CN217768368U - SMD SO8J semiconductor chip's packaging structure - Google Patents

SMD SO8J semiconductor chip's packaging structure Download PDF

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Publication number
CN217768368U
CN217768368U CN202222001671.2U CN202222001671U CN217768368U CN 217768368 U CN217768368 U CN 217768368U CN 202222001671 U CN202222001671 U CN 202222001671U CN 217768368 U CN217768368 U CN 217768368U
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CN
China
Prior art keywords
semiconductor chip
metal
frame base
base island
lead frame
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Active
Application number
CN202222001671.2U
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Chinese (zh)
Inventor
李尚哲
李明芬
陈育峰
黄凯军
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Hefei Big Grid Technology Partnership LP
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Hefei Big Grid Technology Partnership LP
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Priority to CN202222001671.2U priority Critical patent/CN217768368U/en
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Publication of CN217768368U publication Critical patent/CN217768368U/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Lead Frames For Integrated Circuits (AREA)

Abstract

The utility model discloses a SMD SO8J semiconductor chip's packaging structure relates to semiconductor chip packaging technology field, including metal lead frame base island, semiconductor chip and plastic-sealed body, one side of semiconductor chip is connected with first metal pin through the metal bonding wire, and one side that first metal pin was kept away from to metal lead frame base island is connected with second metal pin, and one side that semiconductor chip was kept away from to metal lead frame base island is connected with the heating panel, and the parallel slot of a plurality of is evenly seted up to the one side that metal lead frame base island was kept away from to the heating panel. The utility model discloses a set up the heating panel and set up the slot, when being connected with printed circuit board, the tin cream can enter into the slot, has increased the area of contact of tin cream and heating panel, has increased the tin cream volume to further increase joint strength; the heat dissipation plate is in contact with the printed circuit board, so that heat of the semiconductor chip can be well conducted to the printed circuit board for heat dissipation, and the temperature of the semiconductor chip is reduced.

Description

SMD SO8J semiconductor chip's packaging structure
Technical Field
The utility model relates to a SMD SO8J semiconductor chip's packaging structure belongs to semiconductor chip packaging technology field.
Background
As shown in fig. 1, the conventional surface mount SO8 semiconductor chip employs gull-shaped metal pins, and the bottom of the gull-shaped metal pins protrudes outward, SO that the gull-shaped metal pins occupy a large area under the condition of limited space on the printed circuit board, which limits the sizes of the metal lead frame base island and the semiconductor chip, and thus leads to poor heat dissipation of the semiconductor chip.
How to improve the ratio of the metal lead frame base island in the packaging structure and improve the heat dissipation effect of the semiconductor chip becomes a technical problem which needs to be solved urgently.
SUMMERY OF THE UTILITY MODEL
The utility model provides a SMD SO8J semiconductor chip's packaging structure to solve among the above-mentioned prior art semiconductor chip's radiating effect poor, the many problem of metal pin area occupied.
In order to realize the purpose, the utility model discloses a technical scheme be:
the utility model provides a SMD SO8J semiconductor chip's packaging structure, including metal lead frame base island, semiconductor chip and plastic-sealed body, one side of semiconductor chip is connected with first metal pin through metal bonding wire/area, one side that first metal pin was kept away from to metal lead frame base island is connected with second metal pin, one side that semiconductor chip was kept away from to metal lead frame base island is connected with the heating panel, one side that metal lead frame base island was kept away from to the heating panel extends the plastic-sealed body and flushes with the bottom of first metal pin and second metal pin, the parallel slot of a plurality of is evenly seted up to the one side that metal lead frame base island was kept away from to the heating panel.
Preferably, the first metal pin comprises a first pin section I, a first pin section II and a first pin section III which are sequentially connected, the first pin section II is perpendicular to the first pin section I, the metal bonding wire is connected with the semiconductor chip and the first pin section I, the first pin section III is located on one side, close to the metal lead frame base island, of the first pin section II, and the first pin section III is perpendicular to the first pin section II.
Preferably, the second metal pin comprises a second pin section IV, a second pin section I, a second pin section II and a second pin section III which are sequentially connected, the second pin section II is perpendicular to the second pin section I, the metal lead frame base island is connected with the second pin section IV, the second pin section III is positioned on one side, close to the metal lead frame base island, of the second pin section II, and the second pin section III is perpendicular to the second pin section II.
Preferably, the semiconductor chip is fixed on the metal lead frame base island by solder paste or conductive paste.
Preferably, the projection of the heat radiating plate in the vertical direction is located within the projection range of the metal lead frame base island in the vertical direction.
Compared with the prior art, the beneficial effects of the utility model are that:
by arranging the heat dissipation plate and arranging the groove, when the heat dissipation plate is connected with the printed circuit board, the solder paste can enter the groove, so that the contact area of the solder paste and the heat dissipation plate is increased, the amount of the solder paste is increased, and the connection strength is further increased; the heat dissipation plate is contacted with the printed circuit board, so that the heat of the semiconductor chip can be well conducted to the printed circuit board for heat dissipation, and the semiconductor chip is cooled, so that the semiconductor chip with higher power can be mounted; because second pin section III and first pin section III all are one side towards metal lead frame base island, compare gull type metal pin, the utility model discloses a projected area of pin form in vertical side is littleer, therefore realized reducing metal pin's area of occupation, but improve metal lead frame base island and semiconductor chip's area of occupation's purpose, increase the size of metal lead frame base island and also can improve semiconductor chip's heat-sinking capability, reduce resistivity.
Drawings
Fig. 1 is a schematic view of a conventional chip-type SO8 semiconductor chip package structure;
FIG. 2 is a perspective view of the internal structure of the present invention;
FIG. 3 is a plan view of the internal structure of the present invention;
fig. 4 is a bottom perspective view of the overall structure of the present invention.
In the figure: 1. the package comprises a plastic package body, 11, gull-shaped metal pins, 12, first metal pins, 121, first pin sections I and 122, first pin sections II and 123, first pin sections III and 13, second metal pins, 131, second pin sections I and 132, second pin sections II and 133, second pin sections III and 134, second pin sections IV and 14, metal lead frame base islands, 141, heat dissipation plates, 142, grooves, 15, semiconductor chips, 16, bonding substances, 17 and metal bonding wires/belts.
Detailed Description
The technical solutions in the implementation of the present invention will be clear from the following description and accompanying drawings, and the described embodiments are only some embodiments, not all embodiments, of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
As shown in fig. 2 to 4, an embodiment of the present invention provides a chip-type SO8J semiconductor chip package structure, which includes a metal lead frame base island 14, a semiconductor chip 15, four first metal pins 12 and four second metal pins 13, and the semiconductor chip 15 and the metal lead frame base island 14 can be fixed by a bonding material 16 such as solder paste or conductive adhesive. The four first metal pins and the semiconductor chip 15 are connected through a metal bonding wire/tape 17, and the four second metal pins are connected to one end of the metal lead frame base island 14 away from the first metal pins 12. The side of the metal lead frame base island 14 away from the semiconductor chip 15 is connected with a heat sink 141, and the projection of the heat sink 141 in the vertical direction is located within the projection range of the metal lead frame base island 14 in the vertical direction.
In the present embodiment, when viewed from fig. 3, the distance between the left and right ends of the heat spreader 141 is smaller than the distance between the left and right ends of the metal lead frame base 14, and the left and right ends of the heat spreader 141 do not extend beyond the left and right ends of the metal lead frame base 14. This makes it possible to form a structure in which the metal lead frame base island 14 is large and the heat sink plate 141 is small. The metal lead frame base island 14 and the heat dissipation plate 141 are integrally formed, and the metal lead frame base island 14 is large in top and small in bottom in the whole view, so that the plastic packaging material can tightly hold the metal lead frame base island 14, and the probability of loosening between the metal lead frame base island 14 and the plastic packaging material is reduced.
The first metal pin 12 can be divided into three parts, namely a first pin section I121, a first pin section II 122 and a first pin section III 123 which are sequentially connected, wherein the first pin section I121 is connected with a metal bonding wire/belt 17, the first pin section I121 is parallel to the semiconductor chip 15, the first pin section II 122 is positioned at the lower side of the first pin section I121 and is perpendicular to the first pin section I121, and the first pin section III 123 is positioned at one side of the first pin section II 122, which is close to the metal lead frame base island 14, and is perpendicular to the first pin section II 122. As can be seen from fig. 3, the bottom of the first pin section iii 123 is flush with the bottom of the heat dissipation plate 141.
The second metal pin 13 can be divided into four parts, which are respectively a second pin section iv 134, a second pin section i 131, a second pin section ii 132 and a second pin section iii 133, which are sequentially connected, the second pin section iv 134 is connected with the metal lead frame base island 14, the second pin section i 131 is flush with the first pin section i 121, the second pin section ii 132 is located at the lower side of the second pin section i 131 and is perpendicular to the second pin section i 131, and the second pin section iii 133 is located at one side of the second pin section ii 132 close to the metal lead frame base island 14 and is perpendicular to the second pin section ii 132. As can also be seen from fig. 3, the bottom of the second pin section iii 133 is flush with the bottom of the heat sink plate 141. Because second pin section III 133 and first pin section III 123 all are towards one side of metal lead frame foundation island 14, compare gull-shaped metal pin 11, the utility model discloses a projection area of pin form in vertical side is littleer, therefore has realized reducing metal pin's area occupied.
As shown in fig. 4, all of the metal lead frame base island 14, the semiconductor chip 15, the metal bonding wire/tape 17, and the second lead section iv 134 and a part of the first lead section i 121 and the second lead section i 131 are encapsulated by a plastic encapsulation process to form a plastic encapsulated body 1, one end of the heat dissipation plate 141 away from the metal lead frame base island 14 extends out of the plastic encapsulated body 1 and is provided with 9 grooves 142, the grooves 142 are uniformly spaced and parallel, and the cross section of the groove 142 is V-shaped. The end face of the heat dissipation plate 141 extending out of the plastic package body 1 is flush with the bottom face of the first pin section iii 123.
When connected to the printed wiring board, the solder paste can enter the groove 142, increasing the contact area of the solder paste with the heat dissipation plate 141, increasing the amount of the solder paste, and further increasing the connection strength. Since the heat radiating plate 141 is in contact with the printed wiring board, the heat of the semiconductor chip 15 can be well conducted to the printed wiring board for heat radiation, and the temperature of the semiconductor chip 15 is lowered, so that the semiconductor chip 15 of higher power can be mounted.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the embodiments may be appropriately combined to form other embodiments understood by those skilled in the art.

Claims (5)

1. The utility model provides a SMD SO8J semiconductor chip's packaging structure, includes metal lead frame base island (14), semiconductor chip (15) and plastic-sealed body (1), its characterized in that, one side of semiconductor chip (15) is connected with first metal pin (12) through metal bonding wire/area (17), one side that first metal pin (12) were kept away from in metal lead frame base island (14) is connected with second metal pin (13), one side that semiconductor chip (15) were kept away from in metal lead frame base island (14) is connected with heating panel (141), one side that metal lead frame base island (14) were kept away from in heating panel (141) extends plastic-sealed body (1) and flushes with the bottom of first metal pin (12) and second metal pin (13), the one side that metal lead frame base island (14) were kept away from in heating panel (141) is evenly seted up the parallel slot (142) of a plurality of.
2. The package structure of the chip-on-SO 8J semiconductor chip according to claim 1, wherein the first metal lead (12) includes a first lead section I (121), a first lead section II (122) and a first lead section III (123) which are sequentially connected, the first lead section II (122) is perpendicular to the first lead section I (121), the metal bonding wire/tape (17) connects the semiconductor chip (15) and the first lead section I (121), the first lead section III (123) is located on one side of the first lead section II (122) close to the metal lead frame base island (14), and the first lead section III (123) is perpendicular to the first lead section II (122).
3. The package structure of the chip-type SO8J semiconductor chip according to claim 1, wherein the second metal lead (13) includes a second lead section iv (134), a second lead section i (131), a second lead section ii (132), and a second lead section iii (133) connected in sequence, the second lead section ii (132) is perpendicular to the second lead section i (131), the metal lead frame base island (14) is connected to the second lead section iv (134), the second lead section iii (133) is located on a side of the second lead section ii (132) close to the metal lead frame base island (14), and the second lead section iii (133) is perpendicular to the second lead section ii (132).
4. The packaging structure of the patch type SO8J semiconductor chip as claimed in claim 1, wherein the semiconductor chip (15) is fixed on the metal lead frame base island (14) by solder paste or conductive adhesive.
5. The package structure of the patch type SO8J semiconductor chip according to claim 1, wherein a projection of the heat spreader (141) in a vertical direction is located within a projection range of the metal lead frame base island (14) in the vertical direction.
CN202222001671.2U 2022-07-29 2022-07-29 SMD SO8J semiconductor chip's packaging structure Active CN217768368U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222001671.2U CN217768368U (en) 2022-07-29 2022-07-29 SMD SO8J semiconductor chip's packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222001671.2U CN217768368U (en) 2022-07-29 2022-07-29 SMD SO8J semiconductor chip's packaging structure

Publications (1)

Publication Number Publication Date
CN217768368U true CN217768368U (en) 2022-11-08

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CN (1) CN217768368U (en)

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