CN217822785U - A package structure of patch type TSSOP28 semiconductor chip - Google Patents

Abstract

The utility model discloses a packaging structure of a patch type TSSOP28 semiconductor chip, which comprises a base island of a metal lead frame, a semiconductor chip and a metal pin structure, and a plastic package body. A heat dissipation plate is arranged on the lower side of the base island of the metal lead frame. The bottom of the plastic package is formed with a relief groove, so that the lower part of the base island of the metal lead frame can protrude from the outside of the plastic package, and several bumps are arranged on the side of the base island of the metal lead frame; the metal pins of the utility model are inward Compared with the packaging structure of gull-wing metal pins, the bent J-shaped structure occupies a smaller area, thereby expanding the area of the plastic package on the original printed circuit board and improving the heat dissipation area of the semiconductor chip; the metal lead frame base There are also several bumps on the side of the island. The gap between adjacent bumps can accommodate metal solder paste, increasing the amount of metal solder paste and the connection area with metal solder paste. The chamfers on the corners of the bumps are convenient for climbing metal. tin, which in turn makes the connection stronger.

Description

A package structure of patch type TSSOP28 semiconductor chip

technical field

The utility model relates to the field of packaging structures of semiconductor chips, in particular to a packaging structure of a patch type TSSOP28 semiconductor chip.

Background technique

The structure of the early semiconductor chip package is based on the metal pin structure of the pin-shaped plug-in. Due to the relationship between the packaging structure of the pin-type metal pin and the spacing of the printed circuit board, the gap between the pin-type metal lead angle and the metal pin The distance is 100mils (2.54mm), which is not conducive to the increasing development of high-density, high-capacity semiconductor chip functions and high metal pin count;

Through the efforts of the semiconductor chip packaging industry, a SMD package structure (as shown in Figure 1) that is more in line with market and technological development has been developed. The SMD semiconductor chip package structure uses seagull wings (commonly known as "seagull wings"). Gull wing") type, compared with the metal pin spacing extended from the original pin-type semiconductor chip package, it is significantly reduced by 50%. The area used by the plastic package and the printed circuit board also increases the number of metal pins and Density, but it also caused the problem of smaller plastic package area, and because the smaller plastic package area limited the ability of the semiconductor chip to carry a larger area and higher capacity semiconductor chip size, it virtually reduced the size of many medium and large semiconductor chips. Compatibility and convenience, thus increasing the demand for plastic packages that carry larger semiconductor chips and higher capacity semiconductor chips, resulting in an invisible increase in manufacturing costs and printed circuit board area;

In addition, with the improvement of the function and processing speed requirements of electronic products, semiconductor chips, which are the core components of electronic products, need to have higher density electronic components and electronic circuits, so semiconductor chips will generate a larger amount of power during operation. Thermal energy, and the encapsulant covering the semiconductor chip is a poor heat transfer material with a thermal conductivity of only 0.8-1W/(m·K) (that is, the heat dissipation efficiency is not good), so if it cannot be effectively dissipated The heat will cause damage to the semiconductor chip. Therefore, it is necessary to improve the heat dissipation part of the chip packaging structure in the prior art.

Utility model content

The utility model provides a packaging structure of a patch type TSSOP28 semiconductor chip, which can at least solve one problem pointed out in the background technology.

A packaging structure of a patch type TSSOP28 semiconductor chip, comprising a metal lead frame base island and a semiconductor chip and a metal pin structure arranged on the metal lead frame base island, and also including wrapping around the metal lead frame base island, The semiconductor chip and the plastic package on the metal pin structure, the bottom of the plastic package is formed with a relief groove, so that the lower part of the base island of the metal lead frame can protrude out of the plastic package, and the metal Several projections are arranged on the side surface of the base island of the lead frame protruding from the plastic package.

Preferably, the top edge of the protrusion is provided with a chamfer.

Preferably, the metal pin structure includes a first metal pin and a second metal pin, the first metal pin is connected to one side of the base island of the metal lead frame through a bonding wire, and the second metal pin The pins are connected to the other side of the metal leadframe base island.

Preferably, the semiconductor chip is disposed on the base island of the metal lead frame through an adhesive material.

Preferably, both the first metal pin and the second metal pin are inwardly bent in a J-shaped structure.

Preferably, the plastic encapsulation body is provided with relief slots for respectively giving way to the first metal pin and the second metal pin.

Compared with the prior art, the beneficial effect of the utility model is that the first metal pin and the second metal pin of the utility model are both inwardly bent J-shaped structures, compared with the packaging structure of the prior art Gull-wing metal pins occupy a smaller area, thereby expanding the area of the plastic package on the original printed circuit board, so that the metal lead frame base island carrying a larger semiconductor chip can be placed in the enlarged plastic package , increase the heat dissipation area of the semiconductor chip and reduce more resistivity;

The lower part of the base island of the metal lead frame protrudes out of the plastic package, and the base island of the metal lead frame can be welded on the printed circuit board at the same time during welding, so that the semiconductor chip can be dissipated by the heat dissipation element on the printed circuit board to improve heat dissipation As a result, there are several bumps on the side of the base island of the metal lead frame extending out of the plastic package, and the gaps between adjacent bumps can accommodate metal solder paste, increasing the amount of metal solder paste and the connection area with metal solder paste, The chamfers on the corners of the bumps facilitate the climbing of the metal tin, thereby making the connection stronger. The bumps also effectively increase the surface area of the base island of the metal lead frame to further improve the heat dissipation effect.

Description of drawings

FIG. 1 is a structural schematic diagram of a packaging structure in the prior art;

Fig. 2 is the structural representation of the package structure of the present utility model;

3 is a schematic diagram of the internal structure of the packaging structure of the present invention;

Fig. 4 is a schematic diagram of the bottom structure of the packaging structure of the present invention;

FIG. 5 is an enlarged view of part A of FIG. 4 .

Explanation of reference signs:

1-base island of metal lead frame, 2-semiconductor chip, 3-plastic package, 4-bonding wire, 5-bump, 6-first metal pin, 7-second metal pin.

Detailed ways

A specific embodiment of the present invention will be described in detail below in conjunction with the accompanying drawings, but it should be understood that the protection scope of the present invention is not limited by the specific embodiment.

Embodiment one

As shown in Figures 1 to 3, a package structure of a patch type TSSOP28 semiconductor chip provided by the embodiment of the present invention includes a metal lead frame base island 1 and a semiconductor chip arranged on the metal lead frame base island 1 2 and the metal lead structure, which also includes a plastic package 3 wrapped on the metal lead frame base island 1, the semiconductor chip 2 and the metal lead structure, and the bottom of the plastic package 3 is formed with a relief groove , so that the lower part of the metal lead frame base island 1 can protrude out of the plastic package 3;

The metal pin structure includes a first metal pin 6 and a second metal pin 7, the first metal pin 6 is connected to one side of the metal lead frame base island 1 through a bonding wire 4, and the second The metal pin 7 is connected to the other side of the metal lead frame base island 1;

The semiconductor chip 2 is arranged on the base island 1 of the metal lead frame through an adhesive material;

The sections of the first metal pin 6 and the second metal pin 7 exposed from the plastic package 3 are the same, both of which are inwardly bent in a J-shaped structure; the bent lower part is partially upturned, so that it can be used later with When the printed circuit board is connected, it is convenient to climb the metal tin, which is convenient for the metal pin to be closely connected with the printed circuit board;

Because the form of the metal pin structure is changed, the metal pin structure is bent towards the plastic package body 3, and when connected to the printed circuit board, the size (the dimension in the width direction) of the metal lead frame base island 1 can be increased. The increase in the size of the base island 1 of the lead frame can make the size of the semiconductor chip 2 fixed on it larger, and the volume of the base island 1 of the metal lead frame can be increased, which can enhance the effect of heat conduction and heat dissipation;

Alternatively, after adopting a package structure with the same overall size, the required area of the printed circuit board is smaller. As early as the printed circuit board of the same size, more semiconductor chips can be installed, so that the space of the printed circuit board can be effectively used;

At the same time, a certain angle is formed between the bending part and the two sides connected to the printed circuit board. During the process of connecting the printed circuit board with the metal solder paste, the metal solder paste will form a phenomenon of climbing metal tin due to cohesion, making the metal tin The connection between the paste and the metal pin structure is tighter;

In order to accommodate the metal pin structure, the plastic package body 3 is provided with relief slots for respectively giving way to the first metal pin 6 and the second metal pin 7 .

Embodiment two

On the basis of the embodiment, as shown in Fig. 4-Fig. 5, several bumps 5 are arranged on the side of the metal lead frame base island 1 protruding from the plastic package 3, and the several bumps 5 are arranged in a matrix. , the top edge of the bump 5 is provided with a chamfer;

During welding, the base island 1 of the metal lead frame can also be welded on the printed circuit board at the same time, so that the semiconductor chip 2 can be dissipated by heat dissipation elements on the printed circuit board;

Several bumps 5 are arranged on the base island 1 of the metal lead frame, and the gaps between adjacent bumps 5 form heat dissipation air ducts, thereby improving the heat dissipation effect, and the gaps between adjacent bumps 5 can also accommodate metal tin paste, increase the amount of metal solder paste and the connection area with the metal solder paste, and the chamfering of the top edge of the bump 5 is convenient for climbing the metal tin, thereby making the connection stronger.

It is obvious to those skilled in the art that the present invention is not limited to the details of the above-mentioned exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit and essential features of the present invention. Therefore, no matter from all points of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, so it is intended to fall within the scope of the claims All changes within the meaning and range of equivalents of the required elements are included in the present invention. Any reference sign in a claim should not be construed as limiting the claim concerned.

In addition, it should be understood that although this specification is described according to implementation modes, not each implementation mode only includes an independent technical solution, and this description in the specification is only for clarity, and those skilled in the art should take the specification as a whole, The technical solutions in the various embodiments can also be properly combined to form other implementations that can be understood by those skilled in the art.

Claims (6)

1. a packaging structure of a patch type TSSOP28 semiconductor chip, comprising a metal lead frame base island and a semiconductor chip and a metal pin structure arranged on the metal lead frame base island, it is characterized in that, also includes wrapping in the described metal lead frame base island The metal lead frame base island, the semiconductor chip and the plastic package on the metal pin structure, the bottom of the plastic package is formed with a relief groove, so that the lower part of the metal lead frame base island can protrude from the Outside the plastic package, several protrusions are arranged on the side of the base island of the metal lead frame protruding from the plastic package. 2. The packaging structure of a patch type TSSOP28 semiconductor chip as claimed in claim 1, wherein the top edge of the bump is provided with a chamfer. 3. the packing structure of a kind of patch type TSSOP28 semiconductor chip as claimed in claim 1, is characterized in that, described metal pin structure comprises first metal pin and second metal pin, and described first metal pin The legs are connected to one side of the base island of the metal lead frame through bonding wires, and the second metal pins are connected to the other side of the base island of the metal lead frame. 4. The packaging structure of a chip type TSSOP28 semiconductor chip as claimed in claim 1, wherein the semiconductor chip is arranged on the base island of the metal lead frame through an adhesive material. 5. The packaging structure of a chip type TSSOP28 semiconductor chip as claimed in claim 3, wherein the first metal pin and the second metal pin are both inwardly bent J-shaped structures . 6. The packing structure of a kind of patch type TSSOP28 semiconductor chip as claimed in claim 3, is characterized in that, on the described plastic encapsulation body, be provided with for giving way to the first metal pin and the second metal pin respectively the give way slot.

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