CN217983335U - Packaging structure of SMD TDSO14 semiconductor chip - Google Patents
Packaging structure of SMD TDSO14 semiconductor chip Download PDFInfo
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- CN217983335U CN217983335U CN202222412257.0U CN202222412257U CN217983335U CN 217983335 U CN217983335 U CN 217983335U CN 202222412257 U CN202222412257 U CN 202222412257U CN 217983335 U CN217983335 U CN 217983335U
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Abstract
The utility model discloses a packaging structure of SMD TDSO14 semiconductor chip, including metal lead frame basement, semiconductor chip, metal pin structure and plastic-sealed body, the bottom of metal lead frame basement stretches out outside the plastic-sealed body and is provided with a plurality of bumps, forms metallic tin cream groove between two adjacent bumps, the bump is the rotator that the cross-section is semiellipse; the utility model discloses a gull wing formula metal pin among the prior art of metal pin structure, the space that occupies is littleer, can enlarge the volume of plastic-sealed body on original circuit board, thereby can place the metal lead frame base island of bigger area in the plastic-sealed body, bear the semiconductor chip of bigger area, it is compatible to improve semiconductor chip, form metallic tin cream groove between two adjacent bumps of the bottom of metal lead frame base island, can hold metallic tin cream, thereby improve the joint strength between semiconductor packaging structure and the printed circuit board, also effectively improve the radiating effect.
Description
Technical Field
The utility model relates to a semiconductor packaging structure field, in particular to SMD TDSO14 semiconductor chip's packaging structure.
Background
TDSO14 is a common package form, which generally adopts a gull-leg package (as shown in fig. 6), and after the package is completed, it generally needs to be mounted on a substrate such as a PCB for subsequent utilization, the TDSO14 package body extends out of the metal pins in the form of "gull-wing", but also causes a reduction in the area of the plastic package body, and the size capability of the semiconductor chip capable of bearing a larger area and a higher capacity is limited due to the reduction in the area of the plastic package body, thus virtually reducing the compatibility and inconvenience of many medium and large semiconductor chips, and further increasing the package body required to bear a larger semiconductor chip and a higher capacity semiconductor chip, and as a result, the manufacturing cost and the area of the PCB are increased invisibly, and therefore, a new package structure of the surface mount type TDSO14 semiconductor chip needs to be designed to solve the above problems of the metal pins in the form of "gull-wing".
SUMMERY OF THE UTILITY MODEL
The utility model provides a SMD TDSO14 semiconductor chip's packaging structure can solve the problem that points out among the background art.
A packaging structure of a surface mount TDSO14 semiconductor chip comprises a metal lead frame base island, a semiconductor chip, a metal pin structure and a plastic package body wrapped outside the metal lead frame base island, the semiconductor chip and the metal pin structure, wherein the bottom of the metal lead frame base island extends out of the plastic package body and is provided with a plurality of salient points, and a metal tin paste groove is formed between every two adjacent salient points;
the salient points are semi-ellipsoids.
Preferably, the metal pin structure comprises a first metal pin and a second metal pin which are respectively positioned at two sides of the metal lead frame base island;
the first metal pin comprises a horizontal part, a hook-shaped part and a connecting part connected with the metal lead frame base island;
the second metal pin comprises a horizontal part, a hook-shaped part and a metal bonding wire/wire connected with the metal lead frame base island;
the bottom of the hook-shaped part is provided with an arc-shaped chamfer.
Preferably, a notch groove for giving way to the metal pin structure is formed on the plastic package body.
Preferably, a through groove is formed at the bottom of the plastic package body, so that the bottom of the metal lead frame base island extends out of the plastic package body.
Compared with the prior art, the beneficial effects of the utility model are that: compared with gull wing type metal pins in the prior art, the structure of the first metal pin and the second metal pin occupies smaller space, can enlarge the volume of the plastic package body on the original circuit board, so that a larger-area metal lead frame base island can be placed in the plastic package body, bear a larger-area semiconductor chip, improve the compatibility of the semiconductor chip, or can be provided with more packaging structures on the same circuit board, or can be smaller in the area of the used circuit board under the condition that the number of the packaging structures is the same, and the cost is saved;
the bottom of the metal lead frame base island is also provided with a plurality of salient points, a metal tin paste groove is formed between every two adjacent salient points, and metal tin paste can be contained, so that the connection strength between the semiconductor packaging structure and the printed circuit board is improved, and the heat dissipation effect is also effectively improved.
Drawings
Fig. 1 is a schematic structural diagram I of the present invention;
fig. 2 is a schematic structural diagram II of the present invention;
fig. 3 is a schematic diagram I of the internal structure of the present invention;
fig. 4 is a schematic diagram II of the internal structure of the present invention;
fig. 5 is a schematic structural view of a metal pin according to the present invention;
fig. 6 is a comparison diagram of the semiconductor chip package structure of the present invention and the conventional semiconductor chip package structure.
Description of reference numerals:
1-metal lead frame base island, 2-semiconductor chip, 3-plastic package body, 4-salient point, 5-metal tin paste groove, 6-first metal pin, 7-second metal pin, 8-gap groove, 11-horizontal part, 12-hook part and 13-connecting part.
Detailed Description
In the following, an embodiment of the present invention will be described in detail with reference to the drawings, but it should be understood that the scope of the present invention is not limited by the embodiment.
As shown in fig. 1-6, an embodiment of the present invention provides a packaging structure of a surface mount TDSO14 semiconductor chip, including a metal lead frame base island 1, a semiconductor chip 2 and a metal pin structure which are disposed on the metal lead frame base island 1, and a plastic package body 3 which is wrapped outside the metal lead frame base island 1, the semiconductor chip 2 and the metal pin structure, wherein the bottom of the metal lead frame base island 1 extends out of the plastic package body 3 and is provided with a plurality of bumps 4, and a metal tin paste groove 5 is formed between two adjacent bumps 4; as shown in fig. 2, the bumps 4 are semi-ellipsoidal; in the process of connecting the Printed Circuit Board (PCB) through the metal tin paste, the end part of the salient point 4 is in an arc shape, and the metal tin paste is easier to climb tin, so that the connection strength is improved;
the semiconductor chip 2 is bonded on the metal lead frame base island 1 through metal tin paste or conductive adhesive;
the metal pin structure comprises a first metal pin 6 and a second metal pin 7 which are respectively positioned at two sides of the metal lead frame base island 1;
the first metal lead 6 comprises a horizontal part 11, a hook part 12 and a connecting part 13 connected with the metal lead frame base island 1, wherein the connecting part 13 is inclined;
the second metal lead 7 comprises a horizontal part 11, a hook part 12 and a metal bonding wire/wire connected with the metal lead frame base island 1;
the hook-shaped parts of the first metal pin 6 and the second metal pin 7 face the metal lead frame base island 1, namely, the hook-shaped parts are both of an inward bending structure; the bottom of the hook-shaped part 12 is provided with an arc-shaped chamfer which is also convenient for tin climbing of the metal tin paste, so that the connection between the metal tin paste and the metal pin structure is tighter;
in order to accommodate the metal pin structure, a notch groove 8 for giving way to the metal pin structure is formed on the plastic package body 3; a through groove is formed at the bottom of the plastic package body 3, so that the bottom of the metal lead frame base island 1 extends out of the plastic package body 3.
As shown in fig. 6, the width of the plastic package body 3 of the semiconductor chip package structure using the metal lead structure of the present application is 5.37mm, the width of the metal lead frame base island 1 is 4.52mm, and the width of the semiconductor chip 2 is 4.22mm, whereas the width of the plastic package body 3 of the semiconductor chip package structure using the gull-wing type metal lead structure of the prior art is 3.9mm, the width of the metal lead frame base island 1 is 3.05mm, and the width of the semiconductor chip 2 is 2.75mm, so that the area of the metal lead frame base island 1 of the present application is 48.2% larger than that of the metal lead frame base island 1 of the prior art semiconductor package structure under the condition that the package structure has the same size, and therefore the metal lead frame base island 1 of the present application can bear the semiconductor chip 2 with a larger area and a higher capacity, and the heat dissipation effect can be further improved under the condition that the area is larger;
in addition, under the condition that the semiconductor chips 2 with the same area are used, the size of the packaging structure of the patch type TDSO14 semiconductor chip adopting the metal pin structure is smaller than that of the patch type TDSO14 semiconductor chip in the prior art, so that more semiconductor chips 2 can be mounted on the same PCB, or the area of the PCB required under the condition that the number of the packaging structures is the same is smaller, and the cost is saved more.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the embodiments may be appropriately combined to form other embodiments understood by those skilled in the art.
Claims (4)
1. A packaging structure of a surface mount TDSO14 semiconductor chip comprises a metal lead frame base island, a semiconductor chip, a metal pin structure and a plastic package body wrapped outside the metal lead frame base island, the semiconductor chip and the metal pin structure, and is characterized in that the bottom of the metal lead frame base island extends out of the plastic package body and is provided with a plurality of salient points, and a metal tin paste groove is formed between every two adjacent salient points;
the salient points are semi-ellipsoids.
2. The package structure of the bonded TDSO14 semiconductor chip according to claim 1, wherein the metal lead structure comprises a first metal lead and a second metal lead respectively located at two sides of the metal lead frame base island;
the first metal pin comprises a horizontal part, a hook-shaped part and a connecting part connected with the metal lead frame base island;
the second metal pin comprises a horizontal part, a hook part and a metal bonding wire/wire connected with the metal lead frame base island;
the bottom of the hook-shaped part is provided with an arc-shaped chamfer.
3. The package structure of the bonded TDSO14 semiconductor chip according to claim 1, wherein a notch is formed in the plastic package body for giving way to the metal lead structure.
4. The package structure of the bonded TDSO14 semiconductor chip according to claim 1, wherein a through-slot is formed at a bottom of the plastic package body, so that a bottom of the metal lead frame base island extends out of the plastic package body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222412257.0U CN217983335U (en) | 2022-09-09 | 2022-09-09 | Packaging structure of SMD TDSO14 semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222412257.0U CN217983335U (en) | 2022-09-09 | 2022-09-09 | Packaging structure of SMD TDSO14 semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217983335U true CN217983335U (en) | 2022-12-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222412257.0U Active CN217983335U (en) | 2022-09-09 | 2022-09-09 | Packaging structure of SMD TDSO14 semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217983335U (en) |
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2022
- 2022-09-09 CN CN202222412257.0U patent/CN217983335U/en active Active
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