TWI646340B - Electronic component conveying device and electronic component inspection device - Google Patents

Abstract

An object of the present invention is to provide an electronic component conveying apparatus and an electronic component inspection apparatus which can uniformly cool an electronic component on a cooling member. The electronic component inspection device 1 has a temperature adjustment unit 12 that is a cooling member that cools electronic components. The temperature adjustment unit 12 includes a first flow path 37 through which the refrigerant RF flows, and a second flow path 38 that communicates with the first flow path 37 and that supplies the refrigerant RF. Further, when the temperature adjustment unit 12 is viewed in plan, the first flow path 37 is disposed to surround one of the second flow paths 38.

Description

Electronic component conveying device and electronic component inspection device

The present invention relates to an electronic component conveying device and an electronic component inspection device.

An electronic component inspection apparatus for inspecting electrical characteristics of an electronic component such as a semiconductor component has been known. In the electronic component inspection apparatus, the electronic component is preliminarily held in the process of transporting the electronic component to the inspection section. The plate of the desired temperature.

For example, in the electronic component inspection device described in Patent Document 1, the cooling plate has a flow groove formed by 蜿蜒 (which is a continuous S shape). Further, the liquid nitrogen is supplied to the flow cell to cool the electronic component on the cooling plate.

Further, in the electronic component inspection device described in Patent Document 1, when the above-described cooling plate and the heating plate for heating the electronic component to a desired temperature are incorporated, the heating plate is heated by energization. The heater is superposed on the cooling plate so that the heating plate is disposed closer to the electronic component than the cooling plate.

In the electronic component inspection device, the electronic component is cooled in the chamber and the electronic component is inspected (see, for example, Patent Document 2). In the electronic component inspection apparatus described in Patent Document 2, a low-temperature cooling gas is supplied to the chamber.

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-194874

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2008-107014

However, in the electronic component inspection apparatus described in Patent Document 1, since the cooling plate has a tendency to enter and exit with heat more than the outer peripheral portion of the center portion, the liquid nitrogen is supplied to the cooling plate only by the flow channel of the crucible. It is impossible to perform uniform cooling on the top.

Further, in the electronic component inspection apparatus described in Patent Document 1, when the heater is energized, the heating plate that generates heat quickly is located closer to the electronic component, so that the electronic component can be rapidly heated by the heat. . On the other hand, the liquid nitrogen flowing down in the flow cell of the cooling plate is usually supplied from a storage tank provided outside the electronic component inspection device, so that the cooling capacity is lowered before reaching the cooling plate, and further, the cooling plate is relatively Since the electronic component is located farther than the heating plate, it is difficult to rapidly cool the electronic component.

Therefore, when the thermal efficiency (energy loss) of the cooling plate and the heating plate is compared, the thermal efficiency of the cooling plate is lower than that of the heating plate, that is, the energy loss tends to be high, and it is difficult to perform cooling efficiently.

Further, in the electronic component inspection device described in Patent Document 2, since the low-temperature cooling gas is a gas, the thermal conductivity is extremely low as compared with, for example, metal or water. Therefore, in the electronic component inspection apparatus described in Patent Document 1, for example, when an electronic component held at a normal temperature is carried into the chamber, the electronic component cannot be sufficiently cooled and cooled by the low-temperature cooling gas. State problem.

The present invention has been completed in order to solve at least a part of the above problems, and can be used as The next one is realized.

[Application Example 1]

The electronic component conveying apparatus according to the application example includes a cooling member that cools the electronic component, and the cooling member includes a first flow path through which the refrigerant flows, and a second flow path that communicates with the first flow path. The refrigerant flows out; and when the cooling member is viewed in a plan view, the first flow path is disposed to surround one of the second flow paths.

Thereby, the temperature of the refrigerant flowing down the first flow path located outside is lower than the temperature of the refrigerant flowing down the second flow path inside the first flow path. Therefore, even if the cooling member has a tendency that the heat of the outer peripheral portion is more likely to enter and exit the center portion, the cooling function can be prevented from lowering in the first flow path, and the cooling function can be sufficiently exhibited. Therefore, the electronic component can be uniformly cooled on the cooling member.

[Application Example 2] In the electronic component conveying apparatus of the application example, it is preferable that the cooling member has a first side, a second side, a third side, and a fourth side, and the first side and the second side are And on the third side, when the cooling member is viewed in plan, the first flow path is disposed on the outer side of the second flow path.

Thereby, the temperature of the refrigerant flowing down the first flow path located outside is significantly lower than the temperature of the refrigerant flowing down the second flow path inside the first flow path. Therefore, even if the cooling member is more likely to have heat entering and leaving the outer peripheral portion than the center portion, it is preferable to prevent the cooling function from being lowered in the first flow path, and the cooling function can be more sufficiently exhibited. Therefore, on the cooling member, the electronic component can be more uniformly cooled.

[Application Example 3] In the electronic component conveying apparatus of the application example, preferably, the first side faces the second side, and the third side faces the fourth side.

Thereby, the cooling member has a relatively simple outer shape, and therefore, from the metal plate When the base material is machined to obtain a cooling member, the machining can be easily performed.

[Application Example 4] In the electronic component conveying apparatus of the application example, preferably, the cooling member has a rectangular shape, and has the first side, the second side parallel to the first side, and the first side The third side intersecting with the third side and the fourth side parallel to the third side, wherein the fourth side is provided with an inflow port through which the refrigerant flows into the first flow path, and an outflow port for the above The refrigerant flows out from the second flow path.

Thereby, the inflow port can be placed as close as possible to the outflow port. Therefore, the supply of the refrigerant to the cooling member and the discharge of the refrigerant can be performed using, for example, one manifold joint.

[Application Example 5] In the electronic component conveying apparatus of the application example, it is preferable that a length of the first side and the second side is longer than a length of the third side and the fourth side.

Thereby, since the cooling member has a relatively simple outer shape, the machining can be easily performed when the cooling member is obtained by mechanical processing from the base material of the metal plate.

[Application Example 6] In the electronic component conveying apparatus of the application example, it is preferable that a portion where the first flow path and the second flow path are connected is disposed on the fourth side of the third side.

Thereby, the entire length of the first flow path can be ensured to be as long as possible, thereby contributing to uniform cooling of the electronic component.

[Application Example 7] In the electronic component conveying apparatus of the application example, it is preferable to have the two cooling members, and the fourth side of the cooling member and the cooling member of the other one of the cooling members 4 sides are aligned.

Thereby, a manifold joint that supplies the refrigerant to the refrigerant and discharges the refrigerant once for each of the cooling members can be disposed inside the cooling member and the other of the cooling members.

[Application Example 8] In the electronic component conveying apparatus of the application example, the first stream is preferably the first stream The road is arranged side by side with a part of the second flow path described above.

Thereby, the cooling member itself also becomes uniform in overall temperature, thereby contributing to uniform cooling of the electronic component.

[Application Example 9] In the electronic component conveying apparatus of the application example, it is preferable that the inner surface of the cooling member has a third flow path through which the refrigerant flows into the first flow path, and the second flow path from the second The fourth flow path into which the refrigerant flowing out of the flow path flows.

Thereby, since the arrangement direction of the third flow path and the fourth flow path can be set to the same direction, it is easy to make the piping of the tubes constituting each flow path.

[Application Example 10] In the electronic component conveying apparatus of the application example, it is preferable that the cooling member is a heat equalizing plate that preliminarily cools the electronic component before inspection.

Thereby, the cooling can be uniformly performed when the electronic component is previously cooled on the soaking plate before the inspection.

[Application Example 11] In the electronic component conveying apparatus of the application example, the cooling member is preferably a shuttle plate that can be moved by the driving unit and can transport the electronic component.

Thereby, the cooling can be uniformly performed while cooling the electronic component by the shuttle.

[Application Example 12] An electronic component inspection apparatus according to an application example of the invention includes a cooling member that cools an electronic component, and the cooling member includes a first flow path through which a refrigerant flows, and a second flow path that is different from the first The flow path is connected to the refrigerant, and the refrigerant flows out; and the inspection unit checks the electronic component; and when the cooling member is viewed in plan, the first flow path surrounds one of the second flow paths.

Thereby, the temperature of the refrigerant flowing down in the first flow path on the outer side is lower than the temperature of the refrigerant flowing down in the second flow path on the inner side of the first flow path. Therefore, even if the cooling member is In the case where there is a tendency that the heat of the outer peripheral portion is more likely to enter and exit than the center portion, the cooling function can be prevented from being lowered in the first flow path, and a sufficient cooling function can be exhibited. Therefore, the electronic component can be uniformly cooled on the cooling member.

[Application Example 13] The electronic component transport apparatus according to the application example of the present invention includes an electronic component mounting member that can be disposed with an electronic component, and a cooling member that can mount the electronic component mounting member and cool the electronic component And a heating member that heats the electronic component; and the cooling member is disposed between the electronic component mounting member and the heating member.

When the thermal efficiency (energy loss) of the cooling member and the heating member is compared with respect to the electronic component, the thermal efficiency of the cooling member is lower than that of the heating member, that is, the energy loss is high. In this case, the cooling member is disposed between the electronic component mounting member and the heating member, that is, the cooling member having a high energy loss is disposed at a relatively close position with respect to the electronic component, thereby causing energy loss. The lower heating member is disposed further away from the cooling member, whereby cooling and heating of the electronic component can be performed rapidly, respectively.

[Application Example 14] In the electronic component conveying device according to the application example 13, it is preferable that the cooling member is formed by laminating a first member and a second member.

Thereby, a groove is formed in a surface of the first member facing the second member or a surface of the second member facing the first member or both surfaces, and the groove can be used as a fluid for cooling as a refrigerant, for example. Use it for the flow. Therefore, it is possible to omit the separate members that constitute the flow path, and it is possible to make the cooling member simple.

In the electronic component conveying apparatus according to the application example 14, the cooling member has a flow path through which a fluid as a refrigerant flows, and the flow path is formed in the first member. The fluid passes through the groove.

Thereby, the member constituting the flow path can be omitted, and therefore, the cooling member can be Set as a simple constructor.

[Application Example 16] In the electronic component conveying device according to the application example 15, it is preferable that a sealing member that maintains liquid-tightness or airtightness between the first member and the second member is disposed.

Thereby, it is possible to prevent the liquid flowing down from the flow path from leaking between the first member and the second member.

In the electronic component conveying apparatus described in any one of the above-mentioned application examples 14 to 16, the second member is preferably disposed between the first member and the heating member.

In this case, when the electronic component is heated, the second member functions as a heat storage unit that temporarily stores the heat generated by the heating member. Therefore, the electronic component that is transported one by one can be stably heated continuously. .

In the electronic component conveying apparatus described in any one of the above-mentioned application examples 14 to 17, it is preferable that the thickness of the second member is thicker than the thickness of the first member.

Thereby, even if the first member is bent, the bending can be eliminated regardless of the magnitude of the bending.

In the electronic component conveying apparatus described in any one of the above-mentioned application examples 13 to 18, it is preferable that the cooling member is cooled by a fluid.

Thereby, for example, liquid nitrogen can be used as the fluid for cooling. Liquid nitrogen has a high cooling efficiency (cooling capacity) and is therefore suitable for use in cooling of electronic components.

[Application Example 20] In the electronic component conveying device according to the application example 19, preferably, the cooling member has a flow path through which the fluid flows.

Thereby, for example, liquid nitrogen can be used as the fluid for cooling. And according to the flow path The formation state allows liquid nitrogen to flow through the entirety of the cooling member, effectively cooling a plurality of electronic components.

[Application Example 21] The electronic component inspection apparatus according to the application example of the present invention includes an electronic component mounting member that can be disposed with an electronic component, and a cooling member that can mount the electronic component mounting member and cool the electronic component a heating member that heats the electronic component; and an inspection unit that inspects the electronic component; and the cooling member is disposed between the electronic component mounting member and the heating member.

When the thermal efficiency (energy loss) of the cooling member and the heating member is compared with respect to the electronic component, the thermal efficiency of the cooling member is lower than that of the heating member, that is, the energy loss is high. In this case, the cooling member is disposed between the electronic component mounting member and the heating member, that is, the cooling member having a high energy loss is disposed at a relatively close position with respect to the electronic component, thereby causing energy loss. The lower heating member is disposed at a position further away from the cooling member, and the cooling and heating of the electronic component can be performed quickly.

[Application Example 22] The electronic component transport apparatus according to the application example of the present invention includes: a first mounting portion that mounts an electronic component; and a second mounting portion that mounts the electronic component; and the first mounting The second flow path has a first flow path through which a refrigerant that can cool the liquid of the electronic component passes, and the second load portion has a second flow path through which a refrigerant that can cool the gas of the electronic component passes.

In this case, for example, when the electronic component is inspected for electrical characteristics, the electronic component is first placed in the first mounting portion through which the liquid refrigerant passes, and is rapidly cooled in the middle of the conveyance at the inspection position. Thereby, the electronic parts are quickly tempered to an inspection temperature suitable for inspection. Thereafter, the electronic component is placed on the second placing portion through which the refrigerant for supplying the gas passes. Thereby, the second placing unit maintains the state of being tempered to the inspection temperature, and is transported to the inspection position. Set.

[Application Example 23] In the electronic component conveying device according to the application example 22, it is preferable that the liquid refrigerant is a fluorine-based refrigerant.

Thereby, when the electronic component is inspected at an inspection temperature lower than the normal temperature and lower temperature, the electronic component at normal temperature can be quenched to the vicinity of the inspection temperature.

[Application Example 24] In the electronic component conveying apparatus described in the application example 23, it is preferable that the fluorine-based refrigerant is VERTREL SINERA (registered trademark).

Therefore, as the fluorine-based refrigerant, those having a small greenhouse effect coefficient, high versatility, and easy availability can be used.

[Application Example 25] In the electronic component conveying apparatus described in any one of the application examples 22 to 24, the gas refrigerant is preferably dry air.

In this case, when the refrigerant of the gas is used in the second mounting portion to cool the electronic component and then used in the space of the electronic component conveying device, dew condensation is prevented from occurring in the space.

In the electronic component conveying apparatus described in any one of the above-mentioned application examples 22 to 25, it is preferable that the specific heat of the refrigerant of the gas is smaller than the specific heat of the refrigerant of the liquid.

Thereby, for example, air can be used as the refrigerant of the gas, and in this case, the cost is not required, and the operation cost of the electronic component conveying device is suppressed.

In the electronic component conveying apparatus described in any one of the above-mentioned application examples 22 to 26, preferably, the temperature of the refrigerant in the second flow path is lower than the temperature in the first flow path. The temperature of the liquid refrigerant.

Thereby, even if the specific heat of the refrigerant of the gas is smaller than the specific heat of the liquid refrigerant, the temperature of the refrigerant of the gas in the second flow path is set to be lower than the temperature of the liquid in the first flow path. At the temperature of the medium, the electronic component can be properly cooled by the refrigerant of the gas.

[Application Example 28] The electronic component transport apparatus according to the application example of the present invention includes the first mounting portion that mounts the electronic component and that cools the electronic component, and the second mounting portion that mounts the electronic component And cooling the electronic component; and the cooling capacity of the first mounting portion is higher than the cooling capacity of the second mounting portion.

In this case, for example, when the electronic component is inspected for electrical characteristics, the electronic component is first placed in the first mounting portion having a high cooling capacity and is rapidly cooled in the middle of the conveyance at the inspection position. Thereby, the electronic component is quickly tempered to an inspection temperature suitable for inspection. Thereafter, the electronic component is placed on the second placing portion that suppresses the cooling ability. Thereby, the second placing unit is maintained in the state where the temperature is adjusted to the inspection temperature, and is transported to the inspection position.

In the electronic component conveying apparatus according to any one of the above-mentioned application examples 22 to 28, preferably, the electronic component is placed on the first mounting portion and placed on the second Mounting section.

Thereby, the rapid cooling of the electronic component and the maintenance of the cooling state thereof can be smoothly performed.

In the electronic component conveying device described in any one of the above-mentioned application examples 22 to 29, it is preferable that the first placing portion is fixed.

On the other hand, if the first placing unit is movable, there is a fear that the liquid medium leaks, for example, depending on the degree of movement. In this case, the liquid medium will wet the surrounding mechanism or electronic parts. However, by fixing the first placing portion, it is possible to reduce (suppress) the leakage of the first placing portion.

In the electronic component conveying apparatus described in the application example 30, it is preferable that the first placing portion is a heat equalizing plate that can adjust the temperature of the electronic component.

Thereby, for example, when the electronic component is inspected for electrical characteristics, the electronic component is pre-cooled before the inspection, and can be adjusted to a temperature suitable for the inspection (low temperature inspection).

In the electronic component conveying apparatus described in any one of the above-mentioned application examples 22 to 31, it is preferable that the second placing portion is movable.

Thereby, the electronic component can be transported from a specific location to another specific location.

In the electronic component conveying device according to the application example of the invention, the second mounting portion is configured to adjust the temperature of the electronic component and to transport the electronic component in one of the horizontal directions. Shuttle.

In this case, for example, when the electronic component is cooled by the first mounting portion and the temperature is adjusted, the electronic component can be transported in one of the horizontal directions while maintaining the temperature adjustment state.

In the electronic component conveying device according to the application example 32, preferably, the second placing portion is configured to adjust a temperature of the electronic component, and to allow the electronic component to be at least horizontal or vertical. The moving part of the transfer.

In this case, for example, when the electronic component is cooled by the first mounting portion and the temperature is adjusted, the electronic component can be transported in the horizontal direction or the vertical direction while maintaining the temperature adjustment state.

[Application Example 35] The electronic component inspection apparatus according to the application example of the present invention includes: a first mounting portion on which an electronic component is placed; a second mounting portion on which the electronic component is placed; and an inspection portion that checks the above An electronic component, wherein the first mounting portion has a first flow path through which a refrigerant that can cool the liquid of the electronic component passes, and the second mounting portion has a second flow through which a refrigerant that can cool the electronic component can pass road.

Thereby, when, for example, the electronic component is inspected for electrical characteristics, the electronic component system In the middle of the conveyance at the position where the inspection is performed, first, it is placed on the first placing portion through which the liquid-containing refrigerant passes, and is rapidly cooled. Thereby, the electronic component is quickly tempered to an inspection temperature suitable for inspection. Thereafter, the electronic component is placed on the second placing portion through which the refrigerant for supplying the gas passes. Thereby, the second placing unit is maintained in the state where the temperature is adjusted to the inspection temperature, and is transported to the inspection position.

1‧‧‧Inspection device (electronic parts inspection device)

5‧‧‧岐管接头

3a‧‧‧1st component

3b‧‧‧2nd component

8a‧‧‧1st component

8A‧‧‧1st refrigerant supply unit

8b‧‧‧2nd component

8B‧‧‧2nd refrigerant supply unit

11A‧‧‧Tray transport mechanism

11B‧‧‧Tray transport mechanism

12‧‧‧ Temperature Adjustment Department

12A‧‧‧ Temperature Adjustment Department

12B‧‧‧ Temperature Adjustment Department

13‧‧‧Component transport head

14‧‧‧Component Supply Department

14A‧‧‧Component Supply Department

14B‧‧‧Component Supply Department

15‧‧‧Tray transport mechanism (first transport device)

16‧‧‧Inspection Department

17‧‧‧Component head

18‧‧‧Component Recycling Department

19‧‧‧Recycling tray

20‧‧‧Component head

21‧‧‧Tray transport mechanism (second transport device)

22A‧‧‧Tray transport mechanism

22B‧‧‧Tray transport mechanism

23‧‧‧Pipe

24a‧‧‧Valves

24b‧‧‧Valve

24c‧‧‧Valve

24d‧‧‧ valve

30‧‧‧ Sealing members

31‧‧‧ lower surface

32‧‧‧ upper surface

33‧‧‧Flow

34‧‧‧ slots

35‧‧‧ upper surface

37‧‧‧1st flow path

38‧‧‧2nd flow path

39‧‧‧ Lower surface

41‧‧‧1st tube

42‧‧‧2nd tube

43‧‧‧3rd tube

44‧‧‧4th tube

45‧‧‧1st valve

46‧‧‧2nd valve

51‧‧‧岐管主

52‧‧‧Connectors

53‧‧‧Connectors

54‧‧‧Connectors

55‧‧‧Connectors

56‧‧‧Connectors

57‧‧‧Connectors

61‧‧‧1st next door

62‧‧‧2nd next door

63‧‧‧3rd next door

64‧‧‧4th next door

65‧‧‧5th next door

66‧‧‧Inside wall

70‧‧‧ front cover

71‧‧‧ side cover

72‧‧‧ side cover

73‧‧‧back cover

74‧‧‧Upper cover

81‧‧‧storage tank

82‧‧‧Pipe

83‧‧‧ cooler

84‧‧‧storage tank

85‧‧‧Pipe

86‧‧‧ pump

90‧‧‧IC components

100‧‧‧Electronic parts mounting members

101‧‧‧ recess

114‧‧‧Component Supply Department

116‧‧‧Inspection Department

117‧‧‧Component head

120‧‧‧ Temperature Adjustment Department

120A‧‧‧Temperature Adjustment Department

120B‧‧‧ Temperature Adjustment Department

121‧‧‧Cooling unit

122‧‧‧heating components

141‧‧‧2nd flow path

142‧‧‧ entrance

143‧‧ Export

171‧‧‧2nd flow path

172‧‧‧ entrance

173‧‧‧Export

200‧‧‧Tray (configuration component)

203‧‧‧Pipe

204‧‧‧Pipe

205‧‧‧Pipe

214‧‧‧Component Supply Department

216‧‧ ‧ Inspection Department

217‧‧‧Component head

218‧‧‧Component Recycling Department

220‧‧‧ Temperature Adjustment Department

220A‧‧‧ Temperature Adjustment Department

220B‧‧‧ Temperature adjustment

221‧‧‧1st flow path

222‧‧‧ entrance

223‧‧‧Export

231‧‧‧1st tube

232‧‧‧2nd tube

233‧‧‧3rd tube

234‧‧‧4th tube

235‧‧‧5th tube

236‧‧‧6th tube

237‧‧‧1st valve

238‧‧‧2nd valve

251‧‧‧1st tube

252‧‧‧2nd tube

253‧‧‧3rd tube

254‧‧‧heater

300‧‧‧ monitor

301‧‧‧Display screen

304‧‧‧Flow adjustment valve

306‧‧‧Flow adjustment valve

331‧‧‧Departure

361‧‧‧1st side

362‧‧‧2nd side

363‧‧‧3rd side

364‧‧‧4th side

365‧‧‧ corner (corner)

366‧‧‧ corner (corner)

367‧‧‧ corner (corner)

371‧‧‧Inlet

372‧‧‧Linear

373‧‧‧ crank

374‧‧‧Linear

375‧‧‧Linear

376‧‧‧Linear

377‧‧‧Linear

381‧‧‧Linear

382‧‧‧Linear

383‧‧‧Linear

384‧‧‧蜿蜒

385‧‧‧Linear

386‧‧‧Exit

400‧‧‧Signal lights

500‧‧‧Speakers

501‧‧‧Flow adjustment valve

502‧‧‧Flow adjustment valve

503‧‧‧Flow adjustment valve

510‧‧‧Export

511‧‧‧Internal flow path

512‧‧‧Internal flow path

600‧‧‧mouse table

700‧‧‧storage tank

701‧‧‧ tube (third stream)

702‧‧‧ tube

703‧‧‧ tube

704‧‧‧ tube

705‧‧‧ tube

706‧‧‧ tube (fourth flow)

800‧‧‧Control Department

830‧‧‧Flow

831‧‧‧Departure

840‧‧‧ slot

861‧‧‧1st side

862‧‧‧2nd side

863‧‧‧3rd side

864‧‧‧4th side

865‧‧ Corner (corner)

866‧‧‧ corner (corner)

870‧‧‧1st flow path

871‧‧‧flow entrance

872‧‧‧Linear

873‧‧‧Linear

874‧‧‧Linear

880‧‧‧2nd flow path

881‧‧‧Linear

882‧‧‧Linear

883‧‧‧蜿蜒

884‧‧‧Linear

885‧‧‧Exit

900‧‧‧Operator panel

1000‧‧‧Checking device

2000‧‧‧Inspection device

A-A‧‧‧ line

A1‧‧‧Tray supply area

A2‧‧‧Component supply area (supply area)

A3‧‧‧ inspection area

A4‧‧‧Component recycling area (recycling area)

A5‧‧‧Tray removal area

RF‧‧‧Refrigerant

RF ₁ ‧‧‧1st refrigerant

RF ₂ ‧‧‧2nd refrigerant

t _3a ‧‧‧thickness

t _3b ‧‧‧thickness

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

Fig. 1 is a schematic perspective view of the electronic component inspection device according to the first embodiment of the present invention as seen from the front side.

Fig. 2 is a schematic plan view of the electronic component inspection apparatus shown in Fig. 1.

Fig. 3 is a piping diagram for connecting a supply source of liquid nitrogen and a supply destination of liquid nitrogen.

Fig. 4 is a plan view showing the arrangement state of the two heat equalizing plates in Fig. 2.

Figure 5 is a horizontal cross-sectional view of the soaking plate in the negative side of the Y direction of Figure 4.

Fig. 6 is a cross-sectional view taken along line A-A of Fig. 4 (a state in which a change kit is placed).

Figure 7 is a horizontal cross-sectional view showing the supply line of liquid nitrogen to the two soaking plates of Figure 2 and the discharge line of liquid nitrogen from the two soaking plates.

Figure 8 is a horizontal cross-sectional view of one of the supply shuttles of Figure 2.

Fig. 9 is a schematic perspective view of the electronic component inspection apparatus according to the second embodiment of the present invention as seen from the front side.

Fig. 10 is a schematic plan view of the electronic component inspection device shown in Fig. 9.

Fig. 11 is a piping diagram for connecting a supply source of liquid nitrogen and a supply destination of liquid nitrogen.

Fig. 12 is a plan view showing the arrangement state of the two heat equalizing plates in Fig. 10.

Figure 13 is a horizontal cross-sectional view of the heat equalizing plate on the negative side in the Y direction of Figure 12.

Fig. 14 is a cross-sectional view taken along line A-A of Fig. 12 (a state in which a change kit is placed).

Figure 15 is a horizontal cross-sectional view showing the supply line of liquid nitrogen to the two soaking plates of Figure 10 and the discharge line of liquid nitrogen from the two soaking plates.

Fig. 16 is a schematic perspective view of the electronic component inspection apparatus according to the third embodiment of the present invention as seen from the front side.

Fig. 17 is a schematic plan view showing an operation state of the electronic component inspection device shown in Fig. 16.

Fig. 18 is a circuit diagram of a first refrigerant which is a liquid refrigerant.

Fig. 19 is a circuit diagram of a second refrigerant which is a refrigerant of gas.

Hereinafter, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described in detail based on preferred embodiments with reference to the accompanying drawings.

Further, in the following embodiments, for convenience of explanation, the three orthogonal axes shown in the drawing are referred to as an X-axis, a Y-axis, and a Z-axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X axis is referred to as "X direction", the direction parallel to the Y axis is referred to as "Y direction", and the direction parallel to the Z axis is referred to as "Z direction". Further, the direction in which the arrows in the respective directions are directed is referred to as "positive", and the opposite direction is referred to as "negative". Further, the "horizontal" referred to in the present specification is not limited to the complete level, and includes a state in which a certain amount is inclined with respect to the horizontal (for example, not about 5°) as long as it does not interfere with the conveyance of the electronic component.

Further, the inspection apparatus (electronic component inspection apparatus) of the following embodiment is for transporting, for example, a BGA (Ball Grid Array) package or an LGA (Land Grid) Array: planar grid array) IC components such as IC components, LCD (Liquid Crystal Display), CIS (CMOS Image Sensor), etc., and check and test electrical characteristics during transport (hereinafter simply referred to as "inspection"). In the following, for convenience of explanation, a case where an IC component is used as the electronic component to be inspected will be described as a representative, and this will be referred to as "IC component 90".

In addition, the inspection apparatus of the following embodiment is divided into a tray supply area A1, a component supply area (hereinafter simply referred to as "supply area") A2, an inspection area A3, and a component collection area (hereinafter simply referred to as "recovery area"). A4, with the tray removal area A5. Further, the IC device 90 sequentially inspects the inspection region A3 in the middle through the tray supply region A1 to the tray removal region A5 (each region A1 to A5).

Moreover, in the inspection apparatus of the following embodiment, the side (the negative side in the Y direction) where the tray supply area A1 and the tray removal area A5 are disposed is the front side, and the side opposite to the inspection area A3 (the Y direction) is disposed on the opposite side. The positive side is used as the back side.

(Embodiment 1)

Hereinafter, an electronic component inspection device according to the first embodiment will be described.

Fig. 1 is a schematic perspective view of the electronic component inspection device according to the first embodiment of the present invention as seen from the front side. Fig. 2 is a schematic plan view of the electronic component inspection apparatus shown in Fig. 1. Fig. 3 is a piping diagram for connecting a supply source of liquid nitrogen and a supply destination of liquid nitrogen. Fig. 4 is a plan view showing the arrangement state of the two heat equalizing plates in Fig. 2. Figure 5 is a horizontal cross-sectional view of the soaking plate in the negative side of the Y direction of Figure 4. Fig. 6 is a cross-sectional view taken along line A-A of Fig. 4 (a state in which a change kit is placed). Figure 7 is a horizontal cross-sectional view showing the supply line of liquid nitrogen to the two soaking plates of Figure 2 and the discharge line of liquid nitrogen from the two soaking plates. Figure 8 is a horizontal cross-sectional view of one of the supply shuttles of Figure 2.

As shown in FIG. 1 and FIG. 2, the inspection apparatus 1 of the first embodiment includes an electronic component transport apparatus that transports the IC component 90 in each of the areas A1 to A5, and an inspection unit 16 that performs inspection in the inspection area A3; Control unit 800. Further, the inspection apparatus 1 includes a monitor 300 and a signal lamp 400.

The tray supply area A1 is supplied to a supply unit of a tray (arrangement member) 200 in which a plurality of IC elements 90 in an unchecked state are arranged. In the tray supply area A1, a plurality of trays 200 can be stacked.

In the supply area A2, a plurality of IC elements 90 placed on the tray 200 loaded from the tray supply area A1 are supplied to the inspection area A3. Further, the tray transport mechanisms 11A and 11B that transport the trays 200 one by one in the horizontal direction are provided so as to span the tray supply area A1 and the supply area A2. The tray transport mechanism 11A is a movable portion that can move the tray 200 together with the IC element 90 placed on the tray 200 toward the positive side in the Y direction. Thereby, the IC element 90 can be stably fed to the supply area A2. Further, the tray transport mechanism 11B is a moving portion that can move the empty tray 200 toward the negative side in the Y direction, that is, from the supply region A2 toward the tray supply region A1.

The temperature adjustment unit 12, the component transfer head 13, and the tray conveyance mechanism (first conveyance device) 15 are provided in the supply area A2.

The temperature adjustment unit 12 is a cooling member that can cool a plurality of IC elements 90 at a time, and may be referred to as a “heating plate (English description: soak plate, Chinese description (example): temperature equalization plate)”. By the heat equalizing plate, the IC element 90 before inspection by the inspection portion 16 can be preliminarily cooled and adjusted to a temperature suitable for the inspection. In the configuration shown in FIG. 2, the temperature adjustment unit 12 is disposed in two in the Y direction and fixed. By the tray transport mechanism 11A, the IC element 90 on the tray 200 carried (transferred) from the tray supply area A1 is transported to any one of the temperature adjustment units. 12.

In addition, a plurality of IC elements 90 are placed on the heat equalizing plate in a state in which they are disposed in the recesses (recesses) 101 of the electronic component mounting member 100 of the so-called "change kit" which are exchanged for each type of the IC component 90. That is, the temperature adjustment unit 12 (see FIG. 6). Further, a plurality of IC elements 90 are cooled together with the electronic component mounting member 100 for the heat equalizing plate.

The component transfer head 13 is supported to be movable in the supply area A2. Thereby, the component transfer head 13 is responsible for transporting the IC component 90 between the tray 200 carried in from the tray supply area A1 and the temperature adjustment unit 12, and transporting the IC component 90 between the temperature adjustment unit 12 and the component supply unit 14 to be described later. .

The tray transport mechanism 15 is a mechanism that transports the empty tray 200 in a state in which all of the IC elements 90 have been removed in the supply region A2 toward the positive side in the X direction. After the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray transport mechanism 11B.

The inspection area A3 is an area in which the IC component 90 is inspected. In the inspection area A3, the component supply unit 14, the inspection unit 16, the component transfer head 17, and the component collection unit 18 are provided.

The component supply unit 14 is a mobile unit that mounts the temperature-adjusted IC element 90 and can transport (move) the IC element 90 to the vicinity of the inspection unit 16, and may be referred to as a “supply shuttle”. The component supply unit 14 is supported to be movable in the horizontal direction between the supply region A2 and the inspection region A3 in the X direction. Further, in the configuration shown in FIG. 2, the component supply unit 14 is disposed in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transferred to the component supply unit 14 of either one.

Similarly to the temperature adjustment unit 12, the component supply unit 14 also mounts and uses a change kit exchanged for each type of the IC element 90, and is once cooled together with the change kit. A plurality of cooling members of the IC component 90.

The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC component 90. The inspection unit 16 is provided with a plurality of probe pins electrically connected to the terminals of the IC element 90 while holding the IC element 90. Further, the terminal of the IC component 90 is electrically connected (contacted) to the probe pin, and the IC component 90 is inspected via the probe pin. The inspection of the IC component 90 is performed based on a program stored in the inspection control unit provided in the tester connected to the inspection unit 16. Further, in the inspection unit 16, like the temperature adjustment unit 12, the IC element 90 can be cooled, and the IC element 90 can be adjusted to a temperature suitable for inspection (see FIG. 3).

The component transfer head 17 is supported to be movable in the inspection area A3. Thereby, the element transfer head 17 can transport the IC element 90 on the component supply unit 14 carried in from the supply area A2 and put it on the inspection unit 16. Further, the component transfer head 17 is also a cooling member that can cool the IC component 90.

The component collection unit 18 is a movable unit that can be placed on the IC device 90 that has been inspected by the inspection unit 16 and that transports (moves) the IC element 90 to the collection area A4, and may be referred to as a “recycling shuttle”. The component recovery unit 18 is supported to be movable in the horizontal direction between the inspection region A3 and the recovery region A4 in the X direction. Further, in the configuration shown in FIG. 2, the component collection unit 18 is the same as the component supply unit 14, and two are arranged in the Y direction, and the IC component 90 on the inspection unit 16 is transported and placed on either one. Component recovery unit 18. This transfer is performed by the component transfer head 17.

Similarly to the temperature adjustment unit 12, the component recovery unit 18 or the inspection unit 16 also mounts and uses a change kit that is exchanged for each type of the IC device 90.

The recovery area A4 is a region in which a plurality of IC elements 90 at the end of the inspection are recovered. In the collection area A4, a recovery tray 19, a component transfer head 20, and a tray conveyer are provided. Structure (second transport device) 21. Further, an empty tray 200 is also provided in the collection area A4.

In the collection tray 19, the mounting portion on which the IC device 90 is placed is fixed in the collection area A4, and in the configuration shown in FIG. 2, three are arranged along the X direction. Moreover, the empty tray 200 is also a mounting portion on which the IC component 90 is placed, and three are arranged along the X direction. Further, the IC element 90 on the component recovery unit 18 that has moved toward the recovery area A4 is transported and placed on any of the collection trays 19 and the empty trays 200. Thereby, the IC element 90 is recovered and classified according to each inspection result.

The component transfer head 20 is supported to be movable in the recovery area A4. Thereby, the component transfer head 20 can transport the IC component 90 from the component collection part 18 to the collection tray 19 or the empty tray 200.

The tray transport mechanism 21 is a mechanism that transports the empty tray 200 loaded from the tray removal area A5 in the X direction in the collection area A4. After the transfer, the empty tray 200 is placed at the position where the IC element 90 is collected. That is, it may be any of the above three empty trays 200.

In the inspection apparatus 1, the tray conveyance mechanism 21 is provided in the collection area A4, and the tray conveyance mechanism 15 is provided in the supply area A2. By this means, for example, the empty tray 200 is transported in the X direction by one transport mechanism, and the throughput (the number of transports of the IC elements 90 per unit time) can be improved.

In addition, the configuration of the tray transport mechanisms 15 and 21 is not particularly limited, and examples thereof include a suction member having the adsorption tray 200 and a support mechanism for supporting the adsorption member in a X-direction movable ball screw. .

The tray removing area A5 collects the removing parts of the tray 200 in which a plurality of IC elements 90 in the inspection completion state are arranged and removed. In the tray removal area A5, a plurality of trays can be stacked Disk 200.

Further, the tray transport mechanisms 22A and 22B that transport the trays 200 one by one in the horizontal direction are provided so as to span the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a moving portion that can move the tray 200 together with the IC element 90 placed on the tray 200 in the Y direction. Thereby, the IC element 90 that has been inspected can be transported from the recovery area A4 to the tray removal area A5. Further, the tray transport mechanism 22B can use a moving portion in which the tray 200 in which the empty IC element 90 is collected moves from the tray removal area toward the recovery area A4.

The control unit 800 has, for example, a drive control unit. The drive control unit controls, for example, the tray conveyance mechanisms 11A and 11B, the temperature adjustment unit 12, the component transfer head 13, the component supply unit 14, the tray conveyance mechanism 15, the inspection unit 16, the component transfer head 17, the component collection unit 18, and the component transfer head. 20. Driving of each portion of the tray transport mechanism 21 and the tray transport mechanisms 22A, 22B.

In addition, the inspection control unit of the tester performs inspection of electrical characteristics of the IC component 90 disposed in the inspection unit 16 based on, for example, a program stored in a memory (not shown).

The operator can set or confirm the temperature condition and the like at the time of the operation of the inspection apparatus 1 via the monitor 300. The monitor 300 has a display screen 301 composed of, for example, a liquid crystal screen, and is disposed on the front side of the inspection apparatus 1 (on the positive side in the Z direction). As shown in FIG. 1, on the right side (the positive side in the X direction) of the tray removal area A5, a mouse-sliding table 600 for use when the operation is displayed on the screen of the monitor 300 is provided.

Further, the signal lamp 400 can notify the operating state of the inspection apparatus 1 or the like by a combination of colors of light emission. The signal lamp 400 is disposed on the upper portion of the inspection device 1. In addition, the speaker 500 is built in the inspection device 1, and the operation state of the inspection device 1 can also be reported by the speaker 500. Wait.

As shown in FIG. 2, the inspection apparatus 1 is divided (separated) by the first partition 61 between the tray supply area A1 and the supply area A2, and is divided by the second partition 62 between the supply area A2 and the inspection area A3. The inspection area A3 and the collection area A4 are partitioned by the third partition wall 63, and are partitioned between the collection area A4 and the tray removal area A5 by the fourth partition wall 64. Further, the supply region A2 and the recovery region A4 are also partitioned by the fifth partition wall 65. These partition walls have a function of maintaining the airtightness of each of the regions A1 to A5. Further, the inspection apparatus 1 covers the outermost layer with a cover body, for example, a front cover 70, a side cover 71, a side cover 72, a rear cover 73, and an upper cover 74. Further, an inner partition wall 66 is disposed on the inner side of the rear cover 73.

As described above, the temperature adjustment unit 12 cools the cooling member of the IC element 90. The temperature adjustment unit 12 is configured to cool the IC element 90 by flowing the refrigerant RF inside.

Further, the refrigerant RF, for example, liquid nitrogen (liquid nitrogen) is preferably used for cooling the IC device 90 because the cooling efficiency (cooling energy) is relatively high. As shown in FIGS. 1 and 2, the refrigerant RF is previously filled in a storage tank 700 provided outside the inspection apparatus 1.

Further, as shown in FIG. 3, the storage tank 700 is connected to the temperature adjustment unit 12, the component supply unit 14, the component transfer head 17, and the inspection unit 16 via pipes 23. Thereby, the refrigerant RF is supplied to the temperature adjustment unit 12, the component supply unit 14, the component transfer head 17, and the inspection unit 16, respectively.

Further, a valve 24a is provided in the middle of the pipe 23 facing the temperature adjustment unit 12. By controlling the opening and closing of the valve 24a, it is possible to switch the supply of the refrigerant RF to the temperature adjustment unit 12 and stop the supply thereof. Similarly, a valve 24b is also provided in the middle of the pipe 23 facing the component supply portion 14. By controlling the opening and closing of the valve 24b, it is possible to switch the supply of the refrigerant to the component supply unit 14. RF, and stop the supply. Further, a valve 24c is also provided in the middle of the pipe 23 facing the component transfer head 17. By controlling the opening and closing of the valve 24c, the supply of the refrigerant RF to the component transfer head 17 can be switched and the supply can be stopped. Further, a valve 24d is also provided in the middle of the inspection portion 16 of the pipe 23. By controlling the opening and closing of the valve 24d, the supply of the refrigerant RF to the inspection unit 16 can be switched and the supply can be stopped.

As shown in FIG. 4, two inspection units 1 are provided with two temperature adjustment units 12, and the two temperature adjustment units 12 are disposed in the Y direction, that is, in the upper and lower sides of FIG. 4 (the positive side and the negative side of the Y direction). ). Hereinafter, the temperature adjustment unit 12 on the lower (negative) side in FIG. 4 will be referred to as “temperature adjustment unit 12A”, and the temperature adjustment unit 12 on the upper (positive) side may be referred to as “temperature adjustment unit 12B”. The temperature adjustment unit 12A and the temperature adjustment unit 12B have the same configuration except for the arrangement position. Therefore, the temperature adjustment unit 12A will be described as a representative.

As shown in FIG. 6, the temperature adjustment unit 12A is formed by laminating and joining the first member 3a having a flat shape and the second member 3b having a flat shape. Thereby, a groove is formed in the lower surface 31 of the first member 3a or the upper surface 32 of the second member 3b, or both surfaces (the lower surface 31 and the upper surface 32), and the groove can be used as a flow for the refrigerant RF to flow down. Road 33 is used. Therefore, the member constituting the flow path 33 can be omitted, and the temperature adjustment unit 12A can be configured to be simple. Further, in the present embodiment, a groove is formed in the lower surface 31 of the first member 3a, and the groove is used as the flow path 33. Further, as a method of joining the first member 3a and the second member 3b, for example, a method of fastening using a plurality of bolts can be employed.

Further, parallel grooves 34 are formed along the flow path 33 on the lower surface 31 of the first member 3a. In the groove 34, a sealing member 30 is disposed along the groove 34. The sealing member 30 is made of an elastic material and is in a compressed state between the first structure 3a and the second member 3b. Thereby, the liquid tightness (or airtightness) between the first member 3a and the second member 3b, that is, in the flow path 33 can be maintained. Sex). Therefore, it is possible to prevent the refrigerant RF during the flow in the flow path 33 from leaking from between the first member 3a and the second member 3b.

Further, the elastic material constituting the sealing member 30 is not particularly limited, and various rubber materials such as urethane rubber, enamel rubber, and fluororubber can be used.

As described above, a groove used as the flow path 33 is formed on the lower surface 31 of the first member 3a. For example, in addition to the formation region of the groove (flow path 33), depending on the entire length or depth of the groove, a certain amount of bending may occur in the first member 3a alone (self).

The upper surface 35 of the first member 3a is mounted with the electronic component mounting member 100. Therefore, when the first member 3a is maintained in a curved state, the electronic component mounting member 100 on the upper surface 35 may also follow the first The member 3a is bent. In this state, even if the component carrying head 13 holds the IC component 90 located in the recess 101 of the electronic component mounting member 100 and is to be pulled upward, the electronic component mounting member 100 is bent, so that the IC component cannot be completely held. 90. That is, the situation of insufficient holding.

On the other hand, in the temperature adjustment unit 12, the first member 3a is bent, and the second member 3b thicker than the first member 3a is joined to eliminate the bending. Thereby, the upper surface 35 of the first member 3a can be corrected to have a horizontal planar shape. Therefore, the electronic component mounting member 100 on the upper surface 35 is also prevented from being bent. In the electronic component mounting member 100 in this state, the IC component 90 can be stably lifted by the component transfer head 13.

Further, it is preferable that the thickness t _3b of the second member 3b is thicker than the thickness t _{3a of the} first member 3a. For example, it is preferably 1.2 times or more and 3 times or less, more preferably 1.5 times or more and 2 times or less the thickness t _3a . Thereby, on the one hand, the increase in the thickness t _{3b is} suppressed, and the bending of the first member 3a can be eliminated regardless of the magnitude of the bending of the first member 3a.

As shown in FIGS. 4 and 5, the first member 3a and the second member 3b have a shape and a large shape in plan view. Small identical.

The first member 3a (the second member 3b is also the same) is formed to have a first side 361, a second side 362 that is parallel to the first side 361, a third side 363 that is orthogonal to the first side 361, and The rectangle (rectangular) of the fourth side 364 which is parallel to the third side and parallel. In the present embodiment, the first member 3a is formed in a rectangular shape that is long in the Y-axis direction, and the lengths of the first side 361 and the second side 362 are longer than the lengths of the third side 363 and the fourth side 364. By forming such a relatively simple external shape, when the first member 3a is obtained by mechanical processing from the base material of the metal plate, the machining can be easily and inexpensively performed.

As a constituent material of the first member 3a and the second member 3b, for example, various metal materials can be used, and among the metal materials, aluminum having a high thermal conductivity and easy machining is preferable.

However, in the same manner as the cooling plate described in Patent Document 1, for example, liquid nitrogen flows only in the flow cell of the crucible, and uniform cooling cannot be performed on the cooling plate. This is because the cooling plate has a tendency that the heat of the outer peripheral side is more likely to enter and exit than the center portion.

Therefore, the temperature adjustment unit 12A is configured to uniformly cool the plurality of IC elements 90 on the temperature adjustment unit 12A. Hereinafter, this configuration will be described.

As described above, the temperature adjustment unit 12A is provided with a flow path 33 through which the refrigerant RF flows. As shown in FIG. 5, the flow path 33 includes a first flow path 37 through which the refrigerant RF flows, and a second flow path 38 that communicates with the first flow path 37 and that supplies the refrigerant RF.

When the temperature adjustment unit 12A is placed in a plan view, the first flow path 37 is the starting point of the inlet 371 in which the refrigerant RF flows into the first flow path 37, and is approached (biased) toward the outer peripheral side of the temperature adjustment unit 12A as much as possible. The first side 361, the third side 363, the second side 362, and the fourth side 364 are formed along the respective sides.

In the portion along the first side 361 of the first flow path 37, formed from the upstream side to the downstream side There are a linear portion 372 having a straight line shape, a crank portion 373 bent into a crank shape or a meander shape, and a linear portion 374 having a linear shape.

Further, the first flow path 37 is formed in a direction in which a corner portion (corner) 365 formed by the first side 361 and the third side 363 is formed, and a linear portion is formed in a portion along the third side 363. 375.

Further, the first flow path 37 is formed in a direction in which the third side 363 and the second side 362 are formed at a corner (corner) 366 side, and a linear portion is formed in a portion along the second side 362. 376.

Further, the first flow path 37 is formed in a direction in which a corner portion (corner) 367 formed by the second side 362 and the fourth side 364 is formed, and a linear portion is formed in a portion along the fourth side 364. 377.

The flow path 33 is formed in the subsequent U-shaped folded-back portion 331 of the linear portion 377, and enters the inner side of the first flow path 37, that is, toward the center side of the temperature adjustment portion 12A. The flow path 37 is turned to the second flow path 38 which is a circuit. The folded portion 331 is a portion where the first flow path 37 and the second flow path 38 are connected.

When the temperature adjustment unit 12A is viewed from above, the second flow path 38 is located inside the first flow path 37, and the fourth side 364, the second side 362, and the third side 363 are opposite to the first flow path 37. The order of the first side 361 is formed along each side.

A linear portion 381 having a linear shape is formed in a portion of the second flow path 38 along the fourth side 364. The linear portion 381 is disposed in parallel with the linear portion 377 of the first flow path 37, and the direction in which the refrigerant RF flows is also opposite to the linear portion 377.

Further, the second flow path 38 is formed in a direction in which the corner portion 367 is switched, and a linear portion 382 which is linear in a portion along the second side 362 is formed. The linear portion 382 is connected to the first flow path 37 In a state where the linear portions 376 are arranged side by side, the direction in which the refrigerant RF flows is also opposite to the linear portion 376.

Further, the second flow path 38 is formed in a direction in which the corner portion 366 is switched, and a linear portion 383 is formed in a portion along the third side 363. The straight portion 383 and the straight portion 375 of the first flow path 37 are arranged side by side, and the direction in which the refrigerant RF flows is also opposite to the linear portion 375.

Further, the second flow path 38 is formed in the direction in which the corner portion 365 is shifted, and a portion along the first side 361 is formed with a crotch portion 384 which is repeated close to the linear portion 374 of the first flow path 37. The straight portion 385 has a linear shape on the downstream side of the crotch portion 384. The crotch portion 384 is in a state of being arranged in parallel with the linear portion 374 of the first flow path 37, and the direction in which the refrigerant RF flows is also opposite to the linear portion 374. The linear portion 385 is also disposed in parallel with the linear portion 372 of the first flow path 37, and the direction in which the refrigerant RF flows is also opposite to the linear portion 372.

Further, the second flow path 38 is an end point of the outflow port 386 through which the refrigerant RF flows out from the second flow path 38.

As described above, the flow path 33 is formed in the first side 361, the second side 362, the third side 363, and the fourth side 364 from the linear portion 372 to the linear portion 377 of the first flow path 37. The outer side of the flow path 38 surrounds the linear portion 381 of the second flow path 38 to the crotch portion 384. Further, the temperature of the refrigerant RF flowing down the first flow path 37 located outside is lower than the temperature of the refrigerant RF flowing down the second flow path 38 inside.

In this way, even if the temperature adjustment unit 12A having a tendency to enter and exit the heat on the outer peripheral side is easier than the center portion, the cooling function can be prevented from lowering in the first flow path 37, and a sufficient cooling function can be exhibited. Thereby, a plurality of IC elements 90 can be applied to the temperature adjustment unit 12A. Perform uniform cooling.

In the present embodiment, when the average temperature of the refrigerant RF flowing through the entire flow path 33 is measured, the portion lower than the average temperature is referred to as "first flow path 37", and the portion exceeding the average temperature is referred to as " The second flow path 38" is not limited thereto. For example, 1/2 of the upstream side of the entire flow path 33 may be referred to as "first flow path 37", and 1/2 of the downstream side may be referred to as "second flow path 38".

As shown in FIG. 5, the inflow port 371 and the outflow port 386 are arranged to be biased on the fourth side 364 side of the first side 361 to the fourth side 364. Thereby, the inflow port 371 can be placed as close as possible to the outflow port 386, whereby the refrigerant RF supply to the temperature adjustment unit 12A and the refrigerant can be performed using one of the manifold joints 5 (see FIG. 7) to be described later. RF discharge.

Further, the folded portion 331 is also biased and placed on the side of the fourth side 364. Thereby, the first flow path 37 is along the first side 361 to the fourth side 364, whereby the entire length of the first flow path 37 can be ensured to be as long as possible, contributing to a plurality of IC elements. 90 uniform cooling.

As shown in FIG. 4, the temperature adjustment unit 12A and the temperature adjustment unit 12B are disposed to face each other with the fourth side 364 facing each other. In other words, the temperature adjustment unit 12A and the temperature adjustment unit 12B are arranged in point symmetry around the intermediate point of each other. Thereby, as shown in FIG. 7, the manifold joint 5 can be disposed inside (the negative side in the Z-axis direction) between the temperature adjustment portion 12A and the temperature adjustment portion 12B.

The manifold joint 5 includes a manifold body 51 and a joint 52 to a joint 57 connected to the manifold body 51.

The manifold body 51 includes an internal flow path 511 for the refrigerant RF to flow from the joint 52 to the joint 53 and the joint 54, and an internal flow path 512 for the refrigerant RF to flow from the joint 55 and the joint 56 to the joint 57.

The joint 52 is connected to a pipe (third flow path) 701 through which the refrigerant RF flows from the sump 700. The joint 53 is connected to the inflow port 371 of the temperature adjustment unit 12A via the tube 702. The joint 54 is connected to the inflow port 371 of the temperature adjustment portion 12B via a pipe 703. By thus connecting, the refrigerant RF from the storage tank 700 is supplied to the temperature adjustment unit 12A and the temperature adjustment unit 12B, respectively.

The joint 55 is connected to the outlet 386 of the temperature adjustment unit 12A via a pipe 704. The joint 56 is connected to the outlet 386 of the temperature adjustment unit 12B via a pipe 705. The joint 57 is connected to a liquid discharge portion (not shown) via a pipe (fourth flow path) 706. By the connection, the refrigerant RF discharged from the temperature adjustment unit 12A and the temperature adjustment unit 12B is collected by the liquid discharge unit.

As described above, the component supply unit 14 is the same as the temperature adjustment unit 12 and is a cooling member that can cool the IC element 90. In the following, the component supply unit 14 is configured similarly to the temperature adjustment unit 12A, and the plurality of IC elements 90 can be uniformly cooled. However, the difference from the temperature adjustment unit 12A will be mainly described. The description of the matter is omitted.

The component supply unit 14 is almost the same as the temperature adjustment unit 12A except that the shape of the flow path 830 through which the refrigerant RF flows is different.

As shown in FIG. 8, the component supply unit 14 also has a first member 8a and a second member 8b, and a flow path 830 is formed in the first member 8a. Further, in the first member 8a, a groove 840 is formed along the flow path 830. A sealing member (not shown) that maintains liquid tightness (or airtightness) in the flow path 830 is disposed in the groove 840.

Further, the first member 8a (the second member 8b is also the same) is formed to have a first side 861, a second side 862 that is parallel to the first side 861, and a third side 863 that is orthogonal to the first side 861, And a rectangle of the fourth side 864 parallel to the third side. In the present embodiment, the first member 8a is formed in a rectangular shape that is long in the X-axis direction, and the length of the first side 861 and the second side 862 is shorter than that of the first side 861. The length of the 3rd side 863 and the 4th side 864 is longer.

As shown in FIG. 8, the flow path 830 has a first flow path 870 through which the refrigerant RF flows, and a second flow path 880 that communicates with the first flow path 870 and flows out of the refrigerant RF.

When the component supply unit 14 is viewed in a plan view, the first flow path 870 is a starting point of the inflow port 871 into which the refrigerant RF flows into the first flow path 870, and approaches the outer peripheral side of the component supply unit 14 as much as possible. The order of 361, the third side 363, and the second side 362 is formed along each side.

A linear portion 872 having a straight line is formed in a portion of the first flow path 870 along the first side 361.

Further, the first flow path 870 is formed in a direction in which a corner portion (corner) 865 formed by the first side 861 and the third side 863 is converted, and a linear portion is formed in a portion along the third side 863. 873.

Further, the first flow path 870 is formed in a direction in which the corners (corners) 866 formed by the third side 863 and the second side 862 are shifted, and a linear portion is formed in a portion along the second side 862. 874.

The flow path 830 is formed in the subsequent U-shaped folded-back portion 831 of the linear portion 874, and enters the inner side of the first flow path 870, that is, toward the center side of the component supply portion 14, and the first path is the first one. The flow path 870 is transferred to the second flow path 880 which is the circuit. The folded portion 831 is a portion where the first flow path 870 and the second flow path 880 are connected.

When the component supply unit 14 is planarly viewed, the second flow path 880 is located inside the first flow path 870, and the second side 862, the third side 863, and the first side are opposite to the first flow path 870. The order of 861 is formed along each side.

A linear portion 881 having a straight line is formed in a portion of the second flow path 880 along the second side 862. The linear portion 881 is arranged side by side with the linear portion 874 of the first flow path 870. In the state, the direction in which the refrigerant RF flows is also opposite to the linear portion 874.

Further, the second flow path 880 is switched in the direction of the corner portion 866 side, and a linear portion 882 which is linear in the portion along the third side 863 is formed. The linear portion 882 is disposed in parallel with the linear portion 873 of the first flow path 870, and the direction in which the refrigerant RF flows is also opposite to the linear portion 873.

Further, the second flow path 880 is formed in the direction of the corner portion 865, and a portion along the first side 861 is formed with a crotch portion 883 which is repeated close to the linear portion 872 of the first flow path 870. The straight portion 884 is linear on the downstream side of the crotch portion 883. The crotch portion 883 and the linear portion 884 are arranged side by side with the linear portion 872 of the first flow path 870, and the direction in which the refrigerant RF flows is also opposite to the linear portion 872.

Further, the second flow path 880 is an end point of the outflow port 885 from which the refrigerant RF flows out from the second flow path 880.

As described above, the flow path 830 is disposed in the first side 861, the second side 862, and the third side 863, and is disposed on the outer side of the second flow path 880 from the linear 872 to the linear portion 874 of the first flow path 870. And surrounding the linear portion 881 from the second flow path 880 to the linear portion 884. Further, the temperature of the refrigerant RF flowing down the first flow path 870 located outside is lower than the temperature of the refrigerant RF flowing down the inner second flow path 880. By this means, even if the component supply unit 14 having a tendency to enter and exit the heat more than the center portion on the outer peripheral side is prevented, the cooling function can be prevented from lowering in the first flow path 870, and a sufficient cooling function can be exhibited. Therefore, the plurality of IC elements 90 can be uniformly cooled on the element supply unit 14.

(Embodiment 2)

The electronic component inspection device of the second embodiment will be described below. In the following description, the same components and members as those in the first embodiment are denoted by the same reference numerals and may be Etc. etc. are omitted or simplified.

Fig. 9 is a schematic perspective view of the electronic component inspection apparatus according to the second embodiment of the present invention as seen from the front side. Fig. 10 is a schematic plan view of the electronic component inspection device shown in Fig. 9. Fig. 11 is a piping diagram for connecting a supply source of liquid nitrogen and a supply destination of liquid nitrogen. Fig. 12 is a plan view showing the arrangement state of the two heat equalizing plates in Fig. 10. Figure 13 is a horizontal cross-sectional view of the heat equalizing plate on the negative side in the Y direction of Figure 12. Fig. 14 is a cross-sectional view taken along line A-A of Fig. 12 (a state in which a change kit is placed). Figure 15 is a horizontal cross-sectional view showing the supply line of liquid nitrogen to the two soaking plates of Figure 10 and the discharge line of liquid nitrogen from the two soaking plates.

As shown in FIG. 9 and FIG. 10, the inspection apparatus 1000 according to the second embodiment includes the following components: an electronic component transport apparatus that transports the IC component 90 in each of the regions A1 to A5, and an inspection unit 116 that is in the inspection region A3. The inspection is performed; and the control unit 800. Further, the inspection apparatus 1000 includes a monitor 300 and a signal lamp 400.

In the supply area A2, the temperature adjustment unit 120, the component transfer head 13, and the tray transfer mechanism (first transfer device) 15 are provided.

The temperature adjustment unit 120 includes a cooling member 121 that can cool a plurality of IC elements 90 at a time, and a heating member 122 that can heat a plurality of IC elements 90 at a time (refer to FIG. 14), sometimes referred to as a “heating plate”. Description: soak plate, Chinese description (an example): uniform temperature plate)". By the heat equalizing plate, the IC element 90 before the inspection by the inspection unit 116 can be previously cooled or heated to be adjusted to a temperature suitable for the inspection.

In the configuration shown in FIG. 10, the temperature adjustment unit 120 is disposed and fixed in the Y direction. The IC component 90 on the tray 200 carried in (transferred) from the tray supply area A1 by the tray transport mechanism 11A is transported to any of the temperature adjustment units 120.

In addition, a plurality of IC elements 90 are disposed in respective types according to the IC element 90. The state of the recess (recess) 101 of the electronic component mounting member 100 of the "change kit" which is exchanged is placed on the temperature adjustment section 120 which is a heat equalizing plate (see FIG. 14). Further, a plurality of IC elements 90 are cooled or heated together with the electronic component mounting member 100 for the heat equalizing plate.

The component transfer head 13 is supported to be movable in the supply area A2. Thereby, the component transfer head 13 is responsible for transporting the IC component 90 between the tray 200 carried in from the tray supply area A1 and the temperature adjustment unit 120, and transferring the IC component 90 between the temperature adjustment unit 120 and the component supply unit 114 to be described later. .

The inspection area A3 is an area in which the IC component 90 is inspected. In the inspection area A3, the component supply unit 114, the inspection unit 116, the component transfer head 117, and the component collection unit 18 are provided.

The component supply unit 114 is a mobile unit that can carry the temperature-adjusted IC element 90 and can transport (move) the IC element 90 to the vicinity of the inspection unit 116, and may be referred to as a “supply shuttle”. The component supply unit 114 is supported to be movable in the horizontal direction between the supply region A2 and the inspection region A3 in the X direction. Further, in the configuration shown in FIG. 10, the component supply unit 114 is disposed in the Y direction, and the IC device 90 on the temperature adjustment unit 120 is transferred to the component supply unit 114 of either one.

Similarly to the temperature adjustment unit 120, the component supply unit 114 also mounts and uses a change kit exchanged for each type of the IC element 90, and includes a cooling member that is cooled once with the change kit. And an IC member 90; and a heating member that heats the plurality of IC elements 90 at a time.

The inspection unit 116 is a unit that inspects and tests the electrical characteristics of the IC component 90. The inspection unit 116 is provided with a plurality of probe pins electrically connected to the terminals of the IC element 90 while holding the IC element 90. Moreover, the terminal of the IC component 90 is electrically connected (contacted) to the probe pin, The inspection of the IC component 90 is performed via the probe pin. The inspection of the IC component 90 is performed based on a program stored in the inspection control unit provided in the tester connected to the inspection unit 116. Further, in the inspection unit 116, similarly to the temperature adjustment unit 120, the IC element 90 can be cooled or heated, and the IC element 90 can be adjusted to a temperature suitable for inspection.

The component transfer head 117 is supported to be movable within the inspection area A3. Thereby, the element transfer head 117 can transport the IC element 90 on the component supply unit 114 carried in from the supply area A2 and put it on the inspection unit 116. Further, the component transfer head 117 is also configured to cool or heat the IC component 90.

The component recovery unit 18 is a mobile unit that can be placed on the IC device 90 that has been inspected by the inspection unit 116 and that is transported (moved) to the recovery area A4, and may be referred to as a “recycling shuttle”. The component recovery unit 18 is supported to be movable in the horizontal direction between the inspection region A3 and the recovery region A4 in the X direction. In the configuration shown in FIG. 10, the component collection unit 18 is the same as the component supply unit 114, and is disposed in the Y direction. The IC component 90 on the inspection unit 116 is transported and placed on either one. Component recovery unit 18. This transfer is performed by the component transfer head 117.

In addition to the component recovery unit 18, the inspection unit 116 also mounts and uses a change kit that is exchanged according to each type of the IC element 90, similarly to the temperature adjustment unit 120.

The control unit 800 has, for example, a drive control unit. The drive control unit controls, for example, driving of the following units: the tray transport mechanisms 11A and 11B, the temperature adjustment unit 120, the component transfer head 13, the component supply unit 114, the tray transport mechanism 15, the inspection unit 116, the component transport head 117, and the component recovery unit 18. The component transfer head 20, the tray transport mechanism 21, and the tray transport mechanisms 22A and 22B.

In addition, the inspection control unit of the above tester is based on, for example, a memory that is not shown in the figure. The program in the body performs inspection of the electrical characteristics of the IC device 90 disposed in the inspection unit 116.

The operator can set or confirm the temperature condition or the like at the time of the operation of the inspection apparatus 1000 via the monitor 300. The monitor 300 has a display screen 301 composed of, for example, a liquid crystal screen, and is disposed on the front side of the inspection apparatus 1000 (on the positive side in the Z direction). As shown in FIG. 9, on the right side (the positive side in the X direction) of the tray removal area A5, a mouse-sliding table 600 for use when the operation is displayed on the screen of the monitor 300 is provided.

Further, the signal lamp 400 can notify the operation state of the inspection apparatus 1000 or the like by combining the colors of the light emission. The signal lamp 400 is disposed on the upper portion of the inspection device 1000. Further, a speaker 500 is built in the inspection device 1000. The operating state of the inspection device 1000 or the like can also be reported by the speaker 500.

As shown in FIG. 10, the inspection apparatus 1000 is divided (separated) by the first partition 61 between the tray supply area A1 and the supply area A2, and is divided by the second partition 62 between the supply area A2 and the inspection area A3. The inspection area A3 and the collection area A4 are partitioned by the third partition wall 63, and are partitioned between the collection area A4 and the tray removal area A5 by the fourth partition wall 64. Further, the supply region A2 and the recovery region A4 are also partitioned by the fifth partition wall 65. These partition walls have a function of maintaining the airtightness of each of the regions A1 to A5. Further, the inspection apparatus 1000 has its outermost layer covered by a cover body having, for example, a front cover 70, a side cover 71, a side cover 72, a rear cover 73, and an upper cover 74. Further, an inner partition wall 66 is disposed on the inner side of the rear cover 73.

As described above, the temperature adjustment unit 120 includes the cooling member 121 that can cool the IC element 90 and the heating member 122 that can heat the IC element 90. As shown in FIG. 12, in the inspection apparatus 1000, two temperature adjustment sections 120 are provided, and the two temperature adjustment sections 120 are arranged in the Y direction, that is, the upper and lower sides in FIG. 12 (the positive side and the negative side of the Y direction). ). Hereinafter, sometimes in Figure 12 The temperature adjustment unit 120 on the lower (negative) side is referred to as "temperature adjustment unit 120A", and the temperature adjustment unit 120 on the upper (positive) side is referred to as "temperature adjustment unit 120B". Since the temperature adjustment unit 120A and the temperature adjustment unit 120B have the same configuration except for the arrangement position, the temperature adjustment unit 120A will be representatively described.

The cooling member 121 is configured such that the internal refrigerant RF flows down, thereby performing cooling with respect to the IC element 90.

Further, since the refrigerant RF is, for example, liquid nitrogen (liquid nitrogen) and has a relatively high cooling efficiency (cooling energy), it is preferably used for cooling the IC element 90. As shown in FIGS. 9 and 10, the refrigerant RF is previously filled in a storage tank 700 provided outside the inspection apparatus 1000. Further, as shown in FIG. 11, the storage tank 700 is connected to the temperature adjustment unit 120, the component supply unit 114, the component transfer head 117, and the inspection unit 116 via the piping 23. Thereby, the refrigerant RF is supplied to the temperature adjustment unit 120, the component supply unit 114, the component transfer head 117, and the inspection unit 116, respectively.

Further, a valve 24a is provided in the middle of the pipe 23 leading to the temperature adjustment unit 120. By controlling the opening and closing of the valve 24a, it is possible to switch the supply of the refrigerant RF to the temperature adjustment unit 120 and stop the supply. Similarly, a valve 24b is also provided in the middle of the piping 23 to the component supply unit 114. By controlling the opening and closing of the valve 24b, it is possible to switch the supply of the refrigerant RF to the component supply unit 114 and stop the supply. Further, a valve 24c is also provided in the middle of the pipe 23 leading to the component transfer head 117. By controlling the opening and closing of the valve 24c, it is possible to switch the supply of the refrigerant RF to the component transfer head 117 and stop the supply. Further, a valve 24d is provided in the middle of the pipe 23 leading to the inspection unit 116. By controlling the opening and closing of the valve 24d, it is possible to switch the supply of the refrigerant RF to the inspection unit 116 and stop the supply.

As shown in FIG. 14, the cooling member 121 is formed by laminating and joining the first member 3a having a flat shape and the second member 3b having a flat shape. Thereby, on the lower surface of the first member 3a 31 or the upper surface 32 of the second member 3b, or both surfaces (the lower surface 31 and the upper surface 32) form a groove, and this groove can be used as the flow path 33 through which the refrigerant RF flows. Therefore, the member constituting the flow path 33 can be omitted, and the cooling member 121 can be made simple. Further, in the present embodiment, a groove is formed in the lower surface 31 of the first member 3a, and the groove is used as the flow path 33. Further, as a method of joining the first member 3a and the second member 3b, for example, a method of fastening using a plurality of bolts can be employed.

Further, a groove 34 parallel to the flow path 33 is formed on the lower surface 31 of the first member 3a. In the groove 34, a sealing member 30 is disposed along the groove 34. The sealing member 30 is made of an elastic material and is in a compressed state between the first member 3a and the second member 3b. Thereby, the liquid tightness (or airtightness) between the first member 3a and the second member 3b, that is, in the flow path 33 can be maintained. Therefore, it is possible to prevent the refrigerant RF during the flow in the flow path 33 from leaking from between the first member 3a and the second member 3b.

Further, the elastic material constituting the sealing member 30 is not particularly limited, and various rubber materials such as urethane rubber, enamel rubber, and fluororubber can be used.

As described above, a groove used as the flow path 33 is formed on the lower surface 31 of the first member 3a. For example, in addition to the formation region of the groove (flow path 33), depending on the entire length or depth of the groove, a certain amount of bending may occur in the first member 3a alone (self).

The upper surface 35 of the first member 3a is mounted with the electronic component mounting member 100. Therefore, when the first member 3a is maintained in a curved state, the electronic component mounting member 100 on the upper surface 35 may also follow the first The member 3a is bent. In this state, even if the component carrying head 13 holds the IC component 90 located in the recess 101 of the electronic component mounting member 100 and is to be pulled upward, the electronic component mounting member 100 is bent, so that the IC component cannot be completely held. 90. That is, the situation of insufficient holding.

On the other hand, in the cooling member 121, the first member 3a is bent, and in order to eliminate the bending, the second member 3b thicker than the first member 3a is joined. Thereby, the upper surface 35 of the first member 3a can be corrected to have a horizontal planar shape. Therefore, the electronic component mounting member 100 on the upper surface 35 can also be prevented from being bent. In the electronic component mounting member 100 in this state, the IC component 90 can be stably lifted by the component transfer head 13.

Further, it is preferable that the thickness t _3b of the second member 3b is thicker than the thickness t _{3a of the} first member 3a. For example, it is preferably 1.2 times or more and 3 times or less, more preferably 1.5 times or more and 2 times or less the thickness t _3a . Thereby, on the one hand, the increase in the thickness t _{3b is} suppressed, and the bending of the first member 3a can be eliminated regardless of the magnitude of the bending of the first member 3a.

As shown in FIGS. 12 and 13, the first member 3a and the second member 3b have the same shape and size in plan view.

The first member 3a (the second member 3b is also the same) is formed to have a first side 361, a second side 362 that is parallel to the first side 361, a third side 363 that is orthogonal to the first side 361, and The rectangle (rectangular) of the fourth side 364 which is parallel to the third side and parallel. In the present embodiment, the first member 3a is formed in a rectangular shape that is long in the Y-axis direction, and the lengths of the first side 361 and the second side 362 are longer than the lengths of the third side 363 and the fourth side 364. By forming such a relatively simple external shape, when the first member 3a is obtained by mechanical processing from the base material of the metal plate, the machining can be easily and inexpensively performed.

As a constituent material of the first member 3a and the second member 3b, for example, various metal materials can be used, and among the metal materials, aluminum having a high thermal conductivity and easy machining is preferable.

However, in the same manner as the cooling plate described in Patent Document 1, for example, liquid nitrogen flows only in the flow cell of the crucible, and uniform cooling cannot be performed on the cooling plate. This is because the cooling plate has a tendency that the heat of the outer peripheral side is more likely to enter and exit than the center portion.

Therefore, in the temperature adjustment unit 120A, it is configured to uniformly cool the plurality of IC elements 90 on the cooling member 121. Hereinafter, this configuration will be described.

As described above, the cooling member 121 is provided with a flow path 33 through which the refrigerant RF flows. As shown in FIG. 13, the flow path 33 includes a first flow path 37 through which the refrigerant RF flows, and a second flow path 38 that communicates with the first flow path 37 and that supplies the refrigerant RF.

When the cooling member 121 is viewed in a plan view, the first flow path 37 is the starting point of the inflow port 371 into which the refrigerant RF flows into the first flow path 37, and is approached (biased) toward the outer peripheral side of the cooling member 121 as much as possible. The order of the one side 361, the third side 363, the second side 362, and the fourth side 364 is formed along each side.

A linear portion 372 which is linear, a crank-shaped or meandering crank-shaped portion 373, and a linear portion are formed in the portion along the first side 361 of the first flow path 37 from the upstream side to the downstream side. Straight portion 374.

Further, the first flow path 37 is formed in a direction in which a corner portion (corner) 365 formed by the first side 361 and the third side 363 is formed, and a linear portion is formed in a portion along the third side 363. 375.

Further, the first flow path 37 is formed in a direction in which the third side 363 and the second side 362 are formed at a corner (corner) 366 side, and a linear portion is formed in a portion along the second side 362. 376.

Further, the first flow path 37 is shifted in the direction of the corner (corner) 367 formed by the second side 362 and the fourth side 364, and a linear portion 377 is formed in a portion along the fourth side 364. .

The flow path 33 is formed in the subsequent U-shaped folded-back portion 331 of the linear portion 377, and enters toward the inner side of the first flow path 37, that is, toward the center side of the cooling member 121. The first flow path 37, which is the self-going path, is transferred to the second flow path 38 which is the circuit. The folded portion 331 is a portion where the first flow path 37 and the second flow path 38 are connected.

When the cooling member 121 is viewed in plan, the second flow path 38 is located inside the first flow path 37, and the fourth side 364, the second side 362, and the third side 363 are opposite to the first flow path 37. The order of the first side 361 is formed along each side.

A linear portion 381 having a linear shape is formed in a portion of the second flow path 38 along the fourth side 364. The linear portion 381 is disposed in parallel with the linear portion 377 of the first flow path 37, and the direction in which the refrigerant RF flows is also opposite to the linear portion 377.

Further, the second flow path 38 is formed in a direction in which the corner portion 367 is switched, and a linear portion 382 which is linear in a portion along the second side 362 is formed. The linear portion 382 is disposed in parallel with the linear portion 376 of the first flow path 37, and the direction in which the refrigerant RF flows is also opposite to the linear portion 376.

Further, the second flow path 38 is formed in a direction in which the corner portion 366 is switched, and a linear portion 383 is formed in a portion along the third side 363. The straight portion 383 and the straight portion 375 of the first flow path 37 are arranged side by side, and the direction in which the refrigerant RF flows is also opposite to the linear portion 375.

Further, the second flow path 38 is formed in the direction in which the corner portion 365 is shifted, and a portion along the first side 361 is formed with a crotch portion 384 which is repeated close to the linear portion 374 of the first flow path 37. The straight portion 385 has a linear shape on the downstream side of the crotch portion 384. The crotch portion 384 is in a state of being arranged in parallel with the linear portion 374 of the first flow path 37, and the direction in which the refrigerant RF flows is also opposite to the linear portion 374. The linear portion 385 is also disposed in parallel with the linear portion 372 of the first flow path 37, and the direction in which the refrigerant RF flows is also opposite to the linear portion 372.

Further, the second flow path 38 is an end point of the outflow port 386 through which the refrigerant RF flows out from the second flow path 38.

As described above, the flow path 33 is formed in the first side 361, the second side 362, the third side 363, and the fourth side 364 from the linear portion 372 to the linear portion 377 of the first flow path 37. The outer side of the flow path 38 surrounds the linear portion 381 of the second flow path 38 to the crotch portion 384. Further, the temperature of the refrigerant RF flowing down the first flow path 37 located outside is lower than the temperature of the refrigerant RF flowing down the second flow path 38 inside. With this configuration, even if the cooling member 121 having a tendency to enter and exit the heat on the outer peripheral side is more likely to be lower than the center portion, the cooling function can be prevented from being lowered in the first flow path 37, and a sufficient cooling function can be exhibited. Thereby, a plurality of IC elements 90 can be uniformly cooled on the cooling member 121.

In the present embodiment, when the average temperature of the refrigerant RF flowing through the entire flow path 33 is measured, the portion lower than the average temperature is referred to as "first flow path 37", and the portion exceeding the average temperature is referred to as " The second flow path 38" is not limited thereto. For example, 1/2 of the upstream side of the entire flow path 33 may be referred to as "first flow path 37", and 1/2 of the downstream side may be referred to as "second flow path 38".

As shown in FIG. 13, the inflow port 371 and the outflow port 386 are arranged to be biased on the fourth side 364 side of the first side 361 to the fourth side 364. Thereby, the inflow port 371 can be placed as close as possible to the outflow port 386, whereby the refrigerant RF supply to the cooling member 121 and the refrigerant RF can be performed using one of the manifold joints 5 (see FIG. 15) to be described later. discharge.

Further, the folded portion 331 is also biased and placed on the side of the fourth side 364. Thereby, the first flow path 37 is along the first side 361 to the fourth side 364, whereby the entire length of the first flow path 37 can be ensured to be as long as possible, contributing to a plurality of IC elements. 90 uniform cooling.

As shown in FIG. 12, the cooling member 121 and the temperature adjustment unit of the temperature adjustment unit 120A The cooling members 121 of 120B are disposed to face each other with the fourth side 364 facing each other. In other words, the temperature adjustment unit 120A and the temperature adjustment unit 120B are arranged in point symmetry around the intermediate point of each other. Thereby, as shown in FIG. 15, the manifold joint 5 can be disposed inside (the negative side in the Z-axis direction) between the temperature adjustment unit 120A and the temperature adjustment unit 120B.

The manifold joint 5 includes a manifold body 51 and a joint 52 to a joint 57 connected to the manifold body 51.

The manifold body 51 includes an internal flow path 511 for the refrigerant RF to flow from the joint 52 to the joint 53 and the joint 54, and an internal flow path 512 for the refrigerant RF to flow from the joint 55 and the joint 56 to the joint 57.

The joint 52 is connected to a pipe (third flow path) 701 through which the refrigerant RF flows from the sump 700. The joint 53 is connected to the inflow port 371 of the cooling member 121 of the temperature adjustment unit 120A via the tube 702. The joint 54 is connected to the inflow port 371 of the cooling member 121 of the temperature adjustment portion 120B via the tube 703. By the connection, the refrigerant RF from the storage tank 700 is supplied to the cooling member 121 of the temperature adjustment unit 120A and the cooling member 121 of the temperature adjustment unit 120B.

The joint 55 is connected to the outlet 386 of the cooling member 121 of the temperature adjustment unit 120A via a pipe 704. The joint 56 is connected to the outlet 386 of the cooling member 121 of the temperature adjustment unit 120B via a pipe 705. The joint 57 is connected to a liquid discharge portion (not shown) via a pipe (fourth flow path) 706. By the connection, the refrigerant RF discharged from the cooling member 121 of the temperature adjustment unit 120A and the cooling member 121 of the temperature adjustment unit 120B is recovered by the liquid discharge unit.

The cooling member 121 having the above configuration is disposed between the electronic component mounting member 100 and the heating member 122 (see FIG. 14).

The heating member 122 is a rubber heater that can heat the IC component 90. The rubber heater has a sheet shape and is configured to generate heat by energization. Thereby, the heating member 122 becomes thin. The power density of the rubber heater used as the heating member 122 is not particularly limited, but is preferably, for example, 0.5 W/cm ² or more and 20 W/cm ² or less, more preferably 10 W/cm ² or more and 15 W/cm ² or less. Moreover, it is preferable that the area of the rubber heater in plan view is 0.6 times or more and 1.2 times or less, more preferably 0.8 times or more and 1 time or less of the area of the cooling member 121 in plan view.

In the temperature adjustment unit 120A, when the heating member 122 is energized, heat can be generated relatively early, and the IC element 90 is rapidly heated by the heat. On the other hand, the refrigerant RF flowing down the flow path 33 of the cooling member 121 is supplied from the storage tank 700 provided outside the inspection apparatus 1000 as described above. Therefore, the cooling capacity may be lowered before reaching the cooling member 121. As described above, when the heating efficiency of the heating member 122 and the cooling member 121 with respect to the IC element 90 is compared, the thermal efficiency of the cooling member 121 tends to be lower than that of the heating member 122, that is, the energy loss tends to be high.

On the other hand, in the temperature adjustment unit 120A, the cooling member 121 having a high energy loss is disposed at a position close to the IC element 90, and the heating member 122 having a low energy loss is disposed in the cooling member 121. Relatively far away. With such a configuration, cooling and heating of the IC element 90 can be performed quickly and efficiently, and under good balance.

Further, as shown in FIG. 14, the second member 3b is disposed between the first member 3a and the heating member 122, and the lower surface 39 is in contact with the heating member 122. As a result, when the temperature adjustment unit 120A heats the IC element 90, the second member 3b functions as a heat storage unit that temporarily stores the heat generated by the heating member 122. Therefore, the IC element 90 that is transported one by one can be continuously and stably heated.

(Embodiment 3)

The electronic component inspection device of the third embodiment will be described below. In addition, in the following In the description, the same components and members as those in the above-described embodiments are denoted by the same reference numerals, and the description thereof will be omitted or simplified.

As shown in FIGS. 16 and 17, the inspection apparatus 2000 according to the third embodiment includes the following components: an electronic component transporting device (processor) that transports the IC component 90 in each of the regions A1 to A5, and an inspection unit 216 that checks The inspection is performed in the area A3; and the control unit 800. Further, the inspection device 2000 includes a monitor 300, a signal lamp 400, and an operation panel 900.

In the supply area A2, a temperature adjustment unit (a soak plate, a Chinese description (an example): a temperature equalization plate) 220, a component transfer head 13, and a tray conveyance mechanism 15 are provided.

The temperature adjustment unit 220 may mount a plurality of IC elements 90, and the IC elements 90 may be cooled once, which may be referred to as a “heating plate”. By the heat equalizing plate, the IC element 90 before inspection by the inspection unit 216 can be previously cooled and adjusted to a temperature suitable for the inspection (low temperature inspection). In the configuration shown in FIG. 17, the temperature adjustment unit 220 is disposed and fixed in the Y direction. The IC component 90 on the tray 200 carried in (transferred) from the tray supply area A1 by the tray transport mechanism 11A is carried into the temperature adjustment unit 220 of either one.

The component transfer head 13 is supported to be movable in the X direction, the Y direction, and the Z direction in the supply region A2. Thereby, the component transfer head 13 is responsible for transporting the IC component 90 between the tray 200 carried in from the tray supply area A1 and the temperature adjustment unit 220, and transporting the IC component 90 between the temperature adjustment unit 220 and the component supply unit 214 which will be described later. .

The inspection area A3 is an area in which the IC component 90 is inspected. In the inspection area A3, an inspection unit 216 and a component transfer head 217 are provided. Further, a component supply unit 214 that moves so as to straddle the supply area A2 and the inspection area A3, and an element recovery unit 218 that moves so as to straddle the inspection area A3 and the recovery area A4 are provided.

The component supply unit 214 is a mounting unit that is placed on the temperature-adjusted IC element 90 of the temperature adjustment unit 220 and can be transported (moved) to the vicinity of the inspection unit 216, and may be referred to as a “supply shuttle”. Board (or simply "supply shuttle").

Further, the component supply unit 214 is supported to reciprocate in the X direction (one of the horizontal directions) between the supply region A2 and the inspection region A3. In the configuration shown in FIG. 17, two component supply units 214 are arranged in the Y direction, and the IC component 90 on the temperature adjustment unit 220 is transported to the component supply unit 214 of either one. Further, the component supply unit 214 is configured similarly to the temperature adjustment unit 220, and is configured to cool the IC element 90 placed on the component supply unit 214. Thereby, the IC element 90 whose temperature is adjusted by the temperature adjustment unit 220 can be transported to the vicinity of the inspection unit 216 of the inspection area A3 while maintaining the temperature adjustment state.

The element transfer head 217 is an operation unit that holds (places) the IC element 90 that is maintained in the temperature adjustment state and transports the IC element 90 in the inspection area A3. The component transfer head 217 is supported as a part of a mechanism that can reciprocate in the Y direction and the Z direction in the inspection area A3 and is a so-called "loading arm". Thereby, the element transfer head 217 can transport and mount the IC element 90 on the component supply unit 214 carried in from the supply area A2 toward the inspection unit 216. Further, the component transfer head 217 is supported to be reciprocally movable in the Y direction in the inspection region A3. However, the present invention is not limited thereto, and may be supported to reciprocate in the X direction.

Further, the element transfer head 217 is configured similarly to the temperature adjustment unit 220, and is configured to cool the held IC element 90. Thereby, the temperature adjustment state of the IC element 90 can be continuously maintained from the element supply unit 214 to the inspection unit 216.

The inspection unit 216 is a mounting portion that mounts the IC device 90 and inspects and tests the electrical characteristics of the IC device 90. The inspection unit 216 is provided with a terminal portion electrically connected to the IC component 90. Multiple probe pins. Further, the terminal portion of the IC component 90 is electrically connected (contacted) to the probe pin, and the IC component 90 is inspected via the probe pin. The inspection of the IC component 90 is performed based on a program stored in the inspection control unit provided in the tester connected to the inspection unit 216. Further, in the inspection unit 216, similarly to the temperature adjustment unit 220, the IC element 90 can be cooled, and the IC element 90 can be adjusted to a temperature suitable for inspection.

Further, the inspection unit 216, the temperature adjustment unit 220, the component supply unit 214, and the element transfer head 217 may be configured to heat the IC element 90 in addition to the IC element 90.

The component collection unit 218 is an IC component 90 that can be placed on the inspection unit 216 and that is transported (moved) to the placement area of the collection area A4, and may be referred to as a “recycling shuttle plate (or only "Recycling Shuttle")".

Further, the component recovery unit 218 is supported to reciprocate in the X direction (one of the horizontal directions) between the inspection region A3 and the recovery region A4. In the configuration shown in FIG. 17, the component collection unit 218 is similar to the component supply unit 214, and is disposed in the Y direction. The IC component 90 on the inspection unit 216 is transported and placed on either one. Component recovery unit 218. This transfer is performed by the component transfer head 217.

The recovery area A4 is a region in which a plurality of IC elements 90 at the end of the inspection are recovered. In the collection area A4, a collection tray 19, a component transfer head 20, and a tray conveyance mechanism 21 are provided. Further, an empty tray 200 is also provided in the collection area A4.

The recovery tray 19 is placed on the mounting portion of the IC device 90 that has been inspected by the inspection unit 216, and is fixed so as not to move in the recovery area A4. By this means, even if the collection area A4 of the various movable parts such as the plurality of element transfer heads 20 is disposed, the IC element 90 that has been inspected can be stably placed on the recovery tray 19. In addition, in the configuration shown in FIG. 17, recycling Three trays 19 are arranged along the X direction.

Further, the empty trays 200 are also arranged in three along the X direction. The empty tray 200 is also placed on the mounting portion of the IC component 90 that is placed on the inspection unit 216. The IC component 90 on the component recovery unit 218 that has moved toward the recovery area A4 is transported and placed on either of the collection tray 19 and the empty tray 200. Thereby, the IC element 90 is classified and recovered according to each inspection result.

The component transfer head 20 is supported to be movable in the X direction, the Y direction, and the Z direction in the collection area A4. Thereby, the component transfer head 20 can transport the IC component 90 from the component collection part 218 to the collection tray 19 or the empty tray 200.

The control unit 800 has, for example, a drive control unit. The drive control unit controls, for example, driving of the following units: the tray transport mechanisms 11A and 11B, the temperature adjustment unit 220, the component transfer head 13, the component supply unit 214, the tray transport mechanism 15, the inspection unit 216, the component transport head 217, and the component recovery. The portion 218, the component transfer head 20, the tray transport mechanism 21, and the tray transport mechanisms 22A and 22B.

In addition, the inspection control unit of the tester performs inspection of electrical characteristics of the IC component 90 disposed in the inspection unit 216 based on a program stored in the memory (not shown).

The operator can set or confirm the operating conditions and the like of the inspection device 2000 via the monitor 300. The monitor 300 has a display screen (display portion) 301 composed of, for example, a liquid crystal screen, and is disposed on the front side of the inspection apparatus 2000. As shown in FIG. 16, on the right side of the tray removal area A5, a mouse-sliding table 600 for use when the screen displayed on the operation monitor 300 is placed is provided.

Further, an operation panel 900 is disposed on the lower right side of FIG. 16 with respect to the monitor 300. The operation panel 900 is different from the monitor 300, and the inspection device 2000 is released separately. Look at the action instructions.

Further, the signal lamp 400 can notify the operating state of the inspection device 2000 or the like by a combination of colors of light emission. The signal lamp 400 is disposed on the upper portion of the inspection device 2000. Further, the inspection device 2000 has a built-in speaker 500, and the speaker 500 can be used to notify the operation state of the inspection device 2000 and the like.

As shown in FIG. 17, the inspection apparatus 2000 is divided (separated) by the first partition 61 between the tray supply area A1 and the supply area A2, and is divided by the second partition 62 between the supply area A2 and the inspection area A3. The inspection area A3 and the collection area A4 are partitioned by the third partition wall 63, and are partitioned between the collection area A4 and the tray removal area A5 by the fourth partition wall 64. Further, the supply region A2 and the recovery region A4 are also partitioned by the fifth partition wall 65.

The outermost layer of the inspection device 2000 is covered by a cover body having, for example, a front cover 70, a side cover 71, a side cover 72, a rear cover 73, and an upper cover 74.

As described above, the temperature adjustment unit 220, the component supply unit 214, and the element transfer head 217 are each configured to cool the IC element 90. Hereinafter, this configuration will be described with reference to FIGS. 18 and 19.

As shown in FIG. 18, the two temperature adjustment units 220 are connected to the first refrigerant supply unit 8A via the pipe 203. In the inspection apparatus 2000, each temperature adjustment unit 220 is a first placement unit (primary cooling unit) that cools the mounted IC element 90 by the first refrigerant RF ₁ supplied from the first refrigerant supply unit 8A. . In the following, the temperature adjustment unit 220 located on the negative side in the Y direction in FIG. 18 may be referred to as “temperature adjustment unit 220A”, and the temperature adjustment unit 220 on the positive side may be referred to as “temperature adjustment unit 220B”.

Each of the temperature adjustment units 220 has a first flow path 221 through which the first refrigerant RF ₁ passes. The first flow path 221 is repeatedly bent or bent in the temperature adjustment unit 220 so that the entire IC element 90 placed on the temperature mounting portion 220 can be cooled as uniformly as possible, and the entire entire temperature adjustment unit 220 is spread over the entire temperature adjustment unit 220. And formed. Further, when the first refrigerant RF ₁ is repeatedly bent or bent in the first flow path 221, temperature changes gradually from the inlet 222 to the outlet 223 (for example, even if it enters from the inlet 222 at -65 degrees, the outlet 223 becomes -55 degrees. Therefore, by forming the outward path and the loop in parallel, a more uniform temperature can be set.

The first refrigerant supply unit 8A supplies the refrigerant as the liquid of the first refrigerant RF ₁ to the respective temperature adjustment units 220 via the pipe 203.

The first refrigerant supply unit 8A has a storage tank 81 that stores the first refrigerant RF ₁ at a specific temperature and a cooler 83 that is connected to the storage tank 81 via a pipe 82. Further, the temperature of the first refrigerant RF ₁ in the storage tank 81 is preferably lower than the temperature of the inspection temperature of the IC element 90 of the inspection unit 216, and is preferably, for example, a temperature lower by 10 to 25 degrees than the inspection temperature. Specifically, the temperature of the first refrigerant RF ₁ is preferably -80 degrees or more and -50 degrees or less, more preferably -65 degrees or more and -55 degrees or less. As an example, when the inspection temperature is set to -60 degrees, it is preferable to set the temperature of the first refrigerant RF ₁ to about -80 to -75 degrees, and when the inspection temperature is -45 degrees. Preferably, the temperature of the first refrigerant RF ₁ is set to about -55 degrees.

The first refrigerant RF _{1 is} not particularly limited, and examples thereof include a fluorine-based refrigerant (fluorine-based inert liquid) such as VERTREL SINERA (registered trademark), GALDEN (registered trademark), NOVEC, and FLUORINERT (registered trademark). It is better to use VERTREL SINERA.

The pipe 203 includes a first pipe 231 connected to the storage tank 81 side, a second pipe 232 connected to the cooler 83 side, and a third pipe 233 connecting the first pipe 231 and the first flow path of the temperature adjustment unit 220A. An inlet 222 of 221; a fourth tube 234 connected to the outlet 223 and the second tube 232 of the first flow path 221 of the temperature adjustment unit 220A; and a fifth tube 235 which is disposed in the fourth tube 234 The flow rate adjustment valve 304, the first pipe 231, and the inlet 222 of the first flow path 221 of the temperature adjustment unit 220B are connected; the sixth pipe 236 connects the outlet 223 of the first flow path 221 of the temperature adjustment unit 220B with The second tube 232 is connected; the flow rate adjustment valve 306 is provided in the middle of the sixth tube 236.

After the first refrigerant RF ₁ flows out of the storage tank 81, the first pipe 231, the third pipe 233 (or the fifth pipe 235), and the first flow path 221 of the temperature adjustment unit 220A (or the temperature adjustment unit 220B) are sequentially passed. The fourth tube 234 (or the sixth tube 236) and the second tube 232 flow into the cooler 83.

When the first refrigerant RF ₁ passes through the first flow path 221, it is cooled by the IC element 90. By this cooling (primary cooling), the IC element 90 which has been at a normal temperature up to this point is quenched to the vicinity of the above-mentioned inspection temperature. In such rapid cooling, as the first refrigerant RF ₁ , a fluorine-based refrigerant as described above can be preferably used. Further, the flow rate adjustment valve 304 and the flow rate adjustment valve 306 can adjust the flow rate of the first refrigerant RF ₁ passing through each of the temperature adjustment units 220 to be equal.

Further, the first refrigerant RF ₁ flowing into the cooler 83 is cooled by the cooler 83 to the initial temperature, that is, heat exchange is performed. Thereafter, the first refrigerant RF ₁ is returned to the storage tank 81 through the pipe 82.

Further, a first valve 237 is provided in the middle of the first pipe 231, and a second valve 238 is provided in the middle of the second pipe 232. Thereby, the supply of the first refrigerant RF ₁ can be switched and stopped.

As described above, each temperature adjustment unit 220 is fixed. On the other hand, when the temperature adjustment unit 220 is movable, the third tube 233 connected to, for example, the temperature adjustment unit 220A may be broken by fatigue or the joint of the third tube 233 ( The screw (not shown) is slack, and the first refrigerant RF _{1 is} leaked. In this case, since the first refrigerant RF ₁ is a liquid, the surrounding mechanism or the like is wetted. However, by fixing each temperature adjustment unit 220, it is possible to reduce (suppress) the leakage of the first refrigerant RF ₁ .

As shown in FIG. 19, the two component supply unit 214 and the component transfer head 217 are connected to the second refrigerant supply unit 8B via the pipe 204. In the inspection apparatus 2000, each of the element supply unit 214 and the element transfer head 217 is a second stage in which the mounted IC element 90 is cooled by the second refrigerant RF ₂ supplied from the second refrigerant supply unit 8B. Department (2nd cooling unit). In the following, the component supply unit 214 located on the negative side in the Y direction in FIG. 19 is referred to as “element supply unit 14A”, and the component supply unit 214 located on the positive side may be referred to as “element supply unit 14B”.

Each of the component supply units 214 has a second flow path 141 through which the second refrigerant RF ₂ passes. The second flow path 141 repeats the meandering or bending in the element supply unit 214 so that the entire IC element 90 placed on the element supply unit 214 can be cooled as uniformly as possible, and the entire unit supply unit 214 is substantially integrated. And formed.

The element transfer head 217 also has a second flow path 171 through which the second refrigerant RF ₂ passes. The second flow path 171 is formed by repeating meandering or bending in the element transfer head 217 so that all of the IC elements 90 held by the element transfer head 217 can be cooled as uniformly as possible.

The second refrigerant supply unit 8B supplies the refrigerant as the gas of the second refrigerant RF ₂ to the component supply unit 214 and the component transfer head 217 via the pipe 204.

The second refrigerant supply unit 8B includes a storage tank 84 that is filled with a second refrigerant RF ₂ at a specific temperature and a pump 86 that is connected to the storage tank 84 via a pipe 85. Further, the temperature of the second refrigerant RF ₂ in the storage tank 84 is preferably lower than the temperature of the first refrigerant RF _{1 in} the storage tank 81, and is preferably, for example, -120 degrees or more and -80 degrees or less, more preferably -110 degrees or more, -90 degrees or less.

As the second refrigerant RF ₂ , it is preferable to use air in a dry state. Here, the "dry state" refers to a state in which the occurrence of dew condensation can be prevented even if the second refrigerant RF ₂ is released in each of the regions A1 to A5 of the inspection apparatus 2000.

The pipe 204 includes a first pipe 41 connected to the pump 86 side, a second pipe 42 connecting the first pipe 41 to the inlet 142 of the second flow path 141 of the component supply portion 14A, and a third pipe 43. The first tube 41 is connected to the inlet 142 of the second flow path 141 of the component supply portion 14B.

The second refrigerant RF _{2 that has} flowed out of the pump 86 as a compressed gas sequentially passes through the second flow of the first pipe 41, the second pipe 42 (or the third pipe 43), and the component supply portion 14A (or the component supply portion 14B). The road 141 is discharged from the outlet 143 of the second flow path 141. When the second refrigerant RF ₂ passes through the second flow path 141, it is cooled by the IC element 90. By this cooling, the IC element 90 which is rapidly cooled by the temperature adjustment unit 220 and adjusted to the vicinity of the inspection temperature maintains the temperature adjustment state.

Further, the pipe 204 has a fourth pipe 44 that connects the pump 86 side to the inlet 172 of the second flow path 171 of the component transfer head 217. The second refrigerant RF ₂ that has flowed out of the pump 86 sequentially passes through the fourth tube 44 and the second flow path 171 of the element transfer head 217, and is discharged from the outlet 173 of the second flow path 171. When the second refrigerant RF ₂ passes through the second flow path 171, it is cooled by the IC element 90. By this cooling, the IC element 90 can continue to maintain the temperature adjustment state maintained by the component supply unit 214 until it is transported to the inspection unit 216.

Further, the first valve 45 is provided in the middle of the first pipe 41. Thereby, the supply of the second refrigerant RF ₂ to each of the component supply units 214 can be switched and stopped. A second valve 46 is also provided in the middle of the fourth tube 44. Thereby, the supply of the second refrigerant RF ₂ to the component transfer head 217 can be switched and stopped.

As described above, it is sufficient to perform the secondary cooling for maintaining the temperature adjustment state of the IC element 90 by the second refrigerant RF ₂ having a smaller specific heat than the first refrigerant RF ₁ . Since the second refrigerant RF ₂ is air as described above, it is not necessary to obtain a cost, and it contributes to suppressing the running cost of the inspection apparatus 2000.

Further, since the specific heat of the second refrigerant RF ₂ is smaller than that of the first refrigerant RF ₁ , the temperature in the second flow path 141 or the second flow path 171 can be set to be higher than the temperature of the first refrigerant RF ₁ in the first flow path 221 . Lower. Thereby, the temperature adjustment state of the IC element 90 can be sufficiently maintained.

As described above, in the inspection apparatus 2000, the IC element 90 is placed in the middle of the conveyance to the inspection unit 216, and is first placed on the temperature adjustment unit 220 having a high cooling capacity and quenched. Thereby, the IC component 90 is quickly tempered to an inspection temperature suitable for inspection. Thereafter, the IC element 90 is placed on the component supply unit 214 and the component transfer head 217 whose cooling capacity is suppressed. Thereby, the IC element 90 is transported to the inspection unit 216 while maintaining the state of being tempered to the inspection temperature (cooling state).

Further, since the component supply unit 214 is a moving portion, and the second refrigerant RF _{2 in} the component supply unit 214 is a gas that is lighter than the liquid, the load applied to the motor as the driving source of the component supply unit 214 can be reduced. (such as vibration generated during acceleration and deceleration, etc.). Similarly, since the component transfer head 217 is also a moving portion, and the second refrigerant RF ₂ passing through the component transfer head 217 is a lighter gas than the liquid, the motor applied to the drive source as the component transfer head 217 can be reduced. The load (such as vibration generated during acceleration and deceleration, etc.).

As shown in FIG. 19, a pipe 205 through which the second refrigerant RF ₂ passes is connected to the downstream side of each component supply unit 214 and the element transfer head 217. The piping 205 can supply the second refrigerant RF _{2 for} cooling the IC element 90 to the supply line in each of the above-described areas (for example, the representative recovery area A4) of the inspection apparatus 2000.

The pipe 205 includes a first pipe 251 connected to the outlet 143 of the second flow path 141 of the component supply portion 14A, and a second pipe 252 connected to the outlet 143 of the second flow path 141 of the component supply portion 14B. The first tube 251 and the third tube 253 are connected to the outlet 173 of the second flow path 171 of the element transfer head 217 and the first tube 251.

Further, the first pipe 251 is opposite to the outlet 143 as a discharge port 510 through which the second refrigerant RF ₂ is discharged, and a heater 254 having a built-in temperature sensor (not shown) is provided in the vicinity of the discharge port 510. And, since the second coolant flows out of the outlets 143 RF _2, and from the outlet 173 of the second coolant flowing in the RF ₂ reaches the heater 254 prior to joining the first pipe 251, and is heated by the heater 254 to the specific temperature, That is, heat exchange is performed. Thereafter, the second refrigerant RF _{2 is} discharged from the discharge port 510. Thereby, the recovery area A4 is in a state in which the second refrigerant RF ₂ is filled, and the environment in which condensation is prevented is generated. In the inspection apparatus 2000, in addition to cooling the second refrigerant RF ₂ , it can be reused for dew condensation prevention.

Further, in the past, nitrogen was used as a gas for preventing condensation formation in the recovery area A4. In this case, the recovery area A4 becomes an anoxic state, and an oxygen deficiency detecting sensor for detecting the anoxic state is necessary. On the other hand, by using the second refrigerant RF ₂ , which is air, as the dew prevention, it is possible to prevent oxygen deficiency in the recovery area A4. Thereby, the maintenance can be performed immediately when maintenance in the collection area A4 is necessary, for example. Also, the oxygen deficiency detecting sensor can be omitted.

Further, a flow rate adjustment valve 501 is provided on the side of the first pipe 251 as close as possible to the outlet 143, and a flow rate adjustment valve 502 is provided in the middle of the second pipe 252. Thereby, the flow rate of the first refrigerant RF ₁ passing through each component supply unit 214 can be uniformly adjusted. Further, it is preferable to provide a flow rate adjusting valve 503 in the middle of the third pipe 253.

The electronic component conveying apparatus and the electronic component inspection apparatus of the present invention have been described with respect to the embodiments. However, the present invention is not limited thereto, and the respective components constituting the electronic component conveying device and the electronic component inspection device may be replaced with the same. Any member who performs the same function. Further, any constituent may be added.

Further, in the above embodiment, the temperature adjustment unit includes one set of the first member and the second member. However, the present invention is not limited thereto, and may have a complex array and the layers are multi-layered. By. In this case, the temperature of the temperature adjustment unit is further averaged, that is, the temperature is more uniform as the entire temperature adjustment unit.

Further, the first member (the second member is also the same) is not limited to a rectangular shape, and may be another rectangular shape having at least four sides of the first side to the fourth side. In addition, as other rectangles, squares are also included.

Further, the refrigerant for cooling the IC device is not limited, and is liquid in the above embodiment, but a gas may be used.

Claims (9)

An electronic component transporting apparatus comprising: an electronic component mounting member arranging an electronic component; a cooling member capable of mounting the electronic component mounting member; and cooling the electronic component; and a heating member The electronic component is heated; and the cooling member is disposed between the electronic component mounting member and the heating member. The electronic component conveying apparatus of claim 1, wherein the cooling member is formed by laminating a first member and a second member. The electronic component conveying apparatus according to claim 1, wherein the cooling member has a flow path through which a fluid as a refrigerant flows, and the flow path is formed in the first member and is formed by a groove through which the fluid passes. The electronic component conveying apparatus of claim 1, wherein a sealing member that maintains liquid-tightness or airtightness between the first member and the second member is disposed. The electronic component transport device of any one of claims 2 to 4, wherein The second member is disposed between the first member and the heating member. The electronic component conveying apparatus according to any one of claims 2 to 4, wherein the thickness of the second member is thicker than the thickness of the first member. The electronic component transporting apparatus according to any one of claims 1 to 4, wherein the cooling member is cooled by a fluid. The electronic component transporting apparatus of claim 7, wherein the cooling member has a flow path through which the fluid flows. An electronic component inspection device comprising: an electronic component mounting member arrangable with an electronic component; a cooling member capable of mounting the electronic component mounting member and capable of cooling the electronic component; and a heating member capable of heating The electronic component; and an inspection unit that inspects the electronic component; and the cooling member is disposed between the electronic component mounting member and the heating member.