CN218602425U

CN218602425U - IC chip lead frame

Info

Publication number: CN218602425U
Application number: CN202223251593.8U
Authority: CN
Inventors: 李联勋; 刘文龙; 李广钦; 王鹏; 王仟
Original assignee: Anhui Jixin Microelectronics Technology Co ltd
Current assignee: Anhui Jixin Microelectronics Technology Co ltd
Priority date: 2022-12-05
Filing date: 2022-12-05
Publication date: 2023-03-10
Anticipated expiration: 2032-12-05

Abstract

The utility model discloses a IC chip lead frame belongs to chip package technical field. The device comprises a plurality of frame units distributed in a matrix manner, wherein each frame unit comprises a frame body and a base island positioned in the frame body, and the left side and the right side of the base island are connected with the frame body through connecting ribs; pins are fixed on the frame body opposite to the front and back sides of the base island; the pins comprise an outer pin and an inner pin which are connected into a whole; the outer pin is connected with the frame body; the inner pin is higher than the outer pin, and a certain distance is kept between the inner pin and the base island. The lead frame of the utility model can adapt to the encapsulation of the IC chip, so that the encapsulated IC chip encapsulation body has the advantages of good heat dissipation, reduced space occupation and the like; the notch design of the base island and the pin with the Z-shaped structure can increase the firmness of the combination of the base island, the pin and the plastic package material and ensure the connection stability of the IC chip.

Description

IC chip lead frame

Technical Field

The utility model relates to a chip package technical field specifically is a IC chip lead frame.

Background

An IC Chip (Integrated Circuit Chip) is a Chip formed by placing an Integrated Circuit formed by a large number of microelectronic devices (transistors, resistors, capacitors, etc.) on a plastic substrate, and the packaging process generally includes plastic-packaging the IC Chip and a lead frame in a plastic package.

At present, the frame structure of the PDFN is generally suitable for the package of the MOSFET, and as shown in fig. 5 and fig. 6, the frame structure mainly includes a frame body 10, and a plurality of frame units disposed inside the frame body 10, a single frame unit includes a base island 30, the base island 30 is connected to the frame body 10 through a drain lead 40, two sides are connected to the frame body 10 through a connecting rib 20, and a source lead 60 and a gate lead 50 are disposed on the opposite side of the drain lead 40, wherein the source lead 60 is generally composed of a plurality of source external leads and bonding sites disposed on the plurality of source external leads as needed to carry a large current and voltage.

The existing PDFN frame has a good heat dissipation effect on the MOSFET chip due to the fact that the body is thin. However, this PDFN frame is not suitable for IC chips and cannot be used for packaging IC chips.

SUMMERY OF THE UTILITY MODEL

The utility model discloses an aim at improve the PDFN frame to the encapsulation of adaptation IC chip. Therefore, the utility model provides a IC chip lead frame.

The utility model adopts the following technical scheme: an IC chip lead frame comprises a plurality of frame units distributed in a matrix manner, wherein each frame unit comprises a frame body and a base island positioned in the frame body, and the left side and the right side of the base island are connected with the frame body through connecting ribs; pins are fixed on the frame body opposite to the front and the back sides of the base island; the pins comprise an outer pin and an inner pin which are connected into a whole; the outer pin is connected with the frame body; the inner pin is higher than the outer pin, and a certain distance is kept between the inner pin and the base island.

It further comprises the following steps: and the middle positions of the left side and the right side of the base island are respectively provided with one connecting rib which is connected with the frame body.

The outer pin, the inner pin and the base island are parallel, and the outer pin and the inner pin are connected through an inclined connecting part.

The lower surface of the outer pin is flush with the lower surface of the base island, and the lower surface of the inner pin is flush with the upper surface of the base island.

After packaging, the outer pin is located on the outer side of the plastic package body, and the inner pin and the connecting portion are located in the plastic package body.

The base island is rectangular, and notches are formed in the four corners of the base island.

The frame bodies of all the frame units are connected into a whole to form a total frame, and the total frame is provided with positioning holes and fool-proof holes.

The main frame, the connecting ribs, the base islands and the pins are integrally formed by stamping copper materials.

The beneficial effects of the utility model reside in that: the lead frame can adapt to the packaging of the IC chip, so that the packaged IC chip packaging body has the advantages of good heat dissipation, reduced space occupation and the like; the notch design of the base island and the pin with the Z-shaped structure can increase the firmness of the combination of the base island, the pin and the plastic package material and ensure the connection stability of the IC chip.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic perspective view of a middle frame unit of the present invention;

FIG. 2 is a top view of the middle frame unit of the present invention;

FIG. 3 isbase:Sub>A view taken along line A-A of FIG. 2;

fig. 4 is a schematic view of an overall three-dimensional structure of the IC chip lead frame according to the present invention;

in fig. 1 to 4: 1. a frame body; 2. connecting the ribs; 3. a base island; 31. a notch; 4. a pin; 41. an outer pin; 42. an inner pin; 43. a connecting portion; 5. and (4) a total frame.

Fig. 5 is a schematic perspective view of a frame unit of a conventional PDFN frame;

fig. 6 is a schematic perspective view of a conventional PDFN frame;

in fig. 5 and 6: 10. a frame body; 20. connecting the ribs; 30. a base island; 40. a drain lead; 50. a gate pin; 60. and a source lead.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1 to 3, a lead frame unit of an IC chip includes a frame body 1, the frame body 1 is a rectangular frame, and a base island 3 is located in the frame body 1 and is located on the same plane as the frame body 1. The base island 3 is rectangular, and notches 31 are formed in the four corners of the base island 3. During subsequent plastic packaging, the plastic packaging material can enter the notches 31 at the four corner parts of the base island 3, so that the firmness of the combination of the base island 3 and the plastic packaging material is improved. The middle positions of the left side and the right side of the base island 3 are respectively provided with a connecting rib 2 to be connected with the frame body 1, and the connecting ribs 2 are arranged at the central parts of the two side edges of the base island to ensure the stability of the whole structure and improve the subsequent packaging precision.

The frame body 1 opposite to the front and back sides of the base island 3 is fixed with pins 4. The lead 4 includes an outer lead 41 and an inner lead 42, and the outer lead 41 and the inner lead 42 are connected by an inclined connection portion 43. The outer pin 41, the inner pin 42 and the base island 3 are parallel, the inner pin 42 is higher than the outer pin 41, and the inner pin 42 is separated from the base island 3 by a certain distance. The pins 4 are symmetrically arranged on two sides of the base island 3 in total by 8. The 8 pins 4 are the same in shape, are similar to a Z-shaped structure, and are used for being connected with a chip on the upper portion of the base island 3 through bonding wires, the pins 4 are not connected with each other, and the pins 4 are not connected with the base island 3, so that the IC chip can be packaged conveniently.

In this embodiment, the lower surface of the outer lead 41 is flush with the lower surface of the base island 3, and the lower surface of the inner lead 42 is flush with the upper surface of the base island 3. After packaging, the outer leads 41 are located outside the plastic package body, and the inner leads 42 and the connecting portion 43 are located inside the plastic package body. The outer pin 41 and the inner pin 42 have a height difference therebetween, which is beneficial to locking the plastic package material and improving the packaging quality.

As shown in fig. 4, the IC chip lead frame in this embodiment includes 24 frame units, the frame bodies 1 of all the frame units are connected to form an integrated overall frame 5, and the overall frame 5 is provided with positioning holes and fool-proof holes. When the positioning device is applied to a chip mounting machine table, a bonding machine table and a plastic packaging machine table, positioning can be carried out through the positioning holes and the fool-proof holes. In the embodiment, the main frame 5, the connecting ribs 2, the base islands 3 and the pins 4 are integrally formed by stamping copper materials.

When the chip is used, the chip is placed on the upper part of the base island 3 and is connected with the 8 pins 4 through bonding wires. After the plastic package, the chip, the inner pins 42 and the connecting portion 43 are located in the plastic package, and the outer pins 41 are located outside the plastic package. The lead frame of the embodiment can be suitable for packaging of the IC chip, so that the packaged IC chip packaging body has the advantages of good heat dissipation, reduced space occupation and the like.

The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. An IC chip lead frame comprises a plurality of frame units distributed in a matrix manner, wherein each frame unit comprises a frame body (1) and a base island (3) positioned in the frame body (1), and the left side and the right side of the base island (3) are connected with the frame body (1) through connecting ribs (2); the method is characterized in that: pins (4) are fixed on the frame body (1) opposite to the front and the back sides of the base island (3); the pins (4) comprise an outer pin (41) and an inner pin (42) which are connected into a whole; the outer pin (41) is connected with the frame body (1); the inner pin (42) is higher than the outer pin (41), and a certain distance is kept between the inner pin (42) and the base island (3).

2. The IC chip lead frame according to claim 1, wherein: the middle positions of the left side and the right side of the base island (3) are respectively provided with one connecting rib (2) connected with the frame body (1).

3. The IC chip lead frame according to claim 1, wherein: the outer pin (41), the inner pin (42) and the base island (3) are parallel, and the outer pin (41) and the inner pin (42) are connected through an inclined connecting part (43).

4. The IC chip lead frame according to claim 3, wherein: the lower surface of the outer pin (41) is flush with the lower surface of the base island (3), and the lower surface of the inner pin (42) is flush with the upper surface of the base island (3).

5. The IC chip lead frame according to claim 3, wherein: after packaging, the outer pins (41) are located on the outer side of the plastic package body, and the inner pins (42) and the connecting portions (43) are located in the plastic package body.

6. The IC chip lead frame according to claim 1, wherein: the base island (3) is rectangular, and notches (31) are formed in the four corners of the base island (3).

7. The IC chip lead frame according to claim 1, wherein: the frame bodies (1) of all the frame units are connected into a whole to form a main frame (5), and the main frame (5) is provided with a positioning hole and a fool-proof hole.

8. The IC chip lead frame according to claim 7, wherein: the main frame (5), the connecting ribs (2), the base islands (3) and the pins (4) are integrally formed by punching copper materials.