CN107107398B - Resin molding apparatus - Google Patents

Resin molding apparatus Download PDF

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Publication number
CN107107398B
CN107107398B CN201580072847.3A CN201580072847A CN107107398B CN 107107398 B CN107107398 B CN 107107398B CN 201580072847 A CN201580072847 A CN 201580072847A CN 107107398 B CN107107398 B CN 107107398B
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CN
China
Prior art keywords
communication paths
die cavity
mold
recess portion
cavity recess
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Active
Application number
CN201580072847.3A
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Chinese (zh)
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CN107107398A (en
Inventor
川口诚
涌井正明
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Yamada Acublade Science & Technology Co Ltd
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Yamada Acublade Science & Technology Co Ltd
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Publication of CN107107398A publication Critical patent/CN107107398A/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating

Abstract

Problem of the present invention is that providing a kind of technology of quality that can be improved formed products.As solution, resin molding apparatus (10) includes: a pair of of mold (14), which has die cavity recess portion (12), be able to carry out die sinking die closing；And pressure regulating part (22), it is used to that the pressure of the mould inside (20) including die cavity recess portion (12) to be adjusted.A pair of of mold (14) has multiple communication paths (34) that mold exterior is connected with mould inside (20).The other end by mold outer side of the circumferential openings of opening portion of the one end by mold private side of multiple communication paths (34) in die cavity recess portion (12), multiple communication paths (34) is connected with pressure regulating part (22).Pressure regulating part (22) includes relief portion (36), is used to being attracted via gas of the multiple communication paths (34) to the mould inside (20) after die closing and depressurize to mould inside (20)；And flow control division (38), it is used to that the respective gas flow of multiple communication paths (34) to be adjusted.

Description

Resin molding apparatus
Technical field
The present invention relates to a kind of effective technologies applied to resin molding apparatus.
Background technique
In Japanese Unexamined Patent Publication 2010-179507 bulletin (patent document 1), records one kind and carried out to mould inside Compress the technology being formed to the resin in die cavity recess portion after decompression.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2010-179507 bulletin
Summary of the invention
Problems to be solved by the invention
For the ester moulding that such mould inside after decompression carries out documented by patent document 1, pass through utilization Access is attracted to attract the space surrounded by blocking module, to form pressure reduction space.In this case, in the past, due to The limitation spatially of apparatus structure, cost effective such purpose for realization device, are only arranged 1 or several attract are led to Road forms pressure reduction space and being attracted from the position.However, clear such problems: due to the big ruler of workpiece W Very littleization etc. and generate decompression state may not be uniform in the space surrounded by blocking module situation, lead to the occupied state of resin Deviation is generated because of the position of workpiece.
For example, (being had in resin stream when to multiple electronic component resin seals according to the configuring condition of the electronic component Without electronic component), generate sometimes resin be easy flowing (i.e. flow resistance is lower) position and being difficult to flow (flow resistance compared with It is high) position.Therefore, the position that the position being first filled is filled with after is generated in die cavity recess portion, can according to circumstances be generated Stomata is not filled by position, it is possible to making the quality of formed products reduces.
The object of the present invention is to provide a kind of technologies of quality that can be improved formed products.
According to the record of this specification and attached drawing, above-mentioned purpose and other purposes of the invention and new spy can be understood Sign.
The solution to the problem
The summary of in invention disclosed in this application, representative technical solution is briefly described as follows.This hair A bright technical solution is a kind of resin molding apparatus, which is characterized in that the resin molding apparatus includes: a pair of of mold, this one There is die cavity recess portion to mold, be able to carry out die sinking die closing；And pressure regulating part, it is used to exist to including the die cavity recess portion The pressure of interior mould inside is adjusted, and the pair of mold is more with mold exterior is connected with the mould inside A communication paths, the one end by the mould inside side of the multiple communication paths is in the opening portion of the die cavity recess portion The other end by the mold exterior side of circumferential openings, the multiple communication paths is connected with the pressure regulating part, The pressure regulating part includes relief portion, is used for via the multiple communication paths to the mould inside after die closing Gas is attracted and is depressurized to the mould inside；And flow control division, it is used for the multiple communication paths Respective gas flow be adjusted.Accordingly, for example, by the communication paths of holding runny position to resin weaker into Row attracts (decompression) and is attracted (decompression) strongly to the communication paths at the position that resin is difficult to flow, and can prevent Stomata is not filled by position, so as to improve the quality of formed products.
In addition, in the resin molding apparatus of a technical solution, it is further preferred that the pressure regulating part includes Pressurization part is used to be pressed into gas via the multiple communication paths to the mould inside and add the mould inside Pressure；And switching part, it is used to carry out the multiple communication paths in the relief portion and between the pressurization part respectively Connection switching.Accordingly, for example, by holding the communication paths at runny position to resin in die cavity recess portion, setting in die cavity recess portion The communication paths that rouge is difficult to the position flowed are attracted (decompression) or air to compress (pressurization), can prevent stomata, not Position is filled, so as to improve the quality of formed products.
In addition, in the resin molding apparatus of a technical solution, it is further preferred that the pressure regulating part has stream Measurement portion, the flow measurement portion is for measuring the respective flow of the multiple communication paths.Hereby it is possible to confirm The result of the gas flow of each communication paths and the gas flow that communication paths are adjusted using flow control division can prevent from producing Angry hole is not filled by position, so as to improve the quality of formed products.
In addition, in the resin molding apparatus of a technical solution, it is further preferred that the resin molding apparatus includes pressure Power measurement portion, the pressure measurement portion are used for the part adjacent with the one end of the communication paths of the mould inside Pressure measure.Hereby it is possible to confirm the result of the pressure at multiple positions of mould inside and utilize pressure regulating part Flow control division adjusts the gas flows of communication paths, can prevent stomata, be not filled by position, so as to improve into The quality of shape product.
In addition, in the resin molding apparatus of a technical solution, it is further preferred that the pair of mold is included into Shape portion, with the die cavity recess portion, which can make the resin thermosets being filled into the die cavity recess portion；And chamber Portion is arranged in a manner of surrounding the forming section, which separates the mold exterior and the mould inside, institute The one end for stating multiple communication paths is set to the chamber portion around the opening portion of the die cavity recess portion.Accordingly, example Such as, it even having a pair of of mold for carrying out the forming section of transfer molding, is also easy to recessed to die cavity using pressure regulating part The communication paths 34 that resin holds runny position in portion are weaker attracted (decompression) and are difficult to resin in die cavity recess portion The communication paths at the position of flowing are attracted (decompression) strongly, can be prevented stomata, are not filled by position, so as to Improve the quality of formed products.
In addition, in the resin molding apparatus of a technical solution, it is further preferred that the pair of mold have tank and The multiple die cavity recess portions being connected with the tank, the one ends of the multiple communication paths is by the tank and described Multiple die cavity recess portions are considered as integrated whole circumferential openings.Hereby it is possible to prevent in each die cavity recess portion generation stomata, be not filled by Position, so as to reduce the quality deviation of each formed products.
In addition, in the resin molding apparatus of a technical solution, it is further preferred that the pair of mold have tank and The die cavity recess portion being connected with the tank is equipped with the multiple communication paths around the opening portion of the die cavity recess portion The one end and the tank.Accordingly, for example, in the case where the workpiece to large-scale circular shape carries out ester moulding, The resin of the central portion can be kept uniform to peripheral part using pressure regulating part after making central portion of the pitch in workpiece Ground is extended and will be filled in die cavity recess portion.Thus, it is possible to prevent stomata, be not filled by position, so as to improve formed products Quality.
The effect of invention
Simple declaration is obtained and in invention disclosed in this application, representative technical solution as follows Effect.Using the resin molding apparatus of a technical solution of the invention, the quality of formed products can be improved.
Detailed description of the invention
Fig. 1 is the figure for illustrating the resin molding apparatus of embodiments of the present invention 1.
Fig. 2 is the schematic cross sectional views of the major part of the resin molding apparatus in movement shown in FIG. 1.
Fig. 3 is the schematic cross sectional views of the major part of the resin molding apparatus in the and then movement of Fig. 2.
Fig. 4 is the schematic cross sectional views of the major part of the resin molding apparatus in the and then movement of Fig. 3.
Fig. 5 is the figure for illustrating the function and effect of resin molding apparatus shown in FIG. 1.
Fig. 6 is the figure for illustrating the function and effect of resin molding apparatus shown in FIG. 1.
Fig. 7 is the figure for illustrating the resin molding apparatus of embodiments of the present invention 2.
Fig. 8 is the figure for illustrating the function and effect of resin molding apparatus shown in Fig. 7.
Fig. 9 is the figure for illustrating the function and effect of resin molding apparatus shown in Fig. 7.
Figure 10 is the figure for illustrating the resin molding apparatus of embodiments of the present invention 3.
Figure 11 is the schematic cross sectional views of the major part of the resin molding apparatus in movement shown in Fig. 10.
Figure 12 is the schematic cross sectional views of the major part of the resin molding apparatus in movement shown in Figure 11.
Figure 13 is the schematic cross sectional views of the major part of the resin molding apparatus in movement shown in Figure 12.
Figure 14 is the schematic cross sectional views of the major part of the resin molding apparatus in movement shown in Figure 13.
Figure 15 is the figure for illustrating the resin molding apparatus of embodiments of the present invention 4.
Figure 16 is the schematic plan of the major part of the resin molding apparatus in movement shown in figure 15.
Specific embodiment
In embodiments of the present invention below, it is divided into multiple portions etc. when necessary and is illustrated, but it is former On then, these parts are mutually not without relationship, and there are some or all of variation, details etc. that one is another one Relationship.Therefore, in all the attached drawings, identical appended drawing reference is marked to component with the same function, and omits it and repeats to say It is bright.In addition, about the quantity (including number, numerical value, amount, range etc.) for constituting element, the case where in addition to especially expressing, in principle Other than the case where being obviously defined in specific quantity etc., be not limited to the specific quantity, either specific quantity with On, it is also possible to specific quantity or less.In addition, when speaking of the shape for constituting element etc., the case where in addition to especially expressing and Thought other than obvious really not so situation etc. in principle, including with the substantially approximate or similar shape etc. such as the shape.
Embodiment 1
Referring to Fig.1~Fig. 6 illustrates the resin molding apparatus 10 for being used to carry out compression molding of embodiments of the present invention 1. Fig. 1 is the figure for illustrating the resin molding apparatus 10 of present embodiment.Fig. 2~Fig. 4 be resin in movement shown in FIG. 1 at Shape dress sets the schematic cross sectional views of 10 major part, only extracts the adjacent edges of die cavity recess portion 12 (die cavity when forming) (being equivalent to center side on the right side of paper) is indicated.Fig. 5 and Fig. 6 is the work for illustrating resin molding apparatus 10 shown in FIG. 1 With the figure of effect.In the present embodiment, as manufacturing WLP for shaping resin forming section (resin R) on the workpiecew (Wafer Level Package；Wafer-level packaging) resin molding apparatus 10 (manufacturing device) of product is illustrated.Before forming Workpiece W (by formed products) have overlook circular in shape substrate S (such as circuit board) and with matrix configuration (Japanese: マ ト リ Network ス configuration) it is mounted on multiple electronic component P (such as semiconductor chip) on substrate S (referring to Fig. 2 and Fig. 5).After forming Workpiece W (formed products) also has the resin formation part (resin R) for sealing multiple electronic component P (referring to Fig. 4).
Resin molding apparatus 10 includes a pair of of the mold 14 (referring to Fig. 2) for being able to carry out die sinking die closing, a pair of mold 14 Die cavity recess portion 12 with size corresponding with the workpiece W such as wafer large-scale as such as 8 inches, 12 inches.A pair of of mould Tool 14 include the upper mold 16 (mold) configured in die face (also referred to as clamping face or die joint) mode relative to each other and Lower die 17 (another mold).In the present embodiment, die cavity recess portion 12 is equipped in lower die 17.In addition, resin molding apparatus 10 In order to by workpiece W setting (configuration) Yu Shangmo 16 die face and including it is being made of well known adsorbing mechanism, chuck mechanism etc., For keeping the work holding portion thereof (not shown) of workpiece W.In addition, resin molding apparatus 10 is in order to improve the forming after ester moulding The release property of product and including suction unit 18,19 (such as vacuum pump), the suction unit 18,19 is along lower die 17 to include that die cavity is recessed Die face including portion 12 is adsorbed and keeps the mode of release film F to attract release film F.
A pair of of the mold 14 for being able to carry out die sinking die closing is configured to, close to each other and molding upper mold 16 and lower die 17 To carry out die closing, and keeping upper mold 16 and lower die 17 close away from each other.In the present embodiment, by upper mold 16 as solid Cover half regard lower die 17 as But moving die, by making lower die 17 make a pair of of 14 die closing of mold close to upper mold 16, by making lower die 17 It is opened a pair of of mold 14 far from upper mold 16.As die sinking mold closing mechanism (not shown), it is able to use well known mechanism, such as Using driving source (servo motor etc.) and drive transmission mechanism (ball-screw etc.), guided along connecting rod (Japanese: タ イ バ ー) It is assembled in the lower die 17 of movable platen and goes up and down the lower die 17 relative to the upper mold 16 for being assembled in stationary platen.In addition, a pair of Mold 14 is configured to, and has heater (not shown) in upper mold 16 and the respective inside of lower die 17, which can be heated to Predetermined temperature (such as 180 DEG C).
In addition, resin molding apparatus 10 includes for the gas to the mould inside 20 (referring to Fig. 3) with die cavity recess portion 12 The pressure regulating part 22 (referring to Fig.1) that the pressure of atmosphere (air) is adjusted and the pressure for multiple positions to mould inside 20 The pressure measurement portion 23 (referring to Fig.1) that power measures.In addition, as shown in Figure 1, resin molding apparatus 10 includes: control unit 24, It is used to control pressure regulating part 22, reads the measurement result from pressure measurement portion 23；Input unit 25, is used for control unit 24 input predetermined conditions；And display unit 26, it is used to show predetermined condition, display measurement result.Thus it is configured to, Neng Gougen According to scheduled purpose, control as follows, depressurized and pressurizeed between switching be discharged from air, resin in the decompression The gas (primary decompression) of generation, and the gas in mold is discharged and is decompressed to arbitrary pressure (secondary pressure), in the pressurization In, it is pressurizeed by importing (indentation) air, non-active gas etc. to the gas in mold.In addition, being configured to, Neng Gougen It is controlled according to scheduled purpose as decompression, the change for the intensity pressurizeed.
The lower die 17 being made of multiple die modules includes pedestal 60；Mold cavity block 62 is securely assembled in pedestal 60, Overlook circular in shape (when observation die face)；And clamping piece 64, it is rounded to be formed with the vertical view being inserted into for mold cavity block 62 The through-hole 64a of shape.A pair of of mold 14 has die cavity recess portion 12 in lower die 17, but the bottom of die cavity recess portion 12 is by mold cavity block 62 Upper surface is constituted, and the side of die cavity recess portion 12 is made of the medial surface (inner wall of through-hole 64a) of clamping piece 64.Therefore, such as Fig. 1 In single dotted broken line shown in, the opening portion of die cavity recess portion 12 be formed as overlook circular in shape.In addition, clamping piece 64 surrounds die cavity Block 62 is assembled in pedestal 60 in a manner of it can move up and down and (move forward and backward) by elastic component 66 (such as spring).At this Become in the lower die 17 of sample with flowering structure: mold cavity block 62 and clamping piece 64 are the relationship that can be relatively moved, die cavity recess portion 12 The depth (i.e. volume) of opening portion can change.Between being formed between the lateral surface of mold cavity block 62 and the medial surface of clamping piece 64 Gap, but lower die 17 has for by the containment member 68 (such as O-ring seals) of the clearance seal, with the mold for having been formed closed Internal 20 (confined spaces).
(mould inside) around the opening portion of die cavity recess portion 12 is connected with mold exterior in addition, lower die 17 has Multiple communication paths 70.For example, communication paths 70 are constituted and perforating to clamping piece 64, communication paths 70 lean on die cavity The one end of the opening portion side of recess portion 12 is open in the die face (upper surface) of clamping piece 64, and communication paths 70 lean on mold exterior The other end of side is connected via pipeline with suction unit 18.In addition, lower die 17 have will be around the bottom of die cavity recess portion 12 Multiple communication paths 72 that (mould inside) is connected with mold exterior.For example, communication paths 72 are by carrying out clamping piece 64 It perforates and constitutes, the one end of the bottom side by die cavity recess portion 12 of communication paths 72 with the corner part of die cavity recess portion 12 to be connected Logical mode is open in the medial surface of the bottom periphery positioned at die cavity recess portion 12 of clamping piece 64, and communication paths 72 are leaned on outside mold The other end of portion side is connected via pipeline with suction unit 19.It is (such as true by the suction unit 18,19 that is controlled by control unit 24 Sky pump) attraction movement, release film F can be adsorbed along the shape of die cavity recess portion 12 and be held in die face.
Overlooking state as shown in Figure 1 is such, and the upper mold 16 being made of multiple die modules has pedestal 28, fixedly group The central module 30 of circular shape loaded on pedestal 28 and surround central module 30 and with can moving forward and backward and (move up and down) It is assembled in the clamping piece 32 of pedestal 28.The through-hole 32a of circular shape is formed on the clamping piece 32 for surrounding central module 30, in Module 30 is entreated to be assembled in pedestal 28 in the mode being inserted into through-hole 32a.Therefore, the lateral surface in central module 30 and clamping It is formed between the medial surface (inner wall of through-hole 32a) of part 32 gap (referring to Fig. 2), but upper mold 16 has for by the gap The containment member 31 (such as O-ring seals) of sealing, mould inside 20 is closed.
In addition, in the state that upper mold 16 is in order to after die closing by mould inside 20 it is closed and have be set to clamping piece 32 under End face, the containment member 33 (such as O-ring seals) that will be sealed between upper mold 16 and lower die 17.
In addition, as shown in Figure 1, upper mold 16 has mold exterior and includes the die cavity recess portion 12 opposite with central module 30 Multiple communication paths 34 that mould inside 20 (referring to Fig. 3) inside is connected (in Fig. 1, perspective are indicated using dotted line State).The one end by die cavity recess portion 12 (mould inside 20) side of multiple communication paths 34 is in the opening portion of die cavity recess portion 12 Circumferential openings, the other end by mold outer side of multiple communication paths 34 and pressure regulating part 22, pressure measurement portion 23 It is connected.It (such as is being set in scheduled position at the center of opening portion of the one end of multiple communication paths 34 around die cavity recess portion 12 Rouge R is easy the direction flowed outward from center, is difficult to the direction flowed outward from center) opening.
In the present embodiment, on clamping piece 32, along around circular shape under overlooking state shown in Fig. 1 The position every predetermined angular in the circumferential direction at the center of through-hole 32a is equipped with the communication paths being connected with pressure regulating part 22 34, to be depressurized and be pressurizeed.In addition it is possible to be provided proximally and pressure measurement portion 23 with these 34 phases of communication paths The communication paths 34 that (pressure gauge 52) is connected.In addition, for example, multiple communication paths 34 are and perforating to clamping piece 32 It constitutes, the one end of multiple communication paths 34 is connected with the gap between central module 30 and clamping piece 32, and multiple connections are logical The other end on road 34 is connected and connect with pressure regulating part 22, pressure measurement portion 23 via pipeline.
Pressure regulating part 22 has controlled by control unit 24, relief portion 36 and flow control division 38, which uses Mould inside 20 is depressurized in being attracted via gas of multiple communication paths 34 to the mould inside 20 after die closing, The flow control division 38 is for being adjusted the respective gas flow of multiple communication paths 34.Relief portion 36 is by such as vacuum Pump is constituted, which is connected with multiple communication paths 34.In addition, flow control division 38 is by for example multiple flow control valves 40 It constitutes, the multiple flow control valve 40 is connected with multiple communication paths 34 respectively.Using such pressure regulating part 22, example Such as, runny position can be held (in other words, without keeping resin R appearance runny in die cavity recess portion 12, resin R is located at Position) communication paths 34 weaker attracted (decompression) and in die cavity recess portion 12, resin R is difficult to flow position to being located at The communication paths 34 of (in other words, needing that resin R is made to hold runny position) are attracted (decompression) strongly.
In addition, pressure regulating part 22 can also have controlled by control unit 24, pressurization part 42 and switching part 44, the pressurization Portion 42 is used to be pressed into gas via multiple communication paths 34 to the mould inside 20 after die closing and pressurize to mould inside 20, The switching part 44 between relief portion 36 and pressurization part 42 for being attached switching to multiple communication paths 34 respectively.Pressurization part 42 by such as compression mechanism at the compressor is connected with multiple communication paths 34.As the pressurization part 42, either to sky Gas is pressurizeed and imports the structure of air, is also possible to pressurize to air and be pressed into the structure of air.It can also be pair Non-active gas as nitrogen is pressurizeed and is pressed into the structure of the non-active gas.In addition, switching part 44 is by for example multiple Switching valve 46 is constituted, and the multiple switching valve 46 is connected with multiple communication paths 34 respectively.Using such pressure regulating part 22, for example, can hold to resin R in die cavity recess portion 12, the communication paths 34 at runny position, resin R is difficult in die cavity recess portion 12 Attracted with the communication paths 34 at the position of flowing, air compression, each predetermined position of mould inside 20 can be carried out Decompression (negative pressure), pressurization (positive pressure) are to adjust pressure.Moreover, it is not necessary to which pressurization part 42 is centainly arranged, it is also possible to omit switching Flow control division 38 and relief portion 36 are directly connected to by portion 44.
In addition, pressure regulating part 22 preferably has flow measurement portion 48, the flow measurement portion 48 is for measuring multiple connections The measurement result of the respective flow of access 34, the flow measurement portion 48 is read by control unit 24.Flow measurement portion 48 is by for example Multiple flowmeters 50 are constituted, and the multiple flowmeter 50 is connected with multiple communication paths 34 respectively.Using such pressure tune Section portion 22 is able to confirm that the result of the gas flow of each communication paths 34 and is adjusted communication paths 34 using flow control division 48 Gas flow.
Communication paths 34 except the communication paths 34 that pressure measurement portion 23 is connected with same pressure regulating part 22 are connected, With multiple positions of mould inside 20 that can be adjacent to the one end of communication paths 34 being connected with same pressure regulating part 22 Pressure measure.Pressure measurement portion 23 is made of for example multiple pressure gauges 52.It, can using such pressure measurement portion 23 Confirm the result of the pressure at multiple positions of mould inside 20 and adjust and is connected with the flow control division 48 of pressure regulating part 22 Each communication paths 34 gas flow.Specifically, can be to clipping 1 communication paths being connected with pressure measurement portion 23 34, the gas flow of two communication paths 34 that is connected with pressure regulating part 22 is adjusted.
Next, illustrating the method for operating of resin molding apparatus 10 and illustrating the manufacturing method (manufacturing process) of formed products. Firstly, as shown in Fig. 2, for upper mold 16, being utilized work holding portion thereof (not shown) in the state of the die sinking of a pair of of mold 14 The workpiece W absorption that mould inside will be transported by loading machine (not shown) keeps the die face of (setting) Yu Shangmo 16.For For lower die 17, firstly, make mold cavity block 62 mobile relative to clamping piece 64 in advance so that the upper surface of mold cavity block 62 come it is standby Position.The upper surface of mold cavity block 62 becomes lower than the upper surface of clamping piece 64 on the basis of the upper surface of pedestal 60 as a result,.Separately Outside, the release film F for transporting mould inside 20 by film delivery section (not shown) absorption is kept (setting using suction unit 18,19 Set) in the die face including die cavity recess portion 12 of lower die 17.As release film F, used have be resistant to a pair of of mould Have the heat resistance of 14 heating temperature and easily the film of flexibility, extensibility is removed and had to the die face from lower die 17 Material.Specifically, being able to use such as PTFE, ETFE as release film F, PET, FEP, leaching fluorine glass cloth, polypropylene, gathering Vinylidene chloride etc..
Then, resin R is supplied to the bottom center of die cavity recess portion 12 across release film F.Since a pair of of mold 14 is heated To predetermined temperature, therefore, resin R occurs from the position being in contact with the bottom of die cavity recess portion 12 (upper surface of mold cavity block 62) Melting.As resin R, using such as liquid, graininess, powdery, sheet resin.It can be filled for example, being able to use and having And the distributor for projecting the syringe of fluid resin supplies resin R.
Additionally it is possible to which resin R is supplied into die cavity recess portion 12 as follows: configuring resin R in mold exterior On the central portion of release film F, resin R is transported into mould inside together with release film F.
Next, as shown in figure 3, making upper mold 16 and lower die 17 towards closed mode state from the state of a pair of of mold 14 die sinking It is mutually close, so that the containment member 33 set on the lower end surface of clamping piece 32 is abutted (i.e. sealing ring contact) in the upper end of clamping piece 64 Face.The mould inside 20 including die cavity recess portion 12 constitutes confined space by closed as a result,.At this point, by making pressure tune The relief portion 36 in section portion 22 works, to depressurize via multiple communication paths 34 to mould inside 20, can be set as any Degassing phase.
In this case, for example, when making the entire confined space become uniform decompression state, from whole connections Access 34 attracts air (atmosphere) with uniform intensity.In this case, such as in the through-hole 32a and 1 for being envisioned for clamping piece 32 When the structure that a communication paths 34 are connected, by being attracted from communication paths 34, thus from the communication paths 34 via folder Gap between the inner peripheral surface of the through-hole 32a of gripping member 32 and the outer peripheral surface of central module 30 attracts air.At this point, close to the company All at the position on road 34, air is got started attraction, and at the position far from communication paths 34, the attraction of air compared with Evening.Therefore, the decompression state at the position of the position far from communication paths 34 becomes inadequate, and is not filled by be easy to produce Position, stomata.In addition, in order to improve productivity ratio, workpiece W is constantly in large size, this causes must not be without attracting in decompression Volume significantly increase, the state of the attraction (decompression) of air is easy to become more uneven.In contrast, pass through such as this implementation Multiple communication paths 34 are arranged in mode like that, even if workpiece W is in large size, can also ensure that uniform decompression state.
Next, utilizing the central module 30 of upper mold 16 as shown in figure 4, further make upper mold 16 and lower die 17 mutually close Clamping piece 64 with lower die 17 is across release film F clamping workpiece W (substrate S).The opening portion of die cavity recess portion 12 is by workpiece W as a result, (substrate S) occlusion, to form die cavity, to the mould filling resin R and applies resin pressure.In addition, on containment member 33 The clamping piece 32 of mould 16 and the clamping piece 64 of lower die 17 are pressed and are shunk, and improve the airtightness of mould inside 20.In addition, by making Air discharge duct (not shown) is previously formed in the upper surface of clamping piece 64, also can be into thus even if after having clamped release film F Decompression in row die cavity recess portion 12 (die cavity).
In this case, by further making upper mold 16 and lower die 17 mutually close, to be fed into die cavity recess portion 12 The resin R of bottom center is pressed by workpiece W, and resin R starts to extend to the bottom peripheral side of die cavity recess portion 12.At this point, considering In die cavity recess portion 12, generated because of the configuring condition of electronic component P resin R be easy flowing (i.e. flow resistance is lower) position and Resin R is difficult to flow the position of (flow resistance is higher).Even if in this case, using the tree with pressure regulating part 22 Rouge forming device 10, for example, the communication paths 34 that can hold runny position to resin R are weaker attracted (decompression) simultaneously (decompression) is attracted strongly to the communication paths 34 at the position for being difficult to flow resin R.
Next, further make upper mold 16 and lower die 17 mutually close to (molding), to be filled in the resin R of die cavity recess portion 12 into Row compression.Specifically, elastic component 66 is pressed contraction, and clamping piece 64 is exerted a force same when molding a pair of of mold 14 When it is mobile to 60 side of pedestal.
Mold cavity block 62 is mobile relative to the clamping piece 64.At this point, in die cavity recess portion 12, the position of the upper surface of mold cavity block 62 Setting from deeper position of readiness becomes shallower shaping position.Then, pressure is being kept to the resin R being filled into die cavity recess portion 12 The heat cure predetermined time under the state (state of shaping position) of power.
Herein, it specifically describes and causes with the shape (whether there is or not configuration electronic component P) etc. by workpiece W referring to figure 5 and figure 6 Resin R flowing the corresponding pressure regulating part 22 of complexity adjusting movement.In fig. 5 and fig., be held in upper mold Correspondingly, resin R is expressed as from the center of workpiece W towards the direction that outside is flowed for position in the face of 16 workpiece W It is easiest to the direction D1 (flowing of resin R is not by direction that electronic component P stops) of flowing, least holds runny direction D2 The medium direction D3 of the complexity of (direction that the flowing of resin R is stopped by electronic component), flowing.In addition, in Fig. 5 and Fig. 6 In, with position in the face for the workpiece W for being held in upper mold 16 correspondingly, according to initial position T0 (supply position), the 1st midway position Set T1, the sequence of the 2nd half-way T2 (latter stage position) shows upper surface (the die cavity recess portion 12 of mold cavity block 62 with time series Bottom surface) in resin R expanding location (outer shaped position).
For example, only making the relief portion 36 of pressure regulating part 22 work, on one side from the multiple connections being connected with relief portion 36 Access 34 is depressurized (in addition, in Fig. 5, Fig. 6, hollow arrow indicates the size of decompression) on one side by resin to mould inside 20 R presses on workpiece W.In this case, as shown in figure 5, sometime (for example, the 1st half-way T1, the 2nd half-way When T2), resin R at first to direction D1 flow, then, resin R according to direction D3, direction D2 sequential flowing (extension).Thus, Generated in die cavity recess portion 12 position that is first filled and after the position that is filled, according to circumstances, it is also possible to be easy filling compared with The position generation stomata in evening, the quality for being not filled by position and making formed products reduce.
Thus, for example, when one side makes 22 overall work of pressure regulating part and utilizes the adjusting of flow control division 38 and relief portion Resin R is pressed on workpiece on one side to be depressurized to mould inside 20 by the gas flow of the 36 multiple communication paths 34 being connected When W, as shown in fig. 6, sometime (for example, when the 1st half-way T1, the 2nd half-way T2), with direction D1, D2, D3 without It closes, resin R equably flows.Specifically, minimally from the communication paths 34 being located on the direction D1 for being easiest to flow (weaker) depressurized, from be located at least hold communication paths 34 on runny direction D2 farthest (strongly) into Row decompression is depressurized moderately from the communication paths 34 on the medium direction D3 of the complexity flowed.As a result, In die cavity recess portion 12, substantially simultaneously potting resin R.That is, can prevent from filling later position generation stomata, being not filled by portion Position, so as to improve the quality of formed products.
Then, a pair of of mold 14 is opened, keeps upper mold 16 and lower die 17 separate, workpiece W is (defeated to mold exterior taking-up It send).Further, as post-processing, by by resin formation part heat cure (secondary curing) predetermined time of workpiece W, thus complete At the electronic component P of workpiece W by the formed products after resin R (resin formation part) resin seal.
In this way, the multiple communication paths being connected with the confined space including die cavity are arranged using present embodiment 34, it can be set as uniform decompression state in the confined space or keep decompression state part different, thereby, it is possible to prevent example The unfavorable condition as generating and be not filled by when carrying out ester moulding with circle, so as to improve the quality of formed products.
Embodiment 2
In the embodiment 1, illustrate to correspondingly form using opening portion with the workpiece W for overlooking circular in shape For overlook circular in shape die cavity recess portion 12 the case where.It in the present embodiment, include a pair of of mould referring to Fig. 7~Fig. 9 explanation Tool 14 and the resin molding apparatus 10 for carrying out compression molding, a pair of mold 14 have opening portion and overlook the work of rectangular shaped Part W correspondingly forms to overlook the die cavity recess portion 12 of rectangular shaped.Fig. 7 is the ester moulding for illustrating present embodiment The figure of device 10.Fig. 8 and Fig. 9 is the figure for illustrating the function and effect of resin molding apparatus 10 shown in Fig. 7.Present embodiment Resin molding apparatus 10 also include in the same manner as the embodiment 1 a pair of of mold 14, pressure regulating part 22, control unit 24, Input unit 25 and display unit 26.In addition, resin molding apparatus 10 also may include the pressure measurement portion 23 illustrated referring to Fig.1. In addition, substantially omitting structure same as the embodiment 1 in the explanation carried out below to present embodiment, and lead Illustrate and 1 difference of embodiment.
Overlooking state as shown in Figure 7 is such, and upper mold 16 includes pedestal 28；The central module 30 of rectangular shape, is fixed Ground is assembled in pedestal 28；And clamping piece 32, it surrounds central module 30 and is assembled in capable of moving forward and backward and (move up and down) Pedestal 28.The through-hole 32a of rectangular shape is formed on the clamping piece 32 for surrounding central module 30, central module 30 is to be inserted into Mode in through-hole 32a is assembled in pedestal 28.In addition, as shown in fig. 7, upper mold 16 has multiple communication paths 34 (in Fig. 7 In, the state of perspective is indicated using dotted line), multiple communication paths 34 are by mold exterior and including opposite with central module 30 Die cavity recess portion 12 (in Fig. 7, opposite position is indicated using single dotted broken line) including mould inside 20 (referring to Fig. 3) phase Connection.The one end by die cavity recess portion 12 (mould inside 20) side of multiple communication paths 34 is in the opening portion of die cavity recess portion 12 Circumferential openings, the other end by mold outer side of multiple communication paths 34 and pressure regulating part 22,23 phase of pressure measurement portion Connection.The one end of multiple communication paths 34 around the opening portion of die cavity recess portion 12 scheduled position (such as resin R hold The direction easily flowed outward from center is difficult to the direction flowed outward from center) opening.In the present embodiment, as One example, under overlooking state shown in Fig. 7, the side central portion of the through-hole 32a of the rectangular shape of clamping piece 32 and corner Position is respectively equipped with 1 communication paths 34, which is connected with pressure regulating part 22.In addition, 34 energy of communication paths It is enough freely to configure, additionally it is possible to be only configured at corner.
Herein, it is specifically described referring to Fig. 8 and Fig. 9 and the flowing of the resin R as caused by shape of die cavity recess portion 12 etc. The corresponding pressure regulating part 22 of complexity adjusting movement.It in figs. 8 and 9, as an example, is by fluid resin The explanatory diagram that occupied state when with shape circular in shape supplying to the workpiece W for overlooking rectangular shaped is illustrated.It is right In fluid resin, in order to improve productivity ratio, the resin for the predetermined amount that supply needs at the one of the center of workpiece W.In the situation Under, fluid resin is expanded due to die closing by mold compresses, so that circular in shape expands.
In these figures, with position in the face for the workpiece W for being held in upper mold 16 correspondingly, by resin R from workpiece W The heart is expressed as the shortest direction D1 of flow distance, the longest direction D2 of flow distance towards the direction that outside is flowed.In addition, In figs. 8 and 9, with position in the face for the workpiece W for being held in upper mold 16 correspondingly, according to initial position T0 (supply position Set), the 1st half-way T1, the 2nd half-way T2, the 3rd half-way T3 (latter stage position) sequence shown with time series The expanding location (outer shaped position) of resin R in the upper surface (bottom surface of die cavity recess portion 12) of mold cavity block 62.
For example, the relief portion 36 of pressure regulating part 22 is made to work, it is logical from the multiple connections being connected with relief portion 36 on one side (in addition, in Fig. 8, Fig. 9, hollow arrow indicates the size of decompression) filling tree on one side is equably depressurized to mould inside 20 in road 34 Rouge R.At this point, due to from the center of die cavity recess portion 12 play outside side central portion until distance (distance of direction D1) with Distance (distance of direction D2) until playing the corner in outside from the center of die cavity recess portion 12 is different, therefore, as shown in figure 8, Even if the resin R flowed to direction D1 reaches edge, the resin R of Xiang Fangxiang D2 flowing does not also reach corner, fills later (ginseng According to position T2).
Thus, for example, when one side makes 22 overall work of pressure regulating part and utilizes the adjusting of flow control division 38 and relief portion The gas flow of the 36 multiple communication paths 34 being connected come to mould inside 20 carry out decompression one side potting resin R when, such as Fig. 9 It is shown, it is preferentially flowed to direction D2 compared with direction D1, resin R.Specifically, from the connection on shortest direction D1 is located at Access 34 is depressurized most weakly, is most depressurized by force from the communication paths 34 being located on longest direction D2.Change speech It attracts in the communication paths 34 in corner air strongly and is depressurized compared with the communication paths 34 of side central portion.By This, resin R is easy the corner flowing towards after being depressurized strongly, and resin R is preferentially filled towards corner.Thus, in mould In chamber recess portion 12, on the direction towards its side central portion and the direction towards corner, the difference of occupied state becomes smaller, even if In the case that the fluid resin of rounded supply is filled relative to the die cavity recess portion 12 of rectangle, can also it fill uniformly with.That is, energy It enough prevents stomata, be not filled by position, so as to improve the quality of formed products.
In addition, attract strongly in the communication paths 34 in corner compared with the communication paths 34 with side central portion air from And in the case where being depressurized, either, only attract air from the communication paths 34 in corner and depressurized, is also possible to The communication paths 34 in corner of froming while carrying out air pressurized from the communication paths 34 of side central portion are depressurized.
Embodiment 3
In said embodiment, it illustrates to depressurize the confined space in a pair of of the mold 14 for carrying out compression molding The case where.In the present embodiment, referring to Fig.1 0~Figure 14 illustrate include pressure regulating part 22 resin molding apparatus 10A, should Pressure regulating part 22 is used for the multiple companies being connected with the mould inside 20 formed by the chamber portion 14B of encirclement forming section 14A The gas flow on road 34 is adjusted all.Figure 10 is the figure for illustrating the resin molding apparatus 10A of present embodiment.Figure 11 ~Figure 14 is the schematic cross sectional views of the major part of the resin molding apparatus 10A in movement shown in Fig. 10, ester moulding dress The axis that 10A is set relative to tank 84 (plunger 86) is symmetrical, and therefore, the die cavity recess portion 12 for extracting left side is indicated.
The resin molding apparatus 10A of present embodiment be by transfer molding resin formation part (resin R) on the workpiecew come The device for manufacturing encapsulating products, in the same manner as the embodiment 1, resin molding apparatus 10A includes 14 (upper mold 16 of a pair of of mold With lower die 17), pressure regulating part 22, control unit 24, input unit 25 and display unit 26.In addition, resin molding apparatus 10A can also To include the pressure measurement portion 23 illustrated referring to Fig.1.In addition, it is recessed to be equipped with die cavity in upper mold 16 in resin molding apparatus 10A Portion 12 is equipped with the work holding portion thereof 74 (recess portion) for keeping workpiece W in lower die 17.Workpiece W before forming (by formed products) The multiple electronics zero being mounted on the substrate S (such as circuit board) for overlooking rectangular shaped and with matrix configuration on substrate S Part P (such as semiconductor chip) (referring to Fig.1 1).Workpiece W (formed products) after forming, which also has, seals multiple electronic component P Resin formation part (resin R) (referring to Fig.1 4).
Upper mold 16 includes pedestal 28, is formed as overlooking the recess portion 28a of rectangular shaped with opening portion；And center Module 30 is securely assembled in pedestal 28 in recess portion 28a.In the present embodiment, in the die face of central module 30, Runner gate 78 and die cavity recess portion 12 are communicatively equipped in two sides centered on reservoir (Japanese: カ Le) 76.In this way, a pair of of mold 14 have multiple die cavity recess portions 12 at upper mold 16, and the opening portion of multiple die cavity recess portions 12 is to be formed as example overlooking in rectangle shape The mode of shape is formed in central module 30.
The multiple connections being connected around the opening portion of die cavity recess portion 12 with mold exterior are led in addition, upper mold 16 has Road 70.For example, communication paths 70 are constituted and perforating to central module 30, communication paths 70 by die cavity recess portion 12 The one end of opening portion side is open in the die face (lower end surface) of central module 30, and communication paths 70 lean on the another of mold outer side One end is connected via pipeline with suction unit 18.Suction unit 18 in this after die closing for being depressurized.
Lower die 17 includes pedestal 60, is formed as overlooking the recess portion 60a of rectangular shaped with opening portion；Die sleeve 80, Pedestal 60 is assembled in recess portion 60a；Inserts 82 is assembled in die sleeve 80 in the recess portion 80a formed by die sleeve 80；Tank 84, it is equipped with multiple, multiple tank 84 is set to the central portion of inserts 82 with forming a line, and multiple tank 84 is supplied with resin R； And plunger 86, it is set in tank 84.The plunger 86, which becomes, can pass through well known driving included by resin molding apparatus 10A (not shown) is moved forward and backward in source.In addition, lower die 17 has the mold set on pedestal 60 in order to which mould inside 20 is closed Face (upper surface), by the containment member 33 sealed between upper mold 16 (pedestal 28) and lower die 17 (pedestal 60) (such as O shape seal Circle).
In addition, lower die 17 has the die face (upper surface) set on die sleeve 80, general in order to which mould inside 20 is closed The containment member 90 (such as O-ring seals) sealed between upper mold 16 (central module 30) and lower die 17 (die sleeve 80).
In addition, as shown in Figure 10, lower die 17 has mold exterior and includes that the die cavity recess portion 12 opposite with inserts 82 exists Multiple communication paths 34 that interior mould inside 20 (referring to Fig.1 2) is connected (in Figure 10, perspective are indicated using dotted line State).The one end by die cavity recess portion 12 (mould inside 20) side of multiple communication paths 34 is by tank 84 and surrounding more A die cavity recess portion 12 is considered as integrated whole circumferential openings, the other end by mold outer side of multiple communication paths 34 and Pressure regulating part 22 is connected.For example, multiple communication paths 34 are constituted and perforating to pedestal 60, multiple communication paths 34 one end is connected with the inner wall of the recess portion 60a of pedestal 60, the other end of multiple communication paths 34 via pipeline with Pressure regulating part 22 is connected and connects.
Such a pair of mold 14 includes forming section 14A, and with die cavity recess portion 12, forming section 14A makes to be filled into mould Resin R heat cure in chamber recess portion 12；And chamber portion 14B, it is arranged in a manner of surrounding forming section 14A, chamber portion 14B Mold exterior and mould inside are separated.Forming section 14A is configured to the central module 30 for having in upper mold 16, in lower die 17 Die sleeve 80, inserts 82 and tank 84.In addition, chamber portion 14B be configured to have the pedestal 28 of upper mold 16, lower die 17 pedestal 60 with And the containment member 33 clamped by pedestal 28 and pedestal 60, chamber portion 14B be capable of forming it is closed after mould inside 20 (in pedestal All regions).In the present embodiment, the one end of multiple communication paths 34 is in chamber portion 14B (more specifically lower die 17 Pedestal 60), outs open around opening portion in die cavity recess portion 12.Accordingly, even for example, having for carrying out A pair of of mold 14 of the forming section 14A of transfer molding is also easy to be easy resin R in die cavity recess portion 12 using pressure regulating part 22 The communication paths 34 at the position of flowing are weaker attracted (decompression) and are difficult to the position flowed to resin R in die cavity recess portion 12 Communication paths 14 attracted (decompression) strongly.
Next, illustrating the method for operating of resin molding apparatus 10A and illustrating the manufacturing method (manufacturing process) of formed products. Firstly, as shown in figure 11, in the state of the die sinking of a pair of of mold 14, for lower die 17, loading machine (not shown) will be utilized The workpiece W configuration (setting) of mould inside is transported in work holding portion thereof 74.In addition, to make plunger 86 keep out of the way after tank 84 in supply Give (setting) resin R.At this point, since a pair of of mold 14 is heated to predetermined temperature, the resin R hair being supplied in tank 84 Raw melting.
Next, as shown in figure 12, a pair of of mold 14 makes upper mold 16 and lower die towards closed mode state from the state of die sinking 17 is mutually close, and the containment member 33 of the upper surface of the pedestal 60 set on lower die 17 is made to abut (i.e. sealing ring contact) Yu Shangmo's 16 The lower end surface of pedestal 28.Mould inside 20 as a result, including die cavity recess portion 12 is closed.At this point, by making pressure in advance The relief portion 36 (referring to Fig.1) of adjustment portion 22 works, to depressurize via multiple communication paths 34 to mould inside 20, energy Enough it is set as arbitrary degassing phase.
Then, by further making upper mold 16 and lower die 17 mutually close, to make the upper end of the die sleeve 80 set on lower die 17 The containment member 90 in face abuts the lower end surface of the central module 30 of (i.e. sealing ring contact) Yu Shangmo 16, utilizes suction unit as a result, 18 air started in the narrower range to the inside of containment member 90 depressurize.
Then, by further making upper mold 16 and lower die 17 mutually close, as shown in figure 13, to utilize the center of upper mold 16 The inserts 82 of module 30 and lower die 16 is across release film (not shown) clamping workpiece W (substrate S).Die cavity recess portion 12 is opened as a result, Oral area is occluded by workpiece W (substrate S) and forms die cavity.In addition, being arranged in the lower end surface of central module 30 by 70 He of communication paths The air discharge duct (not shown) that die cavity recess portion 12 is connected, even if as a result, in the central module 30 and lower die 16 for passing through upper mold 16 The clamping of inserts 82 and make between die face there is no after gap, also can be to being depressurized in die cavity recess portion 12 (die cavity).
Then, as shown in figure 14, the plunger 86 in tank 84 is made to stretch out and squeeze out resin R, by resin R via reservoir 76 It is sent to die cavity recess portion 12 with runner gate 78, fills die cavity recess portion 12 using resin R.At this point, consider in die cavity recess portion 12, because The configuring condition of electronic component P and generate resin R be easy flowing (i.e. flow resistance is lower) position and resin R be difficult to flow The position of (flow resistance is higher).Even if in this case, can also be carried out in advance for example such as using pressure regulating part 22 Lower operation: (decompression) is weaker attracted to the resin R communication paths 34 for holding runny position, resin R is difficult to flow The communication paths 34 at position attracted (decompression) strongly.Thus, it is possible to prevent in each die cavity recess portion 12 generation stomata, not Position is filled, so as to reduce the quality deviation of each formed products.
In this case, additionally it is possible to pressure regulating part 22 is utilized, it is runny relative to resin R appearance via communication paths 34 Position is pressed into gas and pressurizes to mould inside 20, keeps occupied state uniformly or different.
Then, heat cure predetermined time in the state of keeping pressure to the resin R being filled into die cavity recess portion 12.It connects , a pair of of mold 14 is opened, keeps upper mold 16 and lower die 17 separate, workpiece W is taken out into (conveying) to mold exterior.Further, As post-processing, by by resin formation part heat cure (secondary curing) predetermined time of workpiece W, to complete the electricity of workpiece W Sub- part P is by the formed products after resin R (resin formation part) resin seal.
In addition, the resin R being fed into tank 84 can melted because of its composition, preparation method in the state of shown in Figure 11 When generate including vapor etc. including a large amount of gas.What is contained in the gas is attached to opening for die cavity recess portion 12 at branch Oral area etc. and reduce release property, sometimes to forming quality cause adverse effect.In contrast, can terminate in the discharge of gas Do not attract air positioned at the communication paths 34 of the position of 84 opposite side of tank from across die cavity recess portion 12 before, and it is close from being located at The gas is discharged in the communication paths 34 of the position of tank 84.Then, from after the discharge of gas terminates at the time of, also from across mould Chamber recess portion 12, which is located at, attracts air with the communication paths 34 of the position of 84 opposite side of tank.Thereby, it is possible to reduce to die face (especially It is die cavity recess portion 12) bring adverse effect.In this case, additionally it is possible to be, by from being located at across die cavity recess portion 12 and tank The communication paths 34 of the position of 84 opposite sides are pressed into air, non-active gas, to make the gas generated from resin R not to die cavity Recess portion 12 flows, to prevent gas from contacting with die cavity recess portion 12.By carrying out such countermeasure, for example, from preventing release property from dropping From the viewpoint of low, the mold material of the low adhesion containing yttrium oxide, zirconium oxide (including base material or is surface-treated The case where) it is also effective.
Embodiment 4
In the embodiment 3, the case where configuring workpiece W across 86 ground of plunger is illustrated.In the present embodiment, join Illustrate the one end and tank 84 around the opening portion of die cavity recess portion 12 equipped with multiple communication paths 34 according to Figure 15~Figure 16 Resin molding apparatus 10B.Figure 15 is the figure for illustrating the resin molding apparatus 10B of present embodiment.Figure 16 is in movement The schematic plan of the major part of resin molding apparatus 10B, show from tank 84 by the resin R of 86 force feed of plunger according to (A), the appearance that is flowed on the workpiece W in die cavity recess portion 12 of sequence of (B), (C), (D), (E), (F).
Resin molding apparatus 10B is to manufacture WLP product by transfer molding resin formation part (resin R) on the workpiecew Device, in the same manner as the embodiment 1, resin molding apparatus 10B includes a pair of of mold 14 (upper mold 16 and lower die 17), pressure Power adjustment portion 22, control unit 24, input unit 25 and display unit 26.In the present embodiment, it is recessed that die cavity is equipped in upper mold 16 Portion 12 is equipped with the work holding portion thereof 74 (recess portion) for keeping workpiece W in lower die 17.In addition, resin molding apparatus 10B includes Suction unit (not shown), the suction unit are adsorbed with the die face including die cavity recess portion 12 along upper mold 16 and keep release The mode of film F attracts release film F.Workpiece W (by formed products) before forming has the substrate S for overlooking circular in shape (such as loading plate, wafer or circuit board) and multiple electronics zero on substrate S are flip-chip mounted with matrix configuration across convex block Part P (such as semiconductor chip).Workpiece W (formed products) after forming also have carry out molded bottom filling and by multiple electronics zero The resin formation part (resin R) of part P sealing, surface (face opposite with the face for the being formed with convex block) exposure of electronic component P.This Outside, it is also possible to match using above-mentioned resin molding apparatus 10B overlooking other than circular in shape on the substrate S of shape with matrix Set the resin for not implemented molded bottom filling without using carrying with being flip-chip mounted on workpiece W made of multiple electronic component P It shapes (resin seal).
Upper mold 16 has pedestal 60, can move back and forth the mold cavity block 62 for being assembled in the vertical view circular in shape of pedestal 60 And it is formed with the clamping piece 64 of the through-hole 64a for the vertical view circular in shape being inserted into for mold cavity block 62.A pair of of mold 14 is in upper mold 16 have die cavity recess portion 12, and the bottom of die cavity recess portion 12 is made of the lower end surface of mold cavity block 62, and the side of die cavity recess portion 12 is by pressing from both sides The medial surface (inner wall of through-hole 64a) of gripping member 64 is constituted.Therefore, the opening portion of die cavity recess portion 12 is formed as overlooking rounded shape Shape.In addition, upper mold 16 die face, the lower end surface of clamping piece 64 be formed with the reservoir 76 being connected with die cavity recess portion 12 With runner gate 78.Clamping piece 64 surrounds mold cavity block 62, and can move up and down by elastic component 66 (such as spring) and (retreat and move It is dynamic) be assembled in pedestal 60.Become in such upper mold 16 with flowering structure: mold cavity block 62 and clamping piece 64 are that opposite can move The depth (i.e. volume) of dynamic relationship, the opening portion of die cavity recess portion 12 can change.In the lateral surface and clamping piece of mold cavity block 62 It is formed with gap between 64 medial surface, but gap is used for the mold including die cavity recess portion 12 along upper mold 16 Face absorption keeps the attraction access of release film F.Due to clamping work in the inserts 82 of mold cavity block 62 and lower die 17 using upper mold 16 Release film F is attached at the surface of electronic component P when part W, and therefore, after demoulding, the surface of electronic component P is exposed.
In the present embodiment, in lower die 17, along being equipped with around the opening portion of die cavity recess portion 12, multiple connections are logical The one end and tank 84 on road 34.In fig. 16 it is shown that the appearance of the resin R flowed on the workpiece W in die cavity recess portion 12, shows The case where having gone out the position opening with hollow arrow of the one end of communication paths 34 around workpiece W.In addition, using should The direction of hollow arrow shows the attraction carried out from communication paths 34 to the mould inside 20 including die cavity recess portion 12 (decompression), air compress (pressurization).Using such resin molding apparatus 10B, pass through the air of decompression, pressurization to air It is controlled at the time of the direction of flowing, the intensity of the decompression and pressurization, movement etc., can be improved the resin of die cavity recess portion 12 Fillibility.In addition, around the opening portion of die cavity recess portion 12, however it is not limited to 1 tank 84 (plunger 86), it both can be across die cavity Two tanks 84 (plunger 86) are arranged in the opposite position of recess portion 12, and multiple tanks can also be arranged at a predetermined interval (such as every 90 °) 84 (plungers 86).
Next, illustrating the method for operating of resin molding apparatus 10B and illustrating the manufacturing method (manufacturing process) of formed products. In the initial stage shown in Figure 16 (A), such as from all communication paths 34 air in die cavity recess portion 12 is attracted And mould inside 20 is depressurized.Then, in the filling initial stage shown in Figure 16 (B), oneself is located at and 84 opposite side of tank Position communication paths 34 attract air, and from addition to this communication paths 34 carry out air compression.Tank 84 is come from as a result, Resin R flowed in a manner of through the central portion of workpiece W, as shown in Figure 16 (C), resin R is diametrically to cross workpiece W Mode flow to the side opposite with 84 place side of tank.
In the case where the flowing of not formed air as described above, resin R is filled out while flowing in the periphery of workpiece W It fills.The reason is that having biggish not equipped with electronic component P (obstacle) region, the easy stream of resin R in the periphery of workpiece W It is dynamic.It also confirms in this case, resin R is preferentially filled along the periphery of workpiece W, as a result, in a manner of surrounding workpiece W The resin R being filled with continue to die cavity recess portion 12 center filling, be easy die cavity recess portion 12 center generate stomata, be not filled by Position.In contrast, by being controlled as the present embodiment, resin R is filled first in the center of die cavity recess portion 12, Thus, it is possible to be reliably prevented die cavity recess portion 12 center generate stomata, be not filled by position.
Resin R is throughout between each electronic component P that the diametrical direction of workpiece W is installed as a result,.Then, such as Figure 16 (D) It is shown, it switches over and attracts air from all communication paths 34, as shown in Figure 16 (E), Figure 16 (F), by the way that work will be crossed Resin R after the central portion of part W is to the direction force feed intersected with resin R, so that resin R passes through electronic component in this direction Die cavity recess portion 12 is filled uniformly between P.
In this way, using resin molding apparatus 10B, for example, even if in the workpiece W tree relative to large-scale circular shape In the case that rouge shapes, it can also utilize the pressure regulating part 22 being connected with multiple communication paths 34 that resin R is made to concentrate on work It after the central portion of part W, equably extends, will be filled in die cavity recess portion 12 from the resin of the central portion to peripheral part.Thus, energy It enough prevents stomata, be not filled by position, so as to improve the quality of formed products.
More than, the present invention is specifically illustrated according to embodiment, but the present invention is not limited to the embodiments, such as It is following such, it can make various changes within the scope of its spirit certainly.
For example, illustrating to be installed on workpiece made of entire substrate to by multiple electronic components in the embodiment 1 Central supply resin and the feelings in die cavity recess portion are filled using resin in a manner of extending resin outward from the center Condition.It is not limited to this, resin is supplied by the space not being available and electronic component is installed at the center of substrate to this, so that tree The mode that rouge extends outward is filled using resin in die cavity recess portion, can be improved fillibility.
In addition, in the above-described embodiment, for the company being connected with the mould inside 20 including die cavity recess portion 12 Road 34 all illustrate the structure of the decompression, the pressurization that arbitrarily control air, but the present invention is not limited to this.That is, for for Adsorb and keep film F and the communication paths 70,72 that configure, can also be arranged in the same manner as communication paths 34 it is multiple, and individually Ground is controlled.Hereby it is possible to prevent plate face it is in large size caused by, the adsorption strength of film F it is unbalanced.
In addition, by be respectively set it is multiple in order to adsorb and keep film F and the communication paths 70,72 that configure and with include mould Both communication paths 34 that mould inside 20 including chamber recess portion 12 is connected simultaneously can be controlled individually, additionally it is possible to be made They interlock and are acted synergistically.Using such structure, even if must be inhaled due to the in large size of workpiece W in decompression The volume drawn significantly increases and needs to be depressurized and produced strongly in a short time to the biggish die face of covering The needs that film is adsorbed also can equably be subtracted in the case where the state depressurized using access 34 is kept in balance Pressure.Thereby, it is possible to equably adsorbed film F on the whole.Accordingly, for example, the balance of the decompression and absorption in die cavity can be prevented It is broken and the film F of a part is made to be pulled to the side opposite with adsorption plane to remove from die face.

Claims (9)

1. a kind of resin molding apparatus, which is characterized in that
The resin molding apparatus includes:
A pair of of mold, a pair of mold have die cavity recess portion, are able to carry out die sinking die closing；And
Pressure regulating part is used to that the pressure of the mould inside including the die cavity recess portion to be adjusted,
The pair of mold has multiple communication paths that mold exterior is connected with the mould inside,
And have and surround the die cavity recess portion and be configured at die face and the sealing element that the mould inside is closed, it is the multiple The circumferential openings by the one end of the mould inside side in the opening portion of the die cavity recess portion of communication paths, the multiple company The other end by the mold exterior side on road is connected with the pressure regulating part all,
The pressure regulating part includes
Relief portion, the mould inside after being used to surround via the multiple communication paths to die closing and by the sealing element Gas attracted and the mould inside depressurized；And
Flow control division is used to that the respective gas flow of the multiple communication paths to be adjusted,
The mould inside is directed at while adjusting the gas flow of multiple communication paths using the flow control division to subtract Pressure is weaker depressurized to the communication paths being easy on the direction of flowing are located at, on the direction for being not easy flowing Communication paths are depressurized strongly, to be adjusted.
2. resin molding apparatus according to claim 1, which is characterized in that
The pressure regulating part includes
Pressurization part, be used for via the multiple communication paths to the mould inside be pressed into gas and to the mould inside into Row pressurization；And
Switching part is used to be attached the multiple communication paths between the relief portion and the pressurization part respectively and cut It changes.
3. resin molding apparatus according to claim 1, which is characterized in that
The pressure regulating part has flow measurement portion, which is used for the respective stream to the multiple communication paths Amount measures.
4. resin molding apparatus according to claim 1, which is characterized in that
The resin molding apparatus includes pressure measurement portion, which is used for leading to described be connected to the mould inside The pressure of the adjacent part of the one end on road measures.
5. resin molding apparatus according to claim 1, which is characterized in that
The pair of mold includes
Forming section, with the die cavity recess portion, which can make the resin thermosets being filled into the die cavity recess portion；With And
Chamber portion is arranged in a manner of surrounding the forming section, and the chamber portion is by the mold exterior and the mould inside It separates,
The one end of the multiple communication paths is set to the chamber portion around the opening portion of the die cavity recess portion.
6. resin molding apparatus according to claim 1, which is characterized in that
Multiple die cavity recess portions that the pair of mold has tank and is connected with the tank,
The tank and multiple die cavity recess portions are being considered as integrated entirety by the one end of the multiple communication paths Circumferential openings.
7. resin molding apparatus according to claim 1, which is characterized in that
The die cavity recess portion that the pair of mold has tank and is connected with the tank,
The one end and the tank of the multiple communication paths are equipped with around the opening portion of the die cavity recess portion.
8. resin molding apparatus according to any one of claim 1 to 7, which is characterized in that
The resin molding apparatus further include:
Release film is adsorbed the die face being held in including the die cavity recess portion；And
1st suction unit and the 2nd suction unit, the 1st suction unit and the 2nd suction unit are used to attract the release film,
The pair of mold, which has, to be connected and is used for carry out the release film with the mould inside by the mold exterior The multiple 1st film communication paths and multiple 2nd film communication paths attracted,
The week of the opening portion by the one end of the mould inside side in the die cavity recess portion of the multiple 1st film communication paths It encloses and is open in the die face, the other end by the mold exterior side of the multiple 1st film communication paths and institute The 1st suction unit is stated to be connected,
The one end by the mould inside side of the multiple 2nd film communication paths is with the corner part phase with the die cavity recess portion The mode of connection is open in the bottom periphery of the die cavity recess portion, and the multiple 2nd film communication paths lean on the mold exterior side The other end be connected with the 2nd suction unit.
9. a kind of resin molding apparatus, which is characterized in that
The resin molding apparatus includes:
A pair of of mold, a pair of mold have die cavity recess portion, are able to carry out die sinking die closing；
Release film is adsorbed the die face being held in including the die cavity recess portion；And
1st suction unit and the 2nd suction unit, the 1st suction unit and the 2nd suction unit are used to attract the release film,
The pair of mold, which has, to be connected with mould inside by mold exterior and is used to attract the release film more A 1st film communication paths and multiple 2nd film communication paths,
The week of the opening portion by the one end of the mould inside side in the die cavity recess portion of the multiple 1st film communication paths It encloses and is open in the die face, the other end by the mold exterior side of the multiple 1st film communication paths and institute The 1st suction unit is stated to be connected,
The one end by the mould inside side of the multiple 2nd film communication paths is with the corner part phase with the die cavity recess portion The mode of connection is open in the bottom periphery of the die cavity recess portion, and the multiple 2nd film communication paths lean on the mold exterior side The other end be connected with the 2nd suction unit,
Multiple 1st film communication paths and multiple 2nd film communication paths are individually carried out in a manner of power is arranged Attract control.
CN201580072847.3A 2015-01-09 2015-07-23 Resin molding apparatus Active CN107107398B (en)

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JP2015003139A JP6438772B2 (en) 2015-01-09 2015-01-09 Resin molding equipment
JP2015-003139 2015-01-09
PCT/JP2015/070951 WO2016111028A1 (en) 2015-01-09 2015-07-23 Resin formation device

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JP6800007B2 (en) * 2016-12-16 2020-12-16 アピックヤマダ株式会社 Resin molding equipment and resin molding method
JP6971780B2 (en) * 2017-10-27 2021-11-24 上村工業株式会社 Work holding jig and load / unload device
SK500282019A3 (en) * 2019-05-28 2020-12-02 Manz Slovakia S R O Device for pressing shaped moldings, particularly into multilayer film

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JP2013123849A (en) * 2011-12-14 2013-06-24 Apic Yamada Corp Resin sealing device and resin sealing method

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JP6438772B2 (en) 2018-12-19
WO2016111028A1 (en) 2016-07-14

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