TWI571637B - Electronic parts conveyor and electronic parts inspection device - Google Patents

Description

Electronic component conveying device and electronic component inspection device

The present invention relates to an electronic component conveying device and an electronic component inspection device.

For example, an electronic component inspection device for inspecting electrical characteristics of an electronic component such as an IC (integrated circuit) component has been known, and the electronic component inspection device is loaded with an IC component for transporting the IC component to the inspection unit. The electronic component transport device up to the holding unit. In the inspection of the IC element, the IC element is placed in the holding portion, and the plurality of probes provided in the holding portion are brought into contact with the respective terminals of the IC element.

The inspection of such an IC component is carried out by cooling the IC component to a specific temperature. In this case, the IC element is cooled, and the condensation atmosphere is prevented from being lowered, so that the humidity of the gas atmosphere around the member in which the IC element is disposed is lowered.

Patent Document 1 discloses an IC chip component testing device in which an IC tray having a plurality of IC housing portions for accommodating a plurality of IC chips is movably accommodated in a chamber whose temperature is controlled to be low temperature, and an opening and closing chamber is provided. A plate-shaped baffle at the entrance to the chamber. When the IC chip is transported from the outside and is housed in the IC housing portion of the IC tray in the chamber, the IC tray moves to the position of the entrance, and the shutter is opened, and the entire IC tray is exposed to the outside, and is adsorbed by the suction nozzle. The IC chip is housed in the IC housing portion of the IC tray by releasing the adsorption. The IC wafer component testing apparatus described in Patent Document 1 can maintain the chamber at a specific temperature and a specific humidity by closing the inlet of the chamber with a baffle.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2000-74996

However, the baffle described in Patent Document 1 includes a plate-shaped member that opens and closes the entire inlet of the chamber, and the baffle is not a baffle that can open and close each IC housing portion of the IC tray. Therefore, in a state where the shutter is opened, the opening portion becomes larger than necessary, whereby all of the IC chips housed in the IC tray are exposed to an unmanaged gas atmosphere such as humidity. Thereby, when the temperature of the IC chip is low, there is a problem that condensation forms on the surface of the IC wafer.

An object of the present invention is to provide an electronic component conveying apparatus and an electronic component inspection apparatus capable of suppressing exposure of an electronic component to an unmanaged gas atmosphere such as humidity.

The present invention has been developed in order to solve at least some of the above problems, and can be realized as the following aspects or application examples.

[Application 1]

An electronic component conveying apparatus according to the present invention includes: a first space; a second space different from the first space; and an arrangement member disposed in the second space and configured with a plurality of electronic components; And a baffle plate that is operable to be in at least one direction in which the electronic component is disposed, and is in contact with the first space and the second space; and the baffle plate is provided with a plurality of first openings.

Thereby, it is possible to suppress the electronic component from being exposed to an unmanaged gas atmosphere such as humidity.

In other words, by closing the shutter, the communication between the first space and the second space can be blocked in the portion of the shutter, whereby the humidity in the second space can be easily managed, for example.

Further, when the baffle is opened, the first opening portion can be placed in a specific portion of the arrangement of the plurality of electronic components in the arrangement member, and only the specific portion can be opened. Thereby, for example, when the humidity is not managed in the first space, it is possible to suppress the electronic component from being exposed to an unmanaged gas atmosphere such as the humidity.

[Applicable Example 2]

Preferably, one surface of the baffle is in contact with the first space, and the other surface of the baffle is in contact with the second space.

Thereby, a baffle with a higher blocking function can be provided.

[Applicable Example 3]

Preferably, the direction in which the shutter operates is the longitudinal direction of the arrangement member.

Thereby, the opening and closing operation of the shutter can be performed efficiently.

[Applicable Example 4]

Preferably, in the electronic component conveying apparatus of the present invention, the first space and the second space have different humidity.

Thereby, by lowering the humidity of the second space, it is possible to suppress dew condensation in the electronic component or the second space when the temperature of the electronic component or the second space is low.

[Applicable Example 5]

Preferably, in the electronic component conveying apparatus of the present invention, the humidity of the second space is lower than the humidity of the first space.

Thereby, when the temperature of the electronic component or the second space is low, condensation can be suppressed from occurring in the electronic component or the second space.

[Applicable Example 6]

Preferably, the electronic component conveying apparatus of the present invention includes an opening member that is disposed between the baffle and the arrangement member and has a plurality of second openings.

Thereby, the baffle can be lifted by reducing the gap between the baffle and the opening member. Block function. Further, when a gas such as air having a low humidity (hereinafter also referred to as dry air) flows into the second space, particularly in the third space between the opening member and the arrangement member in the second space, the dry air is The third space flows so that condensation of the electronic parts can be prevented when the temperature of the electronic parts is low.

[Applicable Example 7]

Preferably, in the electronic component conveying apparatus of the present invention, a gap between the opening member and the arrangement member is larger than a distance between the opening member and the shutter.

Thereby, when the dry air flows into the third space, the dry air can smoothly flow in the third space, and when the temperature of the electronic component is low, dew condensation of the electronic component can be prevented.

[Applicable Example 8]

Preferably, the electronic component conveying device of the present invention has a sliding member that operably supports the shutter.

Thereby, the shutter can be smoothly operated to open and close.

[Applicable Example 9]

Preferably, in the electronic component conveying apparatus of the present invention, the operation of the shutter is a translation.

Thereby, the configuration of the driving mechanism of the shutter can be simplified.

[Application 10]

Preferably, in the electronic component conveying device of the present invention, the shutter may be replaced with a shutter having at least one of a size of the first opening and a position of the first opening.

Thereby, it is possible to correspond to electronic parts of various sizes.

[Applicable Example 11]

Preferably, in the electronic component transport device of the present invention, the size of the first opening is set based on the size of the electronic component.

Thereby, it is possible to correspond to electronic parts of various sizes.

[Applicable Example 12]

Preferably, in the electronic component conveying apparatus of the present invention, the distance between the plurality of first openings is twice as large as the distance between the plurality of electronic component placement portions provided in the arrangement member and the electronic component.

Therefore, when the electronic component arranging portions are arranged in a matrix, only one of the electronic component arranging portions and the even-numbered electronic component arranging portions that can form the odd rows is opened by the shutter, and the other is the shutter is closed. State. Thereby, only the required one of the odd-numbered electronic component arrangement portion and the even-numbered electronic component arrangement portion can open the shutter.

[Applicable Example 13]

Preferably, in the electronic component conveying apparatus of the present invention, the shutter is reciprocally movable, and a distance of the single stroke of the reciprocating motion of the shutter is 1/2 of a distance between the first openings.

Therefore, when the electronic component arranging portions are arranged in a matrix, only one of the electronic component arranging portions and the even-numbered electronic component arranging portions that can form the odd rows is opened by the shutter, and the other is the shutter The status of the shutdown. Thereby, only the required one of the odd-numbered electronic component arrangement portion and the even-numbered electronic component arrangement portion can open the shutter.

[Applicable Example 14]

Preferably, in the electronic component conveying device of the present invention, the conveying member that can transport the electronic component is provided, and the shutter is opened when the conveying member moves toward the placement member.

Thereby, for example, when the first space does not manage the humidity or the like, it is possible to suppress the electronic component from being exposed to an unmanaged gas atmosphere such as humidity, compared to the case where the baffle is opened before the transfer member starts moving toward the disposition member.

Moreover, the processing time can be shortened compared with the case where the conveyance member reaches the arrangement member and the shutter is opened.

[Applicable Example 15]

In the electronic component conveying apparatus of the present invention, it is preferable to set a time period from which the operation of opening the shutter is started based on a position at which the conveying member starts moving toward the arrangement member.

Thereby, the time for starting the operation of opening the shutter can be easily and accurately set.

[Applicable Example 16]

Preferably, in the electronic component conveying apparatus of the present invention, the operation of opening the shutter is started, and the moving distance of the conveying member when the conveying member starts moving toward the positioning member is smaller than the movement of the conveying member. When the specific moving distance to the above-mentioned configuration member is a specific value.

Thereby, the time for starting the operation of opening the shutter can be easily and accurately set.

[Applicable Example 17]

Preferably, in the electronic component conveying apparatus of the present invention, the specific value is set within a range of 60% or more and 95% or less of the total moving distance.

Thereby, the time to start the action of opening the shutter can be set exactly.

[Applicable Example 18]

An electronic component inspection apparatus according to the present invention includes: a first space; a second space different from the first space; and an arrangement member disposed in the second space and configured with a plurality of electronic components; a baffle that is operable to be in at least one direction in which the electronic component is disposed, and that is in contact with the first space and the second space; and an inspection unit that inspects the electronic component; and the baffle is provided with A plurality of openings.

Thereby, it is possible to suppress the electronic parts from being exposed to an unmanaged gas atmosphere such as humidity.

That is, by closing the shutter, the communication between the first space and the second space can be blocked in the portion of the shutter, whereby the humidity of the second space can be easily managed, for example.

Further, when the baffle is opened, the first opening portion can be placed in a specific portion of the arrangement of the plurality of electronic components in the arrangement member, and only the specific portion can be opened. Thereby, for example, when the humidity is not managed in the first space, it is possible to suppress the electronic component from being exposed to an unmanaged gas atmosphere such as the humidity.

1‧‧‧Inspection device (electronic parts inspection device)

3‧‧‧Base

11A‧‧‧1st pallet transport mechanism

11B‧‧‧2nd tray transport mechanism

12‧‧‧Temperature adjustment unit (soaking plate)

13‧‧‧1st component transport head

14‧‧‧Component supply unit (supply shuttle)

15‧‧‧3rd pallet transport mechanism

16‧‧‧Inspection Department

17‧‧‧2nd component transport head

18‧‧‧Component Recycling Department (Recycling Shuttle)

19‧‧‧Recycling tray

20‧‧‧3rd component transport head

21‧‧‧6th tray transport mechanism

22A‧‧‧4th tray transport mechanism

22B‧‧‧5th pallet transport mechanism

41‧‧‧ Temperature Control Board

42‧‧‧Replace the fixture board

43‧‧‧ bracket

44‧‧‧ housing

45‧‧‧Baffle

51‧‧‧1st space

52‧‧‧Second space

53‧‧‧3rd space

61‧‧‧ boards

62‧‧‧Baffle

63‧‧‧Sliding members

64‧‧‧ bolt

80‧‧‧Control Department

90‧‧‧IC components

181‧‧‧ recess

200‧‧‧Tray

421‧‧‧ recess

441‧‧‧2nd wall

442‧‧‧2nd opening

451‧‧‧1st wall

452‧‧‧1st opening

611‧‧‧2nd opening

621‧‧‧1st opening

622‧‧‧ long hole

631, 632‧‧‧ Large Path Department

633‧‧‧Little Trails Department

A1‧‧‧Tray supply area

A2‧‧‧Component supply area (supply area)

A3‧‧‧ inspection area

A4‧‧‧Component recycling area (recycling area)

A5‧‧‧Tray removal area

D1~d4‧‧‧ interval

S101~S104‧‧‧Steps

P1, P2, P3‧‧‧ spacing

Fig. 1 is a schematic plan view showing a first embodiment of an electronic component inspection device according to the present invention.

Fig. 2 is a cross-sectional view showing a temperature adjustment portion of the electronic component inspection device shown in Fig. 1.

Fig. 3 is a cross-sectional view showing a temperature adjustment portion of the electronic component inspection device shown in Fig. 1;

4 is a cross-sectional view showing a temperature adjustment portion of the electronic component inspection device shown in FIG. 1.

Fig. 5 is a plan view showing a replacement jig of a temperature adjustment unit of the electronic component inspection device shown in Fig. 1;

Fig. 6 is a plan view showing a casing of a temperature adjustment unit of the electronic component inspection device shown in Fig. 1;

Fig. 7 is a plan view showing a shutter of a temperature adjusting portion of the electronic component inspection device shown in Fig. 1;

Fig. 8 is a plan view for explaining an operation of a temperature adjustment unit of the electronic component inspection device shown in Fig. 1;

Fig. 9 is a plan view for explaining the operation of the temperature adjustment unit of the electronic component inspection device shown in Fig. 1;

Fig. 10 is a plan view showing a plate and a shutter above the component recovery portion disposed in the component recovery region of the electronic component inspection device shown in Fig. 1;

Fig. 11 is a cross-sectional view showing the component recovery portion, the plate, and the shutter disposed in the component recovery region of the electronic component inspection device shown in Fig. 1.

Fig. 12 is a plan view showing a casing of a temperature adjustment unit according to a second embodiment of the electronic component inspection device of the present invention.

Fig. 13 is a plan view showing a shutter of a temperature adjustment unit according to a second embodiment of the electronic component inspection device of the present invention.

Fig. 14 is a view for explaining the operation of the fourth embodiment of the electronic component inspection device of the present invention.

Fig. 15 is a flow chart showing the control operation of the fourth embodiment of the electronic component inspection device of the present invention.

Hereinafter, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described in detail based on the embodiments shown in the drawings.

<First embodiment>

Fig. 1 is a schematic plan view showing a first embodiment of an electronic component inspection device according to the present invention. 2 to 4 are cross-sectional views showing temperature adjustment portions of the electronic component inspection device shown in Fig. 1, respectively. Fig. 5 is a plan view showing a replacement jig of a temperature adjustment unit of the electronic component inspection device shown in Fig. 1; Fig. 6 is a plan view showing a casing of a temperature adjustment unit of the electronic component inspection device shown in Fig. 1; Fig. 7 is a plan view showing a shutter of a temperature adjusting portion of the electronic component inspection device shown in Fig. 1; 8 and 9 are plan views for explaining the operation of the temperature adjustment unit of the electronic component inspection device shown in Fig. 1, respectively. Fig. 10 is a plan view showing a plate and a shutter above the component recovery portion disposed in the component recovery region of the electronic component inspection device shown in Fig. 1; Fig. 11 is a cross-sectional view showing the component recovery portion, the plate, and the shutter disposed in the component recovery region of the electronic component inspection device shown in Fig. 1.

In the following description, for convenience of explanation, as shown in FIG. 1, the three axes orthogonal to each other are defined as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X axis is also referred to as "X direction", the direction parallel to the Y axis is also referred to as "Y direction", and the direction parallel to the Z axis is also referred to as "Z direction". Further, the direction of the arrows of the respective axes of the X-axis, the Y-axis, and the Z-axis is referred to as a positive side, and the direction opposite to the arrow is referred to as a negative side. Moreover, the upstream side of the conveyance direction of the electronic component is also simply referred to as "upstream side", and the downstream side is also simply referred to as "downstream side". Further, the "level" in the present specification is not limited to the complete level, and includes a state of being inclined with respect to a certain number of levels (for example, not about 5 degrees) as long as it does not hinder the conveyance of the electronic parts. In addition, in FIG. 8 and FIG. 9, illustration of the case 44 is abbreviate|omitted.

The inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 is used, for example, for inspection, testing (hereinafter referred to as "inspection") BGA (Ball Grid Array) package or LGA (Land grid array, Electrical characteristics of electronic components such as IC components, LCD (Liquid Crystal Display), CIS (CMOS (complementary metal oxide semiconductor) Image Sensor, CMOS image sensor) Device. In the following, for convenience of explanation, the case where the IC component is used as the above-described electronic component for inspection is representatively described, and the IC component is referred to as "IC component 90".

As shown in Fig. 1, the inspection apparatus 1 is divided into a tray supply area A1, a component supply area (hereinafter simply referred to as "supply area") A2, an inspection area A3, a component collection area (hereinafter simply referred to as "recycling area") A4, and a tray. Area A5 is removed. Further, the IC element 90 is sequentially inspected in the inspection area A3 in the middle through the above-described respective areas from the tray supply area A1 to the tray removal area A5. In this way, the inspection apparatus 1 is an electronic component transport apparatus including the control unit 80 that transports the IC element 90 in each area, an inspection unit 16 that performs inspection in the inspection area A3, and a detection control unit that is not shown. Further, the inspection apparatus 1 constitutes an electronic unit by a configuration other than the inspection unit 16 and the inspection control unit. Part transfer device.

The tray supply area A1 is supplied with an area of the tray 200 in which a plurality of IC elements 90 in an unchecked state are arranged. In the tray supply area A1, a plurality of trays 200 can be stacked.

The supply area A2 supplies a plurality of IC elements 90 from the tray 200 of the tray supply area A1 to the area of the inspection area A3. Further, the first tray transport mechanism 11A and the second tray transport mechanism 11B that transport the trays 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

In the supply area A2, a temperature adjustment unit (heating plate) 12, a first element transfer head (transport member) 13, and a third tray transfer mechanism 15 are provided.

The temperature adjustment unit 12 heats or cools a plurality of IC elements 90 to adjust (control) the IC element 90 to a temperature suitable for inspection. In the configuration shown in Fig. 1, two temperature adjustment units 12 are arranged and fixed in the Y direction. In addition, the IC component 90 on the tray 200 loaded (transferred) from the tray supply area A1 by the first tray transport mechanism 11A is transported and placed on any of the temperature adjustment units 12.

The first element transfer head 13 is movably supported in the supply area A2. Thereby, the first element transfer head 13 can be responsible for the transfer of the IC element 90 between the tray 200 and the temperature adjustment unit 12 carried in from the tray supply area A1, and the IC between the temperature adjustment unit 12 and the component supply unit 14 described below. Transfer of component 90. Further, the first element transfer head 13 has a plurality of holding portions (not shown) for holding the IC element 90, and each of the holding portions includes a suction nozzle for holding the IC element 90 by suction. Further, the first element transfer head 13 is configured such that the plurality of holding portions can selectively move (close to) the plurality of odd-numbered rows of the holes 421 (the odd-numbered second openings 442) of the temperature adjustment unit 12 described below. One of the plurality of pockets 421 (the second opening portion 442 of the even rows). Further, the first element transfer head 13 can heat or cool the IC element 90 in the same manner as the temperature adjustment unit 12, and adjust the IC element 90 to a temperature suitable for inspection.

The third tray transport mechanism 15 transports all the IC components 90 in the X direction. The mechanism of the empty tray 200 in which the state is removed. Then, after the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the second tray transport mechanism 11B.

The inspection area A3 is an area in which the IC component 90 is inspected. In the inspection area A3, a component supply unit (supply shuttle) 14 as an arrangement member, an inspection unit 16, a component collection unit (recycling shuttle) 18 as an arrangement member, and a second component transfer head 17 are provided.

The component supply unit 14 is a device that transports the temperature-adjusted (temperature-controlled) IC device 90 to the vicinity of the inspection unit 16. The component supply unit 14 is supported between the supply region A2 and the inspection region A3 so as to be movable in the X direction. Further, in the configuration shown in FIG. 1, two component supply portions 14 are disposed in the Y direction, and the IC device 90 on the temperature adjustment portion 12 is transported and placed on any of the component supply portions 14. Further, the component supply unit 14 can heat or cool the IC element 90 in the same manner as the temperature adjustment unit 12, and adjust the IC element 90 to a temperature suitable for inspection.

The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC component 90. The inspection unit 16 is provided with a plurality of probes electrically connected to the terminals of the IC element 90 while holding the IC element 90. Further, the terminal of the IC element 90 is electrically connected (contacted) to the probe, and the IC element 90 is inspected via the probe. The inspection of the IC component 90 is performed based on the program stored in the memory section of the inspection control unit included in the testing machine connected to the inspection unit 16. Further, the inspection unit 16 can heat or cool the IC element 90 in the same manner as the temperature adjustment unit 12, and adjust the IC element 90 to a temperature suitable for inspection.

The second element transfer head 17 is movably supported in the inspection area A3. By this, the second element transfer head 17 can transport and mount the IC element 90 on the component supply unit 14 carried in from the supply area A2 to the inspection unit 16. Further, the second element transfer head 17 has a plurality of holding portions (not shown) for holding the IC element 90, and each of the holding portions includes a suction nozzle for holding the IC element 90 by suction. Further, the second element transfer head 17 can heat or cool the IC element 90 in the same manner as the temperature adjustment unit 12, and adjust the IC element 90 to be suitable. Check the temperature.

The component recovery unit 18 is a device that transports the IC component 90 in the inspection unit 16 to the collection area A4. The component recovery unit 18 is supported between the inspection region A3 and the recovery region A4 so as to be movable in the X direction. In the configuration shown in FIG. 1, the component collection unit 18 is disposed in the Y direction in the same manner as the component supply unit 14, and the IC component 90 on the inspection unit 16 is transported and placed in any component recovery. Part 18. This transfer is performed by the second element transfer head 17.

The recycling area A4 will check the area where the completed IC component 90 is recovered. In the collection area A4, a collection tray 19, a third component transfer head (transport member) 20, and a sixth tray transfer mechanism 21 are provided. Further, in the collection area A4, an empty tray 200 is also prepared.

The recovery tray 19 is fixed in the collection area A4, and in the configuration shown in Fig. 1, three are arranged along the X direction. Further, the empty tray 200 is also arranged in three along the X direction. Then, the IC element 90 moved to the component collection unit 18 of the collection area A4 is transported and placed on any of the collection trays 19 and the empty trays 200. Thereby, the IC element 90 is recovered and classified according to each inspection result.

The third element transfer head 20 is movably supported in the collection area A4. Thereby, the third element transfer head 20 can transport the IC element 90 from the element recovery unit 18 to the collection tray 19 or the empty tray 200. Further, the third element transfer head 20 has a plurality of holding portions (not shown) for holding the IC element 90, and each of the holding portions includes a suction nozzle for holding the IC element 90 by suction.

The sixth tray transport mechanism 21 is a mechanism that transports the empty tray 200 loaded from the tray removal area A5 in the X direction. Then, after the transfer, the empty tray 200 is placed at a position where the IC element 90 is collected, and any of the three empty trays 200 can be obtained.

The tray removal area A5 is an area in which the trays 200 of the plurality of IC elements 90 in the inspection end state are collected and removed. In the tray removal area A5, a large number of stackable Tray 200.

In addition, the fourth tray transport mechanism 22A and the fifth tray transport mechanism 22B that transport the trays 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The fourth tray transport mechanism 22A is a mechanism that transports the tray 200 on which the inspected IC element 90 is placed from the collection area A4 to the tray removal area A5. The fifth tray transport mechanism 22B is a mechanism that transports the empty tray 200 for collecting the IC component 90 from the tray removal area A5 to the collection area A4.

The inspection control unit of the tester performs inspection of electrical characteristics of the IC component 90 disposed in the inspection unit 16 based on, for example, a program stored in a memory (not shown).

Further, the control unit 80 controls, for example, the first tray transport mechanism 11A, the second tray transport mechanism 11B, the temperature adjustment unit 12, the first element transport head 13, the component supply unit 14, the third tray transport mechanism 15, and the inspection unit 16, The second component transfer head 17, the component collection unit 18, the third component transfer head 20, the sixth tray transport mechanism 21, the fourth tray transport mechanism 22A, and the fifth tray transport mechanism 22B are driven by respective portions.

Further, the inspection apparatus 1 is configured to allow a gas such as air having a low humidity (hereinafter also referred to as dry air) to flow into a specific portion. When the IC element 90 is cooled to a specific temperature for inspection, the required portions are cooled accordingly, but dew condensation can be prevented by flowing dry air into the desired portions. Furthermore, in the present embodiment, the dry air flows into the temperature adjustment unit 12, the component supply unit 14, the inspection unit 16, and the component collection unit 18.

Hereinafter, the configuration of the temperature adjustment unit 12 and the element recovery unit 18 will be described, but the description of the common portions will be omitted. In addition, the component supply unit 14 is the same as the component recovery unit 18, and its description will be omitted.

As shown in FIG. 2, the temperature adjustment unit 12 is disposed on the base 3 of the inspection apparatus 1. The temperature adjustment unit 12 includes a temperature control plate 41, a replacement jig plate (arrangement member) 42 in which a plurality of IC elements 90 are disposed, a plurality of (four in the illustrated configuration) brackets 43, and a housing. (opening member) 44 and baffle 45. The shape of the temperature adjustment unit 12, that is, the shape of the temperature control plate 41, the replacement jig plate 42, the casing 44, and the baffle 45 are not particularly limited. However, in the present embodiment, the temperature adjustment unit 12 is viewed from the Z direction. In the middle view, its shape is rectangular. Furthermore, the direction of the long side of the rectangle is the Y direction, and the direction of the short side is the X direction.

The temperature control plate 41 has a plate shape and is fixed to the base 3 via the respective brackets 43. In this case, one end of each of the brackets 43 is fixed to the four corners of the temperature control plate 41, and the other end is fixed to the base 3. The temperature control plate 41 can be heated by a heating mechanism (not shown), and can be cooled by a cooling mechanism (not shown). Thereby, the IC element 90 disposed in the temperature adjustment unit 12 can be heated or cooled.

Further, the replacement jig plate 42 is detachably attached to the temperature control plate 41. The replacement fixture plate 42 can be replaced and replaced with other homologous or heterogeneous species as needed. Specifically, the replacement jig plate 42 is replaced by, for example, the shape and size (size) of the IC component 90 to be inspected, or the arrangement (position) of each of the holding portions of the first component transfer head 13 , and the like. Replace the fixture board.

As shown in FIG. 2 and FIG. 5, in the upper surface of the jig plate 42, that is, the surface opposite to the temperature control plate 41, a plurality of recesses (electronic parts) for housing (disposing) the IC element 90 are formed. Configuration unit) 421. Each of the IC elements 90 is housed in each of the pockets 421, and is disposed on the jig plate 42.

The shape, size (dimension), and arrangement (position) of each of the pockets 421 are based on the shape and size (size) of the IC component 90 to be inspected, or the arrangement (position) of each of the holding portions of the first component transfer head 13 and the like. set up.

Further, in the present embodiment, since the IC element 90 has a square shape (quadrilateral shape) as viewed from the Z direction, the shape of the recess 421 has a shape corresponding to the outer shape of the IC element 90, that is, a square (quadrilateral shape). Further, each of the pockets 421 is arranged in a matrix.

Further, the casing 44 is fixed to the bracket 43. The housing 44 presents a hollow rectangular parallelepiped The temperature control plate 41 and the replacement jig plate 42 are housed in the shape. The inside of the casing 44 is configured to supply dry air. A space having a gas atmosphere having a low humidity (the third space 53 described below) can be formed inside the casing 44 by supplying dry air to the inside of the casing 44.

Further, as shown in FIG. 2 and FIG. 6, a plurality of second portions are formed in the upper wall portion of the casing 44 in FIG. 2, that is, the second wall portion 441 opposed to the recess 421 in which the jig plate 42 is replaced. Opening portion 442.

When viewed in the Z direction, the second opening portion 442 has a rectangular shape (rectangular shape). Further, the direction of the long side of the rectangle is the direction orthogonal to the X direction, that is, the direction in which the baffle 45 reciprocates, and the direction of the short side is the Y direction, that is, the reciprocating direction of the shutter 45. The second openings 442 are arranged side by side in the Y direction. In this manner, since the second opening portion 442 has a long shape in the X direction, it is also possible to deal with the case where the length of the pocket 421 of the jig plate 42 is changed in the X direction or the distance between the X directions is changed.

Further, the distance P3 between the Y-directions of the second opening portion 442 is set to be equal to the distance P2 between the recesses 421.

In addition, when the second opening 442 is focused on the second opening 442, the second opening 442 is disposed on each of the recesses 421 arranged in the X direction, and is viewed from the Z direction, and is included in the second opening 442. Each of the pockets 421 arranged in the X direction.

Further, a gap is formed between the second wall portion 441 and the replacement jig 42. Thereby, when dry air is supplied to the inside of the casing 44, the dry air flows into between the second wall portion 441 and the replacement jig plate 42, and the humidity around the IC element 90 can be lowered.

The interval d1 between the second wall portion 441 and the replacement jig 42 is not particularly limited and may be appropriately set depending on various conditions, but is preferably 4 mm or more and 20 mm or less, and more preferably 5 mm or more and 16 mm or less.

When the interval d1 is smaller than the lower limit value, when dry air is supplied to the inside of the casing 44 due to other conditions, the dry air becomes difficult to flow into the second wall portion 441 and Replace the jig plate 42 between. Moreover, even if the interval d1 is larger than the above upper limit value, the effect that the dry air easily flows between the second wall portion 441 and the replacement jig plate 42 cannot be expected to be improved, and the thickness of the temperature adjustment portion 12 becomes thick.

Further, the interval d1 is preferably larger than the interval d2 between the first wall portion 451 and the second wall portion 441 of the baffle 45 described below. Thereby, when dry air is supplied to the inside of the casing 44, the dry air can smoothly flow between the second wall portion 441 and the replacement jig plate 42, and the humidity around the IC element 90 can be reduced.

Further, the ratio d1/d2 of the interval d1 to the interval d2 is not particularly limited, and may be appropriately set depending on the conditions, but is preferably 1.6 or more and 16 or less, more preferably 2 or more and 4 or less.

When d1/d2 is less than the above lower limit, when dry air is supplied to the inside of the casing 44 due to other conditions, it is difficult for the dry air to flow between the second wall portion 441 and the replacement jig 42. Further, even if d1/d2 is larger than the above upper limit value, the effect that the dry air easily flows between the second wall portion 441 and the replacement jig plate 42 cannot be expected to be improved, and the thickness of the temperature adjustment portion 12 becomes thick.

Further, the shutter 45 is movably (displaceable) with respect to the base 3 in at least one direction in which the IC component 90 is placed. In the present embodiment, the shutter 45 is translated (moved) in the Y direction and reciprocated (reciprocated). That is, the direction in which the shutter 45 operates is the longitudinal direction of the temperature adjustment unit 12.

In addition, when the shape (outer shape) of the temperature adjustment unit 12 is a rectangular shape when viewed in the Z direction (in the plan view of the temperature adjustment unit 12), the long side of the rectangle (the side extending in the Y direction) ).

Here, the direction in which the IC element 90 is disposed includes concepts including directions in the plane in which the IC elements 90 are arranged, that is, directions in the XY plane, and includes not only the direction in which the IC elements 90 are arranged, It also includes the direction of crossing the above direction. Therefore, the operation (shifting) is performed in at least one direction of the IC element 90 to be arranged. The operation is performed in any direction in a plane including the direction in which the IC elements 90 are arranged.

Further, examples of the operation (shift) include translation (movement), rotation (rotation), and the like, and combinations thereof are also included.

Further, examples of the translation include, for example, straight traveling or traveling on a curved line, and also including a movement or a temporary interruption of the movement and a change of the traveling direction. As a specific example, for example, a case where the traveling direction is changed by 90° in a straight line and a reciprocating motion (reciprocating motion) or the like may be mentioned.

The baffle 45 has a hollow rectangular parallelepiped shape, and accommodates the casing 44, the temperature control plate 41, and the replacement jig plate 42 therein. Further, the space outside the baffle 45 is the first space 51, and the space inside the baffle 45 is the second space 52 different from the first space 51. Further, the space inside the casing 44 in the second space 52 is the third space 53. Therefore, the first wall portion 451 of the shutter 45 is disposed between the first space 51 and the second space 52, and the two are in contact with each other. Further, the casing 44, the temperature control plate 41, and the replacement jig plate 42 are disposed in the second space 52. Further, the humidity of the first space 51 and the second space 52 are different, and the humidity of the second space 52 is lower than the humidity of the first space 51. In other words, the humidity in the first space 51 is not managed, and the humidity in the second space 52 is controlled so as to be equal to or lower than the specific humidity. Thereby, in the case where the IC element 90 is cooled, dew condensation can be prevented from occurring in the IC element 90 by closing the shutter 45.

Further, as shown in FIG. 2 and FIG. 7, a plurality of first portions are formed in the upper wall portion of the baffle 45 in FIG. 2, that is, the first wall portion 451 opposed to the second wall portion 441 of the casing 44. Opening portion 452.

When viewed in the Z direction, the first opening portion 452 has a rectangular shape (rectangular shape). Further, the direction of the long side of the rectangle is the direction orthogonal to the X direction, that is, the direction in which the baffle 45 reciprocates, and the direction of the short side is the Y direction, that is, the reciprocating direction of the shutter 45. The first openings 452 are arranged side by side in the Y direction. In this manner, the first opening portion 452 has a shape that is long in the X direction, and therefore, it is also possible to deal with the replacement of the pocket 421 of the jig plate 42. The length in the X direction or the distance between the X directions is changed.

Further, the distance P1 between the Y directions of the first opening 452 is set to be twice the distance P2 between the pockets 421.

In addition, when the first opening 452 is placed on each of the pockets 421 arranged in the X direction, the first opening 452 is included in the first opening 452 as viewed from the Z direction. There are recesses 421 and second openings 442 that are arranged in the X direction.

Further, a gap is formed between the first wall portion 451 and the second wall portion 441. The distance d2 between the first wall portion 451 and the second wall portion 441 is not particularly limited, and may be appropriately set depending on various conditions, but is preferably 10 mm or less, more preferably 0.5 mm or more and 5 mm or less.

If the interval d2 is larger than the above upper limit value, there is a possibility that the blocking effect of the baffle 45 is lowered due to other conditions.

In addition, the driving source of the baffle 45 is not particularly limited, and examples thereof include various motors such as various cylinders and stepping motors.

Next, the operation of the shutter 45 will be described.

First, in a state in which the shutter 45 shown in FIG. 4 is closed (closed state), the first opening portion 452 of the shutter 45 is disposed in the two recesses 421 adjacent to the Y direction of the replacement fixture plate 42. Between the two second openings 442 adjacent to each other in the Y direction of the casing 44.

When the IC device 90 is housed in the recess 421 in a state where the shutter 45 is closed, the IC component 90 can be prevented from being exposed to a gas atmosphere of the unmanaged first space 51 such as humidity. Moreover, the dry air supplied to the inside of the casing 44 can be suppressed from being released from the second opening portion 442, and the humidity of the second space 52 can be easily managed.

In the present embodiment, the first opening 452 is partially overlapped with one of the recess 421 and the second opening 442 as viewed from the Z direction while the shutter 45 is closed. However, the present invention is not limited thereto. The first opening 452 is not overlapped with the pocket 421 and the second opening 442.

When the shutter 45 is opened from the state in which the shutter 45 is closed to be in the first open state (the state shown in FIGS. 2 and 8), as shown in FIGS. 2 and 8, the shutter is used. 45 is shifted toward the Y direction in the right side of FIG. 2 (the positive side in the Y direction) by 1/4 ‧ P1. Thereby, the first opening portion 452 of the shutter 45 is placed on the odd-numbered rows of the pockets 421 of the jig plate 42 and the second openings 442 of the odd-numbered rows of the casing 44. Thereby, the IC element 90 accommodated in the odd-numbered rows of the holes 421 can be taken out, or the IC element 90 can be accommodated in the odd-numbered rows of the holes 421. Further, the arrangement in the X direction is referred to as the above-described line, and the odd-numbered lines and the following even-numbered lines of the line are counted from the right side (the upper side in FIG. 8) in FIG.

On the other hand, when viewed in the Z direction, the first opening portion 452 does not overlap with the even-numbered rows of the holes 421 and the even-numbered second openings 442. Thereby, in the second opening portion 442 of the even-numbered rows, the flow of the gas is suppressed between the first space 51 and the second space 52 by the baffle 45. Thereby, the dry air supplied to the inside of the casing 44 can be suppressed from being released from the second opening portion 442 of the even rows. Further, when the IC element 90 is housed in the recesses 421 of the even rows, the IC element 90 accommodated in the recesses 421 of the even rows can be prevented from being exposed to the gas atmosphere of the unmanaged first space 51 such as humidity. in.

Then, when the shutter 45 is in the second open state (the state shown in FIGS. 3 and 9), as shown in FIGS. 3 and 9, the shutter 45 is oriented in the Y direction on the left side in FIG. The negative side of the direction) moves 1/2‧P1. Thereby, the first opening portion 452 of the shutter 45 is placed on the even hole 421 of the even-numbered row of the jig plate 42 and the second opening portion 442 of the even-numbered rows of the casing 44. Thereby, the IC component 90 housed in the recesses 421 of the even rows can be taken out, or the IC component 90 can be housed in the recesses 421 of the even rows.

On the other hand, when viewed in the Z direction, the first opening portion 452 does not overlap with the odd-numbered rows of the holes 421 and the odd-numbered second openings 442. Thereby, in the second opening portion 442 of the odd row, the flow of the gas between the first space 51 and the second space 52 can be suppressed by the baffle 45. Thereby, the dry air supplied to the inside of the casing 44 can be suppressed from the odd number The second opening portion 442 is released. Further, when the IC element 90 is housed in the recess 421 of the odd-numbered row, the IC element 90 accommodated in the odd-numbered row of holes 421 can be prevented from being exposed to the gas atmosphere of the unmanaged first space 51 such as humidity. in.

Then, when the shutter 45 is in the first open state, as shown in FIGS. 2 and 8, the shutter 45 is moved toward the right side (the positive side in the Y direction) in the Y direction in the Y direction by 1/2 ‧ P1 Then, when the shutter 45 is brought into the second open state, as shown in FIGS. 3 and 9, the shutter 45 is moved to the left side (the negative side in the Y direction) of FIG. 3 in the Y direction by 1/2‧ P1. The following is the same.

In this manner, the shutter 45 reciprocates in the Y direction during the opening and closing operation or the operation of switching between the first open state and the second open state. However, the shutter 45 switches between the first open state and the second open state. The one-way distance of the reciprocating motion during the operation is 1/2 of the distance P1 between the first opening portions 452. Therefore, the switching between the first open state and the second open state, the switching between the closed state and the first open state, and the switching between the closed state and the second open state can be quickly performed.

Next, the component recovery unit 18 and the baffle plate for the component recovery unit 18 will be described, but the description will be focused on the differences from the temperature adjustment unit 12, and the description of the same matters will be omitted.

As shown in FIGS. 10 and 11, the component collecting portion 18 is formed in a plate shape and is disposed on the susceptor 3 of the inspection apparatus 1 so as to be movable in the X direction. The shape of the component collecting portion 18 is not particularly limited. However, in the present embodiment, the outer shape of the component collecting portion 18 is rectangular when viewed from the Z direction (in the plan view of the component collecting portion 18). Further, the direction of the long side of the rectangle is the X direction, and the direction of the short side is the Y direction.

Further, on the upper surface of the element collecting portion 18, that is, on the surface opposite to the susceptor 3, a recess (electronic component arranging portion) 181 that accommodates (arranges) a plurality of recesses of the IC component 90 is formed. Each of the IC elements 90 is housed in each of the pockets 181, and is disposed in the component collecting portion 18.

The shape, size (size) and configuration (position) of each pocket 181 are based on inspection The shape, size (dimension) of the IC element 90, or the arrangement (position) of each of the holding portions of the third element transfer head 20 is set.

Further, the outer shape of the recess 181 has a shape corresponding to the outer shape of the IC element 90, and in the present embodiment, it has a square shape (quadrilateral shape). Further, each of the pockets 181 is arranged in a matrix.

Further, a plate 61 having a plate shape and having a plurality of second openings 611 and a baffle 62 having a plurality of first openings 621 in a plate shape are disposed on the susceptor 3 in the component collection region A4.

The plate 61 is disposed above the component collecting portion 18 when the component collecting portion 18 is disposed in the component collecting region A4.

Further, a gap is formed between the plate 61 and the component collecting portion 18. The interval d3 between the plate 61 and the element collecting portion 18 is not particularly limited and may be appropriately set according to various conditions. However, the preferred value is the same as the interval d1 of the first embodiment.

Further, each of the second openings 611 is disposed in the same manner as each of the pockets 181. In other words, when the component collection portion 18 is disposed in the component collection region A4, each of the second openings 611 is disposed in each of the pockets 181. Therefore, the distance between the X direction and the Y direction of the second opening 611 is set to be equal to the distance between the X direction of the pocket 181 and the Y direction.

Further, when viewed from the Z direction, the outer shape of the second opening portion 611 has a shape corresponding to the recess 181, and in the present embodiment, it has a square shape (quadrilateral shape). In the state in which the second opening 611 is placed on the recess 181, the second opening 611 includes the recess 181 as viewed in the Z direction.

The baffle 62 is disposed above the plate 61. Further, the shutter 62 is movably (displaceable) with respect to the plate 61 in at least one direction in which the IC component 90 is disposed. In the present embodiment, the shutter 62 is translated (moved) in the Y direction and reciprocated (reciprocated). One example of a mechanism for pivotally supporting the above-described baffle 62 is as follows.

First, the four sliding members 63 are fastened to the four corners of the plate 61 by bolts 64. Further, the sliding member 63 may be fixed or rotated.

Further, the sliding member 63 is composed of a pair of large diameter portions 631 and 632 and a small diameter portion 633 disposed between the large diameter portion 631 and the large diameter portion 632. The material of the sliding member 63 is not particularly limited, and is preferably a material having a small friction with respect to the baffle 62, and examples thereof include various resin materials such as a fluorine-containing resin. Further, the sliding member 63 may have a layer formed of a material having a small friction with respect to the baffle 62 on its surface.

On the other hand, at the four corners of the baffle 62, a long hole 622 which is long in the Y direction is formed. Further, each of the sliding members 63 is inserted into each of the long holes 622. In other words, a baffle 62 is disposed between the large diameter portion 631 and the large diameter portion 632 of each of the sliding members 63. Thereby, the baffle 62 is translatably supported by the respective sliding members 63.

Further, a gap is formed between the baffle 62 and the plate 61. The interval d4 between the baffle 62 and the plate 61 is not particularly limited and may be appropriately set according to various conditions, but a preferred value is the same as the interval d2 of the first embodiment. Further, the relationship between the interval d3 and the interval d4 is the same as that of the first embodiment. In this case, the interval d1 and the interval d3 of the first embodiment can be replaced, and the interval d2 and the interval d4 of the first embodiment can be performed. Replacement.

Further, each of the first openings 621 is disposed in the same manner as each of the pockets 181. In other words, the distance between the X-direction and the Y-direction of the first opening 621 is set to be equal to the distance between the X-direction of the pocket 181 and the Y-direction.

Further, when viewed from the Z direction, the shape of the first opening portion 621 has a shape corresponding to the recess 181 and the second opening portion 611, and in the present embodiment, it has a square shape (quadrilateral shape). In the state in which the first opening 621 is placed on the recess 181, the first opening 621 includes the recess 181 and the second opening 611 as viewed in the Z direction.

Further, the upper space of the baffle 62 in FIG. 11 is the first space 51, and the space on the lower side of the baffle 62 in FIG. 11 is the second space 52, and the baffle 62 is connected to the first space 51 and the first space. 2 spaces 52 are connected. Further, the plate 61 and the component collecting portion 18 are disposed in the second space 52.

Next, the operation of the shutter 62 will be described.

First, when the shutter 62 is opened from the state in which the shutter 62 shown in FIGS. 10 and 11 is closed, the shutter 62 is oriented toward the lower side in the Y direction (the positive side in the Y direction). Move 1/2‧P1. Thereby, the first opening portion 621 of the shutter 62 is disposed on the recess 181 of the component collecting portion 18 and the second opening portion 611 of the plate 61. Thereby, the IC element 90 housed in the cavity 181 can be taken out, or the IC element 90 can be accommodated in the pocket 181.

Further, when the shutter 62 is closed, the shutter 62 is moved by 1/2‧P1 toward the upper side (the negative side in the Y direction) of FIG. 10 in the Y direction. As a result, as shown in FIG. 10 and FIG. 11, the first opening 621 of the shutter 62 is retracted from the recess 181 of the component collecting portion 18 and the second opening 611 of the plate 61, and is viewed from the Z direction. The opening 621 does not overlap the recess 181 and the second opening 611. Thereby, the flow of the gas is suppressed between the first space 51 and the second space 52 by the baffle 62.

In this manner, the shutter 62 reciprocates in the Y direction during the opening and closing operation, but the distance of the single stroke of the reciprocating motion of the shutter 62 is 1/2 of the distance P1 between the first openings 621. Therefore, the shutter 62 can be quickly opened and closed.

Further, the component supply region A2, the inspection region A3, and the component collection region A4 are communicated by a tunnel (not shown), and the component supply portion 14 and the component recovery portion 18 move in the tunnel, and dry air flows into the tunnel. Inside the tunnel. Therefore, the drying air can be suppressed from being released from the second opening portion 611 of the plate 61 by closing the shutter 62.

Further, in the present embodiment, the shutter 45 of the temperature adjustment unit 12 is configured such that the second opening 442 (the pocket 421) of the odd rows and the second opening 442 (the pocket 421) of the even rows can be formed. Only one of them is turned off, and only the other is turned on. However, the present invention is not limited thereto. For example, all of the second openings 442 may be simultaneously opened and closed. That is, the baffle 45 can It is configured similarly to, for example, the baffle 62.

Further, in the present embodiment, the distance P1 between the Y-directions of the first opening 452 of the baffle 45 is set to be twice the distance P2 between the recesses 421 of the jig plate 42, but the present invention is not limited thereto. The pitch P1 is set to n times the pitch P2 (n is a natural number).

Further, in the present embodiment, the shutter 62 of the component collecting portion 18 is provided separately from the component collecting portion 18. However, the component collecting portion 18 may have a shutter.

Further, the component supply unit 14 may be provided with a baffle or a baffle. In the case where the baffle is provided, it can be configured in the same manner as in the case of the above-described component collecting portion 18.

<Second embodiment>

Fig. 12 is a plan view showing a casing of a temperature adjustment unit according to a second embodiment of the electronic component inspection device of the present invention. Fig. 13 is a plan view showing a shutter of a temperature adjustment unit according to a second embodiment of the electronic component inspection device of the present invention.

In the following, the second embodiment will be described, but the differences from the above-described first embodiment will be mainly described, and the same matters will not be described.

In the inspection apparatus 1 of the second embodiment, the shape of the second opening 442 of the casing 44 of the temperature adjustment unit 12 and the first opening 452 of the shutter 45 are different from those of the first embodiment described above, and the first embodiment The shape is the same.

As shown in FIG. 12, each of the second opening portions 442 of the casing 44 is disposed in the same manner as each of the pockets 421 of the replacement jig plate 42. In other words, each of the second openings 442 is disposed on each of the pockets 421. Therefore, the distance between the X direction of the second opening 442 and the distance P3 between the Y directions are set to be equal to the distance P2 between the X direction of the pocket 421 and the Y direction.

Further, when viewed from the Z direction, the second opening portion 442 has a shape corresponding to the recess 421, and in the present embodiment, it has a square shape (quadrilateral shape). Further, the second opening portion 442 includes a recess 421 as viewed in the Z direction.

Further, as shown in FIG. 13, the first opening 452 of the shutter 45 has a shape corresponding to the recess 421 and the second opening 442 of the jig plate 42 as viewed from the Z direction. In the present embodiment, a square (quadrilateral) is presented. In the state in which the first opening 452 is placed on the recess 421, the first opening 452 includes the recess 421 and the second opening 442 as viewed in the Z direction.

In this manner, the first opening portion 452 has a shape corresponding to the recess 421 and the second opening portion 442. Therefore, when the IC element 90 is housed in the recess 421, the block is blocked as compared with the first embodiment. When the plate 45 is closed, the gas atmosphere in which the IC element 90 is exposed to the first space 51 can be suppressed, and the dry air supplied to the inside of the casing 44 can be suppressed from being released from the second opening portion 442, and can be easily managed. The humidity of the second space 52.

Further, the distance between the X directions of the first openings 452 is set to be equal to the distance between the X directions of the recesses 421, and the distance between the Y directions of the first openings 452 is set to be the distance between the Y directions of the recesses 421. Times.

According to the second embodiment described above, the same effects as those of the first embodiment described above can be exerted.

In addition, the combination of the baffle 45 and the casing 44 is not limited to the second embodiment and the first embodiment. For example, the baffle 45 of the first embodiment may be combined with the casing of the second embodiment. The baffle plate 45 of the second embodiment may be combined with the casing of the first embodiment.

<Third embodiment>

In the following, the third embodiment will be described, but the differences from the above-described first embodiment will be mainly described, and the same matters will not be described.

In the inspection apparatus 1 of the third embodiment, the shutter 45 of the temperature adjustment unit 12 can be replaced, and can be replaced with another type or the same type as needed.

Specifically, the baffle 45 can be replaced with at least one different shape, size (size) and position (position) of the first opening 452, and in particular, can be replaced with the size and position of the first opening 452. At least one of the different baffles. Further, the size of the first opening 452 of the shutter 45 is set based on the size of the IC component 90. Furthermore, the baffle 45 is based on For example, the shape, size (size) of the IC device 90 to be inspected, or the arrangement (position) of each of the holding portions of the first element transfer head 13 is replaced with a baffle corresponding thereto.

Further, the baffle 45 may be replaced as a whole or a part thereof may be replaced. When one of the flaps 45 can be replaced, for example, the first wall portion 451 of the flap 45 can be replaced.

In the case where the first wall portion 451 of the baffle 45 is replaceable, the method of fixing the first wall portion 451 is not particularly limited, and examples thereof include screwing and adsorption by a magnet.

According to the third embodiment described above, the same effects as those of the first embodiment described above can be exerted.

Moreover, since the shutter 45 can be replaced, it can correspond to IC components 90 of various sizes.

Further, by replacing the first wall portion 451 of the shutter 45, the replacement work can be made easier, and the cost required for the preparation of the replacement member can be reduced as compared with the case where the entire wall portion 451 can be replaced. .

Further, the third embodiment can also be applied to the second embodiment described above.

Further, in the present embodiment, the case where the shutter 45 of the temperature adjustment unit 12 is replaceable has been described as an example. However, the housing 44 may be replaced, and the shutter 45 and the housing 44 may be replaced. It can also be replaced.

Further, either or both of the shutter 62 and the plate 61 of the component collecting portion 18 may be replaced.

Further, when the baffle and the plate of the component supply unit 14 are provided, either or both of the baffle plate and the plate may be replaced.

<Fourth embodiment>

Fig. 14 is a view for explaining the operation of the fourth embodiment of the electronic component inspection device of the present invention. Figure 15 is a view showing a fourth embodiment of the electronic component inspection device of the present invention Flow chart of the control action.

In the following, the fourth embodiment will be described, but the differences from the above-described first embodiment will be mainly described, and the same matters will not be described.

The inspection apparatus 1 of the fourth embodiment is configured to open the shutter when the conveying member moves toward the placement member. This control can also be applied to any of the shutter 45 of the temperature adjustment unit 12, the shutter 62 of the component recovery unit 18, and the shutter of the component supply unit 14. Hereinafter, a case where the above control is applied to the shutter 45 of the temperature adjustment unit 12 will be representatively described. In this case, the first element transfer head 13 transports the IC element 90 disposed on the tray 200 to the temperature adjustment unit 12, and the IC element 90 disposed in the temperature adjustment unit 12 by the first element transfer head 13 In the case of transporting to the component supply unit 14, the case where the IC component 90 disposed on the tray 200 is transported to the temperature adjustment unit 12 will be described below.

As shown in FIG. 14, the inspection apparatus 1 of the fourth embodiment is controlled by the control unit 80 when the first component transfer head 13 transports the IC component 90 disposed on the tray 200 to the temperature adjustment unit 12. When the component transfer head 13 moves toward the replacement jig 42 of the temperature adjustment unit 12, the shutter 45 is opened. Further, based on the position at which the first component transporting head 13 starts moving toward the replacement jig 42 of the temperature adjusting unit 12 (for example, the total moving distance of the first component transporting head 13), the operation of opening the shutter 45 is started. time.

Here, for example, if the shutter 45 is opened before the first component transporting head 13 starts moving from the position of the tray 200, the time during which the shutter 45 is opened becomes long, and during this period, the dry air is supplied from the temperature adjusting portion 12 In addition, when the first element transfer head 13 reaches the temperature adjustment unit 12 and then the shutter 45 is opened, the time required for the transfer of the IC element 90 becomes long. However, in the present embodiment, when the first element transfer head 13 is moved toward the replacement jig 42 of the temperature adjustment unit 12, the shutter 45 can be opened while suppressing the release of dry air from the temperature adjustment unit 12. Shorten the need for transport of IC component 90 Time.

Further, the position of the tray 200 is a position at which the first element transfer head 13 starts moving (moving start position), and the position of the temperature changing unit 12 where the jig plate 42 is replaced is a position at which the first element transfer head 13 ends moving (moving) End position).

Further, each of the movement start position and the movement end position may be, for example, a position in the XY plane, or may include a position in the Z direction. However, the position of the position in the XY plane is representative. Description.

Similarly, the moving distance and the total moving distance of the first element transfer head 13 described below may be, for example, a moving distance and a total moving distance in the XY plane, and may further include a moving distance in the Z direction and a total moving distance, but Hereinafter, a case where the moving distance and the total moving distance in the XY plane are set will be representatively described.

First, the time during which the operation of opening the shutter 45 is started is not particularly limited as long as the movement of the first element transfer head 13 is performed. However, in the present embodiment, as shown in FIG. When the moving distance from the movement start position of the element transfer head 13 is smaller than the specific value A of the total movement distance from the movement start position to the movement end position of the first element transfer head 13,

The specific value A described above may be predetermined as a fixed value or may be determined based on a specific condition. Furthermore, the specific value A may be defined as, for example, a relative value with respect to the total moving distance.

When the specific value A is predetermined as a fixed value, there is an advantage that the control is simple. Further, for example, when the total moving distance from the movement start position to the movement end position of the first element transfer head 13 is fixed and the speed at which the shutter 45 is opened is fixed, the error is small, which is effective.

Further, the specific value A is preferably set within a range of 60% or more and 95% or less of the total moving distance, and more preferably set to a range of 80% or more and 95% or less.

If the specific value A is less than the above lower limit, the first component is due to other conditions. Before the transfer head 13 sufficiently approaches the end position of the movement, the shutter 45 is opened, so that the time during which the shutter 45 is opened becomes long.

Further, when the specific value A is larger than the upper limit value, the first element transfer head 13 reaches the movement end position before the shutter 45 is completely opened due to other conditions, and the time required for the transfer of the IC element 90 becomes changed. long.

In the case where the specific value A is determined based on the specific condition, the specific condition, for example, the moving speed, the movement start position, the movement end position, and the total movement distance of the first element transfer head 13 are exemplified. In this case, for example, when the movement distance of the first element transfer head 13 is a specific value A, when the operation of the opening shutter 45 is started, when the shutter 45 is opened, the first component conveying head 13 is opened. In a manner of moving to the movement end position or the movement end position slightly before, the calibration curve for determining the table or calculation formula of the specific value A is obtained in advance, and is stored in advance in the memory unit (not shown) of the control unit 80. in. Further, when the first element transfer head 13 is moved and the shutter 45 is opened, the control unit 80 reads the calibration curve from the memory unit, and obtains the specific value A based on the calibration curve and the specific condition. Therefore, for example, even when the moving speed, the movement start position, the movement end position, the total movement distance, and the like of the first element transfer head 13 are different, the exact value can be obtained as the specific value A.

Next, a case will be described, and a control operation of the control unit 80 when the shutter 45 is opened will be described based on FIG. 15 .

As shown in FIG. 15, first, the jig plate 42 is replaced from the tray 200 toward the temperature adjustment unit 12, and the first element transfer head 13 starts moving (step S101).

Then, the moving distance of the first element transfer head 13 is detected (step S102). Since the control unit 80 has grasped the position of the first element transfer head 13, the above-described moving distance can be obtained without performing special detection.

Then, it is judged whether the moving distance of the first component transporting head 13 reaches 90% of the total moving distance (step S103), and it is judged that the moving distance does not reach 90% of the total moving distance. In the case of the shape, the process returns to step S102, and the steps subsequent to step S102 are performed again.

Further, when it is determined in step S103 that the moving distance has reached 90% of the total moving distance, the operation of opening the shutter 45 is started (step S104). Hereinafter, the shutter 45 is completely opened, so that the IC component 90 is housed in the recess 421 of the replacement jig plate 42.

According to the fourth embodiment described above, the same effects as those of the first embodiment described above can be exerted.

Further, the fourth embodiment can also be applied to the second and third embodiments described above.

Although the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention have been described above based on the embodiments shown in the drawings, the present invention is not limited thereto, and the configuration of each portion may be replaced by any one having the same function. Further, any other constituents may be added.

Furthermore, the present invention may be a combination of any two or more of the above-described configurations (features).

Further, in the above embodiment, the plurality of openings are formed in the baffle plate. However, the present invention is not limited thereto, and the opening portion may be omitted, for example.

3‧‧‧Base

12‧‧‧Temperature adjustment unit (soaking plate)

41‧‧‧ Temperature Control Board

42‧‧‧Replace the fixture board

421‧‧‧ recess

43‧‧‧ bracket

44‧‧‧ housing

45‧‧‧Baffle

51‧‧‧1st space

52‧‧‧Second space

53‧‧‧3rd space

90‧‧‧IC components

441‧‧‧2nd wall

442‧‧‧2nd opening

451‧‧‧1st wall

452‧‧‧1st opening

D1~d2‧‧‧ interval

Claims (18)

An electronic component conveying apparatus comprising: a first space; a second space different from the first space; and an arrangement member disposed in the second space and configured with a plurality of electronic components; and a baffle The operation is performed in at least one direction in which the electronic component is disposed, and is in contact with the first space and the second space; and the plurality of first openings are provided in the baffle. The electronic component transporting apparatus of claim 1, wherein one of the baffles is in contact with the first space, and the other surface of the baffle is in contact with the second space. The electronic component conveying apparatus according to claim 1 or 2, wherein the direction in which the shutter operates is a longitudinal direction of the arrangement member. The electronic component transport apparatus according to claim 1 or 2, wherein the first space and the second space have different humidity. The electronic component transport apparatus of claim 1 or 2, wherein the humidity of the second space is lower than the humidity of the first space. The electronic component conveying apparatus according to claim 1 or 2, comprising an opening member disposed between the baffle and the arrangement member and having a plurality of second openings. The electronic component transporting apparatus of claim 6, wherein a distance between the opening member and the disposition member is larger than a distance between the opening member and the baffle. An electronic component transporting apparatus according to claim 1 or 2, comprising a sliding member that operatively supports said baffle. The electronic component transporting device of claim 1 or 2, wherein the action of the baffle is translation. The electronic component transporting apparatus according to claim 1 or 2, wherein the baffle plate is replaceable with a baffle having at least one of a size of the first opening and a position of the first opening. The electronic component transport apparatus of claim 10, wherein the size of the first opening is set based on a size of the electronic component. The electronic component transporting apparatus according to claim 1 or 2, wherein a distance between the plurality of first openings is twice as large as a distance between the plurality of electronic component placement portions provided in the arrangement member and the electronic component. The electronic component transporting apparatus according to claim 1 or 2, wherein the baffle is reciprocally movable, and a distance of the one-way reciprocation of the baffle is 1/2 of a distance between the first openings. The electronic component transporting apparatus according to claim 1 or 2, further comprising: a transporting member that can transport the electronic component, and opening the shutter when the transporting member moves toward the disposition member. The electronic component conveying apparatus of claim 14, wherein the time for starting the operation of opening the shutter is set based on a position at which the conveying member starts moving toward the arrangement member. The electronic component transporting apparatus of claim 14, wherein the movement of the transporting member is started to move toward the transporting member, and the moving distance of the transporting member is smaller than the transporting member to move to the configuration. When the total moving distance of the component is a specific value. The electronic component transport apparatus of claim 16, wherein the specific value is set within a range of 60% or more and 95% or less of the total moving distance. An electronic component inspection device comprising: a first space; a second space different from the first space; a arranging member disposed in the second space and disposed with a plurality of electronic components; the baffle operable in at least one direction in which the electronic component is disposed, and is in contact with the first space and the second space And an inspection unit that inspects the electronic component; and the shutter is provided with a plurality of openings.