CN212113687U

CN212113687U - Packaging piece of patch type diode

Info

Publication number: CN212113687U
Application number: CN202020903058.8U
Authority: CN
Inventors: 王志敏; 黄丽凤; 丁晓飞
Original assignee: Rugao Dachang Electronics Co Ltd
Current assignee: Rugao Dachang Electronics Co Ltd
Priority date: 2020-05-26
Filing date: 2020-05-26
Publication date: 2020-12-08
Anticipated expiration: 2030-05-26

Abstract

The utility model relates to the technical field of diode manufacturing, and discloses a chip diode packaging piece, which comprises a bottom plate, wherein the left and right side surfaces of the bottom plate are fixedly connected with a fixed plate, the outer wall of the fixed plate is provided with a hole I in a penetrating way, the upper surface of the bottom plate is fixedly connected with a shell I, the upper surface of the shell I is fixedly connected with a shell II, the outer wall of the shell II is embedded with a rubber pad, the inner part of the shell I is embedded with an anode, the right side of the anode is fixedly connected with a cathode, the inner part of the shell I is fixedly connected with a supporting plate, the outer wall of the supporting plate is provided with a hole II in a penetrating way, the inner wall of the shell I is provided with a groove I, the upper surface of the shell I is provided with a groove II, the lower surface of the shell II is fixedly connected with a convex block, the equipment can act, while preventing static electricity.

Description

Packaging piece of patch type diode

Technical Field

The utility model relates to a diode manufacturing technology field specifically is packaging part of SMD diode.

Background

The diode package is characterized in that a circuit pin on a silicon chip is connected and led to an external joint by a lead so as to be connected with other devices, the diode package not only plays the roles of mounting, fixing, sealing, protecting a chip, enhancing the electric heating performance and the like in electronics, but also is connected to pins of a package shell by leads through contacts on the chip, and the pins are connected with other devices by leads on a printed circuit board so as to realize the connection of an internal chip and an external circuit.

SUMMERY OF THE UTILITY MODEL

The utility model provides a not enough to prior art, the utility model provides a packaging part of SMD diode, current diode packaging part generally adopt the plastic parcel, installation and transportation of being not convenient for after the encapsulation, and impurity in the air causes the problem that electrical performance descends to the corruption of chip circuit easily simultaneously.

The utility model provides a following technical scheme: the packaging piece of the patch type diode comprises a bottom plate, wherein the left side surface and the right side surface of the bottom plate are fixedly connected with a fixing plate, the outer wall of the fixing plate is provided with a first hole in a penetrating way, the upper surface of the bottom plate is fixedly connected with a first shell, the upper surface of the first shell is fixedly connected with a second shell, a rubber pad is embedded in the outer wall of the second shell, an anode is embedded in the first shell, a cathode is fixedly connected to the right side of the anode, a supporting plate is fixedly connected inside the first shell, a second hole is arranged on the outer wall of the supporting plate in a penetrating manner, a first groove is formed in the inner wall of the first shell, a second groove is formed in the upper surface of the first shell, the lower surface of the second shell is fixedly connected with a convex block, the lower surface of the second shell is provided with a groove III, the upper surface embedding of casing two is provided with glass, the lower surface of bottom plate runs through and is provided with the circuit and collects the hole.

Preferably, the width of the protruding block is smaller than that of the first groove, and the protruding block is clamped with the first groove.

Preferably, the protruding block is rectangular, surrounds the lower surface of the second shell, and the first groove is rectangular and is arranged on the upper surface of the first shell.

Preferably, the two rubber pads are embedded in the left side and the right side of the second shell.

Preferably, the second groove is clamped with the third groove, and the width of the third groove is larger than that of the second groove.

Preferably, the number of the fixing plates is four, and the four fixing plates are respectively fixed at four corners of the bottom plate.

Preferably, the upper surface of the first shell and the lower surface of the second shell are tightly attached, and the areas of the first shell and the second shell are equal.

Compared with the prior art, the utility model discloses possess following beneficial effect:

1. the packaging piece of the surface mount diode has the advantages that the rubber pads on two sides are acted by the second shell, the rubber is used as an insulator, when a finger touches the rubber pad, the friction force between the rubber and the finger is increased, the second shell connected with the rubber pad can be lifted conveniently, and static electricity is prevented.

2. This packaging part of SMD diode, through the protruding piece of second casing lower surface, the protruding piece is the lower surface that rectangle centers on second casing, and when the protruding piece inserted the inside of recess one, the upper surface of first casing closely laminated with the lower surface of second casing, prevents that dust and impurity from getting into the inside of first casing and second casing.

3. This packaging part of SMD diode, through the recess two of casing first upper surface, recess two is provided with two, and negative pole and positive pole have been placed to the upper surface of two recesses two, and recess two and three joints of recess wrap up the outer wall of negative pole and positive pole for fixed negative pole and positive pole prevent to rock and crooked.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of an internal structure of a housing according to the present invention;

FIG. 3 is a schematic view of the structure of the lower surface of the second casing of the present invention;

FIG. 4 is a schematic view of the lower surface structure of the bottom plate of the present invention;

in the figure: 1. a base plate; 2. a fixing plate; 3. a first hole; 4. a first shell; 5. a second shell; 6. a rubber pad; 7. an anode; 8. a cathode; 9. a support plate; 10. a second hole; 11. a first groove; 12. a second groove; 13. a raised block; 14. a third groove; 15. glass; 16. a line collection well.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, a chip diode package includes a base plate 1, a fixing plate 2 is fixedly connected to both left and right side surfaces of the base plate 1, four fixing plates 2 are provided and respectively fixed to four corners of the base plate 1, a hole one 3 is formed through an outer wall of the fixing plate 2, a case one 4 is fixedly connected to an upper surface of the base plate 1, a case two 5 is fixedly connected to an upper surface of the case one 4, an upper surface of the case one 4 is closely attached to a lower surface of the case two 5, areas of the case one 4 and the case two 5 are equal, a rubber pad 6 is embedded in an outer wall of the case two 5, two rubber pads 6 are provided and embedded in left and right sides of the case two 5, so as to facilitate detachment of the case two 5, an anode 7 is embedded in the case one 4, a cathode 8 is fixedly connected to a right side of the anode, the outer wall of layer board 9 runs through and is provided with hole two 10, the inner wall of casing one 4 sets up the groove and has a recess 11, the upper surface of casing one 4 sets up the groove and has a recess two 12, the lower fixed surface of casing two 5 is connected with protruding piece 13, protruding piece 13 is the rectangle, around the lower surface of casing two 5, recess one 11 is the rectangle, set up in the upper surface of casing one 4, protruding piece 13 and recess one 11 joint, the width of protruding piece 13 is less than the width of recess one 11, protruding piece 13 and recess one 11 joint, the lower surface of casing two 5 sets up the groove and has a recess three 14, recess two 12 and recess three 14 joint, the width of recess three 14 is greater than the width of recess two 12, recess two 12 and recess three 14 joint, the upper surface embedding of casing two 5 is provided with glass 15, the lower surface of bottom plate 1 runs through and is provided with circuit collection hole 16.

When the device works, firstly, the first shell 4 is clamped on the upper surface of the bottom plate 1, then the cathode 8 and the anode 7 of the diode are placed on the upper surfaces of the two grooves two 12 on the upper surface of the first shell 4, then the rubber pads 6 on the left side and the right side of the second shell 5 are pressed to lift the second shell 5 upwards, the convex blocks 13 on the lower surface of the second shell 5 are aligned with the grooves one 11 on the lower surface of the first shell 4, the second shell 5 is pressed downwards to clamp the convex blocks 13 on the lower surface of the second shell 5 in the grooves one 11, the upper surface of the first shell 4 is tightly attached to the lower surface of the second shell 5, the two grooves three 14 on the lower surface of the second shell 5 are clamped with the two grooves two 12 on the upper surface of the first shell 4, the lower surfaces of the grooves three 14 are tightly attached to the upper surfaces of the cathode 8 and the anode 7, the cathode 8 and the anode 7 are fixed to prevent shaking, the condition of the diode is observed through the glass 15 on, when the LED is detached, the rubber pads 6 on the left side and the right side of the second shell 5 are pressed by fingers, the second shell 5 is lifted upwards, and the lower diodes are exposed.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. Packaging part of SMD diode, including bottom plate (1), its characterized in that: the left side surface and the right side surface of the bottom plate (1) are fixedly connected with fixing plates (2), the outer wall of each fixing plate (2) is provided with a first hole (3) in a penetrating manner, the upper surface of the bottom plate (1) is fixedly connected with a first shell (4), the upper surface of the first shell (4) is fixedly connected with a second shell (5), the outer wall of the second shell (5) is embedded with a rubber pad (6), an anode (7) is embedded in the first shell (4), the right side of the anode (7) is fixedly connected with a cathode (8), the inner part of the first shell (4) is fixedly connected with a supporting plate (9), the outer wall of the supporting plate (9) is provided with a second hole (10) in a penetrating manner, the inner wall of the first shell (4) is provided with a first groove (11), the upper surface of the first shell (4) is provided with a second groove (12), and the lower surface of, the lower surface of the second shell (5) is provided with a groove III (14), the upper surface of the second shell (5) is embedded with glass (15), and the lower surface of the bottom plate (1) is provided with a line collecting hole (16) in a penetrating mode.

2. The package of a chip mounted diode according to claim 1, wherein: the width of the convex block (13) is smaller than that of the first groove (11), and the convex block (13) is clamped with the first groove (11).

3. The package of a chip mounted diode according to claim 2, wherein: the protruding block (13) is rectangular and surrounds the lower surface of the second shell (5), and the first groove (11) is rectangular and is arranged on the upper surface of the first shell (4).

4. The package of a chip mounted diode according to claim 1, wherein: and two rubber pads (6) are arranged and embedded in the left side and the right side of the second shell (5).

5. The package of a chip mounted diode according to claim 1, wherein: the second groove (12) is clamped with the third groove (14), and the width of the third groove (14) is larger than that of the second groove (12).

6. The package of a chip mounted diode according to claim 1, wherein: the number of the fixing plates (2) is four, and the four fixing plates are fixed at four corners of the bottom plate (1) respectively.

7. The package of a chip mounted diode according to claim 1, wherein: the upper surface of the first shell (4) is tightly attached to the lower surface of the second shell (5), and the areas of the first shell (4) and the second shell (5) are equal.