JPH11165847A - Ic device reversing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reverse IC devices placed on a test board, accurately and positively with simple and compact constitution. SOLUTION: A test board 10 provided with a large number of carriers 12 arranged is used in connecting each IC device to a test head in an IC tester to test an electrical characteristic. Each carrier 12 is provided with a device placing part, and in the state of placing the IC device on each carrier 12, each carrier 12 is simultaneously reversed by about 180 deg. and reciprocated by a rack 21 and a pinion 19.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a CSP (Chip Sca)
le Package) type, BGA (Ball Grid Array) type, etc.
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC device reversing device for reversing an IC device in a state of being clamped to a carrier when a C device is tested.

[0002]

2. Description of the Related Art An IC device is an LSI (Large Scaled I).
A predetermined number of electrodes are provided on the chip. The package system is such that lead pins are connected to each electrode, and the LSI chip is sealed with resin. The one that is drawn out from the side of the part has been widely used. However, in recent years, a package has been developed in which the size of the package is reduced to almost the same size as the LSI chip, and an electrode composed of a solder ball, a lead frame, or the like is arranged on one side of the package. It has been put to practical use. This package method is C
These are called SP, BGA, etc., which can reduce the size of the device and reduce the mounting space on the printed wiring board.
Also, it is mounted on a portable electronic device such as a mobile phone, a notebook personal computer or the like, and is used for further downsizing and downsizing these devices.

By the way, the above-mentioned CSP and BGA type I
The test / measurement of the electrical characteristics of the C device is performed such that an electrode formed of a solder ball or the like of the IC device is electrically connected to an electrode on the test head side with respect to the test head of the IC tester. The electrodes are formed on one side of the package portion, and are formed in a large number at small pitch intervals. Therefore, when connecting to the test head, the IC device must be strictly positioned and then pressed against the test head. Also,
In order to efficiently test an IC device, a test board is used, a large number of IC devices are mounted on the test board, and these IC devices are simultaneously connected to a test head. To this end, the test board is provided with a required number of carriers, and each carrier is provided with a clamping means, so that the IC device is placed at a predetermined position of the carrier, and is positioned accurately and then clamped. Is fixedly held.

Therefore, first, the test board is placed at the loading / unloading position, the IC device is mounted on each carrier, and the electrical characteristics of the IC device at the test position where the test head is provided while the test board is being transported. Will be tested. When the test is completed, the test board is returned to the load / unload position, and the tested IC device is taken out of each carrier and stored in a predetermined pallet or the like based on the test result. Then
A new IC device is mounted on this test board.
Although loading and unloading of the IC device can be performed at the same station, the loading and unloading may be performed at different positions.

Here, loading and unloading of the IC device is generally performed by a robot using a suction nozzle. Since the IC device is clamped in the carrier by the clamp means, the loading and unloading of the IC device requires displacing the clamp means of the carrier to the clamp release position. In vacuum-sucking an IC device, it is necessary to suck a flat surface. Since the IC device is provided with an electrode such as a solder ball on one surface thereof, it is not possible to attract the electrode forming surface. Therefore, the surface opposite to the electrode forming surface is attracted. As a result, when the IC device is mounted on the carrier, its electrode forming surface faces downward.

[0006] In order to test an IC device, it is connected to a test head of an IC tester. The electrodes of the test head and the electrodes of the IC device must be opposed to each other. As mentioned above, the test board uses IC
Since the electrodes of the device are facing down, the test head must be located below the test board, and thus the position of the test head is constrained by the test board.

[0007]

By the way, in addition to the test at normal temperature, the IC device may be tested by heating or cooling to a predetermined temperature in some cases. IC
When the device is heated or cooled, a thermostat whose temperature is controlled to maintain a constant temperature state is used. By placing a test board having an IC device mounted on a carrier in a constant temperature bath for a predetermined time, the IC device is connected to a test head while being heated or cooled to a set temperature. In this case, in order to heat or cool the IC device more efficiently, a pitch feeding means is provided in the thermostat so that the test board is sequentially pitch-fed, and the pitch is fed to a predetermined position. Then, the IC device is set to the set temperature. In the space inside the constant temperature chamber, the temperature control is often easier in the upper part than in the lower part. In the overall configuration of the IC device test apparatus, the arrangement of the constant temperature chamber and the IC tester that performs the test is performed. As a relation, it may be preferable to dispose the IC tester on the upper part.

As described above, the test board uses an IC
Since the electrodes of the device face downward, if the test head of the IC tester is arranged at an upper position such as a thermostat, the IC device must be inverted when performing a test. In the test board, the IC device is clamped by the clamping means provided on the carrier. Therefore, if the test board is turned over, the electrodes of the IC device will be in the state of facing upward, and it will be possible to connect with the electrodes of the test head. To this end, a configuration is conceivable in which a reversing mechanism is installed in the transport path of the test board, and during transport of the test board, the test board is reversed by the reversing mechanism and then connected to the test head. However, test boards need to have as many carriers as possible for efficient testing,
For this reason, the test board becomes large. In order to invert such a large test board, the configuration of the inversion mechanism becomes large, and a wide inversion space is required.
Problems such as a complicated and large-sized IC device test apparatus arise.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and an object of the present invention is to provide a simple and compact structure for accurately and reliably inverting an IC device mounted on a test board. To be able to do it.

[0010]

In order to achieve the above object, the present invention provides a test board in which carriers provided with device clamping means are arranged in a predetermined direction, and each carrier has a device body. For positioning and clamping an IC device provided with an electrode on one side surface with the electrode forming surface positioned on the carrier side, and inverting the IC device thus clamped. Is provided with a pinion connected,
The test board was provided with a rack that meshed with each of the pinions so as to extend in the direction in which the carriers were arranged, and the rack was reciprocated by a predetermined stroke by a driving unit, so that the rack was mounted on each of the carriers. I
The feature is that the C device is configured to be capable of reciprocating reversal by approximately 180 °.

Here, in order to conduct a test or the like efficiently, the test board is provided with as many carriers as possible, but for this purpose, the carriers may be arranged in a plurality of rows. To invert all the carriers at the same time, the racks in each row may be connected to each other by connecting members, and the connecting members may be reciprocated by driving means. Although the racks can be reciprocated by the driving means, each rack is always arranged at a position where all the carriers are kept in an inverted state by the urging force of the spring, and this connecting member is pushed by a cylinder or the like. A configuration can be adopted in which the member is displaced to a non-reversed state by being pushed by means. Further, at the time of testing, each carrier needs to be copied to the test head side. For this purpose, the engagement between the rack provided on the test board and the pinion of the carrier must be released. For this purpose, the rack is configured to be displaceable between a state in which the rack meshes with the pinion and a state in which the rack is released.In particular, the rack is provided with biasing means for biasing in a direction in which the rack meshes with the pinion. What is necessary is just to make it possible to release the meshing with the pinion by pushing in the direction against the urging means.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below. In the following description, a thermostat is provided to heat or cool an IC device mounted on a test board, perform temperature management to a predetermined temperature, and then connect the IC device to a test head. However, it is also possible to configure so that the test is performed without controlling the temperature of the IC device.

FIGS. 1 and 2 show a schematic configuration of an IC device test apparatus, and FIG. 3 shows a configuration of the IC device. First, in FIGS. 1 and 2, 1 is a handler unit, 2 is a thermostat, and 3 is an IC tester. Handler part 1
Is provided with a transfer robot 4 for transferring the IC device D, and is a work position for loading and unloading. The transfer robot 4 has suction means 6 capable of displacing a suction head 5 for vacuum-sucking the IC device D in a horizontal direction and a vertical direction. Here, in order to efficiently transfer the IC device D, the suction unit 6 is provided with a plurality of, for example, four suction heads 5.
Each of the suction heads 5 can simultaneously transfer four IC devices 7. In addition, the suction head 5
Are provided for loading and unloading.

The handler unit 1 is provided with a number of trays, and the transfer robot 4 moves the test board 1 from the trays.
A loading operation of transferring the IC device 7 to 0 and an unloading operation of transferring the IC device 7 having completed the test from the test board 10 to the tray based on the test result are performed. Here, I between the tray and the test board 10
To transfer the C device 7 for transportation and storage,
While a tray having a simple structure is used to accommodate as many IC devices 7 as possible with a small jig,
As a jig for transporting the IC device 7 during the test,
This is because a mechanism or the like for clamping the IC device 7 in a positioned state must be provided, and for this purpose, a test board 10 having a configuration described later must be used.

When a predetermined number of IC devices 7 are mounted on the test board 10 by the handler section 1, the test board 1
0 is inserted into the constant temperature bath 2 through a conveyor or another transport path. The temperature inside the thermostat 2 is strictly controlled, and the IC board 7 is heated or cooled to a set temperature by placing the test board 10 in the thermostat 2 for a predetermined time. In order to efficiently heat or cool the IC device 7, a plurality of test boards 10 can be accommodated in the thermostat 2 and a test in the thermostat 2 is performed by a pitch feed mechanism (not shown). The board 10 is sequentially pitch-fed upward with the test time as one unit.

The test head 3a of the IC tester 3 faces the upper position where the temperature control is most accurately performed in the thermostat 2, and the test board 10 is pitch-fed in the thermostat 2 and located at the uppermost position. Then, the electrodes of the IC device 7 are connected to the electrodes of the test head 3a,
The test of the electrical characteristics is performed by applying current to the power supply. When the test is completed, the test board 10 is
And returned to the handler unit 1 and the tested I
Take out the C device 7 and then a new IC device 7
Is placed. At the same time, the uppermost test board 10
Moves to the IC tester 3 side, and the test boards 10 in the thermostat 2 are each raised by one pitch. Further, a new test board 10 is supplied to the lowermost stage of the pitch feed mechanism.

By repeating the above operation, the test of the electrical characteristics of the IC device 7 is continuously performed.
As the IC device 7 on which this test is performed, for example,
This is a BGA type device shown in FIG. This IC
The device 7 includes an insulating sheet 8b on a ceramic substrate 8a.
On the insulating sheet 8b.
And an IC on the back side of the ceramic substrate 8a.
A configuration in which a required number of solder balls 8d are provided as electrodes of the device 7, wire bonding is performed between each of the solder balls 8d and an electrode of the LSI chip 8c, and the LSI chip 8c and wires are sealed with a sealing resin 8e. It is what it was. Therefore, the device main body is constituted by the LSI chip 8c, the ceramic substrate 8a, the sealing resin 8e, and the like, and the electrodes composed of the solder balls 8d are provided on one surface. Therefore, the surface of the IC device 7 on which the solder balls 8d are provided is the electrode forming surface 7a, and the electrode forming surface 7a has irregularities. 7b. In addition,
The connection between the LSI chip 8c and the solder ball 8d can be formed by a film substrate, a bump or the like other than the wire bonding. In addition, the electrodes of the IC device 7 may be formed of a film or the like in addition to the solder balls 8d.

The IC device 7 configured as described above is connected to the test head 3a of the IC tester 3 to test the electrical characteristics. A test board 10 used for the test is shown in FIGS. As shown in the drawing, the test board 10 has a large number of carrier accommodating spaces 10a formed by providing grids in the frame in the vertical and horizontal directions. And
A plurality of support members 11 are provided to extend in the front-rear direction of the frame.
And is arranged in each carrier accommodating space 10a. Accordingly, a plurality of carriers 12 are arranged along the direction of the support member 11. The upper and lower sides of the carrier accommodating space 10a are open, so that the carrier 12 can be turned over in the carrier accommodating space 10a.

As shown in FIGS. 6 to 8, the carrier 12 has a carrier body 13 in which an opening 13a having a middle size between the outer diameter of the IC device 7 and the formation area of the solder ball 8d is formed at the center. And a pair of notches 13b connected to the opening 13a are formed to face each other. A shaft 1 is provided on the wall surface of each of the notches 13b.
The clamp 14 is attached to the shaft 14 so as to be rotatable around the shaft. The clamp lever 15 is normally urged by a spring 16 so as to be in a device clamp state. The clamp lever 15 is provided with an operating portion 15a extending rearward of a portion through which the shaft 14 is inserted. When the operating portion 15a is pushed from above, the clamp lever 15 is clamped from the area where the IC device 7 is mounted. The lever 15 is displaced to a retracted position where the lever 15 is retracted.

The IC device 7 is mounted on the carrier 12 while being positioned at a predetermined position. The part on which the IC device 7 is mounted is the device mounting part 17.
The device mounting portion 17 is a position including the opening 13a. In order to position the IC device 7, a reference wall 17a is formed in the device mounting portion 17 so as to be in contact with the outer peripheral surface of the IC device 7 and the outer peripheral side of the portion of the electrode forming surface 7a where the solder ball 8d is provided. The IC device 7 is placed such that the corners on the outer periphery of the IC device 7 abut against these reference walls 17a. In order to smoothly drop the IC device 7 into the device mounting portion 17, a calling portion 17 b formed in a tapered shape is provided upright on the carrier body 13 so as to correspond to four sides.
Therefore, when the IC device 7 is lowered from above the carrier 12 by the suction head 5 and is attached and detached at the height position of the attraction portion 17b or a position slightly above it, the IC
The device 7 is guided by the call-in portion 17b, and is arranged on the device mounting portion 17 defined by the reference wall 17a. Then, the solder ball 8 of the IC device 7
d are all located inside the opening 13a. Further, two positioning holes 18 are formed in the carrier body 13 so as to penetrate in the thickness direction.

The carrier 12 has a non-inverted position at which the IC device 7 can be introduced into the device mounting portion 17 from above, and a solder ball 8d of the IC device 7 mounted in the carrier 12.
Is approximately 180 ° reciprocally reversible between the reversing position in which the is turned upward. For this purpose, the shaft portion 19a of the pinion 19 is connected to one end of the carrier 12, and the support rod 20 is provided to project from the other end. As is clear from FIG. 9, the support member 11 is a hollow member, and includes the pinion 19 and the support rod 2.
0 extends into the support member 11 and this support member 1
A rack 21 is provided inside 1. Accordingly, the pinion 19 engages with the rack 21, and the end of the support rod 20 located inside the support member 11 has a stopper 20 a.
Are connected. Then, the pinion 19 and the support rod 20
Are the same axis, and this is the reversal axis. Therefore, when the rack 21 is moved in the front-rear direction, the pinion 19 rotates, and the carrier 12 reciprocates.

The number of racks 21 is equal to the number of rows of the carriers 12, that is, four racks 21 are shown in the figure. An operating rod 22 is connected to one end of each rack 21, and each operating rod 22 extends so as to protrude outside from the test board 10 and is connected to a connecting plate 23. Therefore, when the connecting plate 23 is pushed, all the racks 21 move in the front-rear direction in conjunction with each other. On the other hand, support shafts 24 are connected to the other end of the rack 21, respectively, and these support shafts 24 are arranged so as to pass through the other end side of the frame portion of the test board 10.

The carrier 12 is always in the inverted position, and is displaced to the non-inverted position by pushing the connecting plate 23. To this end, each of the operating rods 22 has a spring 2 biasing in a direction protruding from the test board 10.
5 is provided, and a stopper 26 for regulating the most protruding position of the operating rod 22 is provided in the support member 11. Thus, at this position of the rack 21, the pinion 19 is engaged with the rack 21 while the carrier 12 is held at the inverted position. The connecting plate 23 can be pushed in a direction against the spring 25 by using a cylinder 27. A stopper 28 that regulates the end of the rack 21 on the side where the support shaft 24 extends at the end position of the pushing stroke of the rack 21 by the cylinder 27 is provided.
In the position restricted by the above, the pinion 19 is rotated by 180 °, so that the carrier 12 is displaced to the non-reversed position.

The rack 21 can be further displaced between an operating position where the rack 21 meshes with the pinion 19 and a retracted position separated from the pinion 19. For this reason, as shown in FIG. 9, the rack 21 does not directly contact the lower surface of the support member 11, and a spring 29 is attached to the back side of the rack 21. It is in contact with the lower surface. Through holes 30, 30 are formed in the upper surface of the support member 11 at positions near both ends of the rack 21, and push rods 52, which will be described later, are inserted into these through holes 30 to push in the direction of the arrow. By doing so, the rack 21 can be pushed and displaced in a direction to separate the rack 21 from the pinion 19.

The test apparatus for testing the electrical characteristics of the IC device 7 is constructed as described above. The handler unit 1 has a large number of trays TL containing the IC devices 7 to be tested. The trays TU ₁ and TU ₂ that accommodate the IC device 7 are classified and classified into non-defective products and defective products based on the test results. The test board 10 is placed in the device transfer section of the handler section 1 and an IC to be tested from the tray T
The device 7 is transferred. The IC device 7 is mounted on each carrier 12 of the test board 10. Since the carrier 12 is always in the inverted position, the carriers 12 are displaced to the non-inverted position, and the clamps provided on the respective carriers 12 are provided. The lever 15 must be displaced to the retracted position. A cylinder 27 for displacing the carrier 12 in a non-inverted state is therefore provided at this position.

When the cylinder 27 is extended, the connecting plate 23
Is pushed to move the operating rod 22 in a direction against the spring 25, so that the rack 21 connected to the operating rod 22 moves. Therefore, although the pinion 19 meshing with the rack 21 rotates, the movement of the rack 21 is a stroke in which the pinion 19 rotates substantially 180 °, so that the pinion 19 is rotated 180 °. Since the pinion 19 is connected to the carrier 12, the pinion 19 follows the rotation of the pinion 19 and becomes a position where the carrier 12 is rotated by 180 °. In this state, the call-in portion 17b is directed upward from the reference wall 17a constituting the device housing area.

The carriers 12 are held at the non-reversed position, and the clamp lever 15 of each carrier 12 is displaced to the retracted position. For this purpose, a clamp release plate 40 is provided in the handler unit 1. This clamp release plate 40
As shown in FIG. 10, the opening 40 is formed of a plate that can be moved up and down, and through which the IC device 7 can pass.
a, and a push rod 41 is vertically provided. The pushing rod 41 is provided at a position corresponding to the operating portion 15a of the clamp lever 15, and when the clamp release plate 40 is lowered, the clamp lever 15
6 and is displaced to the retracted position. Here, the clamp release plate 40 is connected to the suction head 5 by an IC.
The clamp of the clamp lever 15 with respect to the carrier 12 on which the device 7 is to be transferred may be released. However, the clamp 12 corresponds to the carrier 12 provided on the test board 10 so that all the carriers 12 are released at once. Preferably, a pushing rod 41 is provided.

In a state where the clamp lever 15 is released from the clamp by the clamp release plate 40, the IC device 7 is positioned by the suction head 5 from the opening 40 a of the clamp release plate 40 into the inside of the call-in portion 17 b of the carrier 12, and the suction is performed. The IC device 7 is detached from the head 5. As a result, the IC device 7 is accommodated in a state in which it is lowered along the attraction portion 17b and positioned at a predetermined position by the reference wall 17a. In order to make the transfer of the IC device 7 to the device mounting portion 17 smoothly, the vacuum suction head 5 is not applied with a vacuum and the IC device 7 is not operated.
Is preferably pushed. And all carriers 12
When the IC device 7 is transferred to the
Is raised, the force of the pushing rod 41 on the operating portion 15a of the clamp lever 15 is released. As a result, the IC device 7 is clamped by the action of the spring 16 on the clamp lever 15. Here, the suction of the IC device 7 by the suction head 5 is performed on the upper surface of the sealing resin 8e,
That is, the process is performed on the flat surface 7b on the side opposite to the portion where the solder balls 8d are provided. Therefore, when the IC device 7 is mounted on the carrier 12, the solder balls 8d are oriented to the lower surface side.

Then, in order to invert the IC device 7 and change the direction so that the solder ball 8d is directed upward, the cylinder 27 is contracted and the pressing force to the connecting plate 23 is released. As a result, the operation rod 22 is displaced in the direction protruding from the test board 10 by the action of the spring 25, and the rack 21 moves, and the pinion 19 meshing with the rack 21 rotates. The rack 21 moves to a position where it comes into contact with the stopper 26, whereby the pinion 19 is rotated substantially 180 °. As a result, the carrier 12 is inverted, and the IC device 7 mounted on the carrier 12 changes its direction so that the solder ball 8d faces upward. Since the solder ball 8d faces the opening 13a of the carrier body 13, it is exposed in the opening 13a. Since the IC device 7 is clamped by the clamp lever 15, the IC device 7 does not fall off the carrier 12 even if it is inverted.

In this state, the test board 10 is carried into the constant temperature bath 2 along a required transport path, and the IC device 7 reaches the set temperature while being pitch-fed upward in the constant temperature bath 2. Heated or cooled. In this state, I
The C device 7 is a test head 3a in the IC tester 3.
, And a test of its electrical characteristics is performed as shown in FIG. As shown in the drawing, the test head 3a is provided with electrodes 50 corresponding to solder balls 8d as electrodes of the IC device 7, and each of the solder balls 8d is provided with an electrode through an opening 13a of the carrier 12. The test of the electrical characteristics is performed by making contact with 50.

Since it is necessary to securely contact all the solder balls 8d of all the IC devices 7 mounted on the test board 10 with the respective electrodes 50 of the test head 3a, each carrier 12 is individually attached to the test head 3a. Make them imitate. For this purpose, a required number of positioning pins 51 are provided vertically on the test head 3a. When the test board 10 is lifted, the positioning pins 51 vertically provided from the test head 3a are fitted into the pair of positioning holes 18 provided in each carrier 12, so that each carrier 12 is independently driven by the test head. 3a. However, a pinion 19 is connected to the carrier 12, and if the pinion 19 remains engaged with the rack 21, the positioning of the carrier 12 to the test head 3a may not be performed smoothly. Therefore, a push rod 52 (see FIG. 9) is vertically provided along with the positioning pin 51 on the test head 3a. And
When the test board 10 comes close to the test head 3a, the push rod 52 comes into contact with the both ends of the rack 21 and pushes it, thereby displacing the rack 21 in a direction away from the pinion 19 against the spring 29. As a result, all the carriers 12 are in a free state with respect to the rotation direction, so that even if each carrier 12 is slightly inclined at the time of reversing, it follows the test head 3a without fail.

Further, a pressing means 53 is provided, and the flat surface 7b of the IC device 7 mounted on each carrier 12 is pushed by the pressing means 53 to apply a pushing load to the IC device 7 so that all the devices are pushed. Carrier 12
The solder balls 8d constituting the electrodes of the respective IC devices 7 mounted on the test head 3a reliably contact the electrodes 50 of the test head 3a. In this state, when the IC device 7 is energized, a test of its electrical characteristics is performed. When the test is completed, the test board 10 is lowered and the test head 3a
Since the positioning pin 51 is separated from the positioning hole 18 of the carrier 12 and the pushing of the pushing rod 52 against the rack 21 is released, the rack 21 meshes with the pinion 19 by the action of the spring 29. It returns to the state where it does. Therefore, each carrier 12 is kept in a stable state unless a special external force is applied.

After the test, the test board 10 is conveyed from the thermostatic chamber 2 to the handler unit 1 where the IC device 7 is unloaded.
The unloading work is taken out of the IC device 7 from the carrier 12 by the suction head 5 of the transfer robot 4, it is housed in classified into a tray TU ₁ or TU ₂ based on the test results. Also at this time, the clamp release plate 4
By 0, the clamp lever 15 is displaced to the clamp release position. When the test board 10 becomes empty, a new IC device 7 is mounted from the tray TL, and the same procedure as described above is repeated to test the IC device 7 mounted on the test board 10.

As described above, when the IC device 7 is mounted on the test board 10, the suction head 5 is attached to the test board 10 with the electrode forming surface 7 a of the IC device 7 facing downward. Since the flat surface 7b side is sucked, the IC device 7 can be reliably mounted on each carrier 12 of the test board 10 without being dropped. Moreover,
Since all the carriers 12 are inverted by the rack-pinion mechanism with the IC device 7 placed on each carrier 12, the electrode forming surface 7 a of the IC device 7 is turned from the lower side to the lower side. The forming surface 7a can be directed upward. In this state, test board 1
By pushing 0 upward, the IC device 7 can be connected to the test head 3a. Then, the inversion of the IC device 7 is performed such that only the carrier 12 is inverted instead of the entire test board 10 and the carrier 1 is inverted.
Since the reversing operation 2 is performed by the cylinder 27 and the spring 25, the configuration of the reversing mechanism is significantly simplified, and since there is no need to take up a reversing space, the overall configuration of the test apparatus is simplified. In addition, miniaturization and compactness are achieved. Furthermore, when the IC device 7 is connected to the test head 3a, the pinion 19 connected to the carrier 12 is separated from the rack 21, so that each carrier 12 is substantially in a floating state. Even if the carriers 12 are slightly inclined, they can be individually and surely copied to the test head 3a.

[0035]

As described above, according to the present invention, since a large number of carriers provided on the test board are simultaneously inverted by the rack-pinion mechanism, the carrier is mounted on the test board with a simple and compact structure. There is an effect that the inverted IC device can be inverted accurately and reliably.

[Brief description of the drawings]

FIG. 1 is an overall configuration diagram of an IC device test apparatus according to an embodiment of the present invention.

FIG. 2 is a side view of FIG.

FIG. 3 shows a BGA as an example of an IC device to be tested.
FIG. 2 is an explanatory diagram of a configuration of a device of a type.

FIG. 4 is an external perspective view of a test board.

FIG. 5 is a partially enlarged plan view of a test board.

FIG. 6 is a plan view of a carrier.

FIG. 7 is a sectional view taken along line XX of FIG. 6;

FIG. 8 is a sectional view taken along the line YY of FIG. 6;

FIG. 9 is a cross-sectional view at the ZZ position in FIG.

FIG. 10 is an operation explanatory view showing a clamp release state of the carrier.

FIG. 11 is an operation explanatory view showing a state where an IC device is connected to a test head.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Handler part 2 Temperature chamber 3 IC tester 3a Test head 5 Suction head 7 IC device 7a Electrode formation surface 7b Flat surface 8d Solder ball 10 Test board 11 Support member 12 Carrier 13 Carrier body 13a Opening 15 Clamp lever 17 Device mounting part 18 Positioning hole 19 Pinion 20 Support rod 21 Rack 22 Operating rod 23 Connecting plate 25 Spring 26, 28
Stopper 27 Cylinder 29 Spring 30 Through hole 40 Clamp release plate 41 Push rod 50 Electrode 51 Positioning pin 52 Push rod

Claims (5)

[Claims] An IC device provided with electrodes on one side surface of a device body is provided on each of the carriers. The carriers having device clamping means are arranged on a test board in a predetermined direction. In order to invert the IC device thus clamped in a state where it is positioned on the side, the carrier is provided with a pinion connected thereto, and the test board is provided with each of these pinions. An interlocking rack is provided so as to extend in the direction in which the carriers are arranged, and by reciprocating the rack by a predetermined stroke by a driving unit, the IC device mounted on each of the carriers can be reciprocated by approximately 180 °. An IC device reversing device having a configuration. 2. The apparatus according to claim 1, wherein the plurality of carriers are arranged in a plurality of rows, racks for inverting the respective carriers are connected to each other by a connecting member, and the connecting member is reciprocated by the driving means. 2. The IC device reversing device according to claim 1, wherein: 3. The connecting member always keeps each of the racks in a state where all the carriers are inverted by the urging force of a spring. 3. The IC device reversing device according to claim 2, wherein the reversing state is set. 4. The IC device reversing device according to claim 1, wherein the rack is configured to be displaceable between an engaged state with the pinion and an unengaged state. 5. A structure in which the rack is provided with an urging means for urging in a direction meshing with the pinion, and the rack can be disengaged from the pinion by pushing the rack in a direction against the urging means. The IC device reversing device according to claim 4, wherein: