CN204524480U - A kind of Intelligent reflow welding machine made for bga chip - Google Patents
A kind of Intelligent reflow welding machine made for bga chip Download PDFInfo
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- CN204524480U CN204524480U CN201520242746.3U CN201520242746U CN204524480U CN 204524480 U CN204524480 U CN 204524480U CN 201520242746 U CN201520242746 U CN 201520242746U CN 204524480 U CN204524480 U CN 204524480U
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- hydraulic pump
- drawer
- console
- windowpane
- welding machine
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Abstract
The utility model discloses a kind of Intelligent reflow welding machine made for bga chip, relate to electronic product production equipment field, comprise body and console, described body is connected with console, described internal body is provided with furnace chamber and flue, described body is provided with drawer, described drawer is provided with heating plate, described console is provided with control panel and display, described drawer is connected with hydraulic stem, described hydraulic stem is connected with hydraulic pump, described hydraulic pump is located on body, described hydraulic pump is connected with controller, the top of described body is provided with windowpane, the thickness of described windowpane is 2 ~ 3mm, the hydraulic pump that this kind of reflow machine body is provided with can promote hydraulic stem motion, and then control the folding of drawer, people manipulate hydraulic pump by controller, achieve mechanization production, without the need to manual operation, time saving and energy saving, people observe the situation of chip when welding by the windowpane that body top is provided with, be convenient to the welding situation that staff clearly understands chip.
Description
Technical field
The utility model relates to electronic product production equipment field, is specifically related to a kind of Intelligent reflow welding machine made for bga chip.
Background technology
Reflow machine is also Re-current welder or " reflow ovens " (Reflow Oven), it is by providing a kind of heating environment, solder(ing) paste is heated melt thus allow the equipment that Surface Mount Component and PCB pad are reliably combined by solder(ing) paste alloy, development according to technology is divided into: gas phase Reflow Soldering, infrared reflow welds, far infrared Reflow Soldering, the Reflow Soldering of infrared heating wind and the weldering of full hot air reflux, watercooled reflux welds, the appearance with miniaturized electronic product and the solder technology that grows up, be mainly used in the welding of all kinds of surface-assembled components and parts, the solder of this solder technology is solder(ing) paste.On the pad of circuit board, coat solder(ing) paste that is appropriate and appropriate format in advance, then SMT components and parts are placed with corresponding position; Solder(ing) paste has certain viscosity, and components and parts are fixed; Then the circuit board having mounted components and parts is allowed to enter reflow welding equipment.Transfer system drives circuit board by the temperature province of each setting in equipment, solder(ing) paste is through super-dry, preheating, fusing, wetting, cooling, components and parts are welded in printed board, application number is that CN201220440888.7 discloses binary channels reflow machine, comprise welding machine body, Reflow Soldering flue above body, two guide tracked PCB plate transmission units are installed in flue, its difference is, be divided into the chamber of two symmetrical by insulated wall in Reflow Soldering flue, a guide tracked PCB plate transmission unit is respectively installed in each chamber, this kind of equipment have employed channel track technology, do not interfere with each other when carrying out different Reflow Soldering operations in different channels, even if the temperature difference of both sides differs greatly and also can not influence each other, but the operation inconvenience in the taking of product of this kind of equipment, need manual operations, when carrying out bga chip welding, people also cannot observe chip in welding situation.
Utility model content
The purpose of this utility model is to provide a kind of Intelligent reflow welding machine made for bga chip, to solve the above-mentioned multinomial defect caused in prior art.
A kind of Intelligent reflow welding machine made for bga chip, comprise body and console, described body is connected with console, described internal body is provided with furnace chamber and flue, described body is provided with drawer, described drawer is provided with heating plate, described console is provided with control panel and display, described drawer is connected with hydraulic stem, described hydraulic stem is connected with hydraulic pump, and described hydraulic pump is located on body, and described hydraulic pump is connected with controller, the top of described body is provided with windowpane, and the thickness of described windowpane is 2 ~ 3mm.
Preferably, described console is provided with tool box.
Preferably, described body top is provided with cover plate, and described cover plate and body are for being flexibly connected.
Preferably, described organism bottom is provided with roller.
Preferably, the thickness of described cover plate is 1 ~ 3mm.
The utility model has the advantage of: the hydraulic pump that this kind of reflow machine body is provided with can promote hydraulic stem motion, and then control the folding of drawer, people manipulate hydraulic pump by controller, achieve mechanization production, without the need to manual operation, time saving and energy saving, and, people observe the situation of chip when welding by the windowpane that body top is provided with, be convenient to the welding situation that staff clearly understands chip, contribute to staff carries out relevant parameter adjustment according to the actual welding situation of chip, described console is provided with tool box, some maintenance tools and burnisher can be held, staff is facilitated to carry out maintenance process simulation to machine at any time, described body top is provided with cover plate, described cover plate and body are for being flexibly connected, windowpane can be covered when machine does not use, dust is avoided to fall on windowpane, described organism bottom is provided with roller, facilitate the movement of body, the thickness of described cover plate is 1 ~ 3mm, cost-saving.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of Intelligent reflow welding machine for bga chip making described in the utility model.
Fig. 2 is the positive view of the body of a kind of Intelligent reflow welding machine for bga chip making described in the utility model.
Wherein: 1-body, 2-console, 3-furnace chamber, 4-flue, 5-drawer, 6-control panel, 7-display, 8-hydraulic stem, 9-hydraulic pump, 10-controller, 11-windowpane, 12-tool box, 13-cover plate, 14-roller.
Detailed description of the invention
The technological means realized for making the utility model, creation characteristic, reaching object and effect is easy to understand, below in conjunction with detailed description of the invention, setting forth the utility model further.
As depicted in figs. 1 and 2, a kind of Intelligent reflow welding machine made for bga chip, comprise body 1 and console 2, described body 1 is connected with console 2, described body 1 inside is provided with furnace chamber 3 and flue 4, described body 1 is provided with drawer 5, described drawer 5 is provided with heating plate 6, described console 2 is provided with control panel 7 and display 8, described drawer 5 is connected with hydraulic stem 9, described hydraulic stem 9 is connected with hydraulic pump 10, described hydraulic pump 10 is located on body 1, described hydraulic pump 10 is connected with controller 11, the top of described body 1 is provided with windowpane 12, the thickness of described windowpane 12 is 2 ~ 3mm, the hydraulic pump that this kind of reflow machine body is provided with can promote hydraulic stem motion, and then control the folding of drawer, people manipulate hydraulic pump by controller, achieve mechanization production, without the need to manual operation, time saving and energy saving, and, people observe the situation of chip when welding by the windowpane that body top is provided with, be convenient to the welding situation that staff clearly understands chip, contribute to staff carries out relevant parameter adjustment according to the actual welding situation of chip.
It should be noted that described console 2 is provided with tool box 13, some maintenance tools and burnisher can be held, facilitate staff to carry out maintenance process simulation to machine at any time.
In the present embodiment, described body 1 top is provided with cover plate 14, and windowpane, for being flexibly connected, can cover when machine does not use by described cover plate 14 and body 1, avoids dust to fall on windowpane.
In the present embodiment, be provided with roller 15 bottom described body 1, facilitate the movement of body.
In addition, the thickness of described cover plate 14 is 1 ~ 3mm, cost-saving.
Based on above-mentioned, the hydraulic pump that this kind of reflow machine body is provided with can promote hydraulic stem motion, and then controlling the folding of drawer, people manipulate hydraulic pump by controller, achieve mechanization production, without the need to manual operation, time saving and energy saving, and people observe the situation of chip when welding by the windowpane that body top is provided with, be convenient to the welding situation that staff clearly understands chip, contribute to staff carries out relevant parameter adjustment according to the actual welding situation of chip.
As known by the technical knowledge, the utility model can be realized by other the embodiment not departing from its Spirit Essence or essential feature.Therefore, above-mentioned disclosed embodiment, with regard to each side, all just illustrates, is not only.Allly all to be included in the utility model within the scope of the utility model or being equal to the change in scope of the present utility model.
Claims (5)
1. the Intelligent reflow welding machine made for bga chip, comprise body and console, described body is connected with console, described internal body is provided with furnace chamber and flue, described body is provided with drawer, described drawer is provided with heating plate, described console is provided with control panel and display, it is characterized in that: described drawer is connected with hydraulic stem, described hydraulic stem is connected with hydraulic pump, and described hydraulic pump is located on body, and described hydraulic pump is connected with controller, the top of described body is provided with windowpane, and the thickness of described windowpane is 2 ~ 3mm.
2. a kind of Intelligent reflow welding machine made for bga chip according to claim 1, is characterized in that: described console is provided with tool box.
3. a kind of Intelligent reflow welding machine made for bga chip according to claim 1, it is characterized in that: described body top is provided with cover plate, described cover plate and body are for being flexibly connected.
4. a kind of Intelligent reflow welding machine made for bga chip according to claim 1, is characterized in that: described organism bottom is provided with roller.
5. a kind of Intelligent reflow welding machine made for bga chip according to claim 3, is characterized in that: the thickness of described cover plate is 1 ~ 3mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201520242746.3U CN204524480U (en) | 2015-04-21 | 2015-04-21 | A kind of Intelligent reflow welding machine made for bga chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520242746.3U CN204524480U (en) | 2015-04-21 | 2015-04-21 | A kind of Intelligent reflow welding machine made for bga chip |
Publications (1)
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CN204524480U true CN204524480U (en) | 2015-08-05 |
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CN201520242746.3U Expired - Fee Related CN204524480U (en) | 2015-04-21 | 2015-04-21 | A kind of Intelligent reflow welding machine made for bga chip |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107466198A (en) * | 2017-06-29 | 2017-12-12 | 无锡市京锡冶金液压机电有限公司 | A kind of electronic chip erecting device |
CN110634774A (en) * | 2019-09-05 | 2019-12-31 | 凌顶世纪科技成都有限公司 | Vacuum heating table |
CN112872522A (en) * | 2021-01-11 | 2021-06-01 | 武汉倍普科技有限公司 | Reflow furnace temperature curve intelligent detection system |
-
2015
- 2015-04-21 CN CN201520242746.3U patent/CN204524480U/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107466198A (en) * | 2017-06-29 | 2017-12-12 | 无锡市京锡冶金液压机电有限公司 | A kind of electronic chip erecting device |
CN110634774A (en) * | 2019-09-05 | 2019-12-31 | 凌顶世纪科技成都有限公司 | Vacuum heating table |
CN110634774B (en) * | 2019-09-05 | 2021-09-24 | 凌顶世纪科技成都有限公司 | Vacuum heating table |
CN112872522A (en) * | 2021-01-11 | 2021-06-01 | 武汉倍普科技有限公司 | Reflow furnace temperature curve intelligent detection system |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150805 Termination date: 20160421 |