KR20080040362A - Semiconductor device test handler - Google Patents

Abstract

A semiconductor device test handler is provided to improve reliability of a test result by maintaining the temperature condition demanded for a test of a semiconductor device for the sufficient time. In a semiconductor device test handler, a device loading unit(100) has a loading chamber(110) for receiving a tray loading semiconductor devices and keeping the semiconductor devices loaded in the tray, at a test temperature by a temperature controller. A device test unit(200) includes a test module(210) for receiving the semiconductor device from the loading chamber and testing the semiconductor device. A device sorting unit(300) classifies the semiconductor devices according to the test result of the device test unit and receives the semiconductor devices from the device test unit.

Description

Semiconductor Device Test Handler {Semiconductor Device Test Handler}

1A is a layout view illustrating a configuration of a semiconductor device test handler according to the present invention.

FIG. 1B is a plan view illustrating in detail the configuration of the semiconductor device test handler of FIG. 1A.

FIG. 2 is a cross-sectional view taken along II-II in FIG. 1B.

3A to 3D are cross-sectional views illustrating an operation process of the device loading unit in cross-sectional views in the III-III direction of FIG. 1B.

4A is a perspective view illustrating a part of the device test unit in FIG. 1B.

4B is a cross-sectional view taken along the line IV-IV in FIG. 1B.

5A and 5B are conceptual views illustrating a transfer process of devices, respectively.

***** Explanation of symbols for main parts of drawing *****

1: device 10: main frame

20 tray

100: device loading unit

110: loading chamber 120: movement path

150: bin tray

200: device test unit

210: test module 220: test chamber

300: device sorting unit

310, 320, 330, 340: sorting tray

410, 420: Feeding device

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device test handler, and more particularly, to a semiconductor device test handler for testing and classifying electrical characteristics and the like of semiconductor devices that have been packaged under a predetermined temperature condition.

In general, semiconductor devices (hereinafter, simply referred to as 'devices') that have been completed in a package process are subjected to burn-in tests for reliability tests due to external thermal factors.

This burn-in test loads a device on a burn-in board, places the burn-in board into a hot chamber installed in the burn-in test equipment, and determines whether the device is operating normally under a certain temperature and pressure for a period of time.

However, depending on the type of device, there is a case in which only a good product is shipped by simply performing a test on an electrical characteristic such as a direct current (DC) characteristic without performing a burn-in test, which is referred to as a "simple test".

Since the device shipped after the simple test is not performed the electrical characteristic test under a certain temperature, it is necessary to perform the thermal characteristic test because it is unpredictable such as failure or malfunction that may occur under high temperature conditions.

Typically, the electrical test time performed in a simple test is short, and if such a simple test is performed under the required saturation temperature, a device with a certain degree of reliability in thermal properties can be produced in large quantities.

Accordingly, an object of the present invention is to provide a semiconductor device handler that can perform a test for electrical characteristics and the like under a uniform temperature environment when performing a simple test of a device in recognition of the necessity as described above.

Another object of the present invention is to provide a semiconductor device handler that can improve the reliability of the test results by maintaining the temperature conditions required for the test of the device for a sufficient time.

The present invention was created in order to achieve the object of the present invention as described above, the present invention is supplied with a tray loaded with a semiconductor device, the loading chamber for maintaining the semiconductor device loaded on the tray at a test temperature by a temperature control device A device loading unit having a; And a device test unit configured to receive the semiconductor device from the loading chamber and install a test module for testing the semiconductor device.

The handler may further include a device sorting unit classified according to a test result of the device test unit and receiving the semiconductor device from the device test unit.

The device loading unit may include a movement path through which at least one tray on which the semiconductor device is loaded is moved, and the loading chamber may be formed to surround at least a portion of the movement path.

The movement path is provided at the end of the upper movement path, the lower movement path installed below the upper movement path, and the upper movement path and the lower movement path to move the tray between the upper movement path and the lower movement path. It may be configured to include a lifting unit for descending to the upper movement path or the lower movement path. The lifting portions may be installed at both ends of the upper movement path and the lower movement path, respectively.

One side of the moving path may be additionally provided with a bin tray for the semiconductor device is drawn out while passing through the loading chamber to draw the bin tray from the moving path.

The loading chamber may have an air inlet through which heated gas is introduced into the loading chamber to heat the semiconductor device loaded in the tray.

The loading chamber may have a transfer opening for entering and exiting a transfer device for transferring a semiconductor device loaded in a tray located inside the loading chamber to a device test unit.

The test module may be configured to test the DC characteristics to determine whether it is good or bad.

The device test unit may further include a test chamber installed to surround the test module. The test chamber may be formed with a transfer opening so that a transfer device for entering or withdrawing the semiconductor device into and out of the test module.

The test chamber may be formed with an air inlet through which a heated gas flows into the test chamber in order to heat the semiconductor device loaded in the test module.

The temperature control device may be composed of a heating device or a cooling device.

Hereinafter, a semiconductor device handler according to the present invention will be described in detail with reference to the accompanying drawings.

1A and 1B, the semiconductor device handler includes a device loading unit 100 and a device test unit 200. Here, the handler according to the present invention may further include a device sorting unit 300 for classifying the device 1 according to the test result of the device testing unit 200.

The device loading unit 100 is configured to heat the device 1 loaded on the tray 20 by receiving the tray 20 on which the device 1 is loaded, and the movement path 120 to which the tray 20 is moved. And a loading chamber 110 formed to surround at least a portion of the movement path 120 to heat the device 1.

The movement path 120 is configured to pass through the draw position ① through the tray 20 on which the device 1 is loaded so that the transfer device 410 can withdraw the device 1. Here, the withdrawal position ① refers to a position where the transfer device 410 withdraws the device 1 loaded on the tray 20.

The movement path 120 may be configured in various ways according to the required design conditions, and as shown in FIG. 2, the upper movement path 121 and the lower movement path installed below the upper movement path 121 ( 122 and the upper movement path 121 is installed at the ends of the upper movement path 121 and the lower movement path 122 to move the tray 20 between the upper movement path 121 and the lower movement path 122. Or it may be configured to include a lifting unit 123 to move up and down the lower movement path (122). Of course, the movement path 120 may be composed of only one path.

The upper movement path 121 supports a pair of guide rails 121a for guiding the two sides of the tray 20 to be moved, and a driving unit for moving the tray 20 along the guide rails 121a. It is composed of

It is necessary to accurately move the device 1 to the withdrawal position ① so that the transfer device 410 can withdraw, ie, pick up the device 1 stably from the tray 20, and the drive unit is capable of precise movement control. It is preferable that it is composed of a linear transfer device including a screw.

The lower movement path 122 supports a pair of guide rails 122a for supporting both sides of the tray 20 and a drive unit for moving the tray 20 along the guide rails 122a (not shown). It is composed of

At this time, the movement of the tray 20 in the movement path 120 can be implemented in various forms such as rotational movement, linear movement, but with reference to Figure 1a to facilitate the movement of the tray 20 and the withdrawal of the device (1) It can be configured to linearly move in the Y-axis direction. After the withdrawal of the device 1, the transfer device 410 may be moved in the X axis direction perpendicular to the Y axis direction.

The lifting unit 123 is configured such that the movement path 120 moves the tray 20 up and down (Z axis) between the upper movement path 121 and the lower movement path 122, and the upper movement path 121. ) And the lower movement path 122 may be installed at one end or both ends, respectively.

The lifting unit 123 is configured to elevate the tray 20 reaching the end of the lower movement path 122 toward the upper movement path 121 or the tray 20 reaching the end of the upper movement path 121. It is configured to lower toward the lower movement path (121).

In this case, the test path stacking unit 160 in which the tray 20 on which the devices 1 to be tested are stacked may be stacked may be installed in the movement path 120. Any one of the elevating units 123 may be a test tray stacking unit. It may be configured to receive the tray 20 from the unit 160. Here, the test tray stacking unit 160 is a plurality of trays 20 are stacked, the trays 20 are sequentially moved to the movement path (120).

On the other hand, the loading chamber 110 forms a heating space (H) to surround at least a portion of the movement path 120 to maintain, i.e., heat, the device 1 loaded on the tray 20 at a test temperature.

At this time, the heating space (H) formed by the loading chamber 110 includes a withdrawal position ①, the loading chamber 110 is heated to a temperature control device so that the heating space (H) can be heated to a constant test temperature In connection with the device (not shown). Here, the test temperature is a set temperature for the test, and may be variously set such as 80 ° C. to 100 ° C. and 85 ± 5 ° C. according to requirements.

The heating device may be configured to heat the device 1 by various heating methods such as conduction, convection, radiation, etc., and is configured as an air supply device 431 to introduce a heated gas (generally air) into the heating space. The air supply device 431 is connected to the air inlet 111 formed in the loading chamber 110 so that the heated gas flows into the heating space. In this case, the air supply device 431 may be replaced with a cooling air supply device 431 when the test of the device 1 is to be performed under a low temperature rather than a high temperature. In this case, the cooling air may be cooled in the loading chamber 110. Supplied and maintained at a constant low temperature. Of course, the heating device may be replaced with a cooling device.

By the loading chamber 110 as described above it is possible to minimize the temperature change around the device 1 to maintain a constant temperature appropriate to the test temperature.

Meanwhile, the loading chamber 110 has a transfer opening 115 through which the transfer device 410 enters and exits in order to withdraw the device 1 loaded in the tray 20 located inside the loading chamber 110. The entrance / exit opening 116 is formed on the side surface of the tray 20 so that the tray 20 can enter and exit along the transport path 110. At this time, the transfer opening 115 and the entry and exit opening 116 of the inner surface to minimize the outflow of the gas in the heating space (H) without disturbing the movement of the transfer device 410 or tray 20 Edge is formed by protruding.

Meanwhile, since the device 1 is drawn out while the tray 20 passes the withdrawal position ① of the movement route 120, the tray 20 needs to be removed from the movement route 120.

Therefore, one side of the moving path 120 is an empty tray unit 150 which draws out and loads the tray 20 with which the device 1 is drawn out and emptied from the moving path 120 while passing through the loading chamber 110. Can be installed.

The bin tray 150 is provided on one side of the movement path 120, that is, a pair of guide rails 151 and the tray 20 to which the tray 20 can be moved in parallel with the movement path 120. It is configured to include a drive for moving the.

And one end of the bin tray 150 is provided with a tray feeder 450 for transferring the tray 20 between the bin tray 150 and the movement path 120 is moved by the tray transfer device (450) The tray 20 discharged from 120 is transferred.

In addition, when the tray 20 on which the device 1 to be tested is loaded is loaded in the bin tray 150, the tray transport apparatus 450 may transfer the tray from the bin tray 150 to the transfer path 120. Transfer 20.

The device test unit 200 is integrally installed or detachably installed with a test module 210 for testing electrical characteristics of the device 1 such as DC characteristics. When the test module 210 is detachably installed, there is an advantage in that the device 1 can be tested by replacing and mounting various types of test modules 210 according to the test type.

Meanwhile, the test module 210 receives the device 1 in a heating state from the loading chamber 110 of the device loading unit 100 and tests the electrical characteristics of the device 1, such as DC characteristics, to be good or bad. It discriminates by and makes it possible to classify according to the good or bad of each device 1.

In addition, the test module 210 is provided with one or more pockets 215 into which the device 1 is inserted so as to apply a power or test signal to the device 1 to be tested.

On the other hand, when the device 1 tested by the test module 210 is tested in a heating state or a cooling state, it is necessary to maintain the device 1 at a constant temperature state.

Therefore, the device test unit 200 may further include a test chamber 220 installed to surround the test module 210.

The test chamber 220 may be configured in various forms, and as shown in FIGS. 4A and 4B, the test chamber 220 is installed to be opened and closed to facilitate replacement or maintenance of the test module 210, and in particular, the test module 210. It may be configured to be hinged to one side of the).

In addition, the test chamber 220 has a transfer opening 221 is formed on the upper side so that the transfer device (410, 420) for entering or withdrawing the device 1 to the test module 210 can be entered.

At this time, the test chamber 220 includes a test position ② for receiving the device 1 from the withdrawal position ① of the device loading unit 100, the test chamber 220 is heated so that the inside can be heated to a constant temperature In connection with the device (not shown).

The heating device may be configured to heat the device 1 by various heating methods such as conduction, convection, radiation, etc., and is configured as an air supply device 471 to introduce heated gas (generally air) into the heating space. The air supply device 471 is connected to the air inlet 222 formed in the test chamber 220 so that the heated gas flows into the test chamber 220. In this case, the air supply device 471 may be replaced with a cooling air supply device when a test of the device 1 is to be performed at a low temperature instead of a high temperature, and in this case, the cooling air is supplied into the loading chamber 110 so that a constant Kept at a low temperature.

The transfer opening 221 is a protrusion 224 protruding the edge portion of the inner surface to minimize the outflow of the gas in the heating space (H) without disturbing the movement of the transfer device (410, 420) Is formed.

The test chamber 220 may be installed in connection with the loading chamber 110 so that the device 1 can be maintained at a constant temperature state.

On the other hand, it is necessary to be classified according to the test result of the device test unit 200, the handler according to the present invention may further include a device sorting unit 300.

The device sorting unit 300 is configured to receive the device 1 from the device testing unit 200 according to the test result of the device testing unit 200, as shown in FIG. 1B, the device testing unit 200. In accordance with the results tested in each device 1 may be composed of a plurality of sorting tray unit 310, 320, 330 to be transported and loaded.

The sorting tray parts 310, 320, 330, 340 may be configured according to the number of classifications required (good, poor DC, poor working, retest, etc.), and each sorting tray part 310, 320, 330, 340. Each of them includes a pair of guide rails 311, 321, 331, and 341 to which the tray 20 can be moved, as shown in FIG. 1B, and a driving unit (not shown) for moving the tray 20. It is configured by.

In addition, the sorting tray units 310, 320, 330, and 340 may move the transfer path 420 so that the transfer device 420 may be easily moved from the test position ② of the device test unit 200 to the sorting position ③ that is moved according to the test result. 120 may be installed in parallel.

In addition, the moving direction of the tray 20 in the sorting tray parts 310, 320, 330, and 340 may be configured to move in the Y-axis direction with reference to FIG. 1B in the same manner as the bin tray 150.

Meanwhile, at least one transfer device 410 or 420 for transferring the device 1 loaded on the tray 20 to the withdrawal position ①, the test position ②, the sorting position ③, etc. may be configured, and FIGS. 5A and 5B. As shown in FIG. 2, the transfer device 410 for transferring the device 1 between the withdrawal position ① and the test position ② for the transfer efficiency of the transfer apparatuses 410 and 420, and between the test position ② and the sorting position ③. It may be configured as a conveying device 420 for conveying the device (1).

In addition, the transfer device 410 may be configured to transfer one or more (two, four, eight, one at a time) at a time, the transfer device 410 is one or more adsorption head for generating a vacuum pressure at the end After adsorbing and withdrawing the device (1) in the furnace transfer position to move to the next transfer position, the vacuum pressure is removed to be seated in the next transfer position.

The transfer devices 410 and 420 are X perpendicular to the Y axis, which is the moving direction of the tray 20 in the movement path 120, the bin tray 150, and the sorting tray parts 310, 320, 330, and 340. It is preferable to move the device 1 by moving in the axial direction.

The distance between the devices 1 loaded on the tray 20 and the spaces between the pockets 215 of the test module 210 into which the device 1 is inserted may be different from each other. , 420 may be configured to adjust the distance between the adsorption heads for adsorbing each device (1).

Meanwhile, in FIG. 1B, reference numeral 10 denotes an installation frame for installing the device loading unit 100, the device test unit 200, and the device sorting unit 300.

Reference numeral 460 denotes a tray rotating part and 490 denotes a tray loading part.

The tray rotating part 460 is installed between the bin tray 150 of the device loading part 100 and the sorting tray parts 310, 320, 330, and 340 of the device sorting part 300 to provide a tray 20. It is an apparatus for removing the device 1 loaded in the tray 20 by rotating.

The tray rotating unit 460 may transfer the tray 20 between the bin tray 150 of the device loading unit 100 and the sorting tray units 310, 320, 330, and 340 of the device sorting unit 300. In this case, the empty tray 20 is installed to remove the device 1 that may be in the tray 20 before being transferred to the bin tray 150 so that only the empty tray 20 is transferred.

The tray loading part 490 may be installed to utilize the tray 20.

Referring to the operation of the semiconductor device test handler according to the present invention as follows.

First, the tray 20 on which the devices 1 to be tested are loaded is supplied to the movement path 120 of the device loading unit 100.

The supplied tray 20 moves along the movement path 120 and passes through the loading chamber 110 surrounding at least a portion of the movement path 120. At this time, the inside of the loading chamber 110 is supplied with air by the heating device to maintain a constant test temperature.

When the tray 20 moves along the movement path 120 and moves to the withdrawal position ①, the transfer device 410 adsorbs the devices 1 by the suction head to draw out from the tray 20 and the test device 200. Will be moved to). At this time, since the tray 20 is sequentially moved along the movement path 120, the device 1 is sufficient because the tray 20 is located in the loading chamber 110 while the devices 1 are withdrawn from the first supplied tray 20. The heating state is maintained, so that the reliability of the test of the device 1 can be ensured.

Meanwhile, the tray 20 with which the device 1 is drawn out and emptied while passing through the drawing position ① is transferred to the bin tray 150.

When the movement path 120 of the device loading unit 100 is configured as the upper movement path 121 and the lower movement path 122, the movement process of the tray 20 will be described with reference to FIGS. 3A to 3D. As follows.

In the tray 20 in which the devices 1 to be tested are loaded, the tray 20 is loaded in the test tray stacking unit 160 manually or as illustrated in FIG. 3A.

And each tray 20 is sequentially supplied to the lower movement path 122 by the lifting unit 116, as shown in Figure 3b.

As shown in FIG. 2, the tray 20 supplied to the lower movement path 122 passes through the entrance and exit opening 116 and moves along the lower movement path 122 to the opposite lift 123. When the tray 20 is transferred to the elevating unit 123, the elevating unit 123 is elevated to the upper movement path 121.

The tray 20 lifted by the upper movement path 121 passes through the withdrawal position ① while moving along the upper movement path 122, and the device 1 loaded on the tray 20 by the transfer device 410. Is withdrawn.

The tray 20 passing through the withdrawal position ① of the upper movement path 121 is moved to a state in which the device 1 is drawn out and emptied. As shown in FIG. 3C, the tray 20 may be drawn out toward the bin tray 150. It is moved to the upper transfer path 121 so that. At this time, the tray transfer apparatus 450 moves to the movement path 120 so that the device 1 can withdraw the tray 20 withdrawn. When the tray 20 finishes the movement, the tray transfer apparatus 450 is shown in FIG. As shown in 3d, the tray 20 is moved to the bin tray 450.

The device loading unit 100 as described above continuously supplies the device 1 to the device test unit 200 by continuously performing the operation of FIGS. 3A to 3D.

On the other hand, the device test unit 200 is transferred to the device 1 from the device loading unit 100 performs a test on the DC characteristics of the device 1 and the like to determine whether the good or bad for each device 1 The test result is transmitted to a controller (not shown).

Then, the tested device 1 sorts the sorting position of each tray 20 of the sorting tray part 310, 320, 330, 340 of the device sorting part 300 by the transfer device 420 according to the test result. Transported and loaded.

When the device 1 is filled in the tray 20 of each tray 20 of each sorting tray part 310, 320, 330, 340, the tray 1 is moved and loaded into the tray loading parts positioned at the front.

The semiconductor device test handler according to the present invention has an advantage of performing tests on electrical characteristics and the like under a uniform temperature environment when performing a simple test of a device.

In addition, the semiconductor device test handler according to the present invention has an advantage of improving the reliability of the test results by maintaining the temperature conditions required for the test of the device for a sufficient time.

In addition, the semiconductor device test handler according to the present invention has an advantage that a simple test of a device can be performed quickly.

In addition, the semiconductor device test handler according to the present invention has an advantage in that it is possible to perform various tests by simply replacing the test module according to the type of test by detachably installing a test module for testing the device.

In the above, the preferred embodiment of the present invention has been illustrated and described, but the present invention is not limited to the specific embodiments described above, and the technical spirit of the present invention and the following by those skilled in the art to which the present invention pertains. Various modifications and variations will be possible within the scope of equivalents of the claims to be described therein, and such variations will fall within the protection scope of the present invention.

Claims (13)

A device loading unit having a loading chamber which receives a tray loaded with a semiconductor device and maintains the semiconductor device loaded in the tray at a test temperature by a temperature controller; A device tester configured to receive the semiconductor device from the loading chamber and install a test module for testing the semiconductor device; Semiconductor device test handler comprising a. The method of claim 1, And a device sorting unit classified according to a test result of the device test unit and receiving the semiconductor device from the device test unit. The method of claim 1, The device loading unit And a movement path through which at least one tray on which the semiconductor device is loaded is moved, wherein the loading chamber is formed to surround at least a portion of the movement path. The method of claim 3, wherein The movement path An upper movement path, a lower movement path installed below the upper movement path, and an upper movement path and a lower movement path installed at an end of the upper movement path and the lower movement path to move the tray between the upper movement path and the lower movement path; And a lifter configured to move up and down a path or the lower movement path. The method of claim 4, wherein The elevating unit is a semiconductor device handler, characterized in that installed at both ends of the upper movement path and the lower movement path, respectively. The method of claim 3, wherein The semiconductor device handler, characterized in that the bin tray portion for extracting and loading the bin tray from the moving path is further installed on one side of the moving path through the loading chamber. The method of claim 3, wherein The loading chamber is And an air inlet through which a heated gas flows into the loading chamber to heat the semiconductor device loaded in the tray. The method of claim 3, wherein The loading chamber is And a transfer opening for entering and exiting the transfer device for transferring the semiconductor device loaded in the tray located inside the loading chamber to the device test unit. The method of claim 1, The test module is a semiconductor device test handler, characterized in that for determining the good or bad by testing the DC characteristics. The method of claim 1, The device test unit further comprises a test chamber installed to surround the test module. The method of claim 10, The test chamber is a test handler, characterized in that the transfer opening is formed so that the transfer device for entering or withdrawing the semiconductor device in the test module. The method of claim 10, The test chamber And an air inlet through which a heated gas flows into the test chamber to heat the semiconductor device loaded in the test module. The method of claim 1, The temperature control device is a semiconductor device test handler, characterized in that the heating device or cooling device.

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