JP2008107014A - Cooling device, and cooling method of chamber space for device test - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooling device of simple structure capable of reducing its cost and dimension, stably supplying a cold gas of a desired low temperature and not having influence by temperature variation on a cooled space side, and to provide a cooling method of a chamber space for device test of a handler. <P>SOLUTION: A sealed container of this cooling device is communicated with a cooled space side, and further communicated with a liquid nitrogen source and an air supply source. The low temperature cooling gas of desired low temperature is produced while simultaneously receiving the air from the air supply source and liquid nitrogen from the liquid nitrogen source, and the produced low temperature cooling gas is supplied to the cooled space. The air from the air supply source and the liquid nitrogen from the liquid nitrogen source are simultaneously force-fed and supplied into the sealed container, and force-fed and supplied to the cooled space as the other communication passage as a destination only by its force feed pressure. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a cooling device for cooling a space to be cooled in order to cool to a desired low temperature setting temperature or to maintain the temperature setting and a method for cooling a device test chamber space.

  There may be a need for a device that supplies a cooling medium to a place that requires a low-temperature environment or cools to a set temperature by supplying a cooling medium to a space surrounded by a heat insulating layer, and maintains this, for example, a motor, Engines such as engines, heat source equipment, people's residence space adjacent to various mechanical devices, computers, test equipment, etc. are used to cool and maintain the air conditioning equipment itself for cooling or supplying cold air. Yes. In particular, in the characteristic test of a semiconductor device or the like, it is necessary to cool and maintain the inside of the tank at a cryogenic temperature of minus 60 ° C. or lower, for example, as a device test chamber of the handler. Considering the great damage caused by defective devices due to the occurrence of dew condensation, it is necessary to generate and supply cold air at a set temperature with high accuracy. Conventionally, for example, a device disclosed in Patent Document 1 has been proposed as a cooling device in a chamber of an IC test handler.

JP 2003-28918 A

  The thing of patent document 1 is an apparatus which presses the upper surface of the device at the time of a test with a pressing member, and makes contact with a tester side reliably, holding an electronic component up and down freely from the upper part. The temperature of the cavity is detected by a temperature sensor arranged in the pressing member while introducing liquid nitrogen into the cavity of the provided pressing member, and the liquid nitrogen is ejected by the temperature detection signal. However, in the apparatus of Patent Document 1, the liquid nitrogen injection operation means is arranged such that the tip opening of the injection pipe 50c with the valve 50b, the flow rate adjusting throttle valve 50d, etc. interposed therebetween faces the cavity 25a of the pressing member. Therefore, while adjusting the flow rate of the liquid nitrogen, the liquid is injected into the cavity 25a as it is. For this reason, for example, a cryogenic gas having a boiling point (−) 196 ° C. It will be ejected into the part 25a, and not only the device under test is rapidly cooled and it is difficult to obtain an appropriate temperature characteristic test result, but also condensation, freezing, etc. occur, and the pressing member, the lifting arm, and the expensive tester side There was also a risk of causing a large loss. Also, with such a cooling method, it is difficult to maintain a very low temperature in a stable and highly accurate chamber, and there is a practical difficulty. Furthermore, in this patent document 1, as an instantaneous vaporization means for controlling the flow rate of liquid nitrogen, a liquid nitrogen injection pipe in a liquid storage tank is provided with a transmitter, an electric heater, etc. In this disclosure, nitrogen gas is supplied by intermittent discharge of liquid or instantaneous vaporization. However, this also eventually results in (−) ultra-low temperature gas around 190 ° C. being a cavity on the upper surface side of the electronic component. As described above, not only is it difficult to achieve stable and accurate cooling or temperature maintenance control, but also there is a risk of device test instability and tester machine damage, as well as a device for vaporization means. The whole structure is further increased in size and is also expensive.

  The present invention has been made in view of the above-described conventional problems. One object of the present invention is to greatly reduce the manufacturing cost with a simple structure and to stably supply a desired low-temperature cold gas. Another object of the present invention is to provide a cooling apparatus capable of cooling a cooled space without being affected by temperature fluctuations on the cooled space side, and a method for cooling a chamber space for device test of a handler. Another object of the present invention is to provide a cooling device that can be reduced in size, stored and transported easily, and that can be easily maintained, and a method for cooling a device test chamber space of a handler.

  In order to achieve the above object, the present invention is a cooling device that cools a space to be cooled that requires a low-temperature environment, communicates with the space to be cooled S, and includes a liquid nitrogen source 12 and an air supply source 14. And generating the desired low-temperature low-temperature cooling gas GM while simultaneously receiving the air pumped from the air supply source 14 and the liquid nitrogen LN2 pumped from the liquid nitrogen source 12. The cooling device 10 includes a closed container 20 that supplies the cooled low-temperature gas to the space S to be cooled by pressure from an air supply source and a liquid nitrogen source.

  It is preferable to provide a vaporization conversion means 40 that forcibly converts liquid nitrogen LN2 from the liquid nitrogen source 12 into gas when it is introduced into the closed container 20. Using a closed vessel as a mixed gas preparation means for preparing a temperature-adjusted low temperature mixed gas, gasification is performed when liquid nitrogen is introduced into the hollow portion, so that the device configuration can be unified and simplified. In addition, the preparation of the set temperature gas by adjusting the gas mixture can be realized with simple control.

At that time, the vaporization conversion means 40 is constituted by an orifice portion 42 having a reduced diameter inside the supply line 15 of the liquid nitrogen LN2 communicating with the liquid nitrogen source 12 and facing the downstream discharge side into the closed container 20. Good.

  At that time, the air supplied from the air supply source 14 side is preferably air having a dew point temperature equal to or lower than the set temperature in the cooled space S.

  The air from the air supply source 14 is supplied at a constant flow rate in the closed vessel 20 according to the setting, and the flow rate of the liquid nitrogen LN2 ejected from the liquid nitrogen source 12 to the closed vessel 20 is variable to achieve desired low-temperature cooling. It is preferable to generate the gas GM for use.

  Further, a temperature sensor 94 provided in the vicinity of the low-temperature cooling gas GM outlet 88 on the cooled space S side, a flow rate adjusting valve device 26 for adjusting the flow rate of the liquid nitrogen LN2 from the liquid nitrogen source 12, and a temperature sensor 94. And a control unit 22 that changes the flow rate of the flow rate regulating valve device according to the result of comparing the temperature from the temperature to the set temperature in the space S to be cooled.

In addition, the supply pressure of air from the air supply source 14 is preferably set lower than the supply pressure of liquid nitrogen LN2 from the liquid nitrogen source 12.

  Furthermore, the air supplied from the air supply source 14 side may be dry air.

  In addition, if the device test chamber of the handler is the space to be cooled S and the air outlet 88 communicating with the closed container 20 is arranged in the chamber 70, the device test chamber of the handler is the device to be tested. A stable cooling action can be performed without adversely affecting electronic precision instruments such as test instruments.

  In addition, the present invention provides a device test chamber of the handler as a cooled space, communicates with the cooled space side, and prepares a closed container that communicates with the liquid nitrogen source and the air supply source. While supplying a constant flow of air by pressure, the closed container inlet from the liquid nitrogen source is squeezed to supply the vaporized nitrogen gas to the inside to generate a low-temperature mixed gas of air and vaporized nitrogen gas, and supply air A cooling method for the device test chamber space of the handler is characterized in that the low-temperature mixed gas is cooled and fed to the space to be cooled only by the pressure from the source and the liquid nitrogen source.

  According to the cooling device of the present invention, it is a cooling device that cools a space to be cooled that requires a low-temperature environment, and communicates with the space to be cooled and with a liquid nitrogen source and an air supply source. The low-temperature cooling gas having a desired low temperature is generated while simultaneously receiving the air pumped from the air supply source and the liquid nitrogen pumped from the liquid nitrogen source, and the generated low-temperature cooling gas is supplied to the air supply source and the liquid. Since the structure includes a closed container that supplies the space to be cooled by the pressure from the nitrogen source, the manufacturing cost can be greatly reduced with a simple structure, and a desired low-temperature cold gas can be stably supplied and The space to be cooled can be cooled without being affected by temperature fluctuations on the cooling space side. Further, the apparatus can be greatly reduced in size, stored and transported easily, and maintenance can be easily performed.

  In addition, by providing vaporization conversion means that forcibly converts liquid nitrogen from a liquid nitrogen source into a gas when it is introduced into the closed container, the liquid nitrogen is introduced into the closed container and closed with an orifice or the like. The gas can be gasified in the container, and mixing with the air introduced at the same time and generation of the mixed gas thereby can be performed efficiently and without involving a complicated mechanism.

In addition, the vaporization conversion means has a configuration in which the inner diameter of the supply line of liquid nitrogen leading to the liquid nitrogen source is reduced and the downstream discharge side faces the closed container, so that the inside of the closed container is formed. The liquid nitrogen gasification by the high pressure compression by the orifice function and the low pressure opening action when introducing the liquid nitrogen can be specifically realized in a compact closed container.

  In addition, since the air supplied from the air supply source side is air having a dew point temperature equal to or lower than the set temperature in the cooled space, it is blown out to the cooled space side as a low-temperature gas mixed and adjusted with nitrogen gas. Condensation of the gas in the space to be cooled is prevented, and the cause of condensation on the object to be cooled can be removed.

  In addition, the air from the air supply source side is supplied with a constant flow rate according to the setting in the closed vessel, and the jet flow rate of liquid nitrogen from the liquid nitrogen source to the closed vessel is variable to generate a desired low-temperature cooling gas By doing so, it is possible to easily mix and generate a gas having a low temperature (or extremely low temperature) set in the closed container, and it is possible to generate a gas having a simple control and an accurate temperature.

  Further, a temperature sensor provided in the vicinity of the low-temperature cooling gas outlet on the cooled space side, a flow rate adjusting valve device for adjusting the flow rate of liquid nitrogen from the liquid nitrogen source, the temperature from the temperature sensor, and the cooled space And a control unit that changes the flow rate of the flow rate adjusting valve device according to the result of the comparison, and cools the space to be cooled to the target low temperature, and It is possible to maintain the cooling temperature with high accuracy.

Further, the air supply pressure from the air supply source is set to be lower than the liquid nitrogen supply pressure from the liquid nitrogen source, so that the air flows back to the supply pipe on the liquid nitrogen side and has a low temperature. Without disturbing the temperature adjustment, it is possible to stably generate the desired low-temperature mixing adjustment gas in the closed vessel.

  In addition, since the air supplied from the air supply source side is dry air, air having a dew point temperature for preventing condensation on the cooled space side can be easily generated and supplied into the closed container.

  The handler device test chamber is a space to be cooled, and a blowout opening communicating with the closed container is arranged in the chamber, so that measurement electronic components in the target space without causing condensation, A highly accurate device taste can be maintained and executed without affecting the measurement electronics.

  Further, according to the method for cooling the device test chamber space of the handler of the present invention, the device test chamber of the handler is a space to be cooled, communicated with the space to be cooled, a liquid nitrogen source, an air supply source, Prepare a closed container that communicates with the air supply source, pressurize and supply a constant flow rate of air from the air supply source side, squeeze the closed container inlet from the liquid nitrogen source, and feed it into the interior as vaporized nitrogen gas to vaporize the air Since the low-temperature mixed gas is generated by nitrogen gas and cooled while pumping the low-temperature mixed gas to the space to be cooled only by the pressure from the air supply source and the liquid nitrogen source, the desired low-temperature cold gas Can be stably supplied to the space to be cooled, and the space to be cooled can be cooled without being affected by temperature fluctuations toward the space to be cooled. Further, the apparatus can be greatly reduced in size, stored and transported easily, and maintenance can be easily performed.

  The best mode for carrying out the present invention will be described below with reference to the accompanying drawings. 1 to 4 show an embodiment of the present invention, and FIG. 1 is an overall configuration diagram of a cooling device 10 according to the embodiment. In FIG. 1, the cooling device 10 of the present invention is a cooling means that uses liquid nitrogen as a cold heat source and stably supplies a low-temperature cooling gas to the space to be cooled S. In particular, in the present embodiment, A closed container 20 that is in communication with the space to be cooled S, the liquid nitrogen source 12, and the air supply source 14 at the same time, and stably supplying a low-temperature cooling gas while having an extremely simple and simple configuration. This is one of the features.

  In the present embodiment, the cooling device 10 is a closed container that is connected to the liquid nitrogen source 12, the air supply source 14, and the liquid nitrogen source 12 and the air supply source 14 via supply lines 15 and 16, respectively. 20. The closed vessel 20 communicates with the cooled space S so as to supply the nitrogen gas GM generated by being simultaneously supplied from the liquid nitrogen source 12 and the air supply source 14.

  In the present embodiment, the space to be cooled S is a space formed in a constant temperature bath of a test handler for semiconductor device characteristic test, and its operation performance varies greatly depending on the environmental temperature during use of the semiconductor device. A temperature characteristic test is performed at the time of device development or before shipment, and the inside of a semiconductor device test chamber in which the quality is determined is set as a cooling target. In the present embodiment, the test chamber 70 as a thermostatic bath is surrounded and closed inside, and a test device 76 is disposed on the lower surface side of the bottom wall 72 via a support base 74. A test socket 78 having a connection terminal (not shown) of the test apparatus 76 is fixed to the bottom wall 72 of the test chamber 70, and various kinds of test ICs such as a package IC 80 to be tested are positioned and arranged in the test socket 78. A characteristic test is performed. In addition, an operation device 82 is provided at the upper part of the socket so as to hold the package IC and move it up and down so as to ensure contact between the terminals via the work presser 84 when the electronic component is mounted on the socket. A local cooling space 86 for directly or indirectly cooling the package IC is formed in the work holder, and a cooling gas is blown into the space 86 to locally cool the space. The semiconductor device to be tested that generates heat is locally or indirectly cooled. In this embodiment, as described above, the cooling gas is supplied so as to locally cool the electronic component to be tested in the chamber. However, the present invention is not limited to this, and the cooling gas is supplied to the entire chamber space. It may be one that is blown. A first supply pipe 92 is provided in the test chamber 70 so as to pass through the chamber and maintain the air outlet 88 facing the cooling space 86 by the fixing device 90. The first supply pipe line 92 is means for introducing a cooling low-temperature gas generated in a closed container, which will be described later, into the space to be cooled, and is made of a metal pipe member such as a copper material.

  In the present embodiment, a temperature sensor 94 made of, for example, a thermocouple, a resistance temperature detector, or the like is installed in the vicinity of the air outlet near the tip of the in-chamber pipe 92a that forms part of the first supply pipe line 92. The temperature sensor 94 is a low-temperature gas outlet temperature detecting means for detecting the outlet temperature of the cooling low-temperature gas generated in the closed container and supplied to the cooled space, and feeds back the measured temperature to the control device 22 side. The controller 22 controls the flow rate of liquid nitrogen corresponding to the set temperature.

  As the liquid nitrogen source 12, for example, a known liquid nitrogen production apparatus that separates air to extract nitrogen and outputs product liquid nitrogen is used, and a delivery pressure is constantly applied by a low-temperature pump or the like. The liquid nitrogen production apparatus includes a liquid nitrogen cylinder that stores liquid nitrogen. In addition, as a liquid nitrogen manufacturing apparatus, you may use the liquid nitrogen produced | generated by the utility in a factory, for example. The liquid nitrogen source 12 and the closed container 20 are in direct communication with each other via a liquid nitrogen supply system 24. The liquid nitrogen supply system 24 is provided in the second supply pipeline 15 connected to the liquid nitrogen source (liquid nitrogen production apparatus) and the closed container 20 at both ends thereof, and the second supply pipeline 15. And a pressure regulator 28 interposed in the second supply pipe on the upstream side of the flow rate regulating valve device 26. The pressure regulator 28 is a pressure regulator that adjusts the discharge pressure from the liquid nitrogen production apparatus, and thereby adjusts the primary pressure from the liquid nitrogen production apparatus.

  The flow rate adjusting valve device 26 is a flow rate adjusting unit that adjusts the flow rate of liquid nitrogen for generating a refrigerant for setting the space to be cooled to a set low-temperature value space by a control signal from the control device 22. In the embodiment, the liquid nitrogen flow rate is adjusted and set to be variable while the pressure in the flow rate adjusting valve device is kept constant. The flow rate adjusting valve device 26 includes an electromagnetic valve that is electrically connected to the control device 22 and receives a drive signal from the control device to adjust the throttle amount of the adjusting valve.

  The air supply source 14 is an air pressure supply unit that pumps, for example, room temperature air into the closed container 20. In the present embodiment, a blower such as a blower fan is used. The air supply source 14 and the closed container 20 are in direct communication with each other via an air supply system 30. The air supply system 30 includes a third supply line 16 that is connected to and communicates with the air supply source 14 and the closed container 20, and a flow rate adjusting valve device 31 that is interposed in the third supply line 16. And a pressure regulator 33 interposed in the third supply pipe on the upstream side of the flow rate regulating valve device 31. The pressure regulator 33 sets the air pressure from the air supply source 14 to, for example, a constant pressure, and the flow rate adjusting valve device 32 holds the air flow rate at a constant flow rate to close the constant flow rate air according to the setting. Supply into the container 20.

  In the present embodiment, the air supply source 14 is provided with an air drying device (not shown) by heating, heating, dehumidification, etc., and generates dry air DA to enter the closed container 20 via the air supply system 30. Pumped.

  The air supplied from the air supply source 14 is mixed with, for example, nitrogen gas of about minus 196 ° C. in the closed container 20 and supplied to the cooled space S. At that time, for example, the set temperature of the cooled space S The air must have characteristics that do not cause condensation even at -60 ° C. For this purpose, air having a dew point temperature equal to or lower than the set temperature in the cooled space S is supplied from the air supply source 14 side, and this is supplied into the closed container 20 at a constant pressure (positive pressure) and a constant flow rate.

  At this time, the supply pressure of air from the air supply source 14 is set lower than the supply pressure of liquid nitrogen from the liquid nitrogen source 12. When the supply pressure of liquid nitrogen from the liquid nitrogen source 12 is lower than the supply pressure of air from the air supply source 14, the gas of the mixed gas to be generated in the closed vessel by the backflow of air to the liquid nitrogen supply system 24 This is because it becomes difficult to accurately control the temperature of the glass. On the other hand, a check valve device 32 is interposed in the third supply line of the air supply system so that gas does not flow backward from the closed container side to the air supply system 30 side.

  The closed vessel 20 communicates with the space S to be cooled, the liquid nitrogen source 12 and the air supply source 14 and receives air from the air supply source and liquid nitrogen from the liquid nitrogen source at the same time while receiving a desired low temperature. A cooling low-temperature gas generation container device that generates a low-temperature cooling gas and supplies the generated low-temperature cooling gas to the space S to be cooled. The liquid nitrogen from the liquid nitrogen source and the air supply source Inlet ports 34 and 36 for simultaneously introducing air are provided in the hollow portion 20I of the closed container 20. In particular, in the present embodiment, the closed container 20 is gasified instantaneously when liquid nitrogen from the liquid nitrogen source 12 is introduced into the closed container, and generates a mixed gas of the nitrogen gas and dry air DA. Mixing means.

  In the present embodiment, the closed container is made of, for example, a hollow cylindrical member made of SUS stainless steel, and the hollow portion 20I inside thereof is a cylindrical hollow having both end walls and a body wall that are made to be thicker than the material. Yes. Both end walls of the hollow portion are each formed of a circular wall surface, and one end side thereof is communicated with the cooled space side, the other end wall side is communicated with the liquid nitrogen source 12 side, and further, the cylindrical body portion is connected to the air supply source 14 side. Connection ports that communicate with each other are formed through connection fittings 37, 38, and 39, respectively. The connection ports of the connection fittings 38 and 39 are liquid nitrogen and dry air introduction ports, respectively, and the connection port of the connection fitting 37 is a delivery port for the mixed gas to the space to be cooled.

  In the embodiment, the closed container 20 has, for example, a cylindrical shape with a diameter of about 4 cm and a length of about 18 cm, and a tube thickness of about 1.5 mm. Moreover, it has a very simple structure of a hollow cylindrical body.

In FIG. 3, the cooling device 10 is provided with a vaporization conversion means 40 that forcibly converts liquid nitrogen from a liquid nitrogen source into gas when it is introduced into the closed container. In this embodiment, the vaporization conversion means 40 is composed of an orifice portion 42 having one end communicating with the liquid nitrogen source 12 communicating with the liquid nitrogen supply pipe 15 and the other end facing the closed container 20. . Specifically, in FIG. 3, the orifice portion 42 is provided on a connection fitting 34 having one end facing the hollow portion of the closed container, and the connection fitting 34 is liquid nitrogen in the supply pipe line 15 on the other end side. The portion where the source 12 is connected to the supply pipeline 15 has an inner diameter portion D1 which is substantially the same as or slightly smaller than the supply pipeline 15, and the portion facing the closed container 20 on one end side is greatly narrowed from the inner diameter D1. A small passage D2 having a reduced diameter is formed so as to communicate with a closed container on the downstream side. As a result, the liquid nitrogen LN2 that has passed through the liquid nitrogen supply system 24 becomes high pressure by reducing the cross section of the passage at the orifice portion 42, and is released to low pressure when the orifice portion 42 is removed and introduced into the closed container. At that time, the liquid nitrogen is dispersed and atomized to be gasified. At this time, a cryogenic nitrogen gas GN2 having a boiling point of nitrogen molecules of about −195.8 ° C. is released into the closed container. On the other hand, dry air introduced into the closed container and cryogenic nitrogen gas are mixed at the same time, and the mixed gas GM adjusted to the set low temperature in the space to be cooled is discharged from the outlet 88 via the third supply line 16. It is supplied toward a desired space to be cooled. Liquid nitrogen is gasified in advance when supplying to the space to be cooled, and at the same time mixed with air and supplied to the space to be cooled in a temperature adjusted state. For example, ultra-low temperature nitrogen gas of about -196 ° C is tested. Contact with the target IC envelope or the like does not cause condensation or undesirable effects on the object under test.

  For example, the mixed adjustment gas GM supplied to cool the space to be cooled to a certain set temperature (very low temperature) includes the amount of heat Qn required to cool the dry air supplied into the closed container to the set temperature, The flow rate Ln of liquid nitrogen calculated from the cooling capacity of liquid nitrogen is obtained by the following equation.

However, La (m ³ / sec): dry air supply amount, Ta (° C.): temperature of supplied dry air, T1 (° C.): set temperature of discharged low temperature gas, C1 (kcal / m ³ · ° C.)

Where Ln: flow rate of liquid nitrogen, A1 (m ³ ): second supply pipe cross-sectional area, A2 (m ³ ): injection port (introduction port) cross-sectional area, p1 (Pa): liquid nitrogen supply pressure, p2 ( Pa): Liquid nitrogen nozzle pressure (Pa), Cq: Flow coefficient, ρ (kg / m ³ ): Fluid density

Where Q1: cooling capacity of liquid nitrogen, C2 (kcal / m ³ ): heat of vaporization of liquid nitrogen

In the present embodiment, a control device 22 that controls the flow rate of liquid nitrogen in the second supply pipe is further provided. The control device 22 controls the supply amount of liquid nitrogen to supply the closed container with liquid nitrogen having a flow rate corresponding to the required amount of liquid nitrogen ejected into the closed container from the deviation between the temperature data from the temperature sensor 94 and the set temperature. In this embodiment, a controller composed of a microcomputer or the like is used. The control device 22 receives an electric signal corresponding to the temperature information from the temperature sensor 94, compares it with the set temperature in the space S to be cooled, and generates liquid nitrogen at a flow rate necessary to generate the mixed adjusted low temperature gas corresponding to the temperature deviation. The flow rate adjusting valve device 26 is controlled and driven to flow.

Next, the operation of this embodiment will be described. For example, if the cooling set temperature blown out in the test chamber 70 as the cooled space S is −60 ° C., the temperature close to the cooling set temperature in the cooled space in the cooling device 10 when the refrigerant is blown into the cooled space. The cold gas GM set and adjusted to be generated in a closed container 20 as a mixed adjusted low temperature gas generating device communicating with the space to be cooled. Liquid nitrogen LN2 and dry air DA are simultaneously supplied into the closed container 20 at a required pressure and flow rate. At that time, the pressure is supplied in a relationship of (dry air discharge pressure <liquid nitrogen discharge pressure). Further, the flow rate of dry air DA into the closed container via the air supply system 30 is maintained at a constant flow rate according to the setting. On the other hand, the liquid nitrogen supplied via the liquid nitrogen supply system 24 is released into a low pressure and gasified when discharged into the closed container 20 and is filled in the container as nitrogen gas. At this time, the heat of vaporization is taken from the surroundings and is released into the closed container as an ultra-low temperature gas of about 196 ° C. Therefore, the dry air at normal temperature and this vaporized nitrogen gas are mixed to generate an extremely low temperature mixed adjustment gas GM of, for example, about −60 ° C., and the discharge pressure of dry air and liquid nitrogen is discharged from the outlet of the connection fitting 37. Is sent out to the space on the test chamber 70 side. The space to be cooled is cooled to the set cooling temperature by continuing to supply the low temperature adjusting gas having a flow rate determined from the cross-sectional area of the outlet of the first supply pipe line 92 to the space to be cooled for a required time. While simultaneously receiving air from the air supply source and liquid nitrogen from the liquid nitrogen source, a desired low-temperature low-temperature cooling gas is generated, and the generated low-temperature cooling gas is supplied to the space to be cooled. At that time, the air from the air supply source and the liquid nitrogen from the liquid nitrogen source are simultaneously pumped and supplied into the closed container, and the cooled space communicating with the other communication passages only by the pumping pressure is used as the delivery destination. The regulated low temperature gas is fed by pressure through another communication path. Further, the temperature sensor 94 detects the outlet temperature of the low-temperature adjustment gas on the cooled space side, and the control device 22 receives the electric signal corresponding to this temperature and generates the low-temperature adjustment gas that matches the deviation from the set cooling temperature. The flow rate regulating valve device 26 is controlled and driven so as to flow liquid nitrogen at a flow rate necessary for generation, and the cooled space side is maintained at the set cooling temperature. As a result, a desired low-temperature gas (including all low-temperature regions that can be generated at room temperature or lower) is supplied to the cooled space side without affecting other devices on the cooled space side. Cooling can be stably performed with high accuracy. In particular, as in the above-described embodiment, an IC handler device test chamber or other precision machine that needs to form an extremely low temperature of −60 ° C. to −100 ° C. or lower and maintain it stably. It can be effectively applied to electronic parts manufacturing, pharmaceutical manufacturing and other devices.

The handler device test chamber space cooling method of the present invention is configured such that the handler device test chamber is a space to be cooled, communicated with the space to be cooled, a liquid nitrogen source, an air supply source, A closed container communicating with the air supply source is supplied, and a constant flow rate of air is set by pressure from the air supply source side, while the closed container inlet from the liquid nitrogen source is squeezed to supply the vaporized nitrogen gas to the inside. The method includes the step of generating a low-temperature mixed gas by vaporized nitrogen gas and cooling the low-temperature mixed gas while pumping the low-temperature mixed gas to the space to be cooled only by the pressure from the air supply source and the liquid nitrogen source. Similarly, the low temperature gas is stably and accurately controlled by controlling the pressure and flow rate based on a simple device configuration of a closed vessel communicating with air, liquid nitrogen, and the space to be cooled. Supplied, condensation due to the cooling space side variation of rapid temperature, freezing of the drive portion, so as not to cause a malfunction, it is possible to further retain the suitability of the test environment.

  The set temperature of the space to be cooled was set to −60 ° C., the dry air and liquid nitrogen supplied into the closed container at that time were set as follows, and the operation was performed for 90 minutes. The temperature before cooling of the space to be cooled was 26 ° C., and the time to decrease to the set temperature was 20 minutes.

  In addition, in the cooling device of the above-described embodiment, the closed container has a cylindrical shape, but the outer shape and the inner hollow shape are not limited thereto. In the above embodiment, an example of the characteristic test for the cut chip after mounting assembly is shown. However, the cooling device of the present invention is also necessary for the test on the probe card before the wafer is cut and separated. The same applies depending on the case. Further, the present invention is not limited to the constant temperature bath of the IC handler, and can be effectively used for cooling a space that requires any other cryogenic atmosphere.

1 is an overall configuration explanatory diagram of a cooling device according to an embodiment of the present invention. FIG. 2 is a partially omitted perspective explanatory view of main components including a closed container of the cooling device of FIG. 1. FIG. 2 is a partially omitted cross-sectional explanatory view of main components including a closed container of the cooling device of FIG. 1. FIG. 5 is another cross-sectional explanatory diagram of a main component including a closed container of the cooling device of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Cooling device 12 Liquid nitrogen source 14 Air supply source 15 2nd supply line 16 3rd supply line 20 Closed container 22 Control apparatus 26 Flow control valve apparatus 28 Pressure regulator 40 Evaporation conversion means 42 Orifice part 80 Package IC
88 Air outlet 92 First supply line 94 Temperature sensor DA Dry air S Cooled space LN2 Liquid nitrogen GN2 Nitrogen gas

Claims (10)

It is a cooling device that cools the space to be cooled that requires a low temperature environment.
While communicating with the space to be cooled, it communicates with a liquid nitrogen source and an air supply source, and simultaneously accepts air pumped from the air supply source and liquid nitrogen pumped from the liquid nitrogen source. A cooling device including a closed vessel that generates a low-temperature cooling gas having a desired low temperature and supplies the generated low-temperature cooling gas to a space to be cooled by pressure from an air supply source and a liquid nitrogen source.   2. The cooling apparatus according to claim 1, further comprising vaporization conversion means for forcibly converting liquid nitrogen from a liquid nitrogen source into gas when the liquid nitrogen is introduced into the closed container. 3. The cooling apparatus according to claim 2, wherein the vaporization conversion means comprises an orifice portion having a reduced diameter of the supply line of liquid nitrogen communicating with the liquid nitrogen source and facing the downstream discharge side into the closed container. .   4. The cooling device according to claim 1, wherein the air supplied from the air supply source side is air having a dew point temperature equal to or lower than a set temperature in the space to be cooled.   The air from the air supply source side is supplied with a constant flow rate according to the setting in the closed vessel, and the flow rate of liquid nitrogen from the liquid nitrogen source to the closed vessel is variable to generate a desired low-temperature cooling gas. The cooling device according to any one of claims 1 to 4. A temperature sensor provided near the outlet of the low-temperature cooling gas on the cooled space side;
A flow control valve device for adjusting the flow rate of liquid nitrogen from the liquid nitrogen source;
6. A control unit that compares the temperature from the temperature sensor with the set temperature in the space to be cooled and changes the flow rate by the flow rate regulating valve device according to the comparison result. A cooling device according to claim 1. The cooling device according to any one of claims 1 to 6, wherein the supply pressure of air from the air supply source is set lower than the supply pressure of liquid nitrogen from the liquid nitrogen source.   The cooling apparatus according to claim 1, wherein the air supplied from the air supply source side is dry air.   The cooling device according to any one of claims 1 to 8, wherein a device test chamber of the handler is a space to be cooled, and a blow-out port communicating with the closed container is disposed in the chamber. The handler device test chamber is the space to be cooled,
Prepare a closed container that communicates with the space to be cooled and communicates with the liquid nitrogen source and the air supply source.
While supplying a constant flow rate of air from the air supply source side by pressure, the closed container inlet from the liquid nitrogen source is squeezed and supplied as vaporized nitrogen gas to generate a low-temperature mixed gas of air and vaporized nitrogen gas. And
A method for cooling a chamber space for device testing of a handler, characterized in that cooling is performed while pumping a low-temperature mixed gas to a space to be cooled only by pressure from an air supply source and a liquid nitrogen source.

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