CN214654599U - Low-modulus conductive adhesive for packaging semiconductor chip - Google Patents
Low-modulus conductive adhesive for packaging semiconductor chip Download PDFInfo
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- CN214654599U CN214654599U CN202120840010.1U CN202120840010U CN214654599U CN 214654599 U CN214654599 U CN 214654599U CN 202120840010 U CN202120840010 U CN 202120840010U CN 214654599 U CN214654599 U CN 214654599U
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- adhesive tape
- semiconductor chip
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Abstract
The utility model relates to a conductive adhesive technical field, and a low modulus conductive adhesive for semiconductor chip encapsulation is disclosed, including conductive base member, conductive base member's upper surface and the horizontal spacing adhesive tape of a plurality of evenly distributed of the equal fixedly connected with in lower surface, the vertical spacing adhesive tape of a plurality of evenly distributed of fixedly connected with between two adjacent horizontal spacing adhesive tapes, the conductive colloid that fixedly connected with matees between horizontal spacing adhesive tape and the vertical spacing adhesive tape, and conductive colloid and conductive base member fixed connection run through the louvre of seting up a plurality of evenly distributed on the conductive base member. The utility model discloses not only effectively reduce the modulus of conducting resin, be convenient for absorb the stress that produces because deformation on the interface between chip and the base plate, the convenience is dispelled the heat to the chip moreover and is protected.
Description
Technical Field
The utility model relates to a conducting resin technical field especially relates to a low modulus conducting resin for semiconductor chip encapsulation.
Background
In recent years, as the market demand for portable mobile devices represented by smartphones has increased, larger-sized applications of semiconductor chips that perform core functions have become more prevalent, and their performance has become more critical. Semiconductor chips having basic functions must be subjected to a packaging process such as die bonding, wire bonding, hermetic encapsulation, etc. to become electronic components that can be put to practical use and then to exert various designed properties, and thus various materials used in the packaging process are very important.
The chip bonding is one of the key steps in the packaging process of the semiconductor chip, the conductive adhesive is widely used for bonding the semiconductor chip and the substrate together to fix the chip, and good conductive connection is established to realize the function of the chip.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to solve the above problems in the prior art, and provides a low modulus conductive adhesive for semiconductor chip packaging.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a low modulus conducting resin for semiconductor chip encapsulation, includes conductive base member, conductive base member's upper surface and the horizontal spacing adhesive tape of a plurality of evenly distributed of the equal fixedly connected with of lower surface, adjacent two fixedly connected with a plurality of evenly distributed's vertical spacing adhesive tape between the horizontal spacing adhesive tape, the electrically conductive colloid of fixedly connected with matching between horizontal spacing adhesive tape and the vertical spacing adhesive tape, and electrically conductive colloid and conductive base member fixed connection, run through the louvre of having seted up a plurality of evenly distributed on the conductive base member.
Preferably, one side of the conductive colloid, which is far away from the conductive substrate, is covered and bonded with a lining film.
Preferably, the conductive matrix is made of a composite conductive hydrogel.
Preferably, the transverse limiting rubber strip and the longitudinal limiting rubber strip are both made of butadiene rubber.
Preferably, the cross-sectional heights of the transverse limiting rubber strip and the longitudinal limiting rubber strip are equal, and the cross-sectional heights of the transverse limiting rubber strip and the longitudinal limiting rubber strip are smaller than the cross-sectional height of the conductive rubber body.
Preferably, the edge of the end part of the lining film is fixedly connected with a lifting belt.
Compared with the prior art, the utility model provides a low modulus conducting resin for semiconductor chip encapsulation possesses following beneficial effect:
this a low modulus conducting resin for semiconductor chip encapsulation, through setting up conductive substrate, horizontal spacing adhesive tape, vertical spacing adhesive tape, conductive colloid and louvre, horizontal spacing adhesive tape cooperation is vertical spacing adhesive tape is convenient to be spacing to conductive colloid, effectively reduce its modulus, thereby effectively absorb the stress that produces because deformation on the interface between chip and the base plate, conductive substrate cooperation louvre, not only do not influence the electric conductivity between the conductive colloid, and the convenience is dispelled the heat to the chip, thereby effectively improve the life of chip.
The part that does not relate to among the device all is the same with prior art or can adopt prior art to realize, the utility model discloses not only effectively reduce the modulus of conducting resin, be convenient for absorb the stress that produces because of deformation on the interface between chip and the base plate, conveniently carry out the heat dissipation protection to the chip moreover.
Drawings
Fig. 1 is a schematic structural diagram of a low modulus conductive adhesive for semiconductor chip packaging according to the present invention;
fig. 2 is a sectional view taken along the line a-a in fig. 1.
In the figure: the structure comprises a conductive base body 1, a transverse limiting rubber strip 2, a longitudinal limiting rubber strip 3, a conductive rubber body 4, heat dissipation holes 5, a lining film 6 and a lifting belt 7.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Referring to fig. 1-2, a low modulus conductive adhesive for semiconductor chip packaging, includes a conductive base 1, a plurality of evenly distributed horizontal limit adhesive tapes 2 are fixedly connected to the upper surface and the lower surface of the conductive base 1, a plurality of evenly distributed longitudinal limit adhesive tapes 3 are fixedly connected between two adjacent horizontal limit adhesive tapes 2, a conductive colloid 4 matched with the horizontal limit adhesive tapes 2 and the longitudinal limit adhesive tapes 3 is fixedly connected between the horizontal limit adhesive tapes 2 and the longitudinal limit adhesive tapes 3, the conductive colloid 4 is fixedly connected with the conductive base 1, a plurality of evenly distributed heat dissipation holes 5 are arranged on the conductive base 1 in a penetrating manner, the conductive colloid 4 on one side is bonded with a substrate, the conductive colloid 4 on the other side is bonded with a chip, electrical conduction is conveniently carried out through the conductive base 1, the horizontal limit adhesive tape 2 is matched with the longitudinal limit adhesive tape 3 to conveniently limit the conductive colloid 4, the modulus is effectively reduced, thereby effectively absorbing stress generated by deformation on the interface between the chip and the substrate, the heat that the chip produced can be conducted for conductive matrix 1 by conductive adhesive 4, conveniently dispels the heat fast through a plurality of louvre 5 to effectively improve the life of chip.
One side of the conductive colloid 4, which is far away from the conductive base body 1, is covered and bonded with a lining film 6, so that the bonding surface of the conductive colloid 4 is protected conveniently.
The conductive matrix 1 is made of composite conductive hydrogel which can conduct electricity and has good strength and toughness, so that stress generated by deformation can be absorbed conveniently.
The transverse limiting rubber strip 2 and the longitudinal limiting rubber strip 3 are made of butadiene rubber, so that the elasticity and strength of the transverse limiting rubber strip 2 and the longitudinal limiting rubber strip 3 are guaranteed, and buffering is convenient.
The cross-sectional heights of the transverse limiting rubber strip 2 and the longitudinal limiting rubber strip 3 are equal, and the cross-sectional heights of the transverse limiting rubber strip 2 and the longitudinal limiting rubber strip 3 are smaller than the cross-sectional height of the conductive colloid 4, so that the conductive colloid 4 is prevented from being influenced to be bonded with the substrate and the chip.
The edge of the end part of the lining film 6 is fixedly connected with a lifting belt 7, which is convenient for lifting the lining film 6 for bonding.
The utility model discloses in, bond one side conductive colloid 4 and base plate, opposite side conductive colloid 4 and chip bond, conveniently carry out the electrical conductivity via conductive base member 1, horizontal spacing adhesive tape 2 cooperates vertical spacing adhesive tape 3 to conveniently carry on spacingly to conductive colloid 4, effectively reduce its modulus, thereby effectively absorb the stress that produces because deformation on the interface between chip and the base plate, the heat that the chip produced can be conducted by conductive colloid 4 and give conductive base member 1, conveniently dispel the heat fast through a plurality of louvre 5, thereby effectively improve the life of chip.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. The utility model provides a low modulus conducting resin for semiconductor chip encapsulation, includes conductive base body (1), its characterized in that, the upper surface and the horizontal spacing adhesive tape (2) of a plurality of evenly distributed of the equal fixedly connected with in lower surface of conductive base body (1), adjacent two vertical spacing adhesive tape (3) of a plurality of evenly distributed of fixedly connected with between horizontal spacing adhesive tape (2), electrically conductive colloid (4) that fixedly connected with matches between horizontal spacing adhesive tape (2) and vertical spacing adhesive tape (3), and electrically conductive colloid (4) and conductive base body (1) fixed connection, run through louvre (5) of seting up a plurality of evenly distributed on conductive base body (1).
2. The low-modulus conductive adhesive for packaging the semiconductor chip as claimed in claim 1, wherein the side of the conductive adhesive body (4) far away from the conductive base body (1) is covered and adhered with a lining film (6).
3. The low modulus conductive adhesive for semiconductor chip packaging according to claim 1, wherein the conductive base (1) is made of composite conductive hydrogel.
4. The low modulus conductive adhesive for semiconductor chip packaging according to claim 1, wherein the transverse restraining rubber strip (2) and the longitudinal restraining rubber strip (3) are made of butadiene rubber.
5. The low-modulus conductive adhesive for packaging the semiconductor chip as claimed in claim 1, wherein the cross-sectional heights of the transverse limiting adhesive tape (2) and the longitudinal limiting adhesive tape (3) are equal, and the cross-sectional heights of the transverse limiting adhesive tape (2) and the longitudinal limiting adhesive tape (3) are less than the cross-sectional height of the conductive adhesive body (4).
6. The conductive adhesive with low modulus for packaging semiconductor chips as claimed in claim 2, wherein a lifting tape (7) is fixedly connected to the edge of the end of the lining film (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120840010.1U CN214654599U (en) | 2021-04-23 | 2021-04-23 | Low-modulus conductive adhesive for packaging semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120840010.1U CN214654599U (en) | 2021-04-23 | 2021-04-23 | Low-modulus conductive adhesive for packaging semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214654599U true CN214654599U (en) | 2021-11-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120840010.1U Active CN214654599U (en) | 2021-04-23 | 2021-04-23 | Low-modulus conductive adhesive for packaging semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214654599U (en) |
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2021
- 2021-04-23 CN CN202120840010.1U patent/CN214654599U/en active Active
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