CN214203676U - Packaging frame of patch type photovoltaic bypass module - Google Patents
Packaging frame of patch type photovoltaic bypass module Download PDFInfo
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- CN214203676U CN214203676U CN202120489429.7U CN202120489429U CN214203676U CN 214203676 U CN214203676 U CN 214203676U CN 202120489429 U CN202120489429 U CN 202120489429U CN 214203676 U CN214203676 U CN 214203676U
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- frame
- partition
- bypass module
- photovoltaic bypass
- patch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Photovoltaic Devices (AREA)
Abstract
The utility model provides an encapsulation frame of SMD photovoltaic bypass module, the encapsulation frame includes a plurality of frame cell that are array distribution, and every frame cell corresponds the encapsulation of a SMD photovoltaic bypass module, can realize the encapsulation of a plurality of SMD photovoltaic bypass modules simultaneously, has effectively improved the utilization ratio of production encapsulation efficiency and raw and other materials, has reduced manufacturing cost; the carrier area on the first frame is divided by the first coining groove and the second coining groove, and the first coining groove and the second coining groove can play roles in isolation and drainage, so that the mutual influence of subsequent subarea welding or glue dispensing can be effectively prevented, and the packaging reliability and yield of the photovoltaic module are improved; and the corresponding surface-mounted photovoltaic bypass module product is in a semi-encapsulated surface-mounted assembly, the back surface of the frame carrier is a main heat dissipation part, and the heat dissipation capacity after encapsulation is strong.
Description
Technical Field
The utility model belongs to the technical field of the photovoltaic encapsulation technique and specifically relates to a SMD photovoltaic bypass module's packaging frame is related to.
Background
At present, solar power generation comprises photobiological power generation, photoinduction power generation, photovoltaic power generation and photochemical power generation, and the photovoltaic power generation is one of the most mainstream power generation modes at present. The photovoltaic power generation system consists of a photovoltaic cell, a storage battery, a controller and an inverter, wherein the photovoltaic cell is a key part of the photovoltaic power generation system, and the photovoltaic bypass module and the photovoltaic cell are connected in series and in parallel for use and have the functions of preventing hot spot effect and protecting a photovoltaic cell assembly.
When the photovoltaic cell assembly works normally, the photovoltaic bypass module is in a reverse cut-off state, and the current generated by the photovoltaic cell assembly can be reduced by the existing reverse current (IR); when the photovoltaic cell component is shielded, the photovoltaic bypass module is conducted in the forward direction, and the photovoltaic bypass module generates heat and consumes the power of the photovoltaic cell component due to the existing forward voltage drop (VF). An ideal photovoltaic bypass module should therefore be lossless, with extremely low IR and extremely low VF over the temperature range of operation.
With the continuous development of photovoltaic cell technology, the requirements on the photovoltaic bypass module are higher and higher, the traditional SBD and TMBS can not meet the reliability requirements, the MOSFET photovoltaic bypass module effectively solves the problems of reverse bias breakdown failure and the like of the diode, and the reliability of the photovoltaic module is improved.
MOSFET photovoltaic bypass modules, in turn, present an increasing challenge to the corresponding packaging framework: how to realize the welding or dispensing of devices on each device mounting area of the carrier area without mutual influence, how to realize the miniaturization and flattening packaging of products, how to increase the bonding strength of a packaging frame and a plastic packaging material during flattening packaging, and the like. All of the above will affect the packaging yield, reliability and stability of the photovoltaic bypass module.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a photovoltaic bypass module packaging frame for solving the above-mentioned technical problems.
In order to achieve the above and other related objects, the present invention provides an encapsulation frame for a patch-type photovoltaic bypass module, wherein the encapsulation frame comprises a plurality of frame units distributed in an array, and each frame unit corresponds to the encapsulation of one patch-type photovoltaic bypass module; the frame unit comprises a first frame and a second frame which are mutually independent, a first coining groove is formed in the first frame, the first coining groove divides the first frame into a carrier region and a non-carrier region, the carrier region comprises a first partition, a second partition, a third partition and a fourth partition which are mutually independent, a second coining groove is formed in the carrier region, the first partition is located on one side of the second coining groove, and the second partition, the third partition and the fourth partition are located on the other side of the second coining groove.
Optionally, the package frame comprises 60 of the frame units distributed in a 3x20 matrix.
Optionally, the package frame includes a bare copper frame, the bare copper of the first partition, the bare copper of the second partition, and the bare copper of the third partition are roughened, and the fourth partition is partially silver-plated.
Optionally, the first frame and the second frame comprise: a sheet-like structure.
Optionally, a plurality of alternately arranged recesses and protrusions are arranged on a frame of the carrier region.
Optionally, a first glue locking hole is formed in the non-carrier region, and the first glue locking hole is close to the first coining groove.
Optionally, the first glue locking hole comprises an elliptical hole.
Optionally, on the first frame, an end of the non-carrier region away from the carrier region is provided with a semicircle.
Optionally, a Z-shaped step is arranged on one side of the second frame, which is close to the carrier region, and a plurality of second glue locking holes are arranged on an inclined plane of the Z-shaped step.
Optionally, the second glue locking hole comprises a circular hole.
As described above, the utility model discloses a SMD photovoltaic bypass module's packaging frame has following beneficial effect at least:
the packaging frame comprises a plurality of frame units distributed in an array manner, each frame unit corresponds to the packaging of one surface mount type photovoltaic bypass module, the packaging of the plurality of surface mount type photovoltaic bypass modules can be realized at the same time, and the production packaging efficiency is effectively improved; the carrier region on the first frame is divided by the first coining groove and the second coining groove, the first coining groove and the second coining groove can play roles in isolation and drainage, the mutual influence during welding or dispensing of each subsequent partition is prevented, and the packaging reliability and yield of the photovoltaic bypass module are improved.
Drawings
Fig. 1-3 show schematic structural diagrams of the package frame of the patch-type photovoltaic bypass module according to the embodiment of the present invention.
Fig. 4-6 show a flow chart of an encapsulation process of an encapsulation frame of a patch-type photovoltaic bypass module according to an embodiment of the present invention.
Description of the reference numerals
1-frame cell, 11-first frame, 12-second frame, 2-MOSFET chip, 3-electric capacity, 4-IC chip, 5-plastic-sealed body, A-first subregion, B-second subregion, C-third subregion, D-fourth subregion, S1-first coining slot, S2-second coining slot, T1-first glueing hole, T2-second glueing hole.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.
Please refer to fig. 1 to 6. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the invention in a schematic manner, and only the components related to the invention are shown in the drawings rather than being drawn according to the number, shape and size of the components in actual implementation, and the form, quantity and proportion of the components in actual implementation may be changed at will, and the layout of the components may be more complicated. The structure, ratio, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by people familiar with the technology, and are not used for limiting the limit conditions which can be implemented by the present invention, so that the present invention does not have the substantial significance in the technology, and any structure modification, ratio relationship change or size adjustment should still fall within the scope which can be covered by the technical content disclosed by the present invention without affecting the efficacy which can be produced by the present invention and the purpose which can be achieved by the present invention. Meanwhile, the terms such as "upper", "lower", "first", "second", "close" and "far" used in the present specification are for the sake of clarity only, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof are considered to be the scope of the present invention without substantial changes in the technical content.
As shown in fig. 1-2, the utility model provides an encapsulation frame of a patch-type photovoltaic bypass module, which comprises a plurality of frame units 1 distributed in an array, wherein each frame unit 1 corresponds to the encapsulation of one patch-type photovoltaic bypass module; the frame unit 1 includes a first frame 11 and a second frame 12 which are independent of each other, a first coining groove S1 is provided on the first frame 11, the first coining groove S1 divides the first frame 11 into a carrier region and a non-carrier region, the carrier region includes a first partition a, a second partition B, a third partition C and a fourth partition D which are independent of each other, and a second coining groove S2 is provided on the carrier region, the first partition a is located at one side of the second coining groove S2, and the second partition B, the third partition C and the fourth partition D are located at the other side of the second coining groove S2.
As shown in fig. 1, in an alternative embodiment of the present invention, the packaging frame includes 60 frame units 1 distributed in a 3 × 20 matrix, that is, the packaging frame is arranged in three rows, and one packaging frame can package 60 photovoltaic bypass modules.
In detail, as shown in fig. 2 to 3, the first frame 11 and the second frame 12 include: a sheet-like structure. The first frame 11 and the second frame 12 are both sheet-like structures, provide structural support and external electrical connection pins for the whole photovoltaic bypass module, and are suitable for the current miniaturized and flattened packaging.
As shown in fig. 1-2, in an alternative embodiment of the present invention, the overall length of the package frame is 238.0mm, and the overall width is 70.0 mm; the thickness of the frame unit 1 is 0.3mm (i.e. the thickness of the first frame 11 and the second frame 12 is 0.3mm), the thickness of the PAD is 0.3mm, and the thickness of the pin is 0.3 mm; the step pitch is 23.8mm, and the cumulative step pitch is 214.2 mm; the width of the positioning edge is 1.51mm, and the diameter of the fine positioning hole is 1.524 mm; the size of the carrier region on the first frame 11 was 6.4mm by 5.1 mm.
In detail, as shown in fig. 2, the package frame includes a bare copper frame, and in each frame unit 1, a first partition a, a second partition B, and a third partition C are roughened with bare copper, and a fourth partition D is partially plated with silver. As shown in fig. 4, the first partition a, the second partition B, and the third partition C are respectively used for connection of the MOSFET chip 2, the capacitor 3, and the IC chip 4.
In packaging, as shown in fig. 4, a core mounting process and a bonding process are performed to fix the MOSFET chip 2 on the first partition a so that the drain of the MOSFET chip 2 is electrically connected to the first frame 11, fix the capacitor 3 on the second partition B, fix the IC chip 4 on the third partition C, electrically connect the source of the MOSFET chip 2 to the second frame 12 using a conductive strip, and electrically connect the IC chip 4 to the MOSFET chip 2 and the capacitor 3, respectively.
In an optional embodiment of the present invention, the MOSFET chip 2 is fixed on the first partition a by using soft solder process, the soft solder can be high lead solder (pbsn2ag2.5) or lead-free solder (SnAg25Sb10), the thickness of the solder layer must be 25-75 μm after the core is mounted, the solder voids require less than or equal to 5% of the chip area as a whole, and less than or equal to 2% of the chip area as a single solder, and the shearing force of the MOSFET chip 2 must be greater than the minimum requirement; and respectively fixing the capacitor 3 and the IC chip 4 on the second subarea B and the third subarea C by adopting a glue dispensing process, wherein the insulating glue can adopt Han height 84-3J or amiable Sedi EN-4900GCN4, the glue dispensing thickness is 20-40 mu m, and then, nitrogen baking and curing are carried out, so that the capacitor 3 and the IC chip 4 are respectively and tightly combined with the first frame 11, the baking temperature is 150-180 ℃, and the baking time is 60-90 min.
The first coining groove S1 and the second coining groove S2 play a role in dividing regions (isolation) and guiding, so that the mutual influence during welding or dispensing of each subsequent region is prevented, and the packaging reliability and yield of the photovoltaic bypass module are improved.
The utility model discloses an optional embodiment, the conducting strip can adopt 40 ~ 60mil aluminium strips or pieces, based on the connected mode of conducting strip, can improve heat dispersion and electrical property (drain-source on-resistance RDS (on) reduction, current capability reinforcing).
In an optional embodiment of the utility model, adopt ultrasonic gold thread welding process, with IC chip 4 respectively with MOSFET chip 2 and electric capacity 3 electrical connection, adopt 1 ~ 2mil gold thread (not shown in the figure) to carry out electrical connection between IC chip 4 and electric capacity 3(MOSFET chip 2), when the gold thread is connected, chip pad and bonding ball bonding back not damaged, no crater, push-and-pull strength must be greater than minimum requirement, this connected mode can improve its electrical property and reliability. Wherein, the surface of the capacitor 3 is formed with a gold plating layer, which is convenient for gold wire bonding.
During packaging, as shown in fig. 5-6, a plastic package process is further performed, and the pressure-welded semi-finished product is packaged by using a plastic package material to prevent the external environment from being damaged. The novel photovoltaic bypass module is a surface mounted device, and parameters of the plastic package material which are more heavily considered are stress and water absorption; the plastic packaging materials of the same specification series such as the Sumitomo 7XXX series, the amiable Sedi 9XXX series and the like are selected, and the series of plastic packaging materials are environment-friendly plastic packaging materials with high reliability, low stress, low warpage and low water absorption.
In detail, as shown in fig. 5 to 6, the plastic package body 5 obtained by plastic molding completely covers the MOSFET chip 2, the capacitor 3, the IC chip 4, and the electrically connected connecting portions so as to perform sealing protection, only a portion of the first frame 11 and a portion of the second frame 12 are exposed, and the plastic package body 5 covers only a portion of the front surface of the first frame 11 and a portion of the front surface of the second frame 12, and the back surface of the first frame 11 and the back surface of the second frame 12 are also completely exposed so as to facilitate heat dissipation.
In more detail, as shown in fig. 2 or fig. 4, a plurality of alternately arranged concave portions and convex portions are arranged on a frame of the carrier region, so that the bonding force between the plastic package material (plastic package body 5) and the carrier region during subsequent plastic package is enhanced, and the sealing is strengthened.
In addition, in order to further enhance the bonding force during the subsequent plastic packaging, as shown in fig. 2 or fig. 4, a first glue locking hole T1 is arranged on the non-carrier region, and the first glue locking hole T1 is close to the first coining groove S1; as shown in fig. 2 to 4, a Z-shaped landing is provided on a side of the second frame 12 close to the carrier region, and a plurality of second glue locking holes T2 are provided on an inclined surface of the Z-shaped landing.
As shown in fig. 2, the first glue locking hole T1 includes an elliptical hole, and the second glue locking hole T2 includes a circular hole.
In an optional embodiment of the present invention, the first glue-locking hole T1 is an elliptical hole with a major axis of 1.5mm and a minor axis of 0.5mm, and the second glue-locking hole T2 is a circular hole with a diameter of 0.4 mm.
Thus, the packaging process of the single surface mount type photovoltaic bypass module is basically completed, the drain electrode and the source electrode of the MOSFET chip 2 are respectively led out through the exposed part (pin) of the first frame 11 and the exposed part (pin) of the second frame 12, and the surface mount type photovoltaic bypass module shown in the attached drawings 5-6 is obtained, the surface mount type photovoltaic bypass module is a surface mount device with the height of 1mm, the back heat dissipation area of the device is large, the main cooling path is from the exposed metal pad of the MOSFET chip 2 to the first frame 11, and the heat dissipation capacity after packaging is strong.
In order to distinguish the polarity of the packaged device, as shown in fig. 4-6, a semicircle is disposed on one end of the first frame 11, which is far away from the carrier region, of the non-carrier region, and the pin corresponding to the semicircle is the drain electrode of the MOSFET chip 2.
In an alternative embodiment of the present invention, the diameter of the semi-circle is 1.60 mm.
In addition, the complete packaging process of the patch type photovoltaic bypass module further comprises a screening process, a tinning process, a rib cutting process, a testing and printing process and packaging and shipping, and is not repeated herein.
In summary, in the package frame of the patch-type photovoltaic bypass module of the present invention, the package frame includes a plurality of frame units distributed in an array, each frame unit corresponds to the package of one patch-type photovoltaic bypass module, so that the package of a plurality of patch-type photovoltaic bypass modules can be realized simultaneously, the production package efficiency and the utilization rate of raw materials are effectively improved, and the production cost is reduced; the carrier area on the first frame is divided by the first coining groove and the second coining groove, and the first coining groove and the second coining groove can play roles in isolation and drainage, so that the mutual influence of subsequent subarea welding or glue dispensing can be effectively prevented, and the packaging reliability and yield of the photovoltaic module are improved; and the corresponding surface-mounted photovoltaic bypass module product is in a semi-encapsulated surface-mounted assembly, the back surface of the frame carrier is a main heat dissipation part, and the heat dissipation capacity after encapsulation is strong.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (10)
1. The packaging frame of the patch type photovoltaic bypass module is characterized by comprising a plurality of frame units distributed in an array manner, wherein each frame unit corresponds to the packaging of one patch type photovoltaic bypass module; the frame unit comprises a first frame and a second frame which are mutually independent, a first coining groove is formed in the first frame, the first coining groove divides the first frame into a carrier region and a non-carrier region, the carrier region comprises a first partition, a second partition, a third partition and a fourth partition which are mutually independent, a second coining groove is formed in the carrier region, the first partition is located on one side of the second coining groove, and the second partition, the third partition and the fourth partition are located on the other side of the second coining groove.
2. The packaging frame of the patch photovoltaic bypass module according to claim 1, wherein the packaging frame comprises 60 frame units distributed in a 3x20 matrix.
3. The package frame of the patch-type photovoltaic bypass module according to claim 1, wherein the package frame comprises a bare copper frame, the first partition, the second partition, and the third partition are roughened by bare copper, and the fourth partition is partially silvered.
4. The package frame of a patch photovoltaic bypass module according to claim 3, wherein the first frame and the second frame comprise: a sheet-like structure.
5. The frame for packaging a patch type photovoltaic bypass module according to claim 4, wherein a plurality of recesses and protrusions are alternately disposed on a border of the carrier region.
6. The package frame of the patch-type photovoltaic bypass module according to claim 5, wherein a first glue-locking hole is formed in the non-carrier region, and the first glue-locking hole is close to the first coining groove.
7. The package frame of the patch photovoltaic bypass module according to claim 6, wherein the first glue locking hole comprises an elliptical hole.
8. The packaging frame of the patch photovoltaic bypass module according to claim 6, wherein a semicircle is disposed on an end of the non-carrier region away from the carrier region on the first frame.
9. The package frame of the patch-type photovoltaic bypass module according to claim 8, wherein a Z-shaped step is formed on a side of the second frame close to the carrier region, and a plurality of second glue locking holes are formed on an inclined surface of the Z-shaped step.
10. The package frame of the patch photovoltaic bypass module according to claim 9, wherein the second glue locking hole comprises a circular hole.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202120489429.7U CN214203676U (en) | 2021-03-08 | 2021-03-08 | Packaging frame of patch type photovoltaic bypass module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202120489429.7U CN214203676U (en) | 2021-03-08 | 2021-03-08 | Packaging frame of patch type photovoltaic bypass module |
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| CN214203676U true CN214203676U (en) | 2021-09-14 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114005761A (en) * | 2021-10-29 | 2022-02-01 | 重庆平伟伏特集成电路封测应用产业研究院有限公司 | Packaging method of photovoltaic bypass module |
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2021
- 2021-03-08 CN CN202120489429.7U patent/CN214203676U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114005761A (en) * | 2021-10-29 | 2022-02-01 | 重庆平伟伏特集成电路封测应用产业研究院有限公司 | Packaging method of photovoltaic bypass module |
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