JPS62193757U - - Google Patents

Info

Publication number
JPS62193757U
JPS62193757U JP8240986U JP8240986U JPS62193757U JP S62193757 U JPS62193757 U JP S62193757U JP 8240986 U JP8240986 U JP 8240986U JP 8240986 U JP8240986 U JP 8240986U JP S62193757 U JPS62193757 U JP S62193757U
Authority
JP
Japan
Prior art keywords
substrate
electronic component
stress absorbing
utility
scope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8240986U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8240986U priority Critical patent/JPS62193757U/ja
Publication of JPS62193757U publication Critical patent/JPS62193757U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案に係る電子部品の基板の構造
の好適な実施例を示した平面図である。第2図は
、第1図に示すものの矢視A―A断面図である。
第3図、第4図及び第5図は本考案に係る電子部
品の基板の構造の別の実施例を示した平面図であ
る。第6図は、第5図に示すものの矢視B―B断
面図である。 1……半導体チツプ等の電子素子、2……基板
、3a〜3d……応力吸収部としての穴、4……
接着剤、5……応力吸収部の別の実施例としての
リブ。
FIG. 1 is a plan view showing a preferred embodiment of the structure of an electronic component substrate according to the present invention. FIG. 2 is a cross-sectional view taken along arrow AA of the structure shown in FIG.
3, 4, and 5 are plan views showing other embodiments of the structure of the electronic component substrate according to the present invention. FIG. 6 is a cross-sectional view taken along arrow BB of the device shown in FIG. 1... Electronic elements such as semiconductor chips, 2... Substrate, 3a to 3d... Holes as stress absorbing parts, 4...
Adhesive, 5...Ribs as another embodiment of the stress absorbing part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上の所望部位に応力吸収部を有することを
特徴とする電子部品の基板の構造。
A structure of a substrate for an electronic component, characterized by having a stress absorbing portion at a desired location on the substrate.
JP8240986U 1986-05-30 1986-05-30 Pending JPS62193757U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8240986U JPS62193757U (en) 1986-05-30 1986-05-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8240986U JPS62193757U (en) 1986-05-30 1986-05-30

Publications (1)

Publication Number Publication Date
JPS62193757U true JPS62193757U (en) 1987-12-09

Family

ID=30935039

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8240986U Pending JPS62193757U (en) 1986-05-30 1986-05-30

Country Status (1)

Country Link
JP (1) JPS62193757U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011152502A (en) * 2010-01-26 2011-08-11 Panasonic Electric Works Co Ltd Electrostatic atomizer
JP2011152500A (en) * 2010-01-26 2011-08-11 Panasonic Electric Works Co Ltd Electrostatic atomizer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011152502A (en) * 2010-01-26 2011-08-11 Panasonic Electric Works Co Ltd Electrostatic atomizer
JP2011152500A (en) * 2010-01-26 2011-08-11 Panasonic Electric Works Co Ltd Electrostatic atomizer

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