KR100765461B1 - Method for transferring test tray of handler - Google Patents

Abstract

A method of transferring a test tray of a handler is provided to increase remarkably the number of tested electronic parts for a predetermined time by performing predetermined tests on the electronic parts while moving simultaneously two test trays. Test trays(T) with electronic parts are arranged at right and left sides of a waiting region, wherein the waiting region is prepared at the front of chambers. The test trays are vertically erected and supplied to left and right heating/cooling chambers(151a,151b) one by one. Each test tray is transferred to a rear portion in the left and right heating/cooling chambers. The test trays are vertically supplied in a test chamber(152) in order to perform simultaneously predetermined tests on the test trays corresponding to four test boards. When the electronic parts of the test trays are completed with the predetermined tests, the test trays are supplied to left and right heating/cooling control chambers(154a,154b). The test trays are transferred to front portions in the left and right heating/cooling control chambers. The test trays are horizontally transferred to the waiting position.

Description

Method for transferring test tray of handler}

1 is a schematic diagram illustrating an example of a handler to which a test tray transfer method according to an exemplary embodiment of the present invention is applied.

FIG. 2 is a diagram illustrating an example of a test unit illustrated in FIG. 1.

3 is a view for explaining a path in which the test tray is transferred by the test tray transfer method according to an embodiment of the present invention in FIG.

4 is a diagram illustrating another example of the test unit illustrated in FIG. 1.

5 is a view for explaining a path in which the test tray is transported by the test tray transport method according to another embodiment of the present invention in FIG.

<Brief description of the major symbols in the drawings>

110..Loading Stacker 120..Unloading Stacker

150, 250. Test part 151. Heating / cooling chamber

152 .. Test Chamber 153. Test Board

154. Defrosting / defrosting chamber T .. test tray

The present invention relates to a method for transporting a test tray in a handler for testing an electronic component.

In general, electronic components including a device such as a memory or a non-memory semiconductor element and a module having the devices properly configured on one substrate are shipped after various tests after production. Such testing is typically done by a handler.

The handler moves the electronic components to be tested from the loading stacker and then moves them to accommodate the electronic components in a test tray provided in the exchange unit, and tests the electronic components stored in the test tray in the test unit. Then, the handler absorbs the electronic component from the test tray containing the tested electronic component, moves the electronic component, and stores the electronic component in the unloading stacker. The handler is classified according to the grade according to the test result.

In addition to the general performance tests at room temperature, these handlers can also be configured to test whether electronics can function normally under extreme temperatures, both high and low temperatures. In this case, the test unit includes a heating / cooling chamber, a test chamber, and a defrosting / defrosting chamber.

In the heating / cooling chamber, an operation of heating or cooling the electronic component is performed by receiving a test tray containing the electronic component from the exchange unit. The test chamber receives the test tray containing the electronic components heated or cooled through the heating / cooling chamber, connects the electronic components to the test sockets of the test board, and tests them by an external test equipment. In the heat / cooling chamber, the test tray receives the test tray containing the tested electronic component through the test chamber, returns the battery to a room temperature, and returns it to the exchange unit.

However, according to the related art, it is common to test the test trays in which the electronic components are stored while transferring the heating / cooling chambers, the test chambers, and the heat / cooling chambers one by one. In this case, there is a limit in increasing the number of electronic components that can be tested at a predetermined time. Therefore, in recent years, since customers want to quickly test a large amount of electronic components, a solution for this is required.

The present invention is to solve the above problems, to provide a test tray transfer method of the handler that can increase the number of electronic components that can be tested at a time, as well as the number of electronic components that can be tested at a predetermined time. There is a purpose.

The test tray transfer method of the handler according to the present invention for achieving the above object is a test chamber in which four test boards are vertically arranged in two rows and two columns at the rear, and left and right with the test chamber interposed therebetween. Left and right heating / cooling chambers respectively disposed on the left and right heating / cooling chambers, and the left and right heating / cooling chambers respectively disposed on any one of the upper and lower sides of the left heating / cooling chamber and the upper and lower sides of the right heating / cooling chamber. A test tray transfer method of a handler having a chamber, comprising: (a) waiting a test tray on which electronic components are mounted one by one to the left and right to a standby position provided in front of the chambers, and then vertically standing the left and right heating / Feeding one by one into the cooling chamber; (b) the test trays are moved rearwards in the left and right heating / cooling chambers, respectively, and then vertically in the test chambers can be performed simultaneously in a state corresponding to the four test boards one by one. Feeding step; (c) when the testing of the electronic components mounted on the four test trays in the test chamber is completed, feeding the divided parts into the left and right heat / cooling chambers one by one; And (d) transferring the test trays forward in the left and right heat removal / defrosting chambers, respectively, and then lying them horizontally and returning them to the standby position.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic diagram illustrating an example of a handler to which a test tray transfer method according to an exemplary embodiment of the present invention is applied.

Referring to FIG. 1, the handler 100 tests electronic components such as a memory or a non-memory semiconductor device, and includes a loading stacker 110.

The loading stacker 110 is disposed at the front of the handler 100, in which customer trays containing a plurality of electronic components to be tested are stored. An unloading stacker 120 is disposed at one side of the loading stacker 110. In the unloading stacker 120, the tested electronic components are classified according to the test result and stored in the customer tray.

The exchanger 130 may be disposed at the rear of the loading stacker 110 and the unloading stacker 120, that is, the central portion of the handler 100. In the exchange unit 130, a test tray T that is movable is located. According to the present embodiment, two test trays T are positioned in the exchange unit 130 so that the test trays T may be fed to the test unit 150 to be described later.

The exchange unit 130 receives the electronic component to be tested from the loading stacker 110 and mounts it on the test tray T, and removes the tested electronic component from the test tray T to unload the stacker. The operation to export to 120 is made. The exchange unit 130 may be provided with a driving unit for moving the test tray (T) in the front, rear direction. In addition, buffer units 136 may be disposed on both sides of the exchange unit 130 to temporarily wait for an electronic component to increase work efficiency.

In order to transfer the electronic components between the loading stacker 110, the buffer unit 136, the exchange unit 130, and the unloading stacker 120 and to mount or separate the test stacker T, a plurality of electrons may be used. Component picker 140 is provided.

In addition, one side of the exchange unit 130, as shown, the test unit 150 is provided at the rear of the handler 100. The test unit 150 receives a test tray T on which the electronic component to be tested is mounted from the exchange unit 130 to test the electronic component. In the present embodiment, the test unit 150 is configured to test whether the electronic component can perform a normal function under extreme temperature conditions of high temperature and low temperature as well as general performance test at room temperature.

To this end, the test unit 150 includes a heating / cooling chamber 151, a test chamber 152, and a heat removing / cooling chamber 154, as shown in FIG. 2. Here, the heating / cooling chamber 151 may apply a high or low temperature stress to the electronic component of the test tray T supplied from the exchange unit 130. The test chamber 152 enables an external test equipment (not shown) to test the electronic component imparted by the temperature stress by the above-described heating / cooling chamber 151. In addition, the heat removal / defrosting chamber 154 may remove temperature stress from the test chamber 152 described above to the tested electronic component.

The test chamber 152 has four test boards 153 having a plurality of test sockets electrically connected to external test equipment. Here, the test boards 153 are vertically arranged at the rear of the test chamber 152 and arranged in two rows and two columns. The test means 165 is provided with contact means 165 for moving the test tray T forward and backward so as to press the test tray T to connect the electronic component and the test socket to the test boards 153. Meanwhile, based on the test boards 153, the test chamber 152 may be partitioned into four regions by partition walls.

In addition, corresponding to the test boards 153, the rotator 160 is provided in front of the test unit 150. The rotator 160 rotates the test trays T, which are placed in a horizontal state in the horizontal state, in the vertical state so that the rotator 160 can be fed to the test unit 150 in a vertical state, and is carried out in the vertical state from the test unit 150. The test trays (T) to be rotated back to a horizontal state to be returned to the exchange unit 130.

The heating / cooling chamber 151 may be disposed at the left and right sides with the test chamber 152 as described above. That is, the heating / cooling chamber 151 is divided into a left heating / cooling chamber 151a positioned at the left side of the test chamber 152 and a right heating / cooling chamber 151b positioned at the right side of the test chamber 152. Can be. The heat / cooling chamber 154 may be disposed above or below the heating / cooling chamber 151. Here, as shown in FIG. 2, the heat removal / cooling chamber 154 is formed of the left heat removal / cooling chamber 154a and the right heating / cooling chamber 151b disposed below the left heating / cooling chamber 151a. It may be divided into the right heat removal / defrosting chamber 154b disposed below.

Meanwhile, the left heat / cooling chamber 154a may be disposed above the left heating / cooling chamber 151a, and the right heat / cooling chamber 154b is disposed above the right heating / cooling chamber 151b. May be In addition, the left and right heating / cooling chambers 151a and 151b may be disposed to face each other in a diagonal direction, and the left and right heating / cooling chambers 154a and 154b may be arranged to face each other in a diagonal direction.

In the test unit 150, when the exchange unit 130 is disposed in front of the test chamber 152, although not shown, the test trays T which are vertically erected from the exchange unit 130 are left and right. Driving means for moving one by one into the heating / cooling chambers 151a and 151b, and Driving to transfer the test trays T step by step in the left and right heating / cooling chambers 151a and 151b. Means may be provided.

Then, driving means for sequentially transferring the test trays T from the left and right heating / cooling chambers 151a and 151b into the test chamber 152 and the left and right heating / cooling chambers 154a and 154b. do. In addition, the drive means for transferring the test trays (T) by one step forward in the left and right defrosting / defrosting chambers 154a and 154b, and from the left and right defrosting and defrosting chambers 154a and 154b. Drive means for moving the trays T to return to the exchange unit 130 may be provided.

In the handler 100 configured as described above, a method of transferring the test tray T by the test tray transfer method according to an embodiment of the present invention will be described with reference to FIG. 3. Here, a case in which the test unit 150 is configured as shown in FIG. 2 will be described as an example.

First, a standby position 131 provided in front of the test chamber 152, the test tray (T) on which the electronic components are mounted, one by one left and right. Here, the standby position 131 may be disposed in an area of the exchange unit 130 located in front of the test chamber 152. In the exchange unit 130, since the electronic component is mounted and detached from the test trays T, the test trays T are waited at the standby position 131 in a horizontally divided state.

Thereafter, the test trays T of the standby positions 131 are vertically placed two by two, and then divided into the left and right heating / cooling chambers 151a and 151b and fed one by one. Specifically, the two test trays (T) placed at the stand-by position 131 are erected at the same time vertically, and then one of the test trays (T) is fed into the left heating / cooling chamber (151a) and the other one is Feed into right heating / cooling chamber 151b. After the two test trays T are divided and fed into the left and right heating / cooling chambers 151a and 151b one by one, the two new test trays T are waited again at the standby position 131. After the above-described process, the feeds into the left and right heating / cooling chambers 151a and 151b.

If the process is repeatedly performed, two test trays T may be continuously fed into the heating / cooling chamber 151 from the standby position 131. Therefore, compared to feeding the test tray T into the heating / cooling chamber 151 one by one, it is possible to increase the transfer efficiency.

In this process of transporting the test trays (T) it is desirable to minimize the transport path for rapid transport. To this end, the operation of vertically standing the test trays T may be performed at the standby position 131 or at the position as close as possible to the standby position 131. In addition, when the test trays (T) are upright and then fed into the left and right heating / cooling chambers (151a) and (151b), the test trays (T) can be transported to the shortest distance. The place where the work is made vertically is preferably located parallel to the left and right heating / cooling chamber (151a, 151b) horizontally.

After the test tray T is continuously fed into the left and right heating / cooling chambers 151a and 151b one by one by the above-described process, the test tray T is continuously fed and then rearwarded in the left and right heating and cooling chambers 151a and 151b. Transfer them in sequence. At this time, the test tray T to be transferred previously and the test tray T to be transferred subsequently may be transferred at a predetermined interval. That is, the test tray T may be sequentially moved backward by one step.

In this way, the test trays T are moved one by one in the left and right heating / cooling chambers 151a and 151b to the rear, and then the test trays 153 are moved to the vicinity of the test board 153 shown in FIG. The test trays T correspond to the four test boards 153 one by one so that the test can be carried out simultaneously.

In detail, the test tray T is moved to the right from the left heating / cooling chamber 151a to be transferred into the test chamber 152 and then moved downward to correspond to the test board 153 located at the lower left side. Thereafter, the test tray T, which is subsequently transported, is moved backward and then moved to the right to correspond to the test board 153 located on the upper left side. That is, while transferring the test tray T supplied from the left heating / cooling chamber 151a to the test chamber 152 in the clockwise direction, the test trays 153 correspond to the test boards 153 located on the upper and lower left one by one.

In addition, the test tray T is moved to the left side from the right heating / cooling chamber 151b to be transferred into the test chamber 152 and then moved downward to correspond to the test board 153 located at the lower right side. Subsequently, the test tray T, which is subsequently transported, is moved backward and then moved left to correspond to the test board 153 located on the upper right side. That is, while the test tray T supplied from the right heating / cooling chamber 151b to the test chamber 152 is transferred counterclockwise, the test trays 153 correspond to the test boards 153 located on the upper and lower right sides. In this process, the test tray T is preferably adapted to move the shortest distance.

Through this process, the test trays T may correspond to the four test boards 153 one by one, and the test may be simultaneously performed in this state. As described above, since the electronic components mounted on the four test trays T can be simultaneously supplied to the four test boards 153 for testing, the number of electronic components that can be tested at one time increases. You can do it.

When the testing of the electronic components mounted on the four test trays T in the test chamber 152 is completed, the test parts 152 are supplied one by one into the left and right heat / cooling chambers 154a and 154b. That is, while feeding the test tray T supplied from the test chamber 152 to the left defrosting / defrosting chamber 154a side in a clockwise direction, the test tray T is fed one by one into the left defrosting / defrosting chamber 154a and from the test chamber 152. The test tray T supplied to the right heat removal / defrosting chamber 154b is transferred to the right heat removal / defrosting chamber 154b one by one while being transferred clockwise. At this time, it is preferable that the test tray T be moved at the shortest distance.

After the test tray T is continuously fed into the left and right defrosting / defrosting chambers 154a and 154b by the above-described process, the test tray T is continuously fed one by one, and then forwards in the left and right defrosting and defrosting chambers 154a and 154b. Transfer them in sequence. At this time, the test tray T to be transferred previously and the test tray T to be transferred subsequently may be transferred in a state maintained at a constant interval. That is, the test tray T may be sequentially moved forward by one step.

In this way, each of the test trays T is moved forward one by one in the left and right heat / cooling chambers 154a and 154b, and then the test trays T are moved to the vicinity of the standby position 131. Lie down horizontally and return to the standby position 131.

At this time, in the left heat removal / defrosting chamber 154a, the test trays T, which have reached the vicinity of the standby position 131, are moved one by one to the right, and then raised, and then, in a vertical state, the test trays T are laid down horizontally to the standby position 131. You can wait again. In addition, in the right heat removal / defrosting chamber 154b, the test trays T reached near the standby position 131 are moved one by one to the left, and then raised, and then they are laid down in the horizontal state in the vertical state to the standby position 131. You can wait again.

At this time, it is preferable to move the test tray T to the shortest distance. In addition, it is preferable that the operation of laying the test tray T horizontally can be performed at the same position where the operation of raising the test tray T vertically is performed.

In the state where the test trays T are returned to the standby position 131 by two by the above-described process, the test trays T are equipped with the tested electronic components, and thus the electronic components classified according to the test results are unloaded. The operation of separating the electronic components to be carried out to the loading stacker 120 is made.

Then, if there are more electronic components to be tested, the electronic components are separated and placed in the empty test trays (T) with new electronic components waiting, and then the two test trays (T) After standing upright, it is divided into left and right heating / cooling chambers 151a and 151b and fed one by one. That is, while circulating the test trays (T) two by two along the transfer path of the test tray (T) as described above, it is possible to test the electronic components and to classify by class according to the test results and to carry out.

As described above, according to the present exemplary embodiment, since the electronic components may be tested while transferring the test trays T by two, the electronic components that can be tested at a predetermined time may be compared with the case where the test trays T are transferred one by one. The quantity can be increased.

On the other hand, in the test unit 150, even when the left and right heating / cooling chambers 151a and 151b are disposed to correspond to the lower sides of the left and right heat / cooling chambers 154a and 154b, respectively, As described above, the test tray T fed into the left heating / cooling chamber 151a is fed into the left heat / cooling chamber 154a after passing through the test chamber 152 and fed into the right heating / cooling chamber 151b. After passing the test tray T through the test chamber 152 and feeding it to the right defrosting / defrosting chamber 154b, the test trays T may be transported by two.

4 illustrates another example of the test unit. As shown in FIG. 4, the test unit 250 has a left heating / cooling chamber 151a disposed below the left heat / cooling chamber 154a, and a right heating / cooling chamber 151b has a right heat removal / By being disposed above the defrosting chamber 154b, the left and right heating / cooling chambers 151a and 151b face each other in a diagonal direction, and the left and right defrosting and defrosting chambers 154a and 154b in a diagonal direction. It has a configuration arranged to face each other. Meanwhile, the test unit 250 has a left heating / cooling chamber 151a disposed above the left heating / cooling chamber 154a, and a right heating / cooling chamber 151b has a right heating / cooling chamber 154b. It is also possible to be arranged below.

In the test unit 250, a method of transferring the test tray T will be described with reference to FIG. 5. In this embodiment, the test unit 250 will be described with reference to the case shown in FIG. 4 as an example, and will be described based on differences from the test tray transfer method according to the above-described embodiment.

Referring to FIG. 5, two test trays T in the standby position 131 are vertically placed in a horizontal state, and then each of the test trays T is divided into left and right heating / cooling chambers 151a and 151b and then fed. At this time, if the place where the test trays T are placed vertically is in a position parallel to the right heating / cooling chamber 151b, the test tray T to be transferred into the left heating / cooling chamber 151a is lowered and then moved to the left side. Can be fed into the left heating / cooling chamber 151a.

After the test tray T is continuously fed into the left and right heating / cooling chambers 151a and 151b one by one by the above-described process, the test tray T is continuously fed and then rearwarded in the left and right heating and cooling chambers 151a and 151b. Transfer them in sequence. Next, the test trays T correspond to the four test boards 153 one by one in the test chamber 152 so that the test can be performed simultaneously.

At this time, according to the present embodiment, while transferring the test tray T supplied from the left heating / cooling chamber 151a to the test chamber 152 in the counterclockwise direction, one by one on the test boards 153 located on the upper left and lower sides. Will be matched. In addition, while transferring the test tray T supplied from the right heating / cooling chamber 151b to the test chamber 152 in the counterclockwise direction, the test boards 153 correspond to the test boards 153 located on the upper and lower right sides.

Then, when the testing of the electronic components mounted on the four test trays T in the test chamber 152 is completed, the feeding is divided into the left and right heat / cooling chambers 154a and 154b. That is, while feeding the test tray T supplied from the test chamber 152 to the left defrosting / defrosting chamber 154a side in the counterclockwise direction, the feed tray is fed into the left defrosting / defrosting chamber 154a one by one and the test chamber ( The test tray T supplied from the side 152 to the right side defrosting / defrosting chamber 154b is transported one by one into the right side defrosting / defrosting chamber 154b while being transferred counterclockwise.

Then, each of the left and right heat removal / defrost chambers 154a and 154b is sequentially transferred forward. The test trays T are moved forward one by one in the left and right heat / cooling chambers 154a and 154b. Then, the test trays T are moved to the vicinity of the standby position 131. Then, two test trays T are horizontally disposed. Lie down and return to the standby position 131. At this time, the test tray T reached to the vicinity of the standby position 131 in the left heat removal / defrosting chamber 154a may be moved to the right side, and then may be placed in the horizontal state in the vertical state to stand by again in the standby position 131. have. In addition, in the right heat removal / defrosting chamber 154b, the test trays T reached near the standby position 131 are moved one by one to the left, and then raised, and then they are laid down in the horizontal state in the vertical state to the standby position 131. You can wait again.

Meanwhile, in the test unit 250, the left heating / cooling chamber 151a is disposed above the left heating / cooling chamber 154a, and the right heating / cooling chamber 151b is the right heating / cooling chamber ( Even when disposed below the 154b, the process of transferring the test tray T in the left region may be performed in the same manner as in the right region in the above-described example, and the process of transferring the test tray T in the right region. Of course, can be made the same as in the left region in the above-described example.

According to the present invention as described above, since the electronic components can be tested while transferring the test trays two by two, even if four test boards are provided, the test trays can be quickly fed into the test chamber. Therefore, compared with the case where the test trays are transported one by one, the quantity of electronic components that can be tested at a predetermined time can be increased.

In addition, since the electronic components mounted on the four test trays can be tested simultaneously, the number of electronic components that can be tested at one time can be increased compared to testing the electronic components mounted on one test tray. . Thus, there is an effect that can meet the needs of customers who want to test large quantities of electronic parts quickly.

Although the present invention has been described with reference to one embodiment shown in the accompanying drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Could be. Accordingly, the true scope of protection of the invention should be defined only by the appended claims.

Claims (5)

Four test boards arranged vertically in two rows and two columns at the rear, and left and right heating / cooling chambers arranged in a left and right direction with the test chambers interposed therebetween, and the left heating / cooling chambers. A test tray transfer method of a handler having left and right heat / cooling chambers disposed on either one of an upper side and a lower side of an upper side and an upper side and a lower side of the right side heating / cooling chamber, respectively. (a) waiting each test tray on which the electronic components are mounted to the left and right to a standby position provided in front of the chambers, and then feeding each of the test trays vertically into the left and right heating / cooling chambers one by one; (b) the test trays are moved rearwards in the left and right heating / cooling chambers, respectively, and then vertically in the test chambers can be performed simultaneously in a state corresponding to the four test boards one by one. Feeding step; (c) when the testing of the electronic components mounted on the four test trays in the test chamber is completed, feeding the divided parts into the left and right heat / cooling chambers one by one; And (d) forwarding the test trays forward in the left and right heat / cooling chambers, respectively, and then lying them horizontally and returning them to the standby position; Test tray transfer method of the handler comprising a. The method of claim 1, The left and right heating / cooling chambers are arranged side by side in the horizontal direction, and the left and right heating / cooling chambers are arranged side by side in the horizontal direction, In step (b) above: The test tray is sequentially transferred backward in the left heating / cooling chamber, and then sequentially fed in the vertical direction in the test chamber to correspond to one of two test boards positioned on the upper left and lower sides of the four test boards. In addition to Sikkim, The test tray is sequentially transported backward in the right heating / cooling chamber, and then sequentially fed in the vertical direction in the test chamber to correspond to one of two test boards located on the upper right and lower sides of the four test boards. Test tray transfer method of the handler, characterized in that. The method of claim 1, The left and right heating / cooling chambers face each other in a diagonal direction, and the left and right heat / cooling chambers face each other in a diagonal direction. In step (b) above: The test tray is sequentially transported backward in the left heating / cooling chamber, and then sequentially fed in the test chamber in the vertical direction to correspond to one of two test boards located on the upper left and lower sides of the four test boards. In addition to Sikkim, The test tray is sequentially transported backward in the right heating / cooling chamber, and then sequentially fed in the test chamber in the vertical direction to correspond to one of two test boards located on the upper right and lower sides of the four test boards. Test tray transfer method of the handler, characterized in that. The method according to any one of claims 1 to 3, The standby position is disposed in front of the test chamber, And erecting the test tray vertically and horizontally laying the test tray at the standby position. The method of claim 4, wherein In the step (b), the test trays are sequentially transferred backward by one step in the left and right heating / cooling chambers, respectively. In the step (d), the test tray transfer method of the handler, characterized in that for sequentially transporting the test trays by one step in the left, right heat removal / defrosting chamber.

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