CN107570911A - A kind of lead-free high-temperature solder(ing) paste for being used for mobile phone, computer main board and preparation method thereof - Google Patents
A kind of lead-free high-temperature solder(ing) paste for being used for mobile phone, computer main board and preparation method thereof Download PDFInfo
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- CN107570911A CN107570911A CN201711036312.8A CN201711036312A CN107570911A CN 107570911 A CN107570911 A CN 107570911A CN 201711036312 A CN201711036312 A CN 201711036312A CN 107570911 A CN107570911 A CN 107570911A
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Abstract
The invention discloses a kind of for mobile phone, the lead-free high-temperature solder(ing) paste of computer main board, it is made up of by weight percentage following components, resin 46%, solvent 18%, thixotropic agent 7%, activating agent 28%, corrosion inhibiter 0.5%, antioxidant 0.5%.The invention also discloses its preparation method, pass through the selection to raw material, the regulation of production technology, the accurate viscosity, thixotropy, active release time for controlling solder(ing) paste, coordinate in SMT reflux courses with rework profile, at utmost reduce the defects of easily being produced in precision welding.
Description
Technical field
The invention belongs to the technical field of electronics industry solder solder(ing) paste, is related to a kind of for mobile phone, computer main board
Lead-free high-temperature solder(ing) paste and preparation method thereof.
Background technology
Solder(ing) paste is one of electronics auxiliary material most commonly used in electronics industry, plays very important work in the electronics industry
With.Solder(ing) paste is a kind of pasty masses, is mixed together by solder powder and weld-aiding cream two parts.Wherein, solder
Powder is globular powder, and high temperature, medium temperature, low-temperature alloy are divided into according to alloy melting point in commercial Application.High temperature alloy is the most frequently used
Be SAC (SnAg3.0Cu0.5, SnAg1.0Cu0.5, SnAg0.3Cu0.7), the most frequently used middle temperature alloy is that tin-lead is closed
Golden (Sn63Pb37), the most frequently used low-temperature alloy is sn-bi alloy (Sn42Bi58).The key parameter of solder powder be sphericity,
Particle diameter distribution, surface oxidation degree.Weld-aiding cream is a kind of paste mixture, is combined by a variety of chemical reactions.Production
The main material of weld-aiding cream is rosin, solvent, activating agent, thixotropic agent, corrosion inhibiter.In production, all kinds of materials are pressed necessarily
Proportioning and addition sequence are heated, stir, vacuumize, cool down, ground, and what is ultimately produced is exactly weld-aiding cream.Weld-aiding cream mainly undertakes
Three effects, first, it is the mixing with solder powder, plays carrier function, ensures solder powder during transport, use
It will not settle.Second, it is while transporting, will not be aoxidized using preceding protection solder powder, will not also corrodes solder
The oxide on powder surface.3rd, it is during tin cream use, plays a part of removing solder powder oxide on surface.
Solder(ing) paste primarily serves two effects in the SMT techniques of electronics industry, first, physical connection acts on, that is, passes through conjunction
The physical connection between component and wiring board is realized in the fusing of gold solder feed powder；First, electrical connection acts on, that is, pass through solder
The electric circulation between component and wiring board is realized in the fusing of powder.
With the development of electronics industry, mobile phone, the wiring board of computer main board and electronic component are less and less, component
Degree of integration gradually uprises.This, which results in the spacing of component in the circuit board, becomes smaller, more pin component itself pins
Between distance also diminishing.Slight company's weldering will result in electric short circuit, and slight cavity can then cause electrical open.These are existing
Requirement of the appearance of elephant to SMT techniques becomes higher, and most important of which is exactly that the requirement to solder(ing) paste is more harsh.
Solder(ing) paste present on present domestic market in face of conventional products for example telephone set, intercom, router, refrigerator,
Often it is not so good as when can meeting to require when the electrical home appliances such as washing machine, and face some mobile phones, computer main board Japanese
Solder(ing) paste.And Japanese solder(ing) paste is expensive, while the Buying Cycle is very long, it is difficult to ensures production requirement.Domestic tin cream transport week
Phase is short, and price is low, but the defects of short-circuit and breaking easily occurs in actual use, is brought much to actual production
Trouble, very big burden is brought in the post of reprocessing to producing line.
The thixotropy of solder(ing) paste is the important parameter of solder(ing) paste, is embodied directly on the collapse resistance energy of solder(ing) paste.In SMT
In processing procedure, in the circuit board after printed solder paste from be heated at reflux processing procedure also for some time and with a distance from.The anti-of solder(ing) paste caves in
Property to ensure that solder(ing) paste will not cave in this process, otherwise just first produce bridging not starting welding also, it is inevitable after welding
Short circuit occurs.The active component of solder(ing) paste is the key parameter of solder(ing) paste, and some conventional solder(ing) paste active temperatures are too low, i.e.,
Activity will be discharged at normal temperatures, it is possible to the oxide on premature degradation solder powder surface, cause solder powder to lump.It is living
Warm-natured Du Taigao is also not all right, can cause to influence welding effect slowly without activity is embodied in SMT reflux courses.
In order to tackle the increasingly accurate trend of component, reduce the accurate devices such as mobile phone, computer main board and produced in SMT welding
The defects of raw, the present inventor makes further research to this, develops a kind of for mobile phone, the lead-free high-temperature solder(ing) paste of computer main board
And preparation method thereof, thus this case produces.
The content of the invention
The technical problems to be solved by the invention, which are to provide, a kind of is used for mobile phone, the lead-free high-temperature solder(ing) paste of computer main board
And preparation method thereof, pass through the selection to raw material, the regulation of production technology, the accurate viscosity, thixotropy, work for controlling solder(ing) paste
Property release time, in SMT reflux courses with rework profile coordinate, at utmost reduce precision welding in easily caused by lack
Fall into.
In order to solve the above technical problems, the technical solution of the present invention is：
It is a kind of to be used for mobile phone, the lead-free high-temperature solder(ing) paste of computer main board, it is made up of by weight percentage following components, resin
46%, solvent 18%, thixotropic agent 7%, activating agent 28%, corrosion inhibiter 0.5%, antioxidant 0.5%.
Preferably, resin is specially AR120 rosin, Poral AX-E resins, polyisobutene 300R.
Preferably, solvent is specially tetraethyleneglycol dimethyl ether.
Preferably, thixotropic agent is specially ethylenebis stearic amide, and corrosion inhibiter is selected from benzotriazole.
Preferably, activating agent is maleic acid, decanedioic acid, dimeric dibasic acid BX-H01, dibutyl maleate, 2- phenylimidazoles
And dibutyl succinate.
Preferably, antioxidant is specially 2,6- di-tert-butyl-4-methy phenols.
A kind of preparation method for mobile phone, the lead-free high-temperature solder(ing) paste of computer main board, comprise the following steps：
(1) weigh resin respectively in proportion, solvent, stirred on firing equipment, be heated to resin and be completely dissolved, must mixed
Thing A；
(2) thixotropic agent weighed up in advance is added into A at 150 DEG C, continues stirring until material is completely dissolved, rapid filtration is extremely
Cool down bucket, do not stop in cold water by hand stirring be cooled to 100-110 DEG C, in 11 ± 3 DEG C stand cooling 3-4 hours obtain mixture
B；
(3) take out mixture B to place at room temperature, activating agent, corrosion inhibiter, antioxidant grinding and breast are added after 8 hours
Change to obtain mixture C；
(4) mixture C is ground into pasty masses, produces the weld-aiding cream.
Preferably, weld-aiding cream and solder powder are mixed and formed, by weight percentage, consisting of：Alloy welds
Feed powder 85-94%, weld-aiding cream 6-15%, the composition of solder powder is SnAg3.0Cu0.5, SnAg1.0Cu0.5,
SnAg0.3Cu0.7。
Preferably, in step (4), the fineness of pasty masses is less than 10 microns.
A kind of preparation method for mobile phone, the lead-free high-temperature solder(ing) paste of computer main board, comprise the following steps：
(1) AR120 rosin, Poral AX-E resins, polyisobutene 300R, tetraethylene glycol diformazan are weighed respectively in proportion
Ether, stirred on firing equipment, be heated to resin and be completely dissolved, obtain mixture A；
(2) the ethylenebis stearic amide weighed up in advance is added into A at 150 DEG C, continues stirring until material is completely molten
Solution, rapid filtration do not stop stirring by hand in cold water and are cooled to 100-110 DEG C, cooling 3- is stood in 11 ± 3 DEG C to bucket is cooled down
Obtain mixture B within 4 hours；
(3) mixture B is taken out to place at room temperature, added after 8 hours maleic acid, decanedioic acid, dimeric dibasic acid BX-H01,
Dibutyl maleate, 2- phenylimidazoles, dibutyl succinate, benzotriazole, 2,6 di tert butyl 4 methyl phenol grinding and
Emulsify to obtain mixture C.
(3) mixture C is ground into pasty masses, produces the weld-aiding cream.
After such scheme, because the thixotropic agent selected of the present invention is ethylenebis stearic amide, this thixotropic agent
Good thixotropy can be provided for solder(ing) paste, in the production process of solder(ing) paste, thixotropic agent dissolves by heating in a solvent, cooling
The network structure of three-dimensional interconnection can be formed afterwards, and compared with traditional thixotropic agent such as rilanit special, collapse resistance can be more preferable, together
When diaphragm can be formed on solder powder surface, the oxide on protection solder powder surface will not be lived before the use
Property agent destroy, cause to lump.
The activating agent window that the present invention selects is very big, by adding maleic acid, decanedioic acid, dimeric dibasic acid BX-H01, horse
Come dibutyl phthalate, 2- phenylimidazoles, dibutyl succinate, can preferably coordinate rework profile, this coordinates rework profile design
The thinking of activating agent is unexistent before being.I.e. under the normal temperature before solder(ing) paste use, activating agent does not discharge activity.Entering
After SMT Reflow Soldering, maleic acid, decanedioic acid, the active temperature of 2- phenylimidazoles are at 130 DEG C -150 DEG C, for coordinating back
The warm-up phase of flow curve, solder powder surface portion oxide is removed, solder powder is tentatively combined together, keep scolding tin
The shape invariance of cream；The active temperature of dibutyl maleate and dibutyl succinate is at 150 DEG C -190 DEG C, for coordinating backflow bent
In the constant temperature stage of line, the oxide on surface of circuit pads is removed, be ready to be combined with the solder powder of melting；Dimerization
The active temperature of acid, for coordinating the peak backflow stage of rework profile, removes solder powder surface at 190 DEG C -230 DEG C
Oxide, promote the fusing fusion of solder powder.The unnecessary part volatilization of activating agent simultaneously is clean, avoids remaining after the cooling period
Assist side surface, etching lines plate.
Embodiment
The invention discloses a kind of for mobile phone, the lead-free high-temperature solder(ing) paste of computer main board, by following components by weight hundred
Divide than composition, resin 46%, solvent 18%, thixotropic agent 7%, activating agent 28%, corrosion inhibiter 0.5%, antioxidant 0.5%.
Under this proportioning, the best results of product of the present invention.
Preferably, resin is specially AR120 rosin, Poral AX-E resins, polyisobutene 300R.Can be from straight on the market
Connect purchase and obtain.
Preferably, solvent is specially tetraethyleneglycol dimethyl ether.The solvent can be very good dissolving resin and work as carrier
Property agent, suitable viscosity is provided for the weld-aiding cream of final production.The solvent boiling point is higher simultaneously, it is ensured that solder(ing) paste is being crossed back
When fluid welding, it will not be hardened due to the too early volatilization of solvent, activating agent can be made to be played in reflux course is had suffered
Effect.
Preferably, activating agent is maleic acid, decanedioic acid, dimeric dibasic acid BX-H01, dibutyl maleate, 2- phenyl miaows
Azoles, dibutyl succinate.Maleic acid, decanedioic acid, the active temperature of 2- phenylimidazoles are at 130 DEG C -150 DEG C, for coordinating
The warm-up phase of rework profile, solder powder surface portion oxide is removed, solder powder is tentatively combined together, keep weldering
The shape invariance of tin cream；The active temperature of dibutyl maleate and dibutyl succinate flows back at 150 DEG C -190 DEG C for coordinating
In the constant temperature stage of curve, the oxide on surface of circuit pads is removed, be ready to be combined with the solder powder of melting；Two
The active temperature of polyacids, for coordinating the peak backflow stage of rework profile, removes solder powder surface at 190 DEG C -230 DEG C
Oxide, promote solder powder fusing fusion.
Preferably, corrosion inhibiter is selected from benzotriazole.To copper and its alloy, the anticorrosion ability of silver and its alloy is especially bright
Aobvious, the alloying component of the solder(ing) paste is the alloy of SAC, therefore is used as corrosion inhibiter positive effect by the use of benzotriazole.
Preferably, antioxidant is specially 2,6- di-tert-butyl-4-methy phenols.The antioxidant boiling point is higher, can be with
All played a role in whole reflow process, the secondary of solder powder and circuit pads can be prevented in use
Oxidation, laid a good foundation for the use of activating agent.
Now illustrate the remarkable effect of the invention reached by the assay of specific embodiment, refer to table 1.Implement this hair
Bright mode is not limited to embodiment, and is merely illustrative.
Table 1：The component of embodiment
| Embodiment | Percentage (%) |
| AR120 rosin | 28 |
| Proal AX-E resins | 12 |
| Polyisobutene 30R | 6 |
| Tetraethyleneglycol dimethyl ether | 18 |
| Ethylenebis stearic acid amide | 7 |
| Maleic acid | 4 |
| Decanedioic acid | 2 |
| Dimeric dibasic acid BX-H01 | 7 |
| 2- phenylimidazoles | 5 |
| Dibutyl maleate | 5 |
| Dibutyl succinate | 5 |
| 2,6 di tert butyl 4 methyl phenol | 0.5 |
| Benzotriazole | 0.5 |
Said components are followed the steps below into preparation：
(1) AR120 rosin, Poral AX-E resins, polyisobutene 300R, tetraethylene glycol diformazan are weighed respectively in proportion
Ether, stirred on firing equipment, be heated to resin and be completely dissolved, obtain mixture A；
(2) the ethylenebis stearic amide weighed up in advance is added into A at 150 DEG C, continues stirring until material is completely molten
Solution, rapid filtration do not stop stirring by hand in cold water and are cooled to 100-110 DEG C, cooling 3- is stood in 11 ± 3 DEG C to bucket is cooled down
Obtain mixture B within 4 hours；
(3) mixture B is taken out to place at room temperature, added after 8 hours maleic acid, decanedioic acid, dimeric dibasic acid BX-H01,
Dibutyl maleate, 2- phenylimidazoles, dibutyl succinate, benzotriazole, 2,6 di tert butyl 4 methyl phenol grinding and
Emulsify to obtain mixture C；
(4) mixture C is ground into pasty masses, produces the weld-aiding cream.
Weld-aiding cream obtained by the present embodiment is thoroughly mixed in solder(ing) paste with solder powder under vacuumized conditions.Close
Gold solder feed powder selects SnAg3.0Cu0.5 (particle diameter 20-38 microns), is 10 by weld-aiding cream and solder powder mass ratio：90 are carried out
Prepare, obtain solder(ing) paste.Above-mentioned this kind of solder(ing) paste is tested on cell phone mainboard：Pass through printing, paster, reflux technique
Afterwards, the component welding quality on cell phone mainboard is checked.Its test result is as shown in table 2, and paster yield has reached 100%, effect
Fruit is notable.
Table 2：The experimental result of embodiment
| Parameter | Percentage (%) |
| Paster yield | 100 |
| Bridging rate after paster | 0 |
| Bridging rate after backflow | 0 |
| Solder joint missing solder rate | 0 |
| Solder joint voidage | 0.5 |
The above described is only a preferred embodiment of the present invention, be not intended to limit the scope of the present invention,
Therefore the change or modification that claim under this invention and specification are done in every case, it should all belong to the scope that patent of the present invention covers
Within.
Claims (10)
1. a kind of be used for mobile phone, the lead-free high-temperature solder(ing) paste of computer main board, it is characterised in that：By following components by weight percentage
Composition, resin 46%, solvent 18%, thixotropic agent 7%, activating agent 28%, corrosion inhibiter 0.5%, antioxidant 0.5%.
It is 2. according to claim 1 a kind of for mobile phone, the lead-free high-temperature solder(ing) paste of computer main board, it is characterised in that：Tree
Fat is specially AR120 rosin, Poral AX-E resins, polyisobutene 300R.
It is 3. according to claim 1 a kind of for mobile phone, the lead-free high-temperature solder(ing) paste of computer main board, it is characterised in that：It is molten
Agent is specially tetraethyleneglycol dimethyl ether.
It is 4. according to claim 1 a kind of for mobile phone, the lead-free high-temperature solder(ing) paste of computer main board, it is characterised in that：Touch
It is specially ethylenebis stearic amide to become agent, and corrosion inhibiter is selected from benzotriazole.
It is 5. according to claim 1 a kind of for mobile phone, the lead-free high-temperature solder(ing) paste of computer main board, it is characterised in that：It is living
Property agent is maleic acid, decanedioic acid, dimeric dibasic acid BX-H01, dibutyl maleate, 2- phenylimidazoles and dibutyl succinate.
It is 6. according to claim 1 a kind of for mobile phone, the lead-free high-temperature solder(ing) paste of computer main board, it is characterised in that：It is anti-
Oxidant is specially 2,6 di tert butyl 4 methyl phenol.
A kind of 7. preparation method for mobile phone, the lead-free high-temperature solder(ing) paste of computer main board, it is characterised in that：Including following step
Suddenly：(1) weigh resin respectively in proportion, solvent, stirred on firing equipment, be heated to resin and be completely dissolved, obtain mixture A；
(2) thixotropic agent weighed up in advance is added into A at 150 DEG C, continues stirring until material is completely dissolved, rapid filtration to cooling down bucket,
Do not stop in cold water by hand stirring be cooled to 100-110 DEG C, in 11 ± 3 DEG C stand cooling 3-4 hours obtain mixture B；(3) take
Go out mixture B to place at room temperature, activating agent, corrosion inhibiter, antioxidant grinding are added after 8 hours and emulsifies to obtain mixture C；
(4) mixture C is ground into pasty masses, produces the weld-aiding cream.
8. a kind of preparation method for mobile phone, the lead-free high-temperature solder(ing) paste of computer main board according to claim 7, it is special
Sign is：Weld-aiding cream and solder powder are mixed and formed, by weight percentage, consisting of：Solder powder 85-
94%, weld-aiding cream 6-15%, the composition of solder powder is SnAg3.0Cu0.5, SnAg1.0Cu0.5, SnAg0.3Cu0.7.
9. a kind of preparation method for mobile phone, the lead-free high-temperature solder(ing) paste of computer main board according to claim 7, it is special
Sign is：In step (4), the fineness of pasty masses is less than 10 microns.
10. a kind of preparation method for mobile phone, the lead-free high-temperature solder(ing) paste of computer main board according to claim 7, its
It is characterised by：Comprise the following steps：(1) weigh respectively in proportion AR120 rosin, PoralAX-E resins, polyisobutene 300R,
Tetraethyleneglycol dimethyl ether, stirred on firing equipment, be heated to resin and be completely dissolved, obtain mixture A；(2) will be prior at 150 DEG C
The ethylenebis stearic amide weighed up adds A, continues stirring until material is completely dissolved, rapid filtration is to bucket is cooled down, cold
Do not stop in water by hand stirring be cooled to 100-110 DEG C, in 11 ± 3 DEG C stand cooling 3-4 hours obtain mixture B；(3) take out mixed
Compound B is placed at room temperature, and maleic acid, decanedioic acid, dimeric dibasic acid BX-H01, dibutyl maleate, 2- benzene are added after 8 hours
Base imidazoles, dibutyl succinate, benzotriazole, 2,6 di tert butyl 4 methyl phenol grind and emulsified to obtain mixture C；(4)
Mixture C is ground into pasty masses, produces the weld-aiding cream.
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| CN112262013A (en) * | 2018-06-01 | 2021-01-22 | 千住金属工业株式会社 | Flux for solder paste and solder paste |
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