JPH0312430U - - Google Patents

Info

Publication number
JPH0312430U
JPH0312430U JP7380989U JP7380989U JPH0312430U JP H0312430 U JPH0312430 U JP H0312430U JP 7380989 U JP7380989 U JP 7380989U JP 7380989 U JP7380989 U JP 7380989U JP H0312430 U JPH0312430 U JP H0312430U
Authority
JP
Japan
Prior art keywords
pellet
semiconductor
semiconductor device
mounting
sucking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7380989U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7380989U priority Critical patent/JPH0312430U/ja
Publication of JPH0312430U publication Critical patent/JPH0312430U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本考案の一実施例の要部断面図であ
る。第２図は、従来の例の要部断面図である。 １……コレツト、２……半導体ペレツト、３…
…引伸しシート、４……マウントランド、５……
マウント材、６……基板、７……樹脂マウンド。 FIG. 1 is a sectional view of essential parts of an embodiment of the present invention. FIG. 2 is a sectional view of a main part of a conventional example. 1...Collection, 2...Semiconductor pellet, 3...
...Enlarged sheet, 4...Mountland, 5...
Mounting material, 6...Substrate, 7...Resin mound.

Claims (1)

【実用新案登録請求の範囲】 引伸しシート上で個片に分割された半導体ペレ
ツトを吸着コレツトにて吸着保持して、所定のマ
ウントランド上に移動載置して製造される半導体
装置において、 該半導体ペレツトのコレツト吸着部に樹脂マウ
ンドを形成したことを特徴とする半導体装置。[Scope of Claim for Utility Model Registration] A semiconductor device manufactured by sucking and holding a semiconductor pellet divided into individual pieces on an enlarged sheet with a suction collet, and moving and mounting the semiconductor pellet on a predetermined mounting land, A semiconductor device characterized in that a resin mound is formed in a collect adsorption portion of a pellet.
JP7380989U 1989-06-23 1989-06-23 Pending JPH0312430U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7380989U JPH0312430U (en) 1989-06-23 1989-06-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7380989U JPH0312430U (en) 1989-06-23 1989-06-23

Publications (1)

Publication Number Publication Date
JPH0312430U true JPH0312430U (en) 1991-02-07

Family

ID=31612945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7380989U Pending JPH0312430U (en) 1989-06-23 1989-06-23

Country Status (1)

Country Link
JP (1) JPH0312430U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5727039A (en) * 1980-07-24 1982-02-13 Nec Home Electronics Ltd Mounting method for semiconductor pellet
JPS59119737A (en) * 1982-12-27 1984-07-11 Fujitsu Ltd Manufacture of semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5727039A (en) * 1980-07-24 1982-02-13 Nec Home Electronics Ltd Mounting method for semiconductor pellet
JPS59119737A (en) * 1982-12-27 1984-07-11 Fujitsu Ltd Manufacture of semiconductor device

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