KR20020083742A - Semiconductor device tester - Google Patents

Abstract

PURPOSE: An apparatus for testing a semiconductor device is provided to perform a test of an individual semiconductor device under practical mounting environment and reduce a time necessary for a semiconductor test process and a fabrication cost. CONSTITUTION: A handler portion(110) transfers a semiconductor device(11) located in a client tray(13) to a test tray(21). The handler portion(110) is formed with a tray loading portion(111), a tray unloading portion(121), a buffer portion(141), a test tray loading/unloading portion(151), a heating chamber(153), a cooling chamber(157), and a plurality of pick and place devices(131,135). The tray loading portion(111) is formed with a plurality of tray loaders(112). The tray loader(112) includes a tray loading plate for loading the tray and a tray transfer portion for transferring the client tray to a supply position. A plurality of tray unloaders(123,125) are formed with a plurality of unloaders(123,125). Each structure of the tray loaders(123,125) is the same structure as the tray loader(112). The buffer portion(141) includes a buffer tray(15) and a buffer tray transfer portion(143). The test tray loading/unloading portion(151) has a test tray movement portion(158). The test tray loading/unloading portion(151) is connected with the heating chamber(153) and the cooling chamber(157). The heating chamber(153) is used for heating the semiconductor device(11) of a test tray(21). The pick and place devices(131,135) are formed with a picker(132), a plurality of transfer bars(133,137), and a plurality of transfer rails(134,138). A mounting check portion(170) has a plurality of unit PC test portions(171). The unit PC test portion(171) is formed with a main substrate for test, a fixing portion, and a drive portion. An elevator portion(160) is installed between the handler portion(110) and the mounting check portion(170). A control portion(180) controls the handler portion(110), the elevator portion(160), and the mounting check portion(170).

Description

Semiconductor device inspection device {SEMICONDUCTOR DEVICE TESTER}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device inspection device, and more particularly, to a semiconductor device inspection device capable of inspecting a defective / good state of a semiconductor device under actual mounting environment conditions.

In general, assembling is completed, the reliability of performance is ensured through inspection using expensive specialized inspection equipment provided separately so that inspection can be performed under various conditions. For example, a memory semiconductor device, such as synchronous dynamic random access memory (SDRAM), RAMBUS DRAM, or static random access memory (SRAM), may be inserted into a socket of a professional inspection equipment after an assembly process, and then inside the memory device. The reliability of the circuit's characteristics or operation is checked.

However, in the case of using the professional inspection equipment, the inspection device may not realize the actual environmental characteristics such as the noise of the computer motherboard, and thus the accuracy of the inspection may be degraded, thereby causing a quality problem. Accordingly, the inspection in the environment in which the product is actually used, that is, the mounting environment, is recognized as a more appropriate method than the unique environment provided by the inspection apparatus.

The inspection of the memory semiconductor device in the mounting environment is performed by mounting a memory module mounted with the memory semiconductor device to be inspected in a main board for a personal computer or a workstation, which is intended to be attached in the form of a memory module which is a final use form. Then, it is known to check whether the semiconductor device is good or bad by operating a personal computer or a workstation.

However, in the case of a memory semiconductor device inspection performed in an actual mounting environment, if a defect occurs in any one of the semiconductor devices constituting the memory module, the reject process is rejected. It is additionally required to separate and inspect a semiconductor device or a good semiconductor device which is determined to be defective, and to repair and replace a defective semiconductor device with a good semiconductor device. Accordingly, time loss and production cost increase. In addition, the semiconductor device inspection in the actual mounting environment according to the prior art, because the inspection must be carried out in the main board with the implementation environment conditions as compared to the case of using expensive specialized inspection equipment that can perform a large amount of inspection It takes longer time.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor device inspection apparatus capable of inspecting individual semiconductor devices in an actual mounting environment, reducing the time required for the semiconductor device inspection process and reducing production costs.

1 is a schematic plan view of a semiconductor device inspection apparatus according to the present invention,

2 is a schematic cross-sectional view of a semiconductor device inspection apparatus according to the present invention;

3 and 4 are a plan view and a cross-sectional view showing a part of a test tray.

Explanation of symbols on the main parts of the drawings

11; Semiconductor device 12; External connection terminal

13,17,19; Customer tray

15; Buffer tray 21; Test tray

100; Semiconductor device inspection apparatus 110; Handler

111; Loading part 112; Tray loader

113; Customer tray stack 115; Customer Tray Transport Means

121; Unloading part 123, 125; Tray unloader

131,135; Pick and place device

132,136; Pickers 133,137; Transfer bar

134,138; Guide rail 141; Buffer section

151; A test tray loading unit 153; Heating chamber

154; Lifting means 155; Passage

157; Cooling chamber 160; Elevator

161; Test tray loading plate 162; Transfer bar

163; Guide rail 170; Mount inspection department

171; PC inspection unit 172; Inspection Motherboard

173; Fastening means 175; Chamber

In order to achieve the above object, the semiconductor device inspection apparatus according to the present invention performs an inspection in an actual mounting environment for each semiconductor device that is not in the form of a memory module. To this end, the semiconductor device inspection apparatus of the present invention includes a test tray in which a plurality of pockets in which semiconductor devices are accommodated are formed by exposing external connection terminals. And a tray loader for supplying a plurality of trays in which the semiconductor elements requiring inspection are supplied, a tray unloader for supplying a plurality of trays for accommodating the inspected semiconductor elements, and a tray loader. Pick and place device for transferring semiconductor elements from the stacked trays to the test tray and for transferring the semiconductor elements contained in the test trays to the tray unloader, and loading / unloading the test trays for supplying the test trays ( a handler part having a loading / unloading part; A plurality of inspection main boards circuit-implemented with a plurality of actual mounting environments corresponding to each semiconductor element of the test tray, a fixing means for fixing the supplied test tray, and a drive unit connecting the inspection main board and the semiconductor elements of the test tray. a mounting inspection unit in which a plurality of unit PC inspection units having a drive part are arranged to form a plurality of rows vertically and horizontally; And an elevator part for supplying a test tray to each PC inspection part of the mounting inspection part from the handler part. It also includes a control unit for controlling the operation of each part and inputting the test signal to the test main board of each PC inspection unit and receives the output data. The control unit is driven by a predetermined inspection program.

Through such a configuration, a tray containing a large amount of semiconductor elements to be inspected is supplied by a tray loader and continuously supplied to a test tray by a pick and place device. The test tray in which the semiconductor elements are housed is continuously supplied to each unit PC inspection unit of the mounting inspection unit by the elevator unit and inspected. A large number of unit PC inspection units are provided to accommodate all of the test trays that are continuously supplied.

On the other hand, in the semiconductor device inspection apparatus according to the present invention, the handler unit has a heating chamber or a cooling chamber that applies the inspection atmosphere temperature of the semiconductor element at the temperature condition at which the inspection proceeds, so that the actual inspection environment is improved. It is preferable to shorten the time required for inspection by applying the inspection atmosphere temperature to the semiconductor element before the semiconductor element is supplied to the mounting inspection unit to be advanced. In addition, it is to have a cooling chamber or a heating chamber to make the semiconductor device to be tested at room temperature.

Hereinafter, a semiconductor device inspection apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic plan view of a semiconductor device inspection device according to the present invention, Figure 2 is a schematic cross-sectional view of a semiconductor device inspection device according to the present invention, Figures 3 and 4 are a plan view and a cross-sectional view showing a part of a test tray. to be.

First, referring to FIGS. 3 and 4, a structure of a test tray used in the semiconductor device inspection apparatus of the present invention will be described. The test tray 21 may include the semiconductor device 11 to be inspected in the tray body 22. It has a plurality of pockets 24 and includes a carrier socket 23 for fixing the semiconductor element 11 accommodated therein. Here, the pocket 24 of the carrier socket 23 is formed so that the external connection terminal 12 of the semiconductor element 11 accommodated is exposed below the test tray 21. In addition, an information display hole or a mark may be formed at a side surface of the test tray 21 so that information unique to the test tray or information of the contained semiconductor device may be read using an optical sensor or image recognition.

1 and 2, the semiconductor device inspecting apparatus 100 of the present invention is supplied with the semiconductor element 11 to be inspected stored in the customer tray 13 to inspect the semiconductor element 11. In order to transfer to the test tray 21 prepared in order to proceed to the received test tray 21 unit. For this purpose, the handler 110, the elevator 160, the mounting inspection unit 170, and the controller 180 are provided.

The handler unit 110 is responsible for supplying the semiconductor element 11 accommodated in the customer tray 13 to the test tray 21, and the tray loading unit 111, the tray unloading unit 121, and the buffer unit (buffer). part 141, a test tray loading / unloading unit 151, a heating chamber 153, a cooling chamber 157, and pick and place devices 131 and 135.

The tray loading unit 111 is composed of a plurality of tray loaders 112 in which the customer trays 13 in which the semiconductor elements 11 are stored are loaded and supplied, and each tray loader 112 is loaded by the trays 13. The tray stacking plate 113 and the tray transfer means 115 for moving the customer tray 13 to the supply position.

The tray unloaders 123 and 125 are composed of a plurality of unloaders 123 and 125 to which empty customer trays 17 and 19 are supplied, respectively, for accommodating the semiconductor elements 11 classified as good and bad. The structure of each of the unloaders 123 and 125 is the same as that of the tray loader 112 and is configured to perform the reverse operation.

The buffer unit 141 is installed at a position adjacent to the tray loading unit 111 and the tray unloading unit 121 and for temporary storage of the semiconductor element 11 which is temporarily stored in or supplied to the semiconductor element 11 requiring re-inspection. The buffer tray 15 and the buffer tray moving means 143 for moving the buffer tray 15 are comprised. The buffer tray moving unit 143 is a structure that allows the conveyor tray method or the roller method to be applied to move the buffer tray 15 for a predetermined period.

The test tray loading / unloading unit 151 is installed at a position adjacent to the buffer unit 141 and moves the test tray 21 in which the semiconductor element 11 is accommodated and fixed so as to expose the external connection terminal. It has a configuration including a test tray moving unit 158 to be installed, and is installed in association with the heating chamber 153, the cooling chamber 157 and the like to be described later. The moving section of the test tray 21 is between the heating chamber 153 at the storage position of the semiconductor element 11, the discharge position at the cooling chamber 157, and the storage position at the discharge position.

The heating chamber 153 is installed adjacent to the semiconductor storage position as a means for heating the semiconductor element 11 stored in the test tray 15 to a desired test temperature, and can handle the plurality of test trays 21 at a time. It consists of several layers so as to include a lifting means 154 for lifting the test tray 21 vertically. The lower part is provided with a passage 155 for discharging the test tray 21. Although not shown, a passage is provided in the upper portion so that the test tray 21 may be supplied from the test tray moving means 158. Since the heating chamber 153 is known from the Republic of Korea Patent Publication No. 1999-81111, the detailed description of the structure will be omitted.

The cooling chamber 157 is installed adjacent to the discharge position of the test tray 21 in which the semiconductor element in which the test tray 21 has been inspected is stored, and is a means for cooling the semiconductor element tested at a constant temperature to room temperature. The applied temperature conditions are different, and are the same as the structure of the heating chamber 153.

The pick-and-place devices 131 and 135 respectively have a picker 132 that adsorbs the semiconductor element 11, a transfer bar 133 and 137 and a tray loading unit 111 which are coupled to allow the picker to move left and right. It has a configuration including the transfer rails (134, 138) installed at both edge positions of the loading unit 121, the test tray 21 of the test tray loading / unloading unit 151 from the customer tray 13 of the tray loader 112 And the transfer of the semiconductor element 11 from the test tray 21 of the test tray loading / unloading unit 151 to the customer tray 13 of the tray unloaders 123 and 125.

Meanwhile, the mounting inspecting unit 170 includes an inspection main board 172 in which an actual mounting environment of each semiconductor element 11 accommodated in the test tray 21 is implemented, and fixing means 173 for fixing the test tray 21. And a plurality of unit PC inspection units 171 having a configuration including a drive unit 174 for connecting the semiconductor element 11 stored in the test tray 21 to the inspection main board 172. Here, the plurality of unit PC inspection unit 171 is arranged to form a plurality of rows vertically and horizontally. Each unit PC inspection unit 171 includes a chamber 175 that heats or cools the semiconductor element 11 to a desired inspection temperature. The mounting inspection unit 170 may be expanded by expanding the unit PC inspection unit 171 in the horizontal and vertical directions as shown in 160a and 160b of FIG. 3 as needed.

The elevator unit 160 is installed between the handler unit 110 and the mounting inspection unit 170, and the elevator mounting plate 161 on which the test tray 21 is mounted and the forward and backward and vertical and horizontal of the elevator mounting plate. It has a configuration including a transfer bar 162 and a transfer rail 163 for moving. The test tray 21 supplied from the handler unit 110 is selectively supplied to each PC inspection unit 171 of the mounting inspection unit 170, and the test tray 21 that has been inspected is supplied to the handler unit 110. Here, the elevator stacking plate 161 is a two-layer structure of the two elevator stacking plate 161 to transport two test trays 21 at a time.

The control unit 180 is connected to each part and installed and operated by a predetermined test program to control the handler unit 110, the elevator unit 160, and the mounting inspection unit 170 according to the program. The test signal is input to the plurality of test main boards 172 and the output data is received to store test information, and whether the semiconductor device 11 is defective or not is understood, and the processing of the semiconductor device 11 according to the result is also understood. Is done.

The operation of the customer tray 13 is sequentially performed by the tray transfer means 115 in a state where a plurality of customer trays 13 in which a plurality of semiconductor elements 11 for inspection are stored in the tray loader 112 are stacked. Is moved to the initial supply position. The semiconductor element 11 is absorbed by the picker 132 of the pick-and-place device 131 to the test tray 11 and is accommodated in the pocket 25.

When the semiconductor element 11 is completely stored in all the pockets 25, the test tray 21 is transferred to the heating chamber 153 by the test tray moving means 158. When the lifting means 154 is raised and lowered in the heating chamber 153 and the mounting is completed on each floor, the test tray 21 is discharged through the passage 155 under the heating chamber 153 to lift the elevator portion of the elevator 160. Supplied to trial 161. At this time, the chamber part 81 maintains an ambient temperature of about 85 ° C. in the case of a hot test, for example, a hot test, so that the semiconductor element 11 accommodated in the test tray 21 is brought to the test temperature in advance. It is in a preheated state.

By the operation of the elevator unit 160, the test tray 21 moves forward of the empty unit PC inspection unit 171 to which the test tray 21 of the mounting inspection unit 170 is not supplied, or the unit PC inspection unit 171 on which the inspection is completed. Is moved. When the unit PC inspection unit 171 is empty, the test tray 21 is supplied to the unit PC inspection unit 171 on any floor of the elevator loading plate 161. If there is a test tray 21 in which the inspection is completed in the unit PC inspection unit 172, a test tray 21 in which the inspection is completed is unloaded on one floor of the elevator loading plate 161 and mounted on the other floor. 21 is supplied to the unit PC inspection unit 172. Information about the supplied test tray 21 is stored in the controller 180.

The test tray 21 supplied with the test tray 21 is fixed by the fixing means 173, and the semiconductor element 11 is electrically connected to the inspection main board 172 by the drive unit 174. At this time, the temperature atmosphere condition required by the chamber 175 is applied to the semiconductor element 11. An inspection signal is input to each semiconductor element 11 by the controller 180, and the inspection information is stored in the controller 180.

When the inspection is completed, the test tray 21 is mounted on the elevator stacking plate 161 of the elevator unit 160 and moved to the cooling chamber 157 to be lowered to room temperature. In the cooling chamber 157, the test tray 21 is mounted at the lower portion as opposed to the heating chamber 153, and the test tray 21 is lifted upward. The uppermost test tray 21 lowered to room temperature is transferred from the cooling chamber 157 to the discharge position by the test tray moving unit 158 of the test tray loading / unloading unit 151.

According to the inspection result, the semiconductor element 11 is transferred from the test tray 21 to the customer tray 13 by the pick and place device 135 installed for unloading. The semiconductor element 11 determined as good is transferred to the customer tray 13 in which the good semiconductor element of the tray unloader 123 is stored, and the semiconductor element 11 determined as defective is defective of the tray unloader 125. The semiconductor price is transferred to the customer tray 13 in which it is stored. In addition, the semiconductor element 11, which requires re-inspection, is transferred to the buffer tray 15 of the buffer unit 141. The buffer tray 15 is moved between the initial tray supply position and the test tray storage position by the buffer tray transfer means 143, and the semiconductor elements accommodated therein are again transferred to the test tray 21 by the pick and place device 131. Supplied.

As in the above embodiment, the semiconductor device inspection apparatus according to the present invention includes a mounting inspection unit in which a plurality of unit PC inspection units for inspecting a semiconductor device, not a memory module, in a real actual environment are arranged vertically and horizontally. An elevator unit for supplying a test tray to each unit PC inspection unit is provided. As the test tray is continuously supplied from the handler unit, the test tray may be transferred to the mounting inspection unit without waiting for the time required for the inspection, and the inspection may proceed. Moreover, since a large amount of semiconductor devices are accommodated in a test tray and handled, a large amount of semiconductor devices can be inspected. The test tray is circulated to the test tray loading / unloading unit and the mounting inspection unit, and a constant quantity can be used continuously.

In addition, in the semiconductor device inspecting apparatus of the present invention, the mounting inspecting unit may be adjusted so that the waiting time of the handler unit is reduced or in consideration of the installation space, and the expansion is free. If necessary, the number of PC inspection units can be increased horizontally or vertically, and at this time, it is possible to transfer and discharge the test tray to the unit PC inspection unit increased by the expansion of the elevator unit. Of course, the information of the extended unit PC inspection unit is stored and operated in the control unit.

In the semiconductor device inspection apparatus of the present invention, each inspection result may be secured in the controller by comparing the information of each test tray with the address information of each unit PC inspection unit. In addition, two elevator stacking plates of the elevator unit are formed in two layers so that a test tray to be supplied to the unit PC inspection unit is loaded on the elevator loading plate of one floor and discharged from the unit PC inspection unit to the elevator loading plate of the other floor. By loading the test tray, supply and discharge can be made faster.

In the above-described embodiment of the semiconductor device inspection apparatus according to the present invention, the heating chamber is installed at the position where the semiconductor element is supplied to the handler portion and the cooling chamber is installed at the position where the semiconductor element is discharged in order to perform the hot test. In the case of a cold test, a cooling chamber may be installed at a position where a semiconductor element is supplied and a heating chamber may be installed at a position where a cooling chamber is discharged. Such a configuration change can realize a functional change by adjusting the set temperature in each chamber.

On the other hand, it will be readily apparent to those skilled in the art that the semiconductor device inspection apparatus according to the present invention may be variously modified without departing from the technical spirit of the present invention without being limited to the above-described embodiments.

According to the semiconductor device inspection apparatus according to the present invention as described above, since a plurality of semiconductor devices can be housed in a test tray and can be inspected in an actual mounting environment for a large number of such test trays, the conventional semiconductor device is inspected in a memory module state. Compared to this, the time required for the semiconductor device inspection process can be reduced and the production cost can be reduced. Moreover, the mounting inspection unit can be freely expanded as necessary for increased inspection amount, productivity increase, and the like.

Claims (4)

A tray loader for supplying a plurality of trays containing semiconductor devices to be inspected, a tray unloader for supplying a plurality of trays for receiving the inspected semiconductor devices, and an external connection terminal are exposed. A test tray loading / unloading unit for supplying a test tray having a pocket for storing a large amount of semiconductor devices, and transferring the semiconductor devices to the test tray from the tray loaded on the tray loader. A handler part having a pick and place device for transferring the semiconductor element housed therein to the tray unloader; A plurality of inspection main boards circuit-implemented with a plurality of actual mounting environments corresponding to each semiconductor element of the test tray, a fixing means for fixing the supplied test tray, and a drive unit connecting the inspection main board and the semiconductor elements of the test tray. a mounting inspection unit having a plurality of unit PC inspection units having a drive part; An elevator part for supplying a test tray to each PC inspection part of the mounting inspection part from the handler part; And And a control unit which controls the operations of the respective parts and is operated by a predetermined program to input an inspection signal to the inspection main board of each PC inspection unit and to receive and process the output data. The semiconductor device inspection apparatus according to claim 1, wherein the handler unit further comprises a heating chamber for applying an ambient condition of the semiconductor device to a temperature condition at which the inspection proceeds. The semiconductor device inspection apparatus according to claim 1, wherein the elevator unit includes two elevator mounting plates on which an inspection tray is mounted. 2. The semiconductor device inspecting apparatus according to claim 1, wherein the plurality of unit PC inspecting units are arranged in a plurality of rows vertically and horizontally.