JPS62179796A - Apparatus for attaching electronic parts - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electronic component mounting apparatus for mounting leadless electronic components such as chip-shaped electronic components onto a printed circuit board or the like.

(Prior art) Conventionally, when attaching a leadless chip-shaped electronic component to a printed circuit board, an adhesive for temporary fixing is applied on the printed circuit board in advance, and the chip-shaped electronic component is placed at the position where the adhesive is applied. It used to be attached by suction and transfer using a suction head.

(Problem to be Solved by the Invention) By the way, the conventional glue-less mounting device for chip-shaped electronic components only has the AI function of simply transferring the electronic components with a suction head, so it is difficult to solder them in the post-process. is necessary. In addition, in the soldering process, before the electrodes of the electronic component and the conductive pattern on the board are finally soldered, it may be temporarily attached to the board due to variations in the adhesive strength of the adhesive or dry cohesion. There was an inconvenience in that the chip-shaped electronic components that had been used for this purpose could fall off due to shocks when handling the board.

(Means for Solving the Problems) The present invention improves on the above points by further providing a nozzle for discharging a conductive substance, and at the same time as the electronic component is transferred onto the substrate by the suction head, the electronic component is transferred to the conductive pattern on the substrate side. It is an object of the present invention to provide an electronic component mounting device that connects and fixes electronic components and eliminates the need for temporary fixing using conventional adhesives.

The present invention includes a suction head that is movable up and down and that attracts electronic components, and a suction head that goes up and down together with the suction head and discharges a conductive substance such as conductive adhesive or molten solder when the electronic component is placed on a substrate. The above-mentioned problems of the prior art are solved by the means provided with the nozzle.

(Function) In the electronic component mounting device of the present invention, when the electronic component is transferred onto the board, the electrodes of the electronic component are electrically connected to the conductive pattern on the board using a conductive substance such as conductive adhesive or solder. In addition, since the ends of the electronic components can be mechanically fixed, temporary adhesives and subsequent soldering steps can be eliminated. Further, since the electronic components are securely fixed, it is possible to perform operations such as inserting separate electronic components in a separate process into the board on which the electronic components are mounted according to the present invention without any hindrance. Note that the electronic component does not need to have an end electrode as long as it has an electrode portion that is at least partially exposed at the end of the electronic component.

(Example) Hereinafter, an example of the electronic component mounting apparatus according to the present invention will be described with reference to the drawings.

A first embodiment of the present invention will be explained with reference to FIGS. 1 to 1/I.

In these figures, 1 is a suction head, which can be moved to any position on the printed circuit board 2 (or the board side can be moved) by an XY table mechanism, etc., and can be raised and lowered by an air cylinder, etc. .

A pair of nozzles 3 are arranged on the sides of the tip of the suction blade 1. These nozzles 3 can also be moved up and down together with the suction rod 1. The seven nozzles 3 discharge a certain amount of conductive material such as conductive adhesive or molten solder. Here, the discharge of a certain amount of a conductive substance such as a conductive adhesive or molten solder from the nozzle 3 is performed by discharging a conductive substance 6 in a fluid state such as a conductive adhesive or molten solder, as shown in FIG. The cylinder 8 operated by air pressure is filled with air.
This can be carried out by communicating with the nozzle 3, detecting with a sensor or the like that the suction pad 1 has brought the chip-shaped electronic component 4 into contact with the substrate, and moving the cylinder 8 by a certain amount.

Next, the operation of the first embodiment will be explained. First, the suction head 1 suctions a chip-shaped electronic component 4 as a leadless electronic component from a supply section using vacuum suction force, and moves it to a predetermined position on a substrate 2 as shown in FIG.

Then, as shown in FIG. 3, the suction pad 1 descends to place the chip-shaped electronic component 4 on the substrate 2.

At this time, the end electrodes 4A at both ends (short sides) of the electronic component 4 are located on the conductive pattern (wiring pattern) 5 on the substrate side. Then, the chip-shaped electronic component 4 is
4, a certain amount of conductive adhesive, molten solder, or other conductive substance 6 is discharged from the nozzle 3 that is open above both ends of the electronic component 4. The end electrode 4 of the chip-shaped electronic component 4 is made of a conductive substance 6 such as a conductive adhesive or solder that is cured (solidified) as shown in FIG.
A is electrically connected to the conductive pattern δ and also mechanically fixed.

Although the first embodiment described above shows a case where a chip-shaped electronic component having an end electrode is attached, the present invention can also be applied to a chip-shaped electronic component having no end electrode. In this case,
A second embodiment of the present invention will be explained with reference to FIGS. 5 to 7.

First, the suction head 1 suctions a chip-shaped electronic component 7, which is a chip-shaped laminated ceramic capacitor or the like without forming an end electrode, from a supply section using vacuum suction force, as shown in FIG. Move to a predetermined position on the substrate 2.

Next, as shown in FIG. 6, the suction pad 1 descends and places the chip-shaped electronic component 7 on the substrate 2. At this time, both ends (short sides) of the electronic component 7 are located on the conductive pattern (wiring pattern) 5 on the board side. Then, in the placed state where the chip-shaped electronic component 7 continues to be attracted by the suction head 1, a certain amount of conductive substance 6 such as conductive adhesive or molten solder is discharged from the nozzle 3, as shown in FIG. The internal electrode 7 of the chip-shaped electronic component 7 is formed by the hardened conductive material 6 as shown in FIG.
The exposed end portion of A is electrically connected to the conductive pattern 5, and the end portion of the electronic component 7 is also mechanically fixed.

(Effects of the Invention) As described above, according to the electronic component mounting apparatus of the present invention, the suction head sucks the electronic component and places it on the substrate, and in this placed state, the conductive adhesive is applied from the nozzle. By discharging a conductive substance such as molten solder, it is possible to electrically connect the electrodes of electronic components and the conductive pattern on the board and to fix the electronic components, which eliminates the need for temporary fixing using conventional adhesives or the subsequent soldering process. This makes it possible to eliminate the need for electronic components and reduce the number of steps needed to install electronic components. Furthermore, since the electronic component is reliably fixed to the substrate at the same time as it is transferred by the suction head, there is an advantage that it is possible to insert another electronic component or the like in a subsequent process without any trouble.

[Brief explanation of drawings]

1 to 4 are front sectional views illustrating a first embodiment of an electronic component mounting apparatus according to the present invention, and FIGS. 5 to 7 are front sectional views illustrating a second embodiment. 1... Suction head, 2... Printed circuit board, 3...
Nozzle, 4, 7... Chip-shaped electronic component, 5... Conductive pattern, 6... Conductive substance. 71

Claims (1)

[Claims] (1) A suction head that can be raised and lowered to attract electronic components, and a suction head that goes up and down together with the suction head and discharges a conductive substance such as conductive adhesive or molten solder when the electronic component is placed on the board. An electronic component mounting device characterized by comprising a nozzle.