JPS57190769A - Dropping device for molten solder - Google Patents

Dropping device for molten solder

Info

Publication number
JPS57190769A
JPS57190769A JP7486281A JP7486281A JPS57190769A JP S57190769 A JPS57190769 A JP S57190769A JP 7486281 A JP7486281 A JP 7486281A JP 7486281 A JP7486281 A JP 7486281A JP S57190769 A JPS57190769 A JP S57190769A
Authority
JP
Japan
Prior art keywords
chamber
molten solder
valve
dropping
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7486281A
Other languages
Japanese (ja)
Inventor
Yoshitaka Nagata
Takao Emoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7486281A priority Critical patent/JPS57190769A/en
Publication of JPS57190769A publication Critical patent/JPS57190769A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To provide a device which can drop pressurized molten solder accurately at a constant rate by forming the middle chamber of three chambers which are segmented to upper, middle and lower, to the volume of the desired amt. for one solder dropping and operating a valve stem communicating through the respective chambers vertically and plural valves alternately. CONSTITUTION:Part of the molten solder in an upper chamber 14 is put into a middle chamber 24 by opening an upper valve 13. After this, the valve 13 is closed and a lower valve 23 is opened to drop a required amt. of the molten solder in the chamber 24 through a lower chamber 34 from a nozzle 12. At this time, a non-oxidative gas such as N2 or Ar is injected under a high pressure of 2-4kg/cm<2> through the high pressure gas conduit 43a of the valve stem 23 on the inner side to clean the molten solder stagnating or stuck in the chamber 34 and the nozzle 12. With this device, it is possible to control the rate of dropping of the molten solder at a constant rate with the volume in the middle chamber withot strict regulation of the opening and closing times for the valves.
JP7486281A 1981-05-20 1981-05-20 Dropping device for molten solder Pending JPS57190769A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7486281A JPS57190769A (en) 1981-05-20 1981-05-20 Dropping device for molten solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7486281A JPS57190769A (en) 1981-05-20 1981-05-20 Dropping device for molten solder

Publications (1)

Publication Number Publication Date
JPS57190769A true JPS57190769A (en) 1982-11-24

Family

ID=13559556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7486281A Pending JPS57190769A (en) 1981-05-20 1981-05-20 Dropping device for molten solder

Country Status (1)

Country Link
JP (1) JPS57190769A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6092072A (en) * 1983-10-21 1985-05-23 Toshiba Corp Solder dropping device
JPS60115670U (en) * 1984-01-13 1985-08-05 株式会社　東工精機製作所 Molten solder automatic supply device
JPS62179795A (en) * 1986-02-03 1987-08-06 ティーディーケイ株式会社 Method for attaching electronic parts
JPS62127363U (en) * 1986-01-31 1987-08-12
FR2670505A1 (en) * 1990-12-17 1992-06-19 Solems Sa METHOD AND APPARATUS FOR SUPPLYING A METALLIC COMPOUND MADE OF A SUBSTRATE.
JP2008178892A (en) * 2007-01-23 2008-08-07 Canon Machinery Inc Solder feeding device and solder feeding method
JP2016533266A (en) * 2013-09-20 2016-10-27 スマート パック ゲゼルシャフト ミット ベシュレンクテル ハフツンク − テクノロジー サーヴィシズ Composition and method for reproducibly applying small amounts of liquid

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6092072A (en) * 1983-10-21 1985-05-23 Toshiba Corp Solder dropping device
JPH0478396B2 (en) * 1983-10-21 1992-12-11 Tokyo Shibaura Electric Co
JPS60115670U (en) * 1984-01-13 1985-08-05 株式会社　東工精機製作所 Molten solder automatic supply device
JPS62127363U (en) * 1986-01-31 1987-08-12
JPS62179795A (en) * 1986-02-03 1987-08-06 ティーディーケイ株式会社 Method for attaching electronic parts
FR2670505A1 (en) * 1990-12-17 1992-06-19 Solems Sa METHOD AND APPARATUS FOR SUPPLYING A METALLIC COMPOUND MADE OF A SUBSTRATE.
JP2008178892A (en) * 2007-01-23 2008-08-07 Canon Machinery Inc Solder feeding device and solder feeding method
JP2016533266A (en) * 2013-09-20 2016-10-27 スマート パック ゲゼルシャフト ミット ベシュレンクテル ハフツンク − テクノロジー サーヴィシズ Composition and method for reproducibly applying small amounts of liquid
US9975195B2 (en) 2013-09-20 2018-05-22 Pac Tech-Packaging Technologies Gmbh Arrangement and method for the reproducible application of small amounts of liquid

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