CN217062081U - Lead frame - Google Patents
Lead frame Download PDFInfo
- Publication number
- CN217062081U CN217062081U CN202220254852.3U CN202220254852U CN217062081U CN 217062081 U CN217062081 U CN 217062081U CN 202220254852 U CN202220254852 U CN 202220254852U CN 217062081 U CN217062081 U CN 217062081U
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- installation frame
- base island
- lead frame
- parallel
- installation frames
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Abstract
The utility model belongs to the technical field of the semiconductor manufacturing, especially, relate to a lead frame. Including two parallel installation frames, two set up a plurality of encapsulation units between the installation frame, it is a plurality of encapsulation unit is being on a parallel with the direction and the perpendicular to of installation frame the direction of installation frame is evenly arranged, along the perpendicular to interconnect between two adjacent encapsulation units in the direction of installation frame is close to the installation frame encapsulation unit all with installation frame connection, encapsulation unit is on a parallel with the both sides of installation frame direction are provided with the pin. The utility model discloses a to encapsulate unit array and arrange, increased the number of encapsulation unit, promote 15 from traditional 12, improve production efficiency. Meanwhile, the radiating fins are arranged on the two sides of the base island, so that the high-power silicon wafer is fast in heat dissipation in the using process, heat accumulation is reduced, the temperature of the silicon wafer is reduced, and the service life of a product is prolonged.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor manufacturing, especially, relate to a lead frame.
Background
The lead frame is used as a chip carrier of an integrated circuit or a discrete device, is a key structural member for realizing the electrical connection between a circuit leading-out terminal inside a chip and an external lead by means of a bonding gold wire to form an electrical circuit, and plays a role of a bridge connected with an external lead. At present, lead frames are required to be used in most semiconductor integrated blocks, and the lead frames are important basic materials in the electronic information industry. The packaging units in the existing lead frame are arranged in a row, so that the number of the packaging units is limited, and the production efficiency is low.
Disclosure of Invention
The utility model provides a lead frame has solved traditional lead frame among the prior art, and the encapsulation unit that can set up is small in quantity, leads to the problem that production efficiency is low.
The utility model adopts the following technical scheme: the utility model provides a lead frame, includes the installation frame of two parallels, two set up a plurality of encapsulation units between the installation frame, it is a plurality of the encapsulation unit is being on a parallel with the direction and the perpendicular to of installation frame the direction of installation frame is evenly arranged, follows the perpendicular to interconnect between two adjacent encapsulation units in the direction of installation frame is close to the installation frame the encapsulation unit all with the installation frame is connected, the encapsulation unit is on a parallel with the both sides of installation frame direction are provided with the pin.
Furthermore, the packaging unit comprises a base island, heat radiating fins are arranged on two sides of the base island, and the pins are arranged on one side, far away from the base island, of the heat radiating fins.
Furthermore, a soldering tin groove is formed in the heat dissipation sheet and used for placing soldering tin.
Furthermore, adjacent packaging units are connected through a connecting piece, the connecting piece is connected with the radiating fin, a placement groove is formed between the connecting piece and the radiating fin, and the placement groove is used for placing an external lead.
Furthermore, a waterproof groove is arranged between the base island and the radiating fins and used for blocking the permeation of water vapor.
Furthermore, a plurality of concave points are arranged at the bottom of the base island, and the concave points are arranged in a row.
Further, 15 packaging units are arranged between the two mounting frames and are uniformly arranged in three rows along a direction parallel to the mounting frames.
Further, the length of the mounting frame is 260 +/-0.1 mm, and the width of the mounting frame is 3 +/-0.1 mm; the distance between the two mounting frames is 81 plus or minus 0.1 mm.
The utility model discloses beneficial effect: the utility model discloses a to encapsulate the unit array and arrange, increased the number of encapsulation unit, promote 15 from traditional 12, improve production efficiency. Meanwhile, the radiating fins are arranged on the two sides of the base island, so that the high-power silicon wafer is fast in heat dissipation in the using process, heat accumulation is reduced, the temperature of the silicon wafer is reduced, and the service life of a product is prolonged. Meanwhile, the concave points arranged in an array mode are arranged on the back face of the base island, the bonding force of the lead frame and epoxy resin is increased, air holes and layering are reduced, and the reliability of a product is improved.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic top view of the package unit of the present invention.
Fig. 3 is a schematic bottom view of the package unit according to the present invention.
Detailed Description
In order to make the technical solutions of the present invention better understood by those skilled in the art, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and the described embodiments are only some embodiments, not all embodiments, of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall fall within the protection scope of the present invention.
In one embodiment of the present invention, fig. 1 is a schematic structural diagram provided according to an actual structure of a lead frame. As shown in fig. 1, the present invention includes two parallel mounting frames 1, two a plurality of packaging units 2 are disposed between the mounting frames 1, a plurality of the packaging units 2 are arranged in a direction parallel to the mounting frames 1 and perpendicular to the direction of the mounting frames 1, and are connected to each other along the direction perpendicular to the direction of the mounting frames 1 between two adjacent packaging units 2, the packaging units 2 close to the mounting frames 1 are all connected to the mounting frames 1, and the packaging units 2 are parallel to the two sides of the direction of the mounting frames 1 and are provided with pins 23.
Wherein, the length of the mounting frame 1 is 260 plus or minus 0.1mm, and the width is 3 plus or minus 0.1 mm. The distance between the two mounting frames 1 is 81 ± 0.1 mm.
Specifically, it may be configured that 15 packaging units 2 are disposed between two of the mounting frames 1, and are uniformly arranged in three rows along a direction parallel to the mounting frames 1. The utility model discloses a to encapsulate unit array and arrange, increased the number of encapsulation unit, promote 15 from traditional 12, improve production efficiency.
In an embodiment of the present invention, the package unit 2 includes a base island 21, the heat sink 22 is disposed on two sides of the base island 21, and the pin 23 is disposed on one side of the heat sink 22 away from the base island 21. The heat sink 22 is provided with a solder bath 24 for preventing soldering, and the soldering is used for external connection of leads.
The adjacent packaging units are connected through a connecting piece 11, the connecting piece 11 is arranged on the radiating fin 22, a placing groove 25 is arranged between the connecting piece and the radiating fin 22, and the placing groove 25 is used for placing an external lead.
A waterproof groove 26 is arranged between the base island 21 and the radiating fins 22 and used for blocking the penetration of water vapor.
The utility model discloses increased the fin area of self, wherein the increase of base island area plays the radiating action equally, and the heat dissipation is fast in the high-power silicon wafer use, has reduced the heat and has piled up, has reduced the temperature of silicon wafer, improves product life.
The utility model discloses a 21 size maximums in chinampa are 300 mils, can install and be greater than 200 mils and be less than 300 mils's silicon crystal grain, have satisfied the market demand.
As shown in fig. 3, the base island 21 has a plurality of pits 4 at the bottom, and the pits 4 are arranged in a row. The number of the concave points on the back of the base island 21 is in an aligned arrangement, which increases by 50%, increases the bonding force between the lead frame and the epoxy resin, reduces air holes and layering, and improves the reliability of the product.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the examples, those skilled in the art should understand that the technical solutions of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the scope of the claims of the present invention.
Claims (7)
1. The lead frame is characterized by comprising two parallel installation frames (1), wherein a plurality of packaging units (2) are arranged between the two installation frames (1) and are uniformly distributed in the direction parallel to the installation frames (1) and the direction perpendicular to the installation frames (1), the packaging units (2) are connected with the two adjacent packaging units (2) in the direction perpendicular to the installation frames (1) and are close to the installation frames (1), the packaging units (2) are connected with the installation frames (1), and pins (23) are arranged on two sides of the direction parallel to the installation frames (1).
2. Leadframe according to claim 1, characterized in that the encapsulation unit (2) comprises a base island (21), that heat sinks (22) are arranged on both sides of the base island (21), and that the pins (23) are arranged on the side of the heat sinks (22) remote from the base island (21).
3. Leadframe according to claim 2, characterized in that the heat sink (22) is provided with solder grooves (24) for placing solder.
4. Lead frame according to claim 2, characterized in that adjacent package units (2) are connected by a connector (11), the connector (11) is connected with the heat sink (22), a placement groove (25) is provided between the connector (11) and the heat sink (22), and the placement groove (25) is used for placing external leads.
5. Leadframe according to claim 2, characterized in that between the base island (21) and the heat sink (22) a water-repellent groove (26) is provided for blocking the penetration of water vapour.
6. Leadframe according to claim 2, characterized in that the base island (21) has a plurality of pits (4) at its bottom, the pits (4) being arranged in columns.
7. Lead frame according to claim 1, characterized in that 15 packaging units (2) are arranged between two mounting frames (1) and arranged in three rows uniformly in a direction parallel to the mounting frames (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220254852.3U CN217062081U (en) | 2022-02-08 | 2022-02-08 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220254852.3U CN217062081U (en) | 2022-02-08 | 2022-02-08 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217062081U true CN217062081U (en) | 2022-07-26 |
Family
ID=82485197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220254852.3U Active CN217062081U (en) | 2022-02-08 | 2022-02-08 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217062081U (en) |
-
2022
- 2022-02-08 CN CN202220254852.3U patent/CN217062081U/en active Active
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