CN217822785U - Packaging structure of SMD TSSOP28 semiconductor chip - Google Patents

Abstract

The utility model discloses a chip type TSSOP28 semiconductor chip packaging structure, which comprises a metal lead frame base island, a semiconductor chip and a metal pin structure, and further comprises a plastic package body, wherein a heat dissipation plate is arranged at the lower side of the metal lead frame base island, a abdicating groove is formed at the bottom of the plastic package body, so that the lower part of the metal lead frame base island can extend out of the plastic package body, and a plurality of convex blocks are arranged on the side surface of the metal lead frame base island; the metal pins of the utility model are of the inward bending J-shaped structure, and occupy smaller area compared with the packaging structure of the gull-wing type metal pins, thereby enlarging the area of the plastic packaging body on the original printed circuit board and improving the heat dissipation area of the semiconductor chip; still be equipped with a plurality of lug on the side of metal lead frame base island, clearance between the adjacent lug can hold metallic tin cream, increase metallic tin cream volume and with the area of being connected of metallic tin cream, metallic tin is conveniently climbed to the chamfer on the lug edges and corners, and then makes the intensity of connecting higher.

Description

Packaging structure of SMD TSSOP28 semiconductor chip

Technical Field

The utility model relates to a semiconductor chip packaging structure field, in particular to SMD TSSOP28 semiconductor chip's packaging structure.

Background

The early semiconductor chip package structure is in a metal pin structure mode of a pin-shaped plug-in, and because of the relation between the package structure of the pin-shaped metal pin and the punching pitch of the printed circuit board, the distance between the metal lead angle of the pin-shaped metal pin and the metal pin is 100mils (2.54 mm), which is not beneficial to the increasingly developed high-density and high-capacity semiconductor chip function and high metal lead number;

through the efforts in the semiconductor chip packaging industry, a chip-on-chip packaging structure (as shown in fig. 1) which is relatively in line with the market and technical development at present is developed, and the chip-on-chip semiconductor chip packaging body structure adopts a gull wing (commonly called as a gull wing) type, compared with the metal pin interval extended out of the original pin-type semiconductor chip packaging body, the space between the plastic packaging body and a printed circuit board is obviously reduced by 50%, the used area of the plastic packaging body and the printed circuit board is also increased, but the problem of the reduction of the area of the plastic packaging body is also caused, the capacity of the semiconductor chip for bearing the size of a larger area and a higher capacity is limited due to the reduction of the area of the plastic packaging body, the compatibility and the convenience of a plurality of medium and large semiconductor chips are reduced invisibly, the requirement of the plastic body for bearing the larger semiconductor chip and the higher capacity semiconductor chip is increased, and as a result, the cost is increased invisibly in the manufacturing cost and the area of the printed circuit board;

in addition, as the demand of electronic products for function and processing speed increases, the semiconductor chip as the core component of the electronic product needs to have higher density electronic components and electronic circuits, so the semiconductor chip will generate a larger amount of heat energy during operation, and the encapsulant covering the semiconductor chip is a poor heat transfer material with a thermal conductivity of only 0.8-1W/(m · K) (i.e. the dissipation efficiency of heat is not good), so that if the generated heat cannot be dissipated effectively, the semiconductor chip will be damaged, and therefore, the improvement on the heat dissipation part of the chip type package structure in the prior art is also needed.

SUMMERY OF THE UTILITY MODEL

The utility model provides a SMD TSSOP28 semiconductor chip's packaging structure can solve a problem that points out in the background art at least.

The utility model provides a SMD TSSOP28 semiconductor chip's packaging structure, include metal lead frame base island and set up in semiconductor chip and metal pin structure on the metal lead frame base island still include the parcel metal lead frame base island semiconductor chip and the structural plastic-sealed body of metal pin, the bottom of plastic-sealed body is formed with the groove of stepping down, so that the lower part of metal lead frame base island can stretch out outside the plastic-sealed body, metal lead frame base island is provided with a plurality of lug on stretching out the outer side of plastic-sealed body.

Preferably, the top edge of the bump is provided with a chamfer.

Preferably, the metal pin structure includes a first metal pin and a second metal pin, the first metal pin is connected to one side of the metal lead frame base island through a bonding wire, and the second metal pin is connected to the other side of the metal lead frame base island.

Preferably, the semiconductor chip is arranged on the metal lead frame base island through bonding materials.

Preferably, the first metal pin and the second metal pin are both of an inward-bent J-shaped structure.

Preferably, the plastic package body is provided with yielding grooves for respectively yielding the first metal pins and the second metal pins.

Compared with the prior art, the beneficial effects of the utility model are that: the first metal pin and the second metal pin of the utility model are both of the inward bending J-shaped structure, and have smaller occupied area compared with the gull wing type metal pin of the packaging structure in the prior art, so that the area of the plastic package body is enlarged on the original printed circuit board, and thus, a metal lead frame base island bearing a semiconductor chip with a larger area can be placed in the enlarged plastic package body, the heat dissipation area of the semiconductor chip is increased, and more resistivity is reduced;

the lower part of the metal lead frame base island extends out of the plastic package body, the metal lead frame base island can be welded on the printed circuit board simultaneously when welding, so that a semiconductor chip can be cooled by means of a heat dissipation element on the printed circuit board, the heat dissipation effect is improved, a plurality of bumps are further arranged on the side surface of the metal lead frame base island extending out of the plastic package body, a gap between every two adjacent bumps can accommodate metal tin paste, the amount of the metal tin paste is increased, the connection area of the metal tin paste and the metal tin paste is increased, metal tin is conveniently climbed by chamfering on bump edges and corners, the connection strength is higher, the bumps also effectively increase the surface area of the metal lead frame base island, and the heat dissipation effect is further improved.

Drawings

FIG. 1 is a schematic diagram of a package structure in the prior art;

fig. 2 is a schematic structural diagram of the package structure of the present invention;

fig. 3 is a schematic view of the internal structure of the package structure of the present invention;

fig. 4 is a schematic bottom structure diagram of the package structure of the present invention;

fig. 5 is an enlarged view of a portion a of fig. 4.

Description of the reference numerals:

the chip comprises 1-a metal lead frame base island, 2-a semiconductor chip, 3-a plastic package body, 4-a bonding wire, 5-a bump, 6-a first metal pin and 7-a second metal pin.

Detailed Description

In the following, an embodiment of the present invention is described in detail with reference to the drawings, but it should be understood that the scope of the present invention is not limited by the embodiment.

Example one

As shown in fig. 1 to fig. 3, an embodiment of the present invention provides a chip-type TSSOP28 semiconductor chip package structure, which includes a metal lead frame base island 1, a semiconductor chip 2 and a metal pin structure disposed on the metal lead frame base island 1, and a plastic package body 3 wrapped on the metal lead frame base island 1, the semiconductor chip 2 and the metal pin structure, wherein a yielding groove is formed at the bottom of the plastic package body 3, so that the lower portion of the metal lead frame base island 1 can extend out of the plastic package body 3;

the metal pin structure comprises a first metal pin 6 and a second metal pin 7, wherein the first metal pin 6 is connected with one side of the metal lead frame base island 1 through a bonding wire 4, and the second metal pin 7 is connected with the other side of the metal lead frame base island 1;

the semiconductor chip 2 is arranged on the metal lead frame base island 1 through bonding materials;

the sections of the parts of the first metal pin 6 and the second metal pin 7 exposed out of the plastic package body 3 are the same and are both of inward-bent J-shaped structures; the bent lower part is partially raised, so that metal tin can be conveniently climbed when the metal tin is connected with a printed circuit board in the subsequent process, and the metal pins can be conveniently and tightly connected with the printed circuit board;

because the form of the metal pin structure is changed, the metal pin structure is bent towards the plastic package body 3, when the metal pin structure is connected with a printed circuit board, the size (the size in the width direction) of the metal lead frame base island 1 can be increased, the size of the semiconductor chip 2 fixed on the metal lead frame base island 1 can be larger due to the increase of the size of the metal lead frame base island 1, and the heat conduction and heat dissipation effects can be enhanced;

alternatively, the area of the printed circuit board required is smaller after the package structure with the same overall size is adopted. More semiconductor chips can be mounted on the printed circuit board with the same size, so that the space of the printed circuit board is effectively utilized;

meanwhile, a certain included angle is formed between the bent part and two sides connected with the printed circuit board, and in the process of connecting the metal tin paste with the printed circuit board, the metal tin paste can form a metal tin climbing phenomenon due to cohesion, so that the metal tin paste is more tightly connected with the metal pin structure;

in order to accommodate the metal pin structure, the plastic package body 3 is provided with a yielding groove for respectively yielding the first metal pin 6 and the second metal pin 7.

Example two

On the basis of the embodiment, as shown in fig. 4-5, a plurality of bumps 5 are arranged on the side surface of the metal lead frame base island 1 extending out of the plastic package body 3, the plurality of bumps 5 are arranged in a matrix, and the top edge of each bump 5 is provided with a chamfer;

the metal lead frame base island 1 can be welded on the printed circuit board at the same time during welding, so that the semiconductor chip 2 can be radiated by a radiating element on the printed circuit board;

be provided with a plurality of lug 5 on the metal lead frame basement 1, the space between the adjacent lug 5 forms the heat dissipation wind channel to improve the radiating effect, the metal tin cream can also be held in the space between the adjacent lug 5, increase metal tin cream volume and with the area of being connected of metal tin cream, the metal tin is conveniently climbed to the chamfer of 5 top edges of lug, and then makes the intensity of connection higher.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that the invention can be implemented in other specific forms without departing from the spirit and essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the specification describes embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and it will be understood by those skilled in the art that the specification as a whole and the embodiments may be combined as appropriate to form other embodiments as would be understood by those skilled in the art.

Claims (6)

1. The utility model provides a SMD TSSOP28 semiconductor chip's packaging structure, include metal lead frame base island and set up in semiconductor chip and metal pin structure on the metal lead frame base island, its characterized in that still includes the parcel metal lead frame base island semiconductor chip and the structural plastic-sealed body of metal pin, the bottom of plastic-sealed body is formed with the groove of stepping down, so that the lower part of metal lead frame base island can stretch out outside the plastic-sealed body, be provided with a plurality of lug on the side that the metal lead frame base island stretches out outside the plastic-sealed body.

2. The package structure of a patch-type TSSOP28 semiconductor chip as claimed in claim 1, wherein a top edge of the bump is provided with a chamfer.

3. The package structure of a bonded TSSOP28 semiconductor chip as recited in claim 1, wherein said metal lead structure comprises a first metal lead and a second metal lead, said first metal lead is connected to one side of said base island of said metal lead frame via a bonding wire, and said second metal lead is connected to another side of said base island of said metal lead frame.

4. The package structure of a patch-type TSSOP28 semiconductor chip of claim 1, wherein the semiconductor chip is disposed on the metal lead frame base island by an adhesive material.

5. The package structure of a chip TSSOP28 semiconductor chip as claimed in claim 3, wherein the first metal lead and the second metal lead are both of an inward bent J-shaped structure.

6. The package structure of a chip-type TSSOP28 semiconductor chip of claim 3, wherein the molding compound has a recess for respectively providing a recess for the first metal lead and the second metal lead.

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