TW202334654A - Module handler, and transfer tool therefor - Google Patents

Abstract

The present invention relates to a module handler and a transfer tool installed therein and, more particularly, to a module handler for inspecting modules such as DRAM, SSD, and the like, and a transfer tool installed in the module handler. The present invention relates to a module handler comprising: a loading part (100) for loading a plurality of modules (20) onto a tray (10); a first buffer part (330) for receiving the plurality of modules (20) from the loading part (100) and temporarily storing same; a test part (200) installed at a test position arranged on a preset travel path (L) to perform a preset test after the modules (20) are inserted; at least one shuttle part (310) arranged to shuttle along the traveling path (L) between a loading position, the testing position, and an unloading position that are set on the traveling path (L), to receive the plurality of modules (20) from the first buffer part (330) and deliver same to the test part (200); a second buffer part (340) for receiving the plurality of modules (20) that have been inspected from the shuttle part (310) at the unloading position and temporarily storing same; and an unloading part (400) for receiving the plurality of modules (20) from the second buffer part (340) and unloading same onto a tray (10) according to preset sorting criteria.

Description

Module processor and transmission tool provided in the module processor

The present invention relates to a module processor and a transmission tool provided in the module processor. More specifically, it relates to a module processor that performs inspection of DRAM, SSD and other modules and a transmission tool provided in the module processor. tool

Storage modules such as SDRM, NAND RAM modules such as flash memory, and SSD modules such as M.2 and MVMe (hereinafter collectively referred to as "modules") are electronic components that are installed on a PCB of predetermined specifications. At least one of the two sides is fixed with more than one memory device and other devices.

On the other hand, as the integration level of memory and other devices increases, ultra-thin structures become more expensive, and they are shipped from the factory after undergoing preset tests.

However, in order to test the module, power supply and signal application are performed in the actual use environment. However, the terminals of the module are arranged at the side ends instead of the top and bottom, so the handling of the test module becomes difficult. And the module transmission is cumbersome.

Furthermore, when module processing is difficult and module transportation is difficult, the module testing speed is reduced, so there is a problem of reducing module productivity.

"Problems to be Solved"

The purpose of the present invention is to solve the above-mentioned problems and provide a module processor that can greatly increase the module testing speed and a transmission tool provided in the module processor. "Methods to Solve Problems"

The present invention is proposed to achieve the above objects. The present invention provides a module processor, which includes: a loading part for loading a plurality of modules on a pallet; a first buffer part for receiving a plurality of modules from the loading part. A module is temporarily loaded; the test part is set at a test position, and performs preset inspections after inserting the module, and the test position is set on a preset action path; more than one shuttle part is movably set , to cycle along the action path at the loading position, the test and the unloading position set on the action path, and receive a plurality of modules from the first buffer part and transfer them to the test part; second The buffer part is used to receive a plurality of modules that have been inspected from the shuttle part at the unloading position and temporarily load them; the unloading part is used to receive a plurality of modules from the second buffer part and load them according to the preset Sorting standards are unloaded on pallets.

The module may be a DRAM with DIMM specifications or a DRAM with so-DIMM specifications.

The module moves with its board surface in the horizontal direction; the tray arranges each module at a first spacing, and the test sockets of the test part are arranged at a second spacing; the first buffer portion places the loading slot between space a first spacing between each other, receive the modules from the loading part at the first spacing, and change the spacing between the loading slots so that the loading slots are spaced apart by a second spacing, and then the modules are spaced apart by the second spacing. Passed to the shuttle part; the second buffer part separates the loading slots by a first spacing, and then passes the module to the removal part at the first spacing, and can change the distance between the loading slots. The spacing is such that the loading slots are spaced apart by a second spacing, and the modules are transferred from the shuttle portion at a second spacing in the unloading position.

The shuttle part may be provided with a heating part to heat the module before transferring it to the test part.

The reciprocating part is composed of a first loading slot for placing the module of the first specification and a second loading slot adjacent to the first loading slot for placing the module of the second specification, and n are arranged along the moving direction. The above-mentioned sub-groups are used to form a middle group; the sub-groups of the middle group are such that the spacing between the sub-groups of adjacent middle groups can be configured to be a second spacing corresponding to the spacing of the test sockets of the test part.

The present invention also provides a module processor, which includes: a loading part for loading a plurality of modules on a pallet; and an unloading part for receiving a plurality of modules that have been inspected and unloading them on the pallet according to preset classification standards. ; The test section is located on a third baseline, which performs preset inspections on a plurality of modules. The third baseline is vertically spaced from the first baseline connecting the loading section and the unloading section; the first buffer part, moving back and forth between the loading position and the first exchange position to receive a plurality of modules from the loading part at the loading position, and the first exchange position set on the third baseline will The module is transferred to the test part; the second buffer part moves back and forth between the unloading position and the second exchange position to complete the reception from the test part at the second exchange position set on the third baseline. The inspected plurality of modules are moved to the unloading position, so as to transfer the inspected plurality of modules to the unloading part.

The test part may be located between an action path of the first buffer part and an action path of the second buffer part.

The first buffer part and the second buffer part may include a pair of buffer trays, the pair of buffer trays being arranged in parallel in the direction of the first baseline.

The module handler of the present invention may include: a first module transfer part for picking up a plurality of modules from a tray of the loading part, and loading the picked up plurality of modules into the loading position. a first buffer part; a second module transfer part for picking up a plurality of modules from the second buffer part located at the unloading position, and loading the picked up plural modules onto the tray of the unloading part; The first transfer tool is used to pick up a plurality of modules from the first buffer part located at the first exchange position, and load the picked up plural modules into the test socket of the test part; the second transfer tool, The method is used to pick up the plurality of modules that have been inspected from the test socket of the test part, and load the picked up plurality of modules into the first buffer part located at the second exchange position.

The module moves with its board surface in the horizontal direction; the tray arranges each module at a first interval in the X-axis direction, and the test socket of the test part is arranged at a second interval in the X-axis direction; so The first buffer part and the second buffer part include a plurality of loading groups, the plurality of loading groups include a plurality of loading sections arranged at a second interval in the X-axis direction, and each load of the plurality of loading groups The loading portion of a group may be arranged at a first distance from adjacent loading portions in other loading groups.

The first transfer tool and the second transfer tool include n (n is a natural number of 2 or more) pick-up parts, and the pick-up parts are arranged at the second pitch in the X-axis direction; the plurality of loaders The number of groups in the X-axis direction is m (m is a natural number greater than 1).

The number of the test sockets in the X-axis direction is n, and the test sockets can be arranged at the second spacing in the X-axis direction.

The first conveying tool and the second conveying tool may include: a linear moving part that moves linearly along the It includes a pair of clamps, which are combined with the up and down moving parts, and move in opposite directions in the length direction of the module to clamp both ends of the module; a linear drive part, combined with The vertical moving part moves the pair of clampers in clamping and releasing directions; the main vertical moving part moves the vertical moving part up and down.

The first transfer tool and the second transfer tool may include: a pressurizing part disposed between the pair of clampers, which presses the module module downward by moving up and down; and an auxiliary up and down moving part, which moves up and down. The pressurizing part.

The linear driving part may include: a screw part that rotates to move the moving parts of the pair of clamps in opposite directions in the length direction of the module; and a rotational driving part that directly or indirectly rotates the screw part.

The rotational driving part can rotationally drive the screw part through a rotational force transmission tool.

A plurality of the pickup parts are arranged in the length direction of the module.

The screw portions of the plurality of pickup portions can be rotationally driven by one rotational driving portion.

The screw parts of the plurality of pickup parts are integrated with adjacent screw parts, or are connected to each other through connectors, and can be rotationally driven by one rotation driving part.

The module may be a DRAM with DIMM specifications or a DRAM with so-DIMM specifications.

The present invention also provides a transmission tool for transporting modules. The modules form a right-angled quadrilateral shape and are in a state where the board surface faces the X-axis direction. It includes: a linear moving component for linear movement along the X-axis direction; and an up and down moving component. , can be coupled to the linear moving component up and down; more than one pick-up part includes a pair of clamps, the pair of grippers is coupled to the vertical moving component, with the length direction of the module facing opposite to each other. move in the direction to clamp both ends of the module; the linear drive part, combined with the up and down moving parts, moves the pair of clampers in the clamping and releasing directions; the main up and down moving part moves the up and down The above-mentioned up and down moving parts. "The Effect of Invention"

According to a feature of the present invention, the module processor and the transfer tool provided on the module processor are used to adjust the spacing between the modules on the tray and test when transferring the module from the tray to the test socket of the test part. The module is transmitted smoothly and quickly through the buffer portion of the spacing between the test sockets, which has the advantage of being able to inspect the module more quickly.

Furthermore, during the module transfer process, a reciprocating part for temporarily loading and fully heating the module is disposed between the buffer part and the test part, thereby having the ability to flexibly create conditions for inspecting the module and quickly inspect the module. advantage.

According to another feature of the present invention, the module processor and the transfer tool provided in the module processor are such that the test sections are arranged in an i×j (i is a natural number of 2 or more, and j is a natural number of 1 or more) Configure a test socket, and configure a pair of buffer parts with the test part as the center to load the module to be tested and/or remove the module that has completed the test, and then have a module for DIMM specification DRAM or so-DIMM specification, etc. The advantage is that the group can perform tests more quickly.

In particular, the buffer section arranged on one side with the test section as the center can be flexibly used as a load buffer section for loading the module to be tested, and the buffer section arranged on the other side can be flexibly used as a load buffer section for executing the completed test. The removal buffer portion for removal of the module has the advantage of being able to perform loading, testing and removal of the module more efficiently.

Next, the module processor of the present invention and the transfer tool provided in the module processor will be described with reference to the accompanying drawings.

As shown in Figures 1 to 10b, the module processor according to the first embodiment of the present invention includes: a loading part 100 for loading a plurality of modules 20 on the pallet 10; a first buffer part 330 for loading The part 100 receives a plurality of modules 20 for temporary loading; the test part 200 is set at a test position for performing preset inspections after inserting the modules 20, and the test position is set on the preset action path L; one The above reciprocating part 310 is movably provided to circulate along the action path L at the loading position, the test position and the unloading position set on the action path L, and receives data from the first buffer part 330. The plurality of modules 20 are transferred to the testing part 200; the second buffer part 340 is used to receive the plurality of inspected modules 20 from the shuttle part 310 at the unloading position for temporary loading; the unloading part 400 , used to receive a plurality of modules 20 from the second buffer part 340 and unload them to the tray 10 according to preset classification standards.

Here, the module 20 is a storage module such as an SDRM, a NAND RAM module such as a flash memory, an SSD such as an M.2 module (hereinafter collectively referred to as a "module"), and is used as a predetermined Any electronic product such as a memory that has one or more electronic products fixed on at least one of the two sides of a standard PCB can be the module 20 as long as it is an electrical inspection target.

In particular, the module 20 may be a DRAM with DIMM specifications or a DRAM with so-DIMM specifications.

On the other hand, the module 20 is formed into a right-angled quadrilateral shape with a relatively longer long side, such as a DIMM standard DRAM or an so-DIMM standard DRAM. In order to be installed in a socket such as a motherboard, the long side is The upper and lower surfaces of one side form the terminal connection portion.

Accordingly, in the module handler of the present invention, the module 20 is erected vertically so that the terminal connection portion is located on the lower side, that is, the module is loaded/unloaded on the tray 10 with the board surface facing the horizontal direction. 20.

Then, as shown in Figures 2a and 2b, the tray 10 is placed on the terminal connection portion formed on at least one of the upper and bottom surfaces of the module 20 for transportation. According to the specifications of the module 20, Any structure may be used as long as the module 20 can be placed in an upright state.

In addition, when the module 20 transports the board surface in the horizontal direction, the pallet 10 can arrange each module 20 at a first distance P1.

The loading part 100 is a structure used to load a plurality of modules 20 on the tray 10, and can be implemented in various structures.

As an example, as shown in FIGS. 1 to 2 b , the loading portion 100 can be configured in a state in which one or more trays 10 (for example, three trays 10 ) are exposed on the front side of the main body.

Here, the number (such as three, etc.) loaded by the loading part 100 may be determined by considering the inspection speed of the testing part 200 and the like.

Then, according to the supply structure of the pallets 10 on which the plurality of modules 20 are placed, the loading part 100 can realize various structures; as shown in FIG. 2a to FIG. 2b , the loading part 100 can have a pallet stacker 500. The stacker 500 stacks the pallets 10 up and down and sequentially lifts the pallets 10 upward.

The pallet stacker 500 has a structure in which pallets 10 are stacked up and down and the pallets 10 are sequentially lifted upward. The pallet stacker 500 may include: a guide part 520 that guides the stacked pallets 10 to move up and down; and a lifting part 510 that lifts and lowers the stacked pallets 10 along the guide part 520. The tray 10.

The guide portion 520 is a structure provided corresponding to each vertex of the pallet 10 having a right-angled planar shape to guide the up and down movement of the pallet 10 , and can be implemented in various structures.

The lifting part 510 is a structure that lifts and lowers the tray 10 along the guide part 520, and may include a tray placing part and a lifting driving part. The tray placing part places the tray 10, and the lifting driving part lifts and drives the tray to be placed. department.

On the other hand, as shown in FIG. 1 , the loading sections 100 can be arranged in a row in front of the main body. At this time, a pallet conveyor (not shown) can be set up to convey the pallets 10 to supply the modules to be inspected. 20 of new pallets 10, or the empty pallets 10 picked up by the module 20 are transferred to the empty pallet placing part 410 described later.

The first buffer portion 330 has a structure that receives a plurality of modules 20 from the loading portion 100 and temporarily loads them, and can be implemented in various structures.

As an example, as shown in FIG. 5a and FIG. 5b , the first buffer part 330 may be composed of a buffer plate 331 having a plurality of loading slots 332 and 333 for placing the module 20 .

The buffer plate 331 has a structure having a plurality of loading slots 332 and 333 for placing the module 20. It can be implemented in various structures according to the arrangement structure of the plurality of loading slots 332 and 333.

On the other hand, the buffer plate 331 may have a temperature control part that heats or cools the module 20 according to the test temperature conditions in the test part 200 described later.

The temperature control part is a structure that preheats or cools the module 20 according to the test temperature condition of the module 20. According to the temperature control method, it can be implemented as various structures, such as a heater, a heat medium circulation tube, a thermoelectric module, etc.

On the other hand, the test sockets 210 of the test part 200 described later can be arranged at a second spacing P2. In order to form a test condition, the second spacing P2 is set to be different from the first spacing between the modules 20 on the tray 10. P1, for example, may be greater than the first distance P1.

Accordingly, it is necessary to adjust the distance between the modules 20 received from the tray 10 to the second pitch P2 before the modules 20 are transferred to the test part 200 .

Accordingly, as shown in FIGS. 5a and 5b , the loading grooves 332 and 333 of the first buffer part 330 are spaced apart by a first distance P1, and the modules are received from the loading part 100 at the first distance P1. 20, and the distance between the loading slots 332 and 333 can be changed so that the loading slots 332 and 333 are separated by a second distance P2, and then the module 20 can be transferred to the loading position at a second distance P2. Shuttle 310.

Accordingly, the buffer plate 331 may have a spacing adjustment portion (not shown) for adjusting the spacing between the loading slots 332 and 333 .

On the other hand, the module 20 to be inspected may have different sizes, such as different lengths of long sides, depending on standards such as DIMM standard DRAM and so-DIMM standard DRAM.

Accordingly, the buffer plate 331 may have a first loading slot 332 of a first specification and a second loading slot 333 of a second specification. The second loading slot 333 is arranged adjacent to the first loading slot 332, so The second specification is different from the first specification.

On the other hand, a plurality of first loading slots 332 can be configured (for example, eight first loading slots 332 are configured). When exchanging modules with the pallet 10 , the module 20 can be configured in the direction of arrangement (for example, the X-axis direction). ) forms the spacing on the pallet 10 (ie, the first spacing P1).

In addition, a plurality of second loading slots 333 adjacent to the first loading slot 332 can be configured (for example, eight second loading slots 333 are configured). When exchanging modules with the pallet 10 , the module 20 can be configured according to the configuration of the module 20 . The direction (for example, the X-axis direction) forms the pitch on the tray 10 (ie, the first pitch P1).

As an example, the number of the first loading slots 332 and the second loading slots 333 arranged in the X-axis direction may be N times the number of test sockets 210 of the test unit 200 described later (N is a natural number greater than 1. ).

On the other hand, the first buffer portion 330 and the second buffer portion 340 described below are aligned in the X-axis direction.

That is, based on the front side of the main body, the loading part 100 and the unloading part 400 are arranged in the first row in the X-axis direction, and the first buffer part 330 and the second buffer part behind this 340 is arranged in the second row, and finally the reciprocating part 310 and the test part 200, which will be described later, are arranged along the operation path L (that is, arranged in the third row).

On the other hand, transferring the module 20 between the loading part 100 and the first buffer part 330 may be performed through the first module transferring part 610 .

The first module transfer part 610 is a structure that picks up the module 20 from the tray 10 of the loading part 100 and transfers it to the loading slots 332 and 333 of the first buffer part 330 for loading. According to the pick-up and placement structure of the module 20, Can be implemented in various structures.

As an example, as shown in FIGS. 3 a to 4 , the first module transfer part 610 may include: a moving support part 615 configured to move on the loading part 100 and the first buffer part 330 , for example, in the X-axis direction. and Y-axis direction movement; and a plurality of pick-up parts, coupled to the moving support part 615, the modules 20 on the tray 10 are arranged with a first spacing P1 in the arrangement direction.

The moving support part 615 is configured to move on the loading part 100 and the first buffer part 330, for example, in the X-axis direction and the Y-axis direction, and may be implemented in various structures.

The pickup part is coupled to the moving support part 615 and has a structure in which the modules 20 on the tray 10 are arranged at a first pitch P1 in the arrangement direction, and may be implemented in various structures.

As an example, the pick-up part may include: a pair of clampers 611 coupled to the moving support part 615 to clamp both ends of the module 20 by moving in opposite directions along the length of the module 20 ; Linear drive portion 614 moves the clamper 611 in the direction of clamping and releasing.

Then, the pickup unit forms an arrangement of N×M (N is a natural number equal to or greater than 1, and M is a natural number equal to or equal to 1), and can be arranged in various arrangement structures, thereby being able to pick up and transport a plurality of modules 20 .

On the other hand, the specifications of the modules 20 that are picked up may be different. In order to be able to process two or more types of modules 20, as shown in FIG. 3a and FIG. 3b, the module processor of the present invention can process the picked up modules 20. The structure is such that the distances D ₁ and D ₂ between the pair of clamps 611 can be adjusted.

Then, the pair of clampers 611 may have a buffer member made of a material such as stretchable synthetic resin to flexibly clamp both ends of the module 20 .

The test unit 200 is configured to be installed at a test position set on a preset action path L and perform a preset inspection after inserting the module 20 . According to the test module (not shown) used to test the module 20 The structure can be implemented in various structures.

As an example, as mentioned above, the test part 200 may include: a plurality of test sockets 210, arranged at a second interval P2; a test module (not shown), and the test socket 210 applies telecommunications to the module 20. No. 640 is used to perform inspection on the module 20; a module tool 640 is used to pick up or place the module 20 on the test socket.

The test socket 210 is a structure that transmits electrical signals generated by the test module to the module 20 after placing the module 20 through the module tool 640, and can be implemented in various structures.

As an example, the test socket 210 may include: a test slot 211, which is inserted into the terminal part of the module 20; and a hook 219, which fixes the module 20 to the test socket 210 or releases the hook when separated.

The test module is a structure that applies electrical signals to the module 20 through the test socket 210 to perform inspection on the module 20. It can be implemented in various structures according to the test method of the module 20, and can be confirmed in actual use. Whether the driver module is configured in the installation environment.

The module tool 640 is a structure for picking up or placing the test socket and pressing the module 20, and can be implemented in various structures according to the structure of the pickup module 20.

As an example, as shown in FIGS. 9a to 9f , the module tool 640 may include: a tool body supported by a support member; and a plurality of picking tools 648 corresponding to the number and spacing of the plurality of test sockets 210 configured and coupled to the tool body.

The pickup tool 648 is configured in a number and spacing corresponding to the plurality of test sockets 210 and is coupled to the tool body, and may have a similar structure to the first module transfer part 610 described above.

Specifically, the picking tool 648 is combined with the tool body, picks up the module 20 on the reciprocating part 310 and places it in the test socket 210, and after performing the test, picks up the module 20 from the test socket 210 and places it in the test socket 210 as described later. The structure in which the loading grooves 322, 323, 324, 325 of the reciprocating part 320 are removed can be implemented in various structures.

As an example, the picking tool 648 may include: a pair of clampers 641, coupled to the tool body, moving in opposite directions along the length of the module 20 to clamp both ends of the module 20; The linear driving part (not shown) moves the clamper 641 in the direction of clamping and releasing.

Then, the pick-up tool 648 is configured in an N×M (N is a natural number above 1, M is a natural number above 1) arrangement corresponding to the test socket 210 , such as a 2×8, 4×8, etc. arrangement. Configured to pick up and deliver multiple modules20.

On the other hand, the specifications of the modules 20 to be picked up may be different. In order to be able to handle two or more types of modules 20, as shown in Figures 9a and 9b, the picking tool 648 can adjust a pair of grippers. 611 interval spacing.

Then, the pair of clamps 641 may have buffer members made of stretchable synthetic resin or other materials to flexibly clamp both ends of the module 20 .

On the other hand, as shown in FIG. 9 b , when the module 20 is separated from the test socket 210 , the pair of holders 641 descends to press the hook 219 , thereby releasing the module 20 from being coupled to the test socket 210 .

Here, when the hook portion 219 is pressurized, the module set 20 can be ejected upward. To prevent this phenomenon, the pressing portion 649 is lowered to prevent the module set 20 from being excessively ejected upward.

Then, if the state of the test socket 210 combined with the module 20 is released, the picking tool 648 can pick up the module 20 for the test socket 210 through the processes shown in FIG. 9 c and FIG. 9 d.

On the other hand, the picking tool 648 can place the module 20 through the process shown in FIGS. 10 a to 10 c , that is, install it on the test socket 210 .

At this time, the pick-up tool 648 may include a pressurizing part 649 that presses the module 20 to the test socket 210 by moving up and down, so that when the module 20 is placed on the test socket 210, the module 20 can Stably mounted on test socket 210.

The pressurizing part 649 is a structure that presses the module 20 to the test socket 210 by moving up and down so that the module 20 can be stably installed on the test socket 210 when the module 20 is placed in the test socket 210. It can be implemented in various structures. .

The shuttle part 310 is movably disposed to sequentially cycle through the loading position, test and unloading position set on the action path L, and receives a plurality of modules 20 from the first buffer part 330 and delivers them to the desired location. The structure of the test unit 200 described above can be implemented in various structures.

Here, the loading position is set at the position where the reciprocating part 310 is located in order to receive the module 20 from the first buffer part 330 mentioned above, and the unloading position is set at the position where the module 20 is transferred to the second buffer part 340 (described later). The location of the shuttle 310.

Then, the test part is set at a position where the picking tool 648 of the module tool 640 that picks up the module 20 from the test socket 210 can receive the module 20 , that is, the module 20 to be inspected is transferred from the test part 200 and received to complete the inspection. The location of module 20.

On the other hand, the shuttle portion 310 may have a similar structure to the first buffer portion 330 described above.

As an example, as shown in FIGS. 6 and 7 , the shuttle portion 310 may be composed of a shuttle plate 311 having a plurality of loading slots 312 and 313 for placing the module 20 .

The shuttle plate 311 has a structure having a plurality of loading slots 312 and 313 for placing the module 20, and can be implemented in various structures according to the arrangement structure of the plurality of loading slots 312 and 313.

On the other hand, the shuttle plate 311 may have a temperature control part to heat or cool the module 20 according to the test temperature condition in the test part 200 .

The temperature control part is a structure that preheats or cools the module 20 according to the test temperature condition of the module 20. According to the temperature control method, it can be implemented as various structures, such as a heater, a heat medium circulation tube, a thermoelectric module, etc.

That is, the reciprocating part 310 may be provided with a heating part as a temperature control part, and may be heated before transferring the module 20 to the testing part 200 .

On the other hand, the test sockets 210 of the test part 200 can be arranged at a second spacing P2. At this time, in order to create a test condition, the second spacing P2 can be set to be different from the module 20 on the tray 10. The first pitch P1 of the interval may be greater than the first pitch P1, for example.

Accordingly, similar to the above-mentioned first buffer part 330, the reciprocating part 310 can change the spacing between the loading slots 312 and 313 into the first pitch P1 and the second spacing P2, or consider the above-mentioned first buffer part If the pitch changes in 330, the spacing may be the same as the pitch of the test socket 210 of the test part 200, that is, the second pitch P2.

On the other hand, as described above, the module 20 to be inspected may have different sizes, such as different lengths of long sides, depending on the specifications of DIMM standard DRAM, so-DIMM standard DRAM, or the like.

Accordingly, the buffer plate 331 may have a first loading slot 312 of a first specification and a second loading slot 313 of a second specification. The second loading slot 313 is arranged adjacent to the first loading slot 312, so The second specification is different from the first specification.

On the other hand, the first loading slot 312 and the second loading slot 313 correspond to the configuration of the test socket 210 and can be configured in N×M (N is a natural number above 1, M is a natural number above 1) Arrangements, such as 2×8, 4×8, etc.

On the other hand, for the module 20 that is inspected by the test unit 200 , it is preferable to perform inspection under inspection conditions, such as inspection temperature conditions, before being transferred to the test unit 200 .

In particular, the inspection temperature condition is often performed under high temperature conditions such as 80° C., so it is necessary to control the temperature of the module 20 to the inspection temperature condition (that is, to heat the module 20 ).

However, the transfer time of the module 20 from the loading part 100 to the test part 200 is short and the module 20 cannot be heated sufficiently. In this state, when the module 20 is transferred to the test part 200 , the reliability of the inspection of the module 20 may be reduced. problem.

Accordingly, the reciprocating part 310 is preferably configured to have a heating part, that is, while controlling the temperature, a relatively larger number of modules 20 are placed in order to ensure sufficient temperature control time.

Accordingly, the shuttle 310 uses the loading slots 312, 313, 314, and 315 arranged at the second distance P2 as one loading slot group, and a plurality of loading slot groups can be arranged.

As an example, the shuttle 310 has a first loading slot 312 for placing the module 20 of the first specification and a second loading slot adjacent to the first loading slot 312 for placing the module 20 of the second specification. 313 is formed into small groups, and more than n (n is a natural number of 2 or more) of the small groups are arranged along the moving direction to form an intermediate group. The distance between the small groups of the intermediate group and the adjacent intermediate group can be configured to be equal to The distance between the test sockets 210 of the test part 200 corresponds to the second distance P2.

With the above structure, the modules 20 placed in the shuttle part 310 are transferred to the test part 200, and the modules 20 placed in the remaining loading slots are heated during the test by the test part 200, thereby ensuring sufficient heating. time.

On the other hand, as shown in FIGS. 8e and 8a , the shuttle 310 is placed in the test position after the inspected module 20 picked up by the module tool 640 , and then the module 20 to be inspected is picked up by the module tool 640 .

At this time, in order to effectively transfer the module 20 to the second buffer part 340 at the unloading position, the reciprocating part 310 is preferably preset at a position where the inspected module 20 is placed.

Accordingly, the reciprocating portion 310 can be configured to remove the loading slots 314 and 315 to place the modules 20 that have been inspected in the testing portion 200 .

As shown in FIG. 6 , the unloading loading slots 314 and 315 are loading slots whose positions are set among the plurality of loading slots on the shuttle part 310 to place the module 20 that has been inspected by the testing part 200 , and can be set at a specified location. Position, regardless of processing sequence or time.

In addition, the positions of the unloading loading slots 314 and 315 can be randomly set by heating time in the shuttle part 310 and picking up in the test part 200 .

That is, the unloading loading slots 314, 315, 324, 325 are configured on the shuttle part 310 and are configured according to the type of the module 20, and are placed in the modules 20 that need to be separated (such as Unqualified, etc.) Module 20, only the position is different from other loading slots, the rest is the same as other loading slots.

On the other hand, the shuttle portion 310 transfers the module 20 that has been inspected at the unloading position to the second buffer portion 340 .

On the other hand, picking and placing the module 20 between the shuttle part 310 and the test part 200, and between the test part 200 and the shuttle part 310 in the unloading position may be performed as shown in FIGS. 5a to 8e. Picking up and removing modules20.

Specifically, as shown in Fig. 8a, the shuttle portion 310 receives the module 20 from the first buffer portion 330 in the loading position.

On the other hand, as shown in FIG. 8 b , the shuttle portion 310 moves between the test socket 210 and the module tool 640 . At this time, the module tool 640 is in a state of picking up the inspected module 20 from the test socket 210 .

Then, as shown in Figure 8c, the mold tool 640 picks up the fully heated mold set 20.

Then, as shown in FIG. 8d , the reciprocating part 310 moves to the unloading position in order to unload the inspected module 20 , and then the module tool 640 descends to place the module 20 in the test socket 210 as shown in FIG. 8e Rising, the module 20 placed in the test socket 210 is tested.

On the other hand, the shuttle portion 310 transfers the module 20 to the second buffer portion 340 at the unloading position and then moves to the loading position to receive the new module 20 to be inspected from the first buffer portion 330 .

The second buffer portion 340 has a structure that receives a plurality of modules 20 from the shuttle portion 310 at the unloading position and temporarily loads them, and can be implemented in various structures.

As an example, as shown in FIG. 5a and FIG. 5b , the second buffer part 340 may be composed of a buffer plate 341 configured with a plurality of loading slots 342 and 343 for placing the module 20 .

The buffer plate 341 is configured with a plurality of loading slots 342 and 343 for placing the module 20, and can be implemented in various structures according to the arrangement of the plurality of loading slots 342 and 343.

On the other hand, the arrangement pitch of the modules 20 in the reciprocating part 310 is the second pitch P2, and the arrangement pitch of the modules 20 of the tray 10 in the unloading part 400 is the first pitch P1. In the unloading position , the arrangement pitch of the modules of the reciprocating part 310 and the arrangement pitch of the modules of the tray 10 of the removal part 400 may be different from each other.

Accordingly, as shown in FIG. 5a and FIG. 5b , the loading slots 342 and 343 in the second buffer part 340 are spaced apart by a first spacing P1, so that the module 20 can be transferred to the required space at the first spacing P1. The unloading part 400 can change the distance between the loading slots 342 and 343 in the unloading position, so that the loading slots 342 and 343 are spaced apart by a second distance P2, and thereby the modules 20 are spaced apart by the second distance P2. passed to the shuttle 310.

Accordingly, the buffer plate 341 may be configured with a spacing adjustment portion (not shown) for adjusting the spacing between the loading slots 342 and 343 .

On the other hand, as mentioned above, the module 20 to be inspected may have different sizes, such as different lengths of the long sides, according to standards such as DIMM standard DRAM and so-DIMM standard DRAM.

Accordingly, the buffer plate 341 may have a first loading slot 342 of a first specification and a second loading slot 343 of a second specification. The second loading slot 343 is arranged adjacent to the first loading slot 342, so The second specification is different from the first specification.

On the other hand, a plurality of first loading slots 342 may be configured, for example, eight first loading slots 342 may be configured. When exchanging modules with the pallet 10 , the configuration direction of the module 20 (for example, the X-axis direction) The pitch on the tray 10 (ie, the first pitch P1) is formed.

In addition, a plurality of second loading slots 343 adjacent to the first loading slot 342 can be configured (for example, eight second loading slots 343 are configured). When exchanging modules with the pallet 10 , the module 20 can be configured according to the configuration of the module 20 . The direction (for example, the X-axis direction) forms the pitch on the tray 10 (ie, the first pitch P1).

As an example, the number of the first loading slots 342 and the second loading slots 343 arranged in the X-axis direction may be N times the number of test sockets 210 of the test unit 200 described later (N is a natural number greater than 1). .

The unloading part 400 is a structure that receives a plurality of modules 20 from the second buffer part 340 and unloads them to the tray 10 according to preset classification standards, and can be implemented in various structures.

As an example, as shown in FIGS. 1 to 2 b , the removal part 400 can be arranged in a state in which one or more trays 10 (for example, three trays 10 ) are exposed on the front side of the main body.

Here, for the removal part 400 , the number may be determined by taking into account the inspection speed of the test part 200 and the like, such as three.

As an example, the unloading unit 400 can be implemented in various structures. For example, the module 20 that is a qualified product after being inspected by the testing unit 200 is loaded on the pallet 10 of the qualified product, and is placed on a re-inspection or unqualified product according to the inspection results. 10 pallets with equal classification levels.

For this purpose, the removal part 400 is arranged in a transverse direction, and may be composed of a qualified product tray, a first classification tray, a second classification tray, and the like.

Then, the structure of the unloading part 400 can be similar to that of the loading part 100, as shown in Figures 2a to 2b. According to the supply structure of the pallet 10 for loading a plurality of modules 20, it can be implemented in various structures, and can have a pallet stack. The pallet stacker 500 stacks the pallets 10 up and down and sequentially lifts the pallets 10 upward.

The pallet stacker 500 has a structure in which pallets 10 are stacked up and down and the pallets 10 are lifted upward sequentially. The pallet stacker 500 may include a guide part 520 and a lifting part 510. The guide part 520 guides the stacked pallets 10 to move up and down. The lifting part 510 moves along the The guide part 520 lifts and lowers the tray 10 .

The guide portion 520 is a structure provided corresponding to each vertex of the pallet 10 having a right-angled planar shape to guide the up and down movement of the pallet 10 , and can be implemented in various structures.

The lifting part 510 is a structure that lifts and lowers the tray 10 along the guide part 520, and may include a tray placing part and a lifting driving part. The tray placing part places the tray 10, and the lifting driving part lifts and drives the tray to be placed. department.

On the other hand, transferring the module 20 between the second buffer part 340 and the removal part 400 may be performed through the second module transfer part 620 .

The second module transfer part 620 is a structure used to transfer the module 20 between the second buffer part 340 and the removal part 400. The structure is the same as or similar to the first module transfer part 610. Therefore, Detailed description is omitted.

On the other hand, an empty pallet placing part 410 may be disposed between the loading part 100 and the unloading part 400 to place the empty pallets 10 after the loading part 100 picks up the modules 20 .

The empty pallet placing part 410 is provided between the loading part 100 and the unloading part 400 to place the empty pallets 10 picked up by the module 20 in the loading part 100 , and may include the above-mentioned pallet stacker 500 .

On the other hand, the pallets 10 can be transferred to each other between the loading part 100, the unloading part 400 and the empty pallet placing part 410, and for this purpose, as mentioned above, they can be transferred by a pallet conveyor.

On the other hand, the module 20 can be transported from the first buffer part 330 to the shuttle part 310 and from the shuttle part 310 to the second buffer part 340 at the unloading position through the third mold respectively. The group transfer part 630 and the fourth module transfer part 650 are executed.

The third module transfer part 630 and the fourth module transfer part 650 are respectively configured to transfer the module 20 from the first buffer part 330 to the shuttle part 310 and from the shuttle part 310 to the unloading position. The structure of transferring the module 20 to the second buffer part 340 can be implemented in various structures.

As an example, the structures of the third module transfer part 630 and the fourth module transfer part 650 may be similar to the above-mentioned first module transfer part 610.

However, considering that the loading grooves of the reciprocating part 310 are arranged at a second distance P2, the third module transfer part 630 and the fourth module transfer part 650 are preferably arranged in the horizontal direction of the pickup part (ie, the X-axis direction) They are arranged at a second distance P2.

In addition, the arrangement of the third module transfer part 630 and the fourth module transfer part 650 is the same as the arrangement of the pickup part of the first module transfer part 610, or may have various arrangements, such as 1×8, 2×8 , 4×8, etc.

On the other hand, as shown in FIG. 1 , the module processor of the present invention may also have a module buffer 420 to temporarily load the module 20 .

The module buffer 420 is a structure for temporarily loading the modules 20 , that is, a structure for temporarily loading the modules 20 in order to eliminate bottlenecks in the logistics process, and can be implemented in various structures.

As an example, the module buffer 420 temporarily loads the modules 20 that are inspected as qualified products by the testing part 200 , and upon demand, the module buffer 420 loads the modules 20 that are qualified products into the unloading part 400 . The tray 10 picking module can be loaded on the tray 10 of the unloading part 400 .

On the other hand, various structures can be implemented depending on the arrangement of the structure for loading and unloading the module centered on the test unit that performs the module test.

As an example, the module processor of the present invention may be configured to be configured with a pair of buffer parts. The pair of buffer parts center on the test part to load the module to be tested and/or remove the module that has completed the test. , wherein the test section configures the test sockets in an arrangement of i×j (i is a natural number greater than 2, and j is a natural number greater than 1).

In particular, with the test part as the center, the buffer part arranged on one side can be used as a loading buffer part for loading the module to be tested, and the buffer part arranged on the other side can be used as a buffer part for executing the removal and completion test. Remove the buffer part of the module.

Hereinafter, the module processor according to the second embodiment of the present invention will be described with reference to the accompanying drawings.

As shown in Figures 11 to 12c, the module processor of the second embodiment of the present invention may include: a loading part 100, which loads a plurality of modules 20 on the pallet 10; and a removal part 400, which receives a plurality of modules that have been inspected. The group 20 is unloaded on the pallet 10 according to the preset classification standards; the test part 200 is located on the third baseline L3, and performs preset inspections on the plurality of modules 20. The third baseline L3 is spaced vertically from the connection The first baseline L1 of the loading part 100 and the unloading part 400; the first buffer part 350 moves back and forth on the second baseline L2 to between the loading position and the first exchange position, so as to move from the loading position to the first exchange position. The loading part 100 receives a plurality of modules 20 and transfers a plurality of modules 20 to the test part 200 at the first exchange position set on the third baseline L3; the second buffer part 360 moves back and forth to Between the unloading position and the second exchange position, the plurality of modules 20 that have been inspected are received from the test unit 200 at the second exchange position set on the third baseline L3 and moved toward the unloading position, Then, the plurality of modules 20 that have been inspected are delivered to the removal unit 400 .

Here, as shown in FIG. 12a , the module 20 to be inspected by the module processor of the present invention and the tray 10 on which the module 20 is loaded are the same as or similar to those in the first embodiment of the present invention, so the details are omitted. instruction.

For reference, different module sizes, loading quantities, etc. can be set for the pallet 10 .

The loading part 100 is a structure for loading a plurality of modules 20 on the tray 10, and can be implemented in various structures.

The unloading unit 400 is a structure that receives a plurality of modules 20 that have been inspected and removes them from the tray 10 according to preset classification standards, and can be implemented in various structures.

The loading part 100 and the unloading part 400 are similar or identical to the first embodiment of the present invention, so the detailed description is omitted.

As shown in FIG. 12c , the test part 200 is located on a third baseline L3 spaced in a vertical direction from the first baseline L1 connecting the loading part 100 and the unloading part 400 to perform execution on a plurality of modules 20 The preset inspection structure can be implemented in various structures according to the structure of the test module (not shown) used for the test module 20 .

As an example, as mentioned above, the test part 200 may include: a plurality of test sockets 210, arranged at a second interval P2; a test module (not shown), and the test socket 210 applies telecommunications to the module 20. No. to perform a check on module 20.

The test socket 210 is a structure that transmits electrical signals generated by the test module to the module 20 after the module 20 is placed through the first transmission tool 700 described below, and can be implemented in various structures.

As an example, as shown in FIGS. 9a to 9d showing the above-mentioned first embodiment, the test socket 210 may include: a test slot 211 inserted into the terminal part of the module 20; and a hook 219 for fixing the mold in the test slot 211. Group 20, or unhook upon detachment.

On the other hand, as shown in Figure 12a, the tray 10 is loaded with each module 20. The modules 20 are spaced apart by a first distance P1 in the X-axis direction. As shown in Figure 12c, the test socket 210 of the test part 200 They are arranged at a second pitch P2 in the X-axis direction.

At this time, the second pitch P2 is larger than the first pitch P1, but it needs to be appropriately responded to the order of the tray 10 of the loading part 100 → the first buffer tray 351 → the test part 200 → the second buffer tray 361 → the tray of the unloading part 400 10. The transmission process of the sequential transmission module 20.

Accordingly, the second pitch P2 can be set to k times the first pitch P1 (k is a natural number greater than 2).

For k, the limiting factors that limit the spacing between adjacent test sockets 210 due to the structure and size of the test sockets 210, the number of modules 20 that can be loaded on the tray 10, the buffer trays 351, 361 and the test The efficiency of moving the module 20 between the units 200 is determined.

As an embodiment, when the number of modules 20 that can be loaded on the pallet 10 is twelve, the k may be 3.

The test module is a structure that applies electrical signals to the module 20 through the test socket 210 to perform inspection on the module 20. It can be implemented in various structures according to the test method of the module 20, and can be confirmed in actual use. Whether the driver module is configured in the installation environment.

On the other hand, the test part 200 may be located between the operation path of the first buffer part 350 and the operation path of the second buffer part 360 which will be described later.

The first buffer part 350 moves back and forth between the loading position and the first exchange position to receive a plurality of modules 20 from the loading part 100 at the loading position, and is set on the third baseline L3 The first exchange position transmits the structure of the plurality of modules 20 to the test part 200 and can be implemented in various structures.

The second buffer part 360 moves back and forth between the unloading position and the second exchange position to receive a plurality of completed inspections from the test part 200 at the second exchange position set on the third baseline L3. The structure in which the modules 20 move to the unloading position and then transfer the inspected plurality of modules 20 to the unloading part 400 can be implemented in various structures.

The first buffer part 350 and the second buffer part 360 may be respectively disposed on one side and the other side of the test part 200 , and preferably have the same structure except for the position. Here, the positions of the first buffer part 350 and the second buffer part 360 are relative positions of the test part 200, and of course they may be located at different positions.

As an example, as shown in FIGS. 11 , 12 b , 13 a and 13 b , the first buffer part 350 and the second buffer part 360 may respectively include: one or more buffer trays 351 , and the first buffer part 350 and the second buffer part 360 . The base line L1 is vertical and moves back and forth in the Y-axis direction between the loading position and the first exchange position; and more than one buffer tray 361 is perpendicular to the first base line L1 and moves between the unloading position and the second exchange position. Move back and forth.

In particular, in order to quickly load the module 20 to be tested and remove the module 20 that has completed testing, the first buffer part 350 and the second buffer part 360 preferably include a buffer with the first baseline L1 A pair of buffer trays 351 and 361 arranged in parallel directions.

In particular, as shown in FIG. 11 and FIGS. 13a and 13b , the pair of buffer trays 351 and 361 may have various configurations, such as parallel configuration in the X-axis direction or up and down configuration.

On the other hand, depending on the type, specification, and loading structure of the module 20, the buffer trays 351 and 361 can be implemented in various structures. As shown in Figures 13a and 13b, the buffer trays 351 and 361 can be composed of movable plates 351b, The moving plates 351b and 361b have a plurality of loading parts 351a and 361a for loading the modules 20.

In order to load or pick up the modules 20 transported by the first module transport part 610 and the second module transport part 620, the plurality of loading parts 351a, 361a are preferably configured to space the modules 20 on the pallet 10 along the X-axis. The first pitch P1 of the directional spacing.

On the other hand, in order to facilitate the plurality of loading portions 351a and 361a to load or pick up the modules 20 conveyed by the first module conveying portion 610 and the second module conveying portion 620, the plurality of loading portions 351a and 361a can The module 20 is loaded through various methods, such as a simple insertion method, a loading method through a structure as shown in Figure 9a to Figure 9d, and the like.

As an example, the first buffer part 350 and the second buffer part 360 may include a plurality of loading groups, and the loading groups include a plurality of loading parts 351a and 361a arranged at a second interval P2 in the X-axis direction.

The plurality of loading groups are a group composed of the loading parts 351a and 361a of the loading module 20, and the loading parts 351a and 361a of each loading group of the plurality of loading groups are the same as the adjacent loading parts of another loading group. 351a and 361a are arranged at a first pitch P1.

Then, the number of the plurality of loading groups in the X-axis direction may be m (m is a natural number greater than 1).

At this time, the number of the test sockets 210 in the X-axis direction is n, and the test sockets 210 can be arranged at intervals of the second pitch P2 in the X-axis direction.

On the other hand, by appropriately combining the configuration of the loading portions 351a and 361a on the pair of buffer trays 351 and 361, the configuration of the test socket 210, and the pickup portions 720 of the first and second transfer tools 700 and 800, The 820 is configured in the X-axis direction to execute the transmission of the module 20 more quickly.

First, the test sockets 210 of the test part 200 are arranged at a second distance P2 in the X-axis direction. The second distance P2 may have an X-axis formed by the loading parts 351a and 361a of the tray 10 and the buffer trays 351 and 361. The size of the first distance P1 in the direction is m times (m is a natural number greater than 2).

Then, when the number of test sockets 210 in the test unit 200 in the X-axis direction is n (n is a natural number greater than or equal to 2), the total number of the loading portions 351a and 361a of the buffer trays 351 and 361 in the X-axis direction is preferably is n×m.

At this time, the number of the pickup parts 720 and 820 of the first transfer tool 700 and the second transfer tool 800 in the X-axis direction may be n.

13a and 13b show that the total number of loading portions 351a and 361a of the buffer trays 351 and 361 in the X-axis direction is twenty-four, and the pickup portions 720 of the first conveying tool 700 and the second conveying tool 800 , the case where the number of 820 in the X-axis direction is eight.

Here, when forming a pair of the buffer trays 351 and 361, the number of each buffer tray 351 and 361 in the X-axis direction may be (n×m)/2 (n is an even number).

At this time, as shown in FIGS. 13a and 13b , the pickup portions 720 and 820 of the first transfer tool 700 and the second transfer tool 800 can respectively pick up n/2 modules 20 from the buffer trays 351 and 361 .

Here, as shown in FIG. 11 , one of the pair of buffer trays 351 and 361 is located at the first exchange position or the second exchange position, and the remaining one is located at the loading position or the unloading position.

On the other hand, through the configuration of the loading parts 351a and 361a as described above, it is possible to more flexibly load the module 20 to the first buffer part 350 at the loading position through the first module transfer part 610 and load the module 20 to the first buffer part 350 at the loading position. The first buffer part 350 in the exchange position picks up the module 20 through the first transfer tool 700, the second buffer part 360 in the second exchange position loads the module 20 through the second transfer tool 800, and the third buffer part 360 in the unloading position loads the module 20. The second buffer part 360 picks up the work of the module 20 through the second module transmission part 620 .

Then, as shown in FIGS. 12 b and 13 a and 13 b , a plurality of the loading portions 351 a and 361 a are provided in the X-axis direction and can be arranged in multiple rows in the Y-axis direction.

In addition, the buffer trays 351 and 361 can move in the Y-axis direction through guide rails 352 and 362 and the Y-axis direction moving parts 353 and 363, wherein the guide rails 352 and 362 guide the movement in the Y-axis direction. The axial moving parts 353 and 363 move the buffer trays 351 and 361 along the guide rails 352 and 362.

On the other hand, in order to effectively transfer the modules 20, the module processor of the present invention may include: a first module transfer part 610, which picks up a plurality of modules 20 from the tray 10 of the loading part 100, and transfers the picked up plurality of modules 20. The modules 20 are loaded into the first buffer part 350 at the loading position; the second module transfer part 620 picks up a plurality of modules 20 from the second buffer part 360 at the unloading position and transfers them The plurality of picked modules 20 are loaded on the tray 10 of the unloading part 400; the first transfer tool 700 picks up the plurality of modules 20 from the first buffer part 350 located at the first exchange position, and then picks up the plurality of modules 20. The plurality of modules 20 are loaded into the test socket 210 of the test part 200; the second transfer tool 800 picks up the plurality of modules 20 that have been inspected from the test socket 210 of the test part 200, and transfers the picked up plurality of modules 20. The group 20 is loaded in the first buffer portion 350 in the second exchange position.

The first module transfer part 610 picks up a plurality of modules 20 from the tray 10 of the loading part 100, and loads the picked up modules 20 into the first buffer part 350 located at the loading position. The structure may be implemented in various structures, and may have the structure shown in FIGS. 3a to 4 of the above-mentioned first embodiment.

The second module transfer part 620 picks up a plurality of modules 20 from the second buffer part 360 located in the unloading position, and loads the picked up modules 20 onto the tray 10 of the unloading part 400 The structure may be implemented in various structures, and may have the structure shown in FIGS. 3a to 4 of the above-mentioned first embodiment.

The first transfer tool 700 picks up a plurality of modules 20 from the first buffer part 350 at the first exchange position, and loads the picked up modules 20 into the test socket 210 of the test part 200 The structure can be implemented in various structures.

The second transfer tool 800 picks up the plurality of modules 20 that have been inspected from the test socket 210 of the test part 200, and loads the picked up plurality of modules 20 into the second exchange position. The structure of the buffer portion 350 can be implemented in various structures.

On the other hand, the first conveying tool 700 and the second conveying tool 800 only have different pickup positions, loading positions, and picking and loading operations. In fact, the structures may be the same.

Specifically, the first transfer tool 700 picks up the modules 20 from the first buffer part 350 at the first exchange position, moves to the upper part of the test part 200, and loads the modules 20 into the test sockets 210 of the test part 200 respectively. .

Then, as a reverse process, the second transfer tool 800 picks up the module 20 from the test socket 210 of the test part 200 at the upper part of the test part 200, and loads the module 20 into the second buffer part 360 at the first exchange position.

Then, the first transfer tool 700 and the second transfer tool 800 may include n (n is a natural number greater than or equal to 2) pickup parts 720 and 820 arranged at intervals of the second pitch P2 in the X-axis direction.

As a specific embodiment, the first transfer tool 700 and the second transfer tool 800 may include: linear moving parts 710 and 810 that move linearly along the X-axis direction; and up and down moving parts 740 and 840 that can move up and down. Combined with the linear moving parts 710 and 810; one or more pickup parts 720 and 820 include a pair of clamps 721 and 821, and the pair of clamps 721 and 821 are combined with the up and down moving parts 740 and 840 , to clamp both ends of the module 20 by moving the length directions of the module 20 in opposite directions; the linear driving parts 730 and 830 are combined with the up and down moving parts 740 and 840 to clamp and release the clamping. The pair of clampers 721 and 821 are moved in the direction; and the main vertical moving parts 750 and 850 are used to move the vertical moving parts 740 and 840 up and down.

The linear moving parts 710 and 810 are structures that move linearly along the Guide rails for linear movement.

As an example, the linear moving part 710 of the first transfer tool 700 may be configured to move back and forth between the first exchange position and the upper part of the testing part 200 .

At this time, the linear moving component 710 of the first conveying tool 700 is driven by a separate linear driving part to perform linear movement in the X-axis direction.

Then, the linear moving part 810 of the second transfer tool 800 may be configured to move back and forth between the upper part of the testing part 200 and the second exchange position.

At this time, the linear moving component 810 of the second conveying tool 800 can be driven by a separate linear driving part to perform linear movement in the X-axis direction.

On the other hand, the linear moving members 710 and 810 are structures for supporting the vertical moving members 740 and 840 and the linear driving parts 730 and 830. According to the support of the vertical moving members 740 and 840 and the linear driving parts 730 and 830, etc. Structure, can be implemented as various structures.

As an example, the linear moving parts 710 and 810 may include: upper plates 711 and 811 and lower plates 713 and 813 arranged at intervals in the up and down direction; and one or more side plates 712 and 812 connected up and down to the upper plate 711 , 811 and lower plate 713, 813.

The upper plates 711 and 811 and the lower plates 713 and 813 are members for stably supporting the vertical moving parts 740 and 840, the linear drive parts 730 and 830, etc., and may be implemented in various structures.

As an example, the upper plates 711 and 811 are provided on the upper side to directly or indirectly support the main vertical moving parts 750 and 850 described below.

Specifically, the upper plates 711 and 811 may be provided to support the drive part support parts 714 and 814 which are supported by a plurality of support rods 715 and 815 and support the main upper and lower parts described below. Moving parts 750,850.

Here, the driving part support parts 714 and 814 are supported by a plurality of support rods 715 and 815 and are provided on the upper plates 711 and 811, and support the main rotation driving parts 751 and 851, and the upper and lower driving parts 753 are rotatably provided. ,853.

The lower plates 713 and 813 are spaced from the upper plates 711 and 811 on the lower side, and may be provided to directly or indirectly support the auxiliary vertical movement parts 760 and 860 described below.

As an example, the lower plates 713 and 813 are provided to support the main rotation driving parts 751 and 851, support the auxiliary rotation driving parts 761 and 861 described later, and rotatably support the screw members 762 and 862.

On the other hand, penetrations are provided in the lower plates 713 and 813 at positions corresponding to the coupling rods 754 and 854 of the main vertical movement parts 750 and 850 and the coupling rods 764 and 864 of the auxiliary vertical movement parts 760 and 860 which will be described later. The hole can move the coupling rods 754 and 854 of the main vertical movement parts 750 and 850 described later and the coupling rods 764 and 864 of the auxiliary vertical movement parts 760 and 860 up and down, and guide bushings for guiding the vertical movement may be provided.

The one or more side panels 712 and 812 have a structure that connects the upper panels 711 and 811 and the lower panels 713 and 813 up and down, and can be implemented in various structures depending on the connection structure.

As an example, the side panels 712 and 812 vertically connect the upper plates 711 and 811 and the lower plates 713 and 813 while rotatably supporting the screw members 752 and 852 of the main vertical moving parts 750 and 850 and the auxiliary vertical moving part. Screw parts 762, 862 of 760, 860.

The vertical movement members 740 and 840 are coupled to the linear movement members 710 and 810 so as to be capable of vertical movement. Mobile structures can be implemented as various structures.

As an example, the vertical movement members 740 and 840 may be composed of plate members coupled to the bottom surface so that the clampers 721 and 821 described below can linearly move in the Y-axis direction.

The pickup parts 720 and 820 are structured to include a pair of clamps 721 and 821, wherein the pair of clamps 721 and 821 are coupled to the up and down moving parts 740 and 840 to move in the length direction of the module 20 (also That is, the Y-axis direction) move in opposite directions to clamp the two ends of the module 20 . The pickup portions 720 and 820 can be implemented in various structures.

As an example, the pair of clamps 721 and 821 may be configured to be coupled to the bottom surfaces of the up-and-down moving parts 740 and 840 and to be coupled to the up-and-down moving parts 740 and 840 in conjunction with a linear driving part provided above. 840, and further can move in opposite directions to each other in the length direction of the module 20 (that is, the Y-axis direction).

At this time, the up and down moving parts 740 and 840 may be provided with guide rails that are combined with the moving blocks combined with the pair of grippers 721 and 821 to guide the linear movement in the X-axis direction.

On the other hand, the pair of clampers 721 and 821 may have any structure as long as they can clamp both end side surfaces of the module 20 with the plate surfaces facing the X-axis direction.

In addition, the pair of clampers 721 and 821 may be configured to clamp more than one, for example, four module sets 20 during clamping, and may include plate-shaped components.

The linear driving parts 730 and 830 are coupled to the vertical moving parts 740 and 840 to move the pair of pickup parts 720 and 820 in clamping and releasing directions. According to the pair of clampers 721 and 821 The linear moving structure can be realized in various structures.

As an example, the linear driving parts 730 and 830 may include: screw parts 734 and 834, which rotate the moving parts 733 and 833 of the pair of clamps 721 and 821 toward opposite directions in the length direction of the module 20 to move in the direction; the rotation driving parts 731 and 831 directly or indirectly rotate the screw parts 734 and 834.

The screw portions 734 and 834 are configured to move the moving members 733 and 833 of the pair of clamps 721 and 821 in opposite directions in the longitudinal direction of the module 20 by rotation, and can be implemented in various structures.

As an example, the screw portions 734 and 834 are rotatably supported on the upper surfaces of the vertical movement members 740 and 840 and are rotatably and drivably provided on rotation drive portions 731 and 831 described below.

At this time, in the screw portions 734 and 834, threads in opposite directions may be formed in the portions coupled with the clamps 721 and 821, so that the pair of clamps 721 and 821 move in opposite directions when rotated. .

That is, in the screw portions 734 and 834 , threads facing in different directions are formed in the portions respectively coupled to the pair of clampers 721 and 821 , so that when the screw portions 734 and 834 rotate, the pair clamps The devices 721 and 821 can move in opposite directions to each other.

On the other hand, the screw portions 734 and 834 and the pair of clamps 721 and 821 can be disposed at various positions in the up and down moving parts 740 and 840, respectively, such as being disposed on the up and down moving parts 740 and 840 respectively. The top and bottom surfaces are all set on the bottom surface, etc.

The rotation drive portions 731 and 831 are configured to directly or indirectly rotate the screw portions 734 and 834, and may be any structure as long as they are used for rotation.

The rotation drive parts 731 and 831 are composed of rotation motors, and the screw parts 734 and 834 can be directly connected to the drive shaft through a connector or the like.

In addition, as shown in FIGS. 14a and 14b , the rotational driving parts 731 and 831 can rotationally drive the screw parts 734 and 834 through the rotational force transmission tools 732 and 832.

The rotational force transmission tools 732 and 832 can be implemented in various structures according to the rotational force transmission structure, and can have various structures such as a belt and pulley structure, a gear combination structure, a wire and pulley structure, and the like.

On the other hand, as shown in FIGS. 14a and 14b , the rotation driving parts 731 and 831 are preferably located on the same side as the screw parts 734 and 834 in the Y-axis direction based on the rotation force transmission tools 732 and 832. , to prevent the vertical moving parts 740 and 840 from extending in the Y-axis direction.

Specifically, the end portions of the drive shafts of the rotation drive portions 731 and 831 and the end portions of the screw portions 734 and 834 are located at the same position in the Y-axis direction, and the rotation force transmission tool 732 and the rotation force transmission tool 732 can be coupled to these end portions. 832.

On the other hand, a plurality of, for example, four pick-up parts 720 and 820 may be provided in the length direction of the module 20. In this case, the screw parts 734 and 834 of the plurality of pick-up parts 720 and 820 may be driven by one rotation. The parts 731 and 831 are driven to rotate.

Specifically, a plurality of the plurality of pickup parts 720 and 820 are arranged in the Y-axis direction. Correspondingly, the screw parts 734 and 834 are composed of one bolt member extending integrally in the Y-axis direction or through a The above connector can be realized in various structures including a plurality of screw parts for connection.

At this time, one end of the two ends of the screw portions 734 and 834 is directly or indirectly coupled to the rotation driving portion 731 and 831, and the plurality of pickup portions 720 and 820 can be rotationally driven through one rotation driving portion 731 and 831. Screw parts 734, 834.

Then, the screw parts 734 and 834 may be composed of screw parts and connectors. The screw parts are correspondingly combined with the respective pickup parts 720 and 820 and are rotatably supported by the up and down moving parts 740 and 840. The connectors are in turn Attach the screw parts.

That is, the screw portions 734 and 834 of the plurality of pickup portions 720 and 820 are integrated with the adjacent screw portions 734 and 834 or connected to each other through connectors, and can be rotationally driven by one rotation driving portion 731 and 831 .

On the other hand, the screw member is formed with threads (threads in different directions from each other, such as right threads and left threads) to be coupled to a pair of clamps 721 and 821 of the pickup parts 720 and 820, and can be rotated in Y A pair of clampers 721 and 821 are linearly moved in the axial direction.

Then, the screw component is not only for clamping the module 20, as shown in Figures 14a and 14b, but also can adjust the width of the pair of clampers 721, 821 in the Y-axis direction to clamp the Y-axis direction. Modules 20 in different lengths.

The main vertical movement parts 750 and 850 are configured to move the vertical movement members 740 and 840 vertically, and can be implemented in various structures.

As an example, the main up and down moving parts 750 and 850 may include: up and down driving parts 753 and 853, which are combined with the up and down moving parts 740 and 840 to make the up and down moving parts 740 and 840 move relative to the linear moving part 710. , 810 can move up and down; and the main up and down driving part is combined with the linear moving parts 710 and 810 to move the up and down driving parts 753 and 853 up and down.

The vertical driving members 753 and 853 are combined with the vertical moving members 740 and 840 to allow the vertical moving parts 740 and 840 to move up and down relative to the linear moving members 710 and 810, and may be implemented in various structures. .

As an example, the up and down driving components 753 and 853 may be composed of a driving plate coupled to the up and down moving components 740 and 840 through a plurality of coupling rods 754 and 854.

The main vertical driving part is coupled to the linear moving members 710 and 810 and moves the vertical driving members 753 and 853 vertically. It can be implemented in various structures according to the vertical driving method.

As an example, the main up and down driving parts may include: screw parts 752, 852, which are combined with nuts combined with the up and down driving parts 753, 853; and main rotation driving parts 751, 851, which directly or indirectly drive the rotation of the Screw components 752, 852.

The screw members 752 and 852 are coupled to nuts coupled to the upper and lower driving members 753 and 853, and can be implemented in various structures.

As an example, the screw components 752 and 852 are coupled to nuts coupled to the upper and lower driving components 753 and 853, and are rotatably supported and provided on the linear moving components 710 and 810.

The main rotation driving parts 751 and 851 are configured to directly or indirectly rotate the screw members 752 and 852, and may be implemented in various structures.

As an example, the main rotation driving parts 751 and 851 may be composed of rotation motors fixedly provided on the linear moving parts 710 and 810 .

On the other hand, in the main rotation drive portions 751 and 851, the drive shaft can be directly coupled to the screw members 752, 852 or indirectly coupled to the screw members 752, 852 through a rotational force transmission tool.

As shown in Figures 14a and 14b, the rotational force transmission tool may have various structures, such as a belt and pulley structure, a gear combination structure, a wire and pulley structure, and the like.

On the other hand, the module 20 must be transported in the order of the tray 10 of the loading unit 100 → the first buffer tray 351 → the test unit 200 → the second buffer tray 361 → the tray 10 of the unloading unit 400 During the process, the module 20 is pressed on the upper side for loading, or the module 20 is prevented from being ejected on the upper side during the process of pressing the hook portion when picking up.

Specifically, it is necessary to prevent the module 20 from being ejected to the upper side during the picking up process of the module 20 shown in FIGS. 20 pressurized socket.

Accordingly, the first transfer tool 700 and the second transfer tool 800 may include: pressurizing parts 722 and 822, which are provided between the pair of clampers 721 and 821 and move up and down to pressurize the mold to the lower side. Group 20; and auxiliary vertical moving parts 760, 860, which move the pressurizing parts 722, 822 up and down.

The pressurizing parts 722 and 822 are arranged between the pair of clampers 721 and 821 and pressurize the module 20 downward by moving up and down. Depending on the pressurizing method of the module 20, it can be implemented as various structures.

On the other hand, when a plurality of the pickup portions 720 and 820 are provided, the pressing portions 722 and 822 are provided at the center portions of the pair of grippers 721 and 821 corresponding to the respective pickup portions 720 and 820 , respectively. .

At this time, corresponding to the length of the module 20 in the Y-axis direction, the width of the pair of clamps 721 and 821 can change. Therefore, the pair of clamps 721 and 821 preferably have a width that does not hinder the change. The length in the Y-axis direction.

The auxiliary vertical movement parts 760 and 860 are configured to move the pressurizing parts 722 and 822 up and down, and may be implemented in various structures according to the vertical movement of the pressurizing parts 722 and 822.

As an example, the auxiliary up and down moving parts 760 and 860 may include: auxiliary up and down driving parts 765 and 865, combined with the pressurizing parts 722 and 822, for the linear moving parts 710 and 810 to move up and down; and The auxiliary vertical driving part is coupled to the linear moving parts 710 and 810 to move the auxiliary vertical driving parts 765 and 865 up and down.

The auxiliary vertical driving members 765 and 865 are coupled to the pressurizing parts 722 and 822 and can move up and down with respect to the linear moving members 710 and 810, and can be implemented in various structures.

As an example, the auxiliary up and down driving components 765 and 865 may be composed of a driving plate connected to the pressurizing parts 722 and 822 through a plurality of coupling rods 764 and 864.

The auxiliary vertical driving unit is coupled to the linear moving members 710 and 810 to move the auxiliary vertical driving members 765 and 865 vertically, and may be implemented in various structures.

As an example, the auxiliary up and down driving parts may include: screw parts 762, 862, which are combined with nuts combined with the auxiliary up and down driving parts 765, 865; and auxiliary rotation driving parts 761, 861, which directly or indirectly drive the rotation of the The screw components 762 and 862 are described.

The screw members 762 and 862 are configured to be coupled to nuts coupled to the auxiliary vertical driving members 765 and 865, and may be implemented in various structures.

As an example, the screw components 762 and 862 are coupled to nuts coupled to the auxiliary up and down driving components 765 and 865 and are rotatably supported and provided on the linear moving components 710 and 810 .

The auxiliary rotation driving parts 761 and 861 are configured to directly or indirectly rotate the screw members 762 and 862, and may be implemented in various structures.

As an example, the auxiliary rotation driving parts 761 and 861 may be composed of rotation motors fixedly provided on the linear moving parts 710 and 810 .

On the other hand, the auxiliary rotation drive portions 761 and 861 have a drive shaft that is directly coupled to the screw members 762 and 862 or that is indirectly coupled to the screw members 762 and 862 through a rotational force transmission tool.

The rotational force transmission tool may have various structures, such as a belt and pulley structure, a gear combination structure, a wire and pulley structure, etc. shown in Figures 14a and 14b.

On the other hand, the screw members 762 and 862 of the auxiliary vertical drive part may be provided coaxially with the screw members 752 and 852 of the main vertical drive part described above in a state of being separated from each other.

The first transfer tool 700 with the above structure can quickly and flexibly pick up the module 20 from the first buffer part 350 and load the module 20 into the test part 200. The second transfer tool 800 can quickly and flexibly execute the test from The module 200 picks up the module 20 and loads the module 20 into the second buffer part 360 .

On the other hand, as for the first transfer tool 700 and the second transfer tool 800, as well as the mold tool 640 shown in FIGS. 9a to 10d, as long as the mold has a right rectangular shape and the plate surface faces the X-axis direction, The transfer tool of group 20, regardless of the other structures, can of course also be flexibly used as an independent structure of the transfer tool for picking up and loading modules.

On the other hand, an empty pallet placing part 410 may be disposed between the loading part 100 and the unloading part 400, and the empty pallet placing part 410 may place the empty pallet 10 after picking up the module 20 from the loading part 100.

The empty pallet placing part 410 is provided between the loading part 100 and the unloading part 400 to place empty pallets 10 after picking up the modules 20 from the loading part 100 , and may include the above-mentioned pallet stacker 500 .

Then, the pallets 10 can be transferred to each other between the loading part 100, the unloading part 400 and the empty pallet placing part 410. To this end, the pallets 10 can be transferred through the pallet conveyor as mentioned above.

On the other hand, in the module processor of the second embodiment of the present invention, the loading part 100 and the unloading part 400 are arranged in a row in the X-axis direction, and the test part 200 can be located at a distance from the loading part 100 in the Y-axis direction. and the position of the removal part 400.

Then, the first buffer part 350 and the second buffer part 360 are disposed on both sides of the test part 200 in the X-axis direction so as to be reciprocally movable in the Y-axis direction, and can be transferred from the loading part 100 to the test part 200 as described above. The module 20 may be transferred from the testing part 200 to the removal part 400 .

On the other hand, based on the inspection results such as complete failure among the failures in the module 20 inspected by the testing unit 200, the module 20 is re-transmitted to the testing unit 200 for re-inspection or can be removed and used in the removal unit 400. of module 20, and export completely unqualified module 20 separately.

Specifically, the module processor of the second embodiment of the present invention may further include a re-inspection shuttle part 440 and a defective product between the loading part 100, the unloading part 400 and the testing part 200 in the Y-axis direction. Department 430 etc.

The re-inspection reciprocating part 440 is arranged in the Y-axis direction between the loading part 100, the unloading part 400, and the testing part 200, and receives and loads the module 20 inspected as the re-inspection object from the second buffer part 360. Afterwards, if a predetermined number of modules 20 are loaded, the structure of transferring the modules 20 to the first buffer part 350 can be implemented in various structures.

As an example, the structure of the rechecking shuttle part 440 may be similar to the first buffer part 350 and the second buffer part 360 . However, unlike the first buffer part 350 and the second buffer part 360 which move in the Y-axis direction, the moving direction of the rechecking and reciprocating part 440 may be set to move in the X-axis direction.

Here, the transmission from the second buffer part 360 to the re-test shuttle part 440 can be transmitted through the second module transmission part 620, and the module 20 can be transmitted from the re-test shuttle part 440 to the first buffer part 350 through the second module transmission part 620. The module transfer unit 620 transfers.

The defective part 430 is arranged in the Y-axis direction between the loading part 100, the unloading part 400, and the testing part 200, and is configured to individually export completely defective modules 20, and may be implemented in various structures.

As an example, the defective part 430 may be arranged in line with the re-inspection shuttle part 440 and include the tray 10 loading the module 20. If all are filled with completely unqualified modules 20, then the X-axis Move in the direction, move to the right in the attached picture to export to the outside.

On the other hand, the module processor according to the second embodiment of the present invention has been described with the test unit 200 as the center, loading the module 20 on one side, and removing the module 20 on the other side. However, the first buffer unit 350 The structures of the second buffer part 360 , the first transfer tool 700 and the second transfer tool 800 may actually be the same, so of course the loading process and the unloading process may be alternately performed on both sides of the test part 200 .

The above is only a relevant description of a part of the preferred embodiments that can be implemented by the present invention. Therefore, it is well known that the scope of the present invention should not be limited to the above-mentioned embodiments. The technical ideas and fundamental technical ideas of the present invention described above are not limited to the above-mentioned embodiments. All are included in the scope of the present invention.

10: Tray 20: Module 100: Loading part 200: Test part 210: Test socket 211: Test slot 219: Hook part 310: Shuttle part 311: Shuttle plate 312: First loading slot (loading slot) 313: Second loading Slot (loading slot) 314, 315: Unloading loading slot 330: First buffer portion 331, 341: Buffer plate 332, 342: First loading slot (loading slot) 333, 343: Second loading slot (loading slot) 340: Second buffer portion 350: Second One buffer part 351: first buffer tray (buffer tray) 351a, 361a: loading part 351b, 361b: moving plate 352, 362: guide rail 353, 363: Y-axis direction moving part 360: second buffer part 361: second buffer tray (buffer tray) Pallet) 400: Unloading part 410: Empty pallet placing part 420: Module buffer part 430: Defective part 440: Reinspection and shuttle part 500: Stacker 510: Elevating part 520: Guide part 610: First module transfer part 611: Holder 614: Linear drive part 615: Moving support part 620: Second module transfer part 630: Third module transfer part 640: Module tool 641: Holder 648: Picking tool 649: Pressure part 650: Fourth module transfer part 700: First transfer tool 710, 810: Linear moving part 711, 811: Upper plate 712, 812: Side plate 713, 813: Lower plate 714, 814: Drive part support part 715, 815: Support rod 720, 820: Pickup part 721, 821: Clamp 722, 822: Pressure part 730, 830: Linear drive part 731, 831: Rotary drive part 732, 832: Rotary force transmission tool 733, 833: Moving part 734, 834: Screw part 740, 840: Up and down moving part 750, 850: Main up and down moving part 751, 851: Main rotation driving part 752, 852: Screw part 753, 853: Vertical drive member 754, 854: Coupling rod 760, 860: Auxiliary vertical movement part 761, 861: Auxiliary rotation drive part 762, 862: Screw member 764, 864: Coupling rod 765, 865: Auxiliary vertical drive member 800: Second transfer tool D ₁ , D ₂ : Distance L: Action path L1: first baseline L2: second baseline L3: third baseline P1: first distance P2: second distance

Figure 1 is a plan view showing a module processor according to a first embodiment of the present invention; Figure 2a is a plan view showing an example of the pallet stacker constituting the loading section and the unloading section in Figure 1; Figure 2b is a front view of the pallet stacker of Figure 2a; FIG. 3a is a side view showing an example of the module transfer part used for transferring modules between the loading part and the first buffer part and between the second buffer part and the removal part in FIG. 1; Figure 3b is a side view showing that the module transfer section of Figure 3a adjusts the distance between a pair of clampers holding the module to pick up and transfer modules with different specifications; Figure 4 is a front view of the module transfer section of Figure 3a; 5a and 5b respectively show plan views of the first buffer part and the second buffer part; wherein, FIG. 5a is a plan view showing the state in which the loading groove part is spaced apart by a first distance in order to exchange the module with the loading part/unloading part; FIG. 5b is a plan view showing that in order to exchange the module with the loading shuttle/unloading shuttle, the loading grooves are spaced at a second distance; Fig. 6 is a plan view showing the arrangement of the first buffer portion and the loading shuttle portion or the second buffer portion and the unloading shuttle portion in Fig. 1; Figure 7 is a plan view showing the transfer and arrangement between the loading shuttle/unloading shuttle and the test section in Figure 1; Figures 8a to 8e are schematic diagrams showing the transfer module and testing process between the loading shuttle part/unloading shuttle part and the test part; Figures 9a to 9d are schematic diagrams showing the process of separating the module for the test part; Figures 10a to 10d are schematic diagrams showing the process of placing the module on the test section; Figure 11 is a plan view showing a module processor according to a second embodiment of the present invention; Figure 12a is a plan view showing an example of a tray used by the module processor of Figure 11; Figure 12b is a plan view showing an example of a buffer tray used in the module processor of Figure 11; Figure 12c is a plan view showing an example of the test section side used by the module processor of Figure 11; 13a and 13b are schematic diagrams illustrating an example of a process of picking up a module by loading/unloading the shuttle in the module processor of FIG. 11; Figures 14a and 14b are diagrams showing an example of the loading shuttle/unloading shuttle of Figures 13a and 13b, respectively showing the state of picking up DIMM-standard DRAM or so-DIMM-standard DRAM; Figure 15a is an enlarged view of part A in Figure 14a; Figure 15b is an enlarged view of part B in Figure 14b; and Fig. 16 is a side view of the loading shuttle/unloading shuttle of Figs. 13a and 13b seen from another side.

10: Tray

100:Loading Department

200:Testing Department

210:Test socket

310: Round trip department

330: First buffer part

340: Second buffer part

350: First buffer part

400:Removal part

410: Empty pallet placement department

420:Module buffer part

610: First module transmission department

620: Second module transmission department

630:Third module transmission department

650: The fourth module transmission department

L: action path

L1: first baseline

L2: second baseline

L3: third baseline

Claims (26)

A module processor including: A loading part (100) for loading a plurality of modules (20) on a pallet (10); A first buffer part (330) receives the plurality of modules (20) from the loading part (100) for temporary loading; A test part (200) is set at a test position, and performs preset inspections after inserting the module (20). The test position is set on a preset action path (L); More than one shuttle part (310) is movably provided to circulate along the action path (L) at a loading position, the test position and an unloading position set on the action path (L), and Receive the plurality of modules (20) from the first buffer part (330) and transfer them to the test part (200); a second buffer part (340) that receives the plurality of modules (20) that have completed inspection from the shuttle part (310) at the unloading position for temporary loading; and A removal part (400) receives the plurality of modules (20) from the second buffer part (340), and removes them to the tray (10) according to preset classification standards. The module processor according to claim 1, wherein the module (20) is a DRAM with DIMM specifications or a DRAM with so-DIMM specifications. The module processor according to claim 1, wherein the module (20) moves with its board surface facing the horizontal direction; The tray (10) arranges each of the modules (20) at a first spacing (P1), and a test socket (210) of the test part (200) is spaced at a second spacing (P2). ) configuration; Wherein, the first buffer part (330) is spaced by the first spacing (P1) between a loading slot (332, 333), and receives data from the loading part (100) at the first spacing (P1). The module (20), and changes the spacing between the loading slots (332, 333), so that the loading slots (332, 333) are separated by the second spacing (P2), and then all the loading slots (332, 333) are separated by the second spacing (P2). The module (20) is delivered to the shuttle portion (310) at a distance of the second spacing (P2); and Wherein, the second buffer part (340) is spaced by the first spacing (P1) between the loading slots (342, 343), and further separates the module (20) by the first spacing (P1). ) to the removal part (400), and change the distance between the loading grooves (342, 343) so that the loading grooves (342, 343) are spaced apart by the second distance (P2), Furthermore, the module (20) is transferred from the reciprocating part (310) at the unloading position by the second pitch (P2). The module processor according to claim 1, wherein the shuttle part (310) is provided with a heating part to heat the module (20) before transferring it to the testing part (200). The module processor according to claim 1, wherein the shuttle portion (310) will place a first loading slot of the module (20) of the first specification and be adjacent to the first loading slot. Set and place a second loading slot of the module (20) of the second specification to form a small group, and arrange more than n of the small groups along the moving direction to form an intermediate group; Wherein, the small groups of the middle group are arranged such that the spacing between the small groups of the adjacent middle group is configured as a second spacing (P2), and the second spacing (P2) is connected to the test part (200). ) corresponds to the spacing of a test socket (210). A module processor including: A loading part (100) loads a plurality of modules (20) on a pallet (10); A removal part (400) receives the plurality of modules (20) that have been inspected and removes them from the tray (10) according to preset classification standards; A test part (200) is located on a third baseline (L3), which performs preset inspections on the plurality of modules (20). The third baseline (L3) is vertically spaced to connect the load. part (100) and a first baseline (L1) of the removal part (400); A first buffer part (350) moves back and forth between a loading position and a first exchange position to receive the plurality of modules (20) from the loading part (100) at the loading position, where The first exchange position set on the third baseline (L3) transfers the plurality of modules (20) to the test part (200); and A second buffer part (360) moves back and forth between an unloading position and a second exchange position, so as to move from the test part (200) to the second exchange position set on the third baseline (L3). ) receives the plurality of modules (20) that have been inspected and moves them to the unloading position, and transfers the plurality of modules (20) that have been inspected to the unloading part (400). The module processor according to claim 6, wherein the test part (200) is located between the action path of the first buffer part (350) and the action path of the second buffer part (360). The module processor according to claim 6, wherein the first buffer part (350) and the second buffer part (360) include a pair of buffer trays (351, 361), and the pair of buffer trays (351, 361) are arranged parallel to the direction of the first baseline (L1). The module processor according to any one of claims 6 to 8, further comprising: A first module transfer part (610) picks up the plurality of modules (20) from the tray (10) of the loading part (100), so as to transfer the picked up plurality of modules (20) Loaded on the first buffer portion (350) located in the loading position; A second module transfer part (620) picks up the plurality of modules (20) from the second buffer part (360) located at the unloading position, so as to transfer the picked up plurality of modules (20) ) the pallet (10) loaded on the unloading part (400); A first transfer tool (700) picks up the plurality of modules (20) from the first buffer portion (350) located at the first exchange position, so as to transfer the picked up plurality of modules (20) ) is mounted on a test socket (210) of the test part (200); and A second transfer tool (800) picks up the plurality of modules (20) that have been inspected from the test socket (210) of the test part (200), so as to transfer the picked up plurality of modules (20) 20) Loaded in the first buffer portion (350) located in the second exchange position. The module processor according to claim 9, wherein the module (20) moves with its board surface facing the horizontal direction; Wherein, the tray (10) arranges each of the modules (20) at a first spacing (P1) in the X-axis direction, and the test socket (210) of the test part (200) The directions are spaced apart by a second spacing (P2); and Wherein, the first buffer part (350) and the second buffer part (360) include a plurality of loading groups, and the plurality of loading groups include a plurality of loads arranged at a second spacing (P2) in the X-axis direction. parts (351a, 361a), the loading parts (351a, 361a) of each loading group of the plurality of loading groups are separated from adjacent loading parts (351a, 361a) in other loading groups by the first spacing (P1) configured locally. The module processor according to claim 10, wherein the first transfer tool (700) and the second transfer tool (800) include n (n is a natural number above 2) pickup parts (720, 820), the pick-up portions (720, 820) are arranged at intervals in the X-axis direction by the second spacing (P2); and Wherein, the number of the plurality of loading groups in the X-axis direction is m (m is a natural number greater than 1). The module processor according to claim 10, wherein the number of the test sockets (210) in the X-axis direction is n, and the test sockets (210) are spaced apart by the second spacing (P2) in the X-axis direction. ) to configure. The module processor according to claim 10, wherein the first transfer tool (700) and the second transfer tool (800) include: A linear moving component (710, 810) that moves linearly along the X-axis direction; An up-and-down moving component (740, 840), which is coupled to the linear moving component (710, 810) to move up and down; More than one pick-up part (720, 820) includes a pair of clamps (721, 821), and the pair of clamps (721, 821) is combined with the up and down moving parts (740, 840), so The length directions of the module (20) move in opposite directions to clamp both ends of the module (20); A linear drive part (730, 830), combined with the up and down moving parts (740, 840), moves the pair of clampers (721, 821) in the direction of clamping and releasing; and A main up-and-down moving part (750, 850) is used to move the up-and-down moving part (740, 840) up and down. The module processor according to claim 13, wherein the first transfer tool (700) and the second transfer tool (800) include: A pressurizing part (722, 822) is provided between the pair of clampers (721, 821) and presses the module (20) downward by moving up and down; and An auxiliary upward and downward moving part (760, 860) is used to move the pressurizing part (722, 822) up and down. The module processor according to claim 13, wherein the linear driving part (730, 830) includes: A screw part (734, 834) rotates to move a moving part (733, 833) of the pair of clamps (721, 821) in opposite directions in the length direction of the module (20). ;as well as A rotation driving part (731, 831) directly or indirectly rotates the screw part (734, 834). The module processor according to claim 15, wherein the rotational driving part (731, 831) rotationally drives the screw part (734, 834) through a rotational force transmission tool (732, 832). The module processor according to claim 15, wherein a plurality of the pickup parts (720, 820) are provided in the length direction of the module (20); and Among them, the screw parts (734, 834) of the plurality of pickup parts (720, 820) are rotationally driven by one of the rotation driving parts (731, 831). The module processor according to claim 17, wherein the screw parts (734, 834) of the plurality of pickup parts (720, 820) are integrated with the adjacent screw parts (734, 834) , or connected to each other through connectors to be rotationally driven by one of the rotation driving parts (731, 831). The module processor according to claim 10, wherein the module (20) is a DRAM with DIMM specifications or a DRAM with so-DIMM specifications. A conveying tool used to convey a module (20). The module (20) forms a right-angled quadrilateral shape and is in a state where the board surface faces the X-axis direction, including: A linear moving component (710, 810) that moves linearly along the X-axis direction; An up-and-down moving component (740, 840), which is coupled to the linear moving component (710, 810) to move up and down; More than one pick-up part (720, 820) includes a pair of clamps (721, 821), and the pair of clamps (721, 821) is combined with the up and down moving parts (740, 840), so The length directions of the module (20) move in opposite directions to clamp both ends of the module (20); A linear drive part (730, 830), combined with the up and down moving parts (740, 840), moves the pair of clampers (721, 821) in the clamping and releasing direction; and A main up-and-down moving part (750, 850) is used to move the up-and-down moving part (740, 840) up and down. The delivery tool according to claim 20, further comprising: A pressurizing part (722, 822) is provided between the pair of clampers (721, 821), and presses the module (20) downward by moving up and down; and An auxiliary upward and downward moving part (760, 860) is used to move the pressurizing part (722, 822) up and down. The conveying tool according to claim 20, wherein the linear drive part (730, 830) includes: A screw part (734, 834) rotates to move a moving part (733, 833) of the pair of clamps (721, 821) in opposite directions in the length direction of the module (20). ;as well as A rotation driving part (731, 831) directly or indirectly rotates the screw part (734, 834). The transmission tool according to claim 22, wherein the rotational driving part (731, 831) rotationally drives the screw part (734, 834) through a rotational force transmission tool (732, 832). The transfer tool according to claim 22, wherein a plurality of the pickup parts (720, 820) are provided in the length direction of the module (20); and Among them, the screw parts (734, 834) of the plurality of pickup parts (720, 820) are rotationally driven by one rotation driving part (731, 831). The transfer tool according to claim 24, wherein the screw parts (734, 834) of the plurality of pickup parts (720, 820) are integrated with the adjacent screw parts (734, 834), or They are connected to each other through connectors to be rotationally driven by one of the rotation driving parts (731, 831). The transfer tool according to claim 20, wherein the module (20) is a DRAM with DIMM specifications or a DRAM with so-DIMM specifications.