WO2008054186A1

WO2008054186A1 - Test handler for semiconductor device

Info

Publication number: WO2008054186A1
Application number: PCT/KR2007/005559
Authority: WO
Inventors: Hong-Jun You; Won-Jin Jang; Woon-Joung Yoon
Original assignee: Jt Corporation
Priority date: 2006-11-03
Filing date: 2007-11-05
Publication date: 2008-05-08
Also published as: TW200821248A; KR20080040362A

Abstract

A test handler for semiconductor device, which includes: a device loading unit having a loading chamber for receiving a tray on which semiconductor devices are loaded and maintaining a temperature of semiconductor devices in a test temperature by a temperature control system; and a device test unit having a test module for testing a semiconductor device transferred from the loading chamber, is disclosed.

Description

TEST HANDLER FOR SEMICONDUCTOR DEVICE

Technical Field

[1] The present disclosure relates to a test handler for semiconductor device, and more particularly, to a test handler for semiconductor device capable of testing electric characteristic, etc. of a semiconductor device at a constant temperature after a packaging process, and sorting semiconductor devices according to result thereof. Background Art

[2] Generally, a semiconductor device having undergone a packaging process

(hereinafter, will be referred to as a 'device' undergoes a Burn-In test for a reliability against an external thermal factor.

[3] According to the Burn-In test, a device is disposed on a Burn-In Board (BIB), and then the BIB is placed in a chamber of high temperature installed at a Burn-In test device. Then, it is tested whether the device is normally operated in a certain temperature and pressure for a certain time.

[4] However, a test for testing only electric characteristic such as direct current (DC) without performing the Burn-In test according to the kind of the device, for distributing a good device is referred to as a "simple test".

[5] A device having undergone only the simple test did not undergo electric characteristic test under a certain temperature. Since a mal-operation of the device that may be caused at a high temperature can not be expected, thermal characteristic test for a device is necessary.

[6] Generally, the electric characteristic test is performed in the simple test for a short time. Accordingly, if the simple test is performed at a necessary saturation temperature, a device having a reliability for the thermal characteristic can be massively produced. Disclosure of Invention

Technical Problem

[7] Therefore, an object of the present disclosure is to provide a test handler for semiconductor device capable of performing electric characteristic test, etc. for a semiconductor device at a uniform temperature at the time of performing a simple test.

[8] Another object of the present disclosure is to provide a test handler for semiconductor device capable of enhancing a reliability for a test result by maintaining a required temperature condition to perform a device test for a sufficient time. Technical Solution

[9] To achieve these and other advantages and in accordance with the purpose of the present disclosure, as embodied and broadly described herein, there is provided a test handler for semiconductor device, which includes a device loading unit having a loading chamber for receiving a tray on which semiconductor devices are loaded and maintaining a temperature of semiconductor devices in a test temperature by a temperature control system; and a device test unit having a test module for testing a semiconductor device transferred from the loading chamber.

[10] The test handler for semiconductor device may further include a device sorting unit for receiving semiconductor devices from the device test unit and sorting semiconductor devices according to test result by the device test unit.

[11] The device loading unit includes a moving path for one or more trays on which semiconductor devices are loaded, and the loading chamber may be formed to enclose at least a part of the moving path.

[12] The moving path may include an upper moving path; a lower moving path installed below the upper moving path; and a lifting unit installed at ends of the upper moving path and the lower moving path, and vertically moving to the upper moving path or the lower moving path, for moving a tray between the upper moving path and the lower moving path. The lifting unit may be respectively installed at both ends of the upper moving path and the lower moving path.

[13] An empty tray unit for withdrawing an empty tray passing through the loading chamber from which semiconductor devices are withdrawn from the moving path and being loaded into the tray may be further installed at one side of the moving path.

[14] An air inlet for introducing heated gas into the loading chamber may be formed at the loading chamber so as to heat semiconductor devices loaded on a tray.

[15] A transfer opening through which a transfer unit for transferring semiconductor devices loaded on a tray in the loading chamber to the device test unit may be formed at the loading chamber.

[16] The test module may be configured so as to examine whether a semiconductor device is good or bad by testing DC characteristic.

[17] The device test unit may further include a test chamber installed to enclose the test module. A transfer opening through which a transfer unit for inserting or withdrawing semiconductor device into/from the test module may be formed at the test chamber.

[18] An air inlet for introducing heated gas into the loading chamber may be formed at the test chamber so as to heat a semiconductor device loaded on the test module.

[19] The temperature control system may be implemented as a heating device or a cooling device.

Advantageous Effects

[20] The test handler for semiconductor device according to the present invention has an advantage in that the test handler for semiconductor device can perform a simple test of the semiconductor device together with an electric characteristic in a uniform temperature condition.

[21] In addtion, the test handler for semiconductor device according to the present invention has an advantage in that since a temperature condition required to test the semiconductor device is maintained for a sufficient time, a reliability for a test result is enhanced.

[22] In addtion, the test handler for semiconductor device according to the present invention has an advantage in that a simple test for the semiconductor device is rapidly performed.

[23] In addition, the test handler for semiconductor device according to the present invention has an advantage in that since the test module for testing the semiconductor device is detachably installed, the test module is easily replaced by another according to the kind of tests. Accordingly, various tests can be performed. Brief Description of the Drawings

[24] FIG. 1 is a view showing a layout of the test handler for semiconductor device according to the present invention;

[25] FIG. 2 is a plane view showing the test handler for semiconductor device of FIG. 1;

[26] FIG. 3 is a sectional view taken along line II-II in FIG. 2;

[27] FIGS. 4 to 7 are sectional views taken along line Hi-Ill in FIG. 2, which show an operation of the device loading unit;

[28] FIG. 8 is a perspective view showing a part of the device test unit of FIG. 2;

[29] FIG. 9 is a sectional view taken along line IV-IV in FIG. 2; and

[30] FIGS. 10 and 11 are conceptual views showing a transferring process of each device. Mode for the Invention

[31] Hereinafter, a test handler for semiconductor device according to the present invention will be explained in more detail referring to the accompanying drawings.

[32] As shown in FIGS. 1 and 2, the test handler for semiconductor device includes a device loading unit 100 and a device test unit 200. The test handler for semiconductor device may further include a device sorting unit 300 for sorting semiconductor devices 1 according to test result by the device test unit 200.

[33] The device loading unit 100 is configured to receive a tray 20 on which semiconductor devices 1 are loaded, and to heat semiconductor devices 1. The device loading unit 100 includes a moving path 120 along which a tray 20 moves, and a loading chamber 110 for heating semiconductor devices 1 and enclosing at least a part of the moving path 120. [34] The moving path 120 is configured so that a tray 20 on which semiconductor devices 1 are loaded passes a withdrawing position ® so as to withdraw semiconductor device 1 by a transfer device 410. The withdrawing position ® indicates a position where semiconductor devices 1 loaded on a tray 20 can be withdrawn by the transfer device 410.

[35] The moving path 120 may have various configurations according to a design condition. As shown in FIG. 3, the moving path 120 may include an upper moving path 121; a lower moving path 122 installed below the upper moving path 121; and a lifting unit 123 installed at ends of the upper moving path 121 and the lower moving path 122, and vertically moving to the upper moving path 121 or the lower moving path 122, for moving a tray 20 between the upper moving path 121 and the lower moving path 122. The moving path 120 may be configured to have only one path.

[36] The upper moving path 121 includes one pair of guide rails 121a for supporting both sides of a tray 20 and guiding a motion of a tray 20, and a driving unit (not shown) for moving a tray 20 along the guide rails 121a.

[37] Preferably, a device 1 should be precisely moved to the withdrawing position ® so that the transfer device 410 may stably withdraw, i.e. pick up a semiconductor device 1 form a tray 20. The driving unit may be comprised of a linear moving device including a screw of which the precise movement control is possible.

[38] The lower moving path 122 includes one pair of guide rails 122a for supporting both sides of a tray 20 and guiding a motion of a tray 20, and a driving unit (not shown) for moving a tray 20 along the guide rails 122a.

[39] Here, a tray 20 can perform various motions such as a rotation motion and a linear motion along the moving path 120. However, a tray 20 may be configured to be linearly moved in a Y-axis direction in FIG. 1 so as to facilitate a motion thereof and a withdrawing of devices 1. After devices 1 have been withdrawn, the transfer device 410 can be moved in an X-axis direction perpendicular to the Y-axis direction.

[40] The lifting unit 123 may be configured so as to vertically move a tray 20 in a up and down direction(Z-axis) between the upper moving path 121 and the lower moving path 122. The lifting unit 123 may be installed at one end or both ends of the upper moving path 121 and the lower moving path 122.

[41] The lifting unit 123 is configured to move a tray 20 positioned at the end of the lower moving path 122 to the upper moving path 121, or is configured to move a tray 20 positioned at the end of the upper moving path 121 to the lower moving path 121.

[42] A test tray stacking unit 160 for loading a tray 20 on which devices 1 to be tested are loaded may be installed at the moving path 120. One of the lifting units 123 may be configured to receive a tray 20 from the test tray stacking unit 160. A plurality of trays 20 may be loaded in the test tray stacking unit 160, and trays 20 sequentially move to the moving path 120.

[43] The loading chamber 110 forms a heating space H enclosing at least a part of the moving path 120 so as to heat semiconductor devices 1 loaded on a tray 20.

[44] Here, the heating space H formed by the loading chamber 110 includes the withdrawing position ®. The loading chamber 110 is connected to a heating device (not shown), a temperature control system so that devices 1 can be heated with a constant test temperature in the heating space H. The test temperature is a preset temperature for testing devices 1, and may be variously set to be 8O⁰C-IOO⁰C, 85°C±5°C, etc. according to a required condition.

[45] The heating device may be configured to heat devices 1 by various methods such as conduction, convection, radiation, and is implemented as an air supplying device 431 for introducing heated gas (generally air) into the heating space. The air supplying device 431 is connected to an air inlet 111 formed at the loading chamber 110 so as to introduce heated gas into the heating space. The air supplying device 431 may be replaced by a cooling air supplying device 431 when devices 1 are to be tested at a low temperature. Here, cooling air is supplied into the loading chamber 110 thus to maintain an inner temperature of the loading chamber 110 as a low temperature. The heating device may be replaced by a cooling device.

[46] Change of a peripheral temperature of a device 1 can be minimized by the loading chamber 110, thereby maintaining a constant temperature suitable for a test.

[47] A transfer opening 115 through which the transfer device 410 for withdrawing a device 1 loaded on a tray 20 in the loading chamber 110 is formed at an upper side of the loading chamber 110. At least one moving in-out opening 116 for withdrawing a tray 20 along the moving path 120 is formed at a lateral side of the loading chamber 110. Here, inner edges of the transfer opening 115 and the moving in-out opening 116 may be protruding so as to minimize leakage of gas inside the heating space H, and so as not to disturb a motion of the transfer device 410 or a tray 20.

[48] Since devices 1 loaded on the tray 20 are withdrawn while a tray 20 passes through the withdrawing position ® of the moving path 120, an empty tray 20 needs to be removed from the moving path 120.

[49] An empty tray unit 150 for withdrawing an empty tray 20 from which semiconductor devices are withdrawn while passing through the loading chamber 110 from the moving path 120 and loading the empty tray 20 may be further installed at one side of the moving path 120.

[50] The empty tray unit 150 is installed at one side of the moving path 120 in parallel with the moving path 120, and includes one pair of guide rails 151 for guiding a motion of a tray 20, and a driving unit (not shown) for moving a tray 20.

[51] A tray transfer device 450 for transferring a tray 20 between the empty tray unit 150 and the moving path 120 is installed at one end of the empty tray unit 150. A tray 20 withdrawn from the moving path 120 is transferred to the empty tray unit 150 by the tray transfer device 450.

[52] When a tray 20 on which devices 1 to be tested are loaded is loaded on the empty tray unit 150, the tray transfer device 450 transfers a tray 20 to the moving path 120 fro m the empty tray unit 150.

[53] The device test unit 200 is integrally or detachably provided with a test module 210 for testing electric characteristic such as DC characteristic of devices 1. When the test module 210 is detachable, devices 1 can be tested by replacing the test modules 210 of various models according to the kind of tests.

[54] The test module 210 receives devices 1 in a heated state from the loading chamber

110 of the device loading unit 100, and examines devices 1 to be good or bad by testing electric characteristic such as DC characteristic of devices 1. The test module 210 can sort devices 1 according the test result of "Good" or "Bad".

[55] One or more pockets 215 to be inserted with a device 1 to be tested so as to apply power or a test signal thereto are installed at the test module 210.

[56] When devices 1 are tested by the test module 210 in a heated or a cooled state, the temperature of devices 1 needs to be maintained in a constant temperature.

[57] The device test unit 200 may further include a test chamber 220 installed to enclose the test module 210.

[58] The test chamber 220 may have various configurations. As shown in FIGS. 8 and 9, the test chamber 220 is openably installed so as to easily replace the test module 210 by another or so as to easily repair the test module 210. The test chamber 220 may be configured so as to be hinge-coupled to one side of the test module 210.

[59] A transfer opening 221 through which the transfer units 410, 420 for inserting or withdrawing devices 1 into/from the test module 210 may pass, may be formed at an upper surface of the test chamber 220.

[60] The test chamber 220 includes a test position © to receive devices 1 from the withdrawing position ® of the device loading unit 100. The test chamber 220 is connected to a heating device (not shown) so that an inner space thereof can be heated in a constant temperature.

[61] The heating device may be configured to heat devices 1 by various methods such as conduction, convection, radiation, and may be implemented as an air supplying device 471 for introducing heated gas (generally air) into the heating space. The air supplying device 471 is connected to an air inlet 222 formed at the test chamber 220 so as to introduce heated gas into the test chamber 220. The air supplying device 471 may be replaced by a cooling air supplying device when devices 1 are to be tested at a low temperature. Here, cooling air is supplied into the loading chamber 110 thus to maintain an inner temperature of the loading chamber 110 as a constant low temperature.

[62] The transfer opening 221 is provided with a protruding portion 224 formed at inner edges thereof are protruding so as to minimize leakage of gas inside the heating space H, and so as not to disturb motion of the transfer units 410 and 420.

[63] The test chamber 220 may be connected to the loading chamber 110 so that temperature of devices 1 may be maintained in a constant temperature.

[64] The test handler for semiconductor device according to the present invention may further include a device sorting unit 300 for sorting devices 1 according to a test result by the device test unit 200.

[65] The device sorting unit 300 is configured to receive devices 1 from the device test unit 200 according to test result by the device test unit 200. As shown in FIG. 2, a plurality of sorting tray units 310, 320, 330 and 340 for being loaded with the transferred devices 1 according to a test result by the device test unit 200 may be implemented.

[66] The sorting tray units 310, 320, 330 and 340 may be configured to have the number corresponding to the number of sorting conditions (good/bad, DC failure, mal- operation, re-inspection, etc.). As shown in FIG. 2, each of the sorting tray units 310, 320, 330 and 340 may include one pair of guide rails 311, 321, 331 and 341 for guiding a motion of a tray 20, and a driving portion (not shown) for moving a tray 20.

[67] Each of the sorting tray units 310, 320, 330 and 340 may be installed in parallel with the moving path 120 so that the transfer device 420 can be easily moved from the testing position © of the device test unit 200 to the sorting position © according to a test result.

[68] In addition, in the same manner as the empty tray unit 150, a tray 20 is configured to move at the sorting tray units 310, 320, 330 and 340 in the Y-axis direction in FIG. 2.

[69] The transfer devices 410 and 420 for transferring devices 1 loaded on a tray 20 to the withdrawing position ®, the testing position ©, the sorting position ©, etc. may be implemented in one or in plurality. As shown in FIGS. 10 and 11, the transfer device 410 for transferring devices 1 may be disposed between the withdrawing position ® and the testing position ©, the transfer device 420 for transferring devices 1 may be disposed between the testing position © and the sorting position ©, thereby enhancing a transferring efficiency by the transfer devices 410 and 420.

[70] The transfer device 410 may be configured to transfer a plurality of devices (2 devices, 4 devices, or 8 devices) at one time. The transfer device 410 absorbs devices 1 by using one or more absorption heads installed at the end thereof by generating a vacuum pressure, and withdraws devices 1. Then, the transfer device 410 transfers devices 1 to the next position, and removes the vacuum pressure thus to load devices 1 in the next position.

[71] Preferably, the transfer devices 410 and 420 transfer the devices 1 in the X-axis direction perpendicular to the Y-axis direction which is a moving direction of a tray 20 at the moving path 120, the empty tray unit 150, and the sorting tray units 310, 320, 330 and 340.

[72] An interval between devices 1 loaded on a tray 20 may be configured to be different from an interval between the pockets 215 of the test module 210 for being inserted with devices 1. Here, the transfer devices 410 and 420 may be configured to control an interval between the absorption heads for absorbing devices 1.

[73] The reference number 10 in FIG. 2 denotes an installation frame for installing the device loading unit 100, the device test unit 200, and the device sorting unit 300.

[74] The reference numeral 460 denotes a tray rotating unit, and 490 denotes a tray loading unit.

[75] The tray rotating unit 460 is installed between the empty tray unit 150 of the device loading unit 100 and the sorting tray units 310, 320, 330 and 340 of the device sorting unit 300, and removes any device 1 remained on the tray 20 by rotating a tray 20.

[76] The tray rotating unit 460 is configured so that a tray 20 can be transferred between the empty tray unit 150 of the device loading unit 100 and the sorting tray units 310, 320, 330 and 340 of the device sorting unit 300. The tray rotating unit 460 is installed to remove any device 1 remained inside a tray 20 before the tray 20 can be transferred to the empty tray unit 150, so that only the empty tray 20 having no device 1 can be transferred.

[77] The tray loading unit 490 may be installed to load a tray 20.

[78] The operation of the test handler for semiconductor device according to the present invention will be explained as follows.

[79] First, a tray 20 on which devices 1 to be tested are loaded is supplied to the moving path 120 of the device loading unit 100.

[80] Then, the tray 20 moves along the moving path 120, and passes through the loading chamber 110 that surrounds at least a part of the moving path 120. The test chamber 110 can be maintained in a constant inner temperature by being introduced with air from the heating device.

[81] Once the tray 20 moves to the withdrawing position ® along the moving path 120, the transfer device 410 withdraws devices 1 from the tray 20 by absorption of the absorption head. Then, the transfer device 410 moves to the device test unit 200. Here, since trays 20 sequentially move along the moving path 120, while devices are withdrawn from the previous tray 20, devices in the next tray 20 are positioned in the loading chamber 110. Accordingly, devices 1 can be maintained in a sufficiently heated state, thereby enhancing a reliability for a test of devices 1.

[82] The tray 20 from which all devices 1 have been withdrawn while passing through the withdrawing position ® is transferred to the empty tray unit 150.

[83] A transferring process of a tray 20 when the moving path 120 of the device loading unit 100 is composed of the upper moving path 121 and the lower moving path 122 will be explained with reference to FIGS. 4 to 7

[84] A tray 20 on which devices 1 to be tested are loaded is loaded on the test tray loading unit 160 by a user's manual operation, or by the manner as shown in FIG. 4.

[85] As shown in FIG. 5, trays 20 are sequentially supplied to the lower moving path

122 by a lifting unit 123.

[86] As shown in FIG. 3, a tray 20 supplied to the lower moving path 122 passes through the moving in-out opening 116, and moves to the opposite lifting unit 123 along the lower moving path 122. When the tray 20 has been transferred to the lifting unit 123, the lifting unit 123 is lifted to the upper moving path 121.

[87] The tray 20 lifted to the upper moving path 121 moves along the upper moving path

121, and passes through the withdrawing position ®. Then, devices 1 loaded on the tray 20 are withdrawn.

[88] The tray 20 having passed through the withdrawing position ® is in an empty state without having any device 1, and as shown in FIG. 6, moves to the upper moving path 121 so as to be withdrawn to the empty tray unit 150. The tray transfer device 450 moves to the moving path 120 so as to withdraw the tray 20 from which all devices 1 has been withdrawn. Then, as shown in FIG. 7, the tray transfer device 450 transfers the empty tray 20 to the empty tray unit 450.

[89] As the operations of FIGS. 4 to 7 are continuously performed, the device loading unit 100 continuously supplies devices 1 to the device test unit 200.

[90] The device test unit 200 received with device 1 from the device loading unit 100 performs a test such as DC characteristic of the semiconductor device 1, and examines whether device 1 is good or bad. Then, the device test unit 200 transmits a test result to a controller (not shown).

[91] Then, the tested device 1 is transferred to the sorting position © of each tray 20 of the sorting tray units 310, 320, 330 and 340 of the device sorting unit 300 by the transfer device 420 according to the test result, and is loaded on a tray 20.

[92] When devices 1 are inserted into any tray 20 of the sorting tray units 310, 320, 330 and 340, trays 20 are transferred to the tray loading units positioned at a front side thereof thus to be loaded.

[93] As the present features may be embodied in several forms without departing from the characteristics thereof, it should also be understood that the above-described embodiments are not limited by any of the details of the foregoing description, unless otherwise specified, but rather should be construed broadly within its scope as defined in the appended claims, and therefore all changes and modifications that fall within the metes and bounds of the claims, or equivalents of such metes and bounds are therefore intended to be embraced by the appended claims.

Claims

[1] A test handler for semiconductor device, comprising: a device loading unit having a loading chamber for receiving a tray on which semiconductor devices are loaded and maintaining a temperature of semiconductor devices in a test temperature by a temperature control system; and a device test unit having a test module for testing a semiconductor device transferred from the loading chamber.

[2] The test handler for semiconductor device of claim 1, further comprising a device sorting unit for receiving semiconductor devices from the device test unit and sorting semiconductor devices according to test result by the device test unit.

[3] The test handler for semiconductor device of claim 1, wherein the device loading unit comprises a moving path for one or more trays on which semiconductor devices are loaded, wherein the loading chamber is formed to enclose at least a part of the moving path.

[4] The test handler for semiconductor device of claim 3, wherein the moving path comprises: an upper moving path; a lower moving path installed below the upper moving path; and a lifting unit installed at ends of the upper moving path and the lower moving path, and vertically moving to the upper moving path or the lower moving path, for moving a tray between the upper moving path and the lower moving path.

[5] The test handler for semiconductor device of claim 4, wherein the lifting unit is respectively installed at both ends of the upper moving path and the lower moving path.

[6] The test handler for semiconductor device of claim 3, wherein an empty tray unit for withdrawing an empty tray passing through the loading chamber from which semiconductor devices are withdrawn from the moving path and being loaded into the tray may be further installed at one side of the moving path.

[7] The test handler for semiconductor device of claim 3, wherein an air inlet for introducing heated gas into the loading chamber is formed at the loading chamber so as to heat semiconductor devices loaded on a tray.

[8] The test handler for semiconductor device of claim 3, wherein a transfer opening through which a transfer unit for transferring semiconductor devices loaded on a tray in the loading chamber to the device test unit is formed at the loading chamber.

[9] The test handler for semiconductor device of claim 1, wherein the test module is configured so as to examine whether a semiconductor device is good or bad by testing DC characteristic.

[10] The test handler for semiconductor device of claim 1, wherein the device test unit further comprises a test chamber installed to enclose the test module.

[11] The test handler for semiconductor device of claim 10, wherein a transfer opening through which a transfer unit for inserting or withdrawing semiconductor device into/from the test module is formed at the test chamber.

[12] The test handler for semiconductor device of claim 10, wherein an air inlet for introducing heated gas into the loading chamber is formed at the test chamber so as to heat a semiconductor device loaded on the test module.

[13] The test handler for semiconductor device of claim 1, wherein the temperature control system is implemented as a heating device or a cooling device.