CN221041148U - Multi-surface radiating photovoltaic module - Google Patents
Multi-surface radiating photovoltaic module Download PDFInfo
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- CN221041148U CN221041148U CN202322343753.XU CN202322343753U CN221041148U CN 221041148 U CN221041148 U CN 221041148U CN 202322343753 U CN202322343753 U CN 202322343753U CN 221041148 U CN221041148 U CN 221041148U
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- base island
- photovoltaic
- island
- fixed
- photovoltaic module
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 34
- 238000004806 packaging method and process Methods 0.000 claims abstract description 15
- 238000005538 encapsulation Methods 0.000 claims abstract description 7
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- 229910052802 copper Inorganic materials 0.000 claims description 27
- 239000010949 copper Substances 0.000 claims description 27
- 230000000694 effects Effects 0.000 abstract description 4
- 239000004020 conductor Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A multi-surface radiating photovoltaic module belongs to the technical field of conductor manufacturing. Including the frame, the frame includes two base islands, and crisscross formation is crisscross portion from top to bottom in two base islands, and photovoltaic chip (6) are located crisscross portion, and its top surface and bottom surface are fixed with the inner of two base islands respectively, and two base islands are left base island (2) and right base island (8) respectively, and encapsulation body (3) encapsulates crisscross portion and photovoltaic chip (6) in, and left base island (2) and right base island (8) form left base island heat dissipation area and right base island heat dissipation area respectively at the both ends of frame, its characterized in that: at least one surface of the staggered part of the fixed photovoltaic chip (6) is exposed on the surface of the packaging body (3) close to the surface. In the multi-face radiating photovoltaic module, at least one end face of the staggered part where the photovoltaic chip is located is exposed from the surface of the packaging body, and the staggered part is combined with the left island radiating area and the right island radiating area to form a multi-face radiating structure, so that the radiating effect of the photovoltaic module is improved.
Description
Technical Field
A multi-surface radiating photovoltaic module belongs to the technical field of photovoltaic modules.
Background
The structure of the conventional photovoltaic module is shown in fig. 7 to 8: comprising a frame and a photovoltaic chip 6 fixed on the surface of the frame. The frame comprises a left base island 2 and a right base island 8, the photovoltaic chip 6 is fixed at the inner edge of the right base island 8, one end of the copper strip 5 is fixed at the inner edge of the left base island 2 where the other end of the surface of the photovoltaic chip 6 extends, and the photovoltaic chip 6 is packaged inside the left base island 2 and the right base island 8 through the packaging body 3.
When the photovoltaic module is turned on in the forward direction, the photovoltaic chip 6 in the photovoltaic module generates a large amount of heat, the heat generated by the photovoltaic chip 6 is firstly transferred to four corners of the packaging body 3 (see a rectangular dotted line frame in fig. 7), and then is transferred to the left base island 2 and the right base island 8 outwards, and the two base island heat dissipation areas respectively formed by the left base island 2 and the right base island 8 dissipate heat.
Therefore, in the conventional photovoltaic module, the heat generated by the photovoltaic chip 6 can be transferred to the two island heat dissipation areas only through four narrow areas (four corners of the package body 3) on two sides of the hollowed-out hole 10, so that the heat transfer efficiency is low, and the whole heat dissipation effect of the photovoltaic module is further limited.
The utility model relates to Chinese patent with the application number 202223451710.5, the application date 2022, 12 months and 23 days and the patent name of 'a photovoltaic module with high heat dissipation', and discloses a technical scheme. In this application, outwards draw out the heat dissipation extension from the lateral part of base island, improved photovoltaic module heat transfer efficiency through the heat dissipation extension, nevertheless can greatly increased photovoltaic module's planar area and thickness when technical scheme is actually implemented, consequently design one kind can improve photovoltaic module heat transfer efficiency, can not increase planar area and thickness's technical scheme simultaneously, become the problem that the field is to be solved urgently.
Disclosure of Invention
The utility model aims to solve the technical problems that: the defect of the prior art is overcome, and at least one end face of the staggered part where the photovoltaic chip is located is exposed from the surface of the packaging body and combined with the left island heat dissipation area and the right island heat dissipation area to form a multi-surface heat dissipation structure.
The technical scheme adopted for solving the technical problems is as follows: this multiaspect radiating photovoltaic module, including the frame, the frame includes two base islands, and crisscross formation is crisscross portion from top to bottom in two base islands, and photovoltaic chip is located crisscross portion, and its top surface and bottom surface are fixed with the inner of two base islands respectively, and two base islands are left base island and right base island respectively, and the encapsulation body is in crisscross portion and photovoltaic chip encapsulation, and left base island and right base island form left base island heat dissipation area and right base island heat dissipation area respectively at the both ends of frame, its characterized in that: at least one surface of the staggered part for fixing the photovoltaic chip is exposed on the surface close to the packaging body.
Preferably, at the staggered part for fixing the photovoltaic chip, the surfaces of the inner ends of the two base islands are exposed from the top surface and the bottom surface of the package body respectively.
Preferably, the inner ends of the left base island and the right base island are respectively bent to form a left connecting part and a right connecting part, the photovoltaic chip is fixed on the surface of the right connecting part, and the left connecting part extends to the upper part of the photovoltaic chip to form a staggered part and is fixed with the top surface of the photovoltaic chip.
Preferably, the inner ends of the left base island and the right base island are respectively bent to form a left connecting part and a right connecting part, the photovoltaic chip is fixed on the surface of the right connecting part, a copper strip is fixed on the left connecting part, and the copper strip extends to the upper part of the photovoltaic chip to form a staggered part and is fixed with the top surface of the photovoltaic chip.
Preferably, the left base island and the right base island are both planes, the photovoltaic chip is fixed on the surface of the right connecting part, a copper strip is fixed on the left connecting part, extends to the upper part of the photovoltaic chip to form a staggered part, and is fixed with the top surface of the photovoltaic chip.
Preferably, the top surface of the copper tape is exposed from the top surface of the package, and the bottom surfaces of the left and right islands are respectively exposed from the bottom surface of the package.
Preferably, the upper and lower surfaces of the staggered part are flush with the top and bottom surfaces of the package body, respectively.
Compared with the prior art, the utility model has the following beneficial effects: in the multi-face heat dissipation photovoltaic module, at least one end face of the staggered part where the photovoltaic chip is located is exposed from the surface of the packaging body and is combined with the left island heat dissipation area and the right island heat dissipation area to form a multi-face heat dissipation structure. On the basis that radiating fins are led out from two ends of a traditional photovoltaic module to radiate, copper sheets wrapped below the module and above the module are leaked, so that the heat inside the module is increased by a radiating mode that the copper sheets exposed above and below are directly and rapidly exchanged with the outside, and the novel structure that the radiating fins are led out from two ends of the traditional photovoltaic module to radiate is realized. Compared with the traditional radiating mode of the photovoltaic module, the heat transfer efficiency of the photovoltaic module is greatly improved, and the radiating effect of the photovoltaic module is improved.
Drawings
Fig. 1 is a front view of embodiment 1 of a multi-sided heat dissipating photovoltaic module.
Fig. 2 is a top view of embodiment 1 of a multi-sided heat dissipating photovoltaic module.
Fig. 3 is a left side view of embodiment 2 of a multi-sided heat dissipating photovoltaic module.
Fig. 4 is a left side view of embodiment 3 of a multi-sided heat dissipating photovoltaic module.
Fig. 5 is a left side view of embodiment 4 of a multi-sided heat dissipating photovoltaic module.
Fig. 6 is a left side view of embodiment 5 of a multi-sided heat dissipating photovoltaic module.
Fig. 7 is a top view of a prior art photovoltaic module.
Fig. 8 is a left side view of fig. 7.
Wherein: 1. terminal 2, left base island 3, encapsulation body 4, left connecting portion 5, copper strips 6, photovoltaic chip 7, right connecting portion 8, right base island 9, tin storage tank 10, fretwork hole.
Detailed Description
Fig. 1-2 are diagrams illustrating preferred embodiments of the present utility model, and the present utility model is further described below with reference to fig. 1-6.
Example 1:
As shown in fig. 1-2, a multi-surface heat dissipation photovoltaic module (hereinafter referred to as photovoltaic module) comprises a frame, wherein the frame is composed of a left base island 2 and a right base island 8 which are arranged side by side, the inner edges of the left base island 2 are respectively bent downwards to form a left connecting portion 4, the inner edges of the right base island 8 are respectively bent downwards to form a right connecting portion 7, a photovoltaic chip 6 is fixed on the surface of the right connecting portion 7, the left base island 2 and the right base island 8 are connected into a whole through a copper strip 5, one end of the copper strip 5 is fixed on the surface of the photovoltaic chip 6, and the other end of the copper strip 5 is fixed on the surface of the left connecting portion 4.
The middle part of the frame is encapsulated by an encapsulation body 3, and the encapsulation body 3 encapsulates the photovoltaic chip 6, the copper strips 5 and the inner edges of the left base island 2 and the right base island 8. The section of the left island 2 outside the package 3 forms a left island heat dissipation area on the left side of the package 3, and the section of the right island 8 outside the package 3 forms a right island heat dissipation area on the right side of the package 3.
The left base island 2 and the right base island 8 are respectively provided with a hollowed-out hole 10, the hollowed-out holes 10 are respectively positioned at two sides of the packaging body 3 along the length direction of the frame, tin storage tanks 9 are respectively arranged at two outer sides of the hollowed-out holes 10 at two sides, and wiring terminals 1 are respectively arranged at two ends of the length direction of the frame.
In this embodiment, the top surface of the copper tape 5 is flush with the top surface of the package 3, and the top surface of the copper tape 5 is exposed from the top surface of the package 3. The bottom surfaces of the left and right connection parts 4 and 7 are flush with the bottom surface of the package body 3, and the bottom surfaces of the left and right connection parts 4 and 7 are exposed from the bottom surface of the package body 3, respectively.
In the photovoltaic module of this embodiment, the heat generated by the photovoltaic chip 6 after being conducted in the forward direction is conducted to the Zuo Jidao heat dissipation area and the right island heat dissipation area through the areas on two sides of the hollowed-out hole 10 to achieve heat dissipation, and also is dissipated through the top surface of the copper strip 5 and the bottom surfaces of the left island 2 and the right island 8, so that in the photovoltaic module of this embodiment, multi-surface heat dissipation is achieved. Compared with the traditional radiating mode of the photovoltaic module, the heat transfer efficiency of the photovoltaic module is greatly improved, and the radiating effect of the photovoltaic module is improved.
Example 2:
This embodiment differs from embodiment 1 in that: as shown in fig. 3, in the present embodiment, only the bottom surfaces of the left connection portion 4 and the right connection portion 7 are flush with the bottom surface of the package body 3, and are respectively exposed from the bottom surface of the package body 3, and the left island heat dissipation area and the right island heat dissipation area cooperate with each other to realize multi-sided heat dissipation as described in embodiment 1.
Example 3:
This embodiment differs from embodiment 1 in that: as shown in fig. 4, in this embodiment, only the top surface of the copper tape 5 is flush with the top surface of the package body 3 and exposed from the top surface of the package body 3, and the left island heat dissipation area and the right island heat dissipation area described in embodiment 1 cooperate to realize multi-sided heat dissipation.
Example 4:
This embodiment differs from embodiment 1 in that: as shown in fig. 5, in this embodiment, the left base island 2 and the right base island 8 are both planar structures, the photovoltaic chip 6 is fixed on the inner end surface of the right base island 8, one end of the copper strip 5 is fixed on the inner end surface of the left base island 2, and the other end is fixed on the surface of the photovoltaic chip 6.
In this embodiment, the top surface of the copper tape 5 is flush with the top surface of the package 3, and the top surface of the copper tape 5 is exposed from the top surface of the package 3. Meanwhile, the bottom surfaces of the inner ends of the left base island 2 and the right base island 8 are flush with the bottom surface of the package body 3, and the bottom surfaces of the inner ends of the left base island 2 and the right base island 8 are exposed from the bottom surface of the package body 3 respectively, so that multi-surface heat dissipation is realized.
Example 5:
This embodiment differs from embodiment 1 in that: as shown in fig. 6, in the present embodiment, the left connecting portion 4 at the inner edge of the left base island 2 and the right connecting portion 7 at the edge of the right base island 8 are staggered up and down.
The photovoltaic chip 6 is fixed on the surface of the right connecting part 7, and the left connecting part 4 is fixed on the surface of the photovoltaic chip 6. In this example, therefore, copper strip 5 in example 1 was omitted. The top surface of the left connecting portion 4 is flush with the top surface of the package body 3 and is exposed from the top surface of the package body 3. Meanwhile, the bottom surface of the right connecting part 7 is flush with the bottom surface of the packaging body 3 and is exposed from the bottom surface of the packaging body 3, so that multi-surface heat dissipation is realized.
Example 6:
This embodiment differs from embodiment 1 in that: in the present embodiment, while the top surface of the copper tape 5 is exposed from the top surface of the package body 3, the top surface of the copper tape 5 may be higher or lower than the top surface of the package body 3; the bottom surfaces of the left connecting portion 4 and the right connecting portion 7 are exposed from the bottom surface of the package body 3, and the bottom surfaces of the left connecting portion 4 and the right connecting portion 7 may be higher or lower than the bottom surface of the package body 3.
The above description is only a preferred embodiment of the present utility model, and is not intended to limit the utility model in any way, and any person skilled in the art may make modifications or alterations to the disclosed technical content to the equivalent embodiments. However, any simple modification, equivalent variation and variation of the above embodiments according to the technical substance of the present utility model still fall within the protection scope of the technical solution of the present utility model.
Claims (7)
1. The utility model provides a multiaspect radiating photovoltaic module, including the frame, the frame includes two base islands, crisscross formation is crisscross portion from top to bottom in two base islands, photovoltaic chip (6) are located crisscross portion, and its top surface and bottom surface are fixed with the inner of two base islands respectively, two base islands are left base island (2) and right base island (8) respectively, encapsulation body (3) encapsulates crisscross portion and photovoltaic chip (6) in, left base island (2) and right base island (8) form left base island heat dissipation area and right base island heat dissipation area respectively at the both ends of frame, its characterized in that: at least one surface of the staggered part of the fixed photovoltaic chip (6) is exposed on the surface of the packaging body (3) close to the surface.
2. The multi-sided heat dissipating photovoltaic module of claim 1, wherein: at the staggered part of the fixed photovoltaic chip (6), the surfaces of the inner ends of the two base islands are respectively exposed from the top surface and the bottom surface of the packaging body (3).
3. The multi-sided heat dissipating photovoltaic module of claim 1, wherein: the inner ends of the left base island (2) and the right base island (8) are respectively bent to form a left connecting part (4) and a right connecting part (7), the photovoltaic chip (6) is fixed on the surface of the right connecting part (7), and the left connecting part (4) extends to the upper part of the photovoltaic chip (6) to form a staggered part and is fixed with the top surface of the photovoltaic chip (6).
4. The multi-sided heat dissipating photovoltaic module of claim 1, wherein: the inner ends of the left base island (2) and the right base island (8) are respectively bent to form a left connecting part (4) and a right connecting part (7), the photovoltaic chip (6) is fixed on the surface of the right connecting part (7), the copper strips (5) are fixed on the left connecting part (4), and the copper strips (5) extend to the upper part of the photovoltaic chip (6) to form a staggered part and are fixed with the top surface of the photovoltaic chip (6).
5. The multi-sided heat dissipating photovoltaic module of claim 1, wherein: the left base island (2) and the right base island (8) are both planes, the photovoltaic chip (6) is fixed on the surface of the right connecting part (7), the copper strip (5) is fixed on the left connecting part (4), and the copper strip (5) extends to the upper part of the photovoltaic chip (6) to form a staggered part and is fixed with the top surface of the photovoltaic chip (6).
6. The multi-sided thermal photovoltaic module of claim 4 or 5, wherein: the top surface of the copper strip (5) is exposed from the top surface of the packaging body (3), and the bottom surfaces of the left base island (2) and the right base island (8) are respectively exposed from the bottom surface of the packaging body (3).
7. The multi-sided heat dissipating photovoltaic module of claim 1, wherein: the upper and lower surfaces of the staggered parts are respectively flush with the top surface and the bottom surface of the packaging body (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322343753.XU CN221041148U (en) | 2023-08-30 | 2023-08-30 | Multi-surface radiating photovoltaic module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322343753.XU CN221041148U (en) | 2023-08-30 | 2023-08-30 | Multi-surface radiating photovoltaic module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221041148U true CN221041148U (en) | 2024-05-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322343753.XU Active CN221041148U (en) | 2023-08-30 | 2023-08-30 | Multi-surface radiating photovoltaic module |
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| Country | Link |
|---|---|
| CN (1) | CN221041148U (en) |
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2023
- 2023-08-30 CN CN202322343753.XU patent/CN221041148U/en active Active
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