-to-roll manner in which the first one side roller and the first other side roller are supplied between the roll-to-roll method, the flexible printed circuit board manufacturing method. 3. The method of claim 2,
The step (a) is carried out at a temperature of 40°C or higher and 80°C or lower,
In the step (a), the first side roller and the first other side roller apply a pressure of 4 kg or more and 20 kg or less to the first laminate, the second laminate, and the tape. Way. According to claim 1,
Step (b) is,
(b1) comprising the step of coating a dry film on one side and the other side of the main laminate,
The step (b1) is,
The main laminate, the first dry film, and the second dry film, one surface and the other surface of the main laminate each face one side and the other side, and the first dry film and the first dry film on each of the one side and the other side of the main laminate The method for manufacturing a flexible printed circuit board, wherein each of the second dry films is passed between the second roller positioned on one side and the second roller positioned on the other side in a state in which the second dry film is disposed. 6. The method of claim 5,
The step (b1) is,
Each of the main laminate, the first dry film, and the second dry film is unwound from each unwinding roller and supplied between the second one-side roller and the second other roller, which is performed in a roll-to-roll method, flexible printing Circuit board manufacturing method. 6. The method of claim 5,
Step (b) is,
After step (b1),
(b2) exposing the main laminate on which the first dry film and the second dry film are coated;
(b3) developing the main laminate on which the first dry film and the second dry film are coated;
(b4) etching the main laminate on which the first dry film and the second dry film are coated; and
(b5) removing the first dry film and the second dry film from the main laminate on which the first dry film and the second dry film are coated,
Steps (b2) to (b5) are to be performed in a roll-to-roll method in which the main laminate coated with the first and second dry films is unwound from its unwinding roller. The method for manufacturing a flexible printed circuit board. According to claim 1,
Between step (b) and step (c),
Further comprising the step of cutting the main laminate, the flexible printed circuit board manufacturing method.

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