TWI434053B - Electronic device testing machine - Google Patents

Description

Carrier device for electronic component testing machine

The invention provides a carrying device for an electronic component testing machine which can rapidly cool down the stage by directly and thermally cooling the stage with the cooling fluid to shorten the cooling operation time, thereby improving the cooling performance and the work convenience.

Nowadays, electronic components are used in different electronic devices. Since the environment in which the electronic devices are located may be a normal temperature environment, a high temperature environment or a low temperature environment, in order to ensure the quality of use of the electronic components, the electronic components are placed after the completion of the production. On a test sorting machine, and depending on the ambient temperature applied in the future, normal temperature test work or cold test work or thermal test work is performed in different work temperature environments to eliminate defective products. At present, when the electronic component test classification machine performs the thermal test operation, the electronic component to be tested is placed on a stage of a warming device, and the stage can be warmed up to a high temperature (for example, 100 ° C) by using a warming device to preheat the first. The electronic component to be tested is then carried to the test device of a test socket, so that the electronic component to be tested performs thermal testing in the test socket, but the ambient temperature of the electronic component application is different. When the test sorter wants to perform the normal temperature test operation of the next batch of electronic components to be tested, since the temperature of the stage is still high temperature, in order to prevent the high temperature of the stage from being transmitted to the electronic components to be tested, the electronic components to be tested are heated. In order to affect the quality of the test, the manufacturer must cool the stage to normal temperature (for example, 30 ° C) before carrying the electronic component to be tested to the test device for normal temperature test. The method of cooling is to cool the stage of the high temperature. To normal temperature, but the cooling time of this method is quite time consuming, so that the test sorter is too long to stand and reduce the test capacity.

Therefore, the manufacturer adopts a forced cooling method to cool the high temperature stage to the normal temperature. Referring to FIG. 1 , the test classification machine is provided with a stage 12 on the machine table 11 for driving displacement by a driving source. A jig 13 for holding the electronic component to be tested is disposed on the top of the table 12, and a slide rail group 14 is connected to the lower portion of the table 12, and a connection air supply is respectively disposed on the machine table 11 and on both sides of the slide rail group 14. The blowing member 15 of the device is used for blowing cold air; in use, the high temperature stage 12 is placed above the air blowing member 15, and the blowing member 15 is controlled to blow cold air to the carrier 12 to utilize the cold air. The hot and cold exchange with the high temperature stage 12 causes the stage 12 to gradually cool down to a normal temperature, so as to carry the electronic components to be tested during the normal temperature test operation; however, although the air blowing cooling method can cool the stage 12, The air blowing member 15 only blows air to both sides of the bottom surface of the stage 12, and cannot perform comprehensive hot and cold exchange on the stage 12, resulting in limited cooling performance, and cannot effectively shorten the cooling time of the stage 12, and further, the blowing member 15 When the air is blown on both sides of the bottom surface of the stage 12, part of the cold air will be dissipated. In the atmosphere, it is necessary to increase the amount of blowing to cool down, so that the gas supply equipment is considerably depleted, so the blowing cooling method needs to be improved.

Therefore, how to design a carrier device that can quickly cool the stage and improve the cooling efficiency and work convenience is the standard developed by the manufacturer.

A first object of the present invention is to provide a carrier device for an electronic component testing machine, which is disposed on a machine platform including a testing device and a material moving device, and the testing device is provided with at least one test circuit for the test socket. a plate for testing electronic components, wherein the loading device is provided with at least one pick-and-place device for transferring electronic components, the carrier device being respectively provided with at least one displacement driven by the driving source on both sides of the testing device a carrying device for carrying electronic components; wherein the carrying device is provided with at least one flow channel of different shapes inside the loading platform, one end of the flow channel is provided with an input port for inputting a cooling fluid, and the other end is provided with an input port for inputting a cooling fluid, and the other end is The output port for discharging the cooling fluid is provided; thereby, the cooling fluid can be input into the flow channel of the stage, so that the cooling fluid flows along the flow channel, and the heat exchange with the stage is performed, so that the stage is rapidly cooled to shorten the temperature drop operation. Time, in turn, achieves practical benefits of improving cooling efficiency and ease of operation.

A second object of the present invention is to provide a carrier device for an electronic component testing machine, wherein the carrier device is provided with at least one protrusion inside the flow channel of the stage, and the diameter of the protrusion is smaller than the width of the flow channel. When the flow of the cooling fluid in the flow channel hits the stud, a turbulent flow is formed at the stud and flows to the wall to touch the wall of the flow passage, thereby causing more cooling fluid to exchange heat with the stage. Achieve practical benefits of improved cooling performance.

In order to make the reviewer further understand the present invention, a preferred embodiment will be described in conjunction with the drawings, which will be described in detail later. Referring to FIG. 2, the carrier device of the present invention can be applied to different types of electronic devices. The component testing machine includes the testing device 30, the carrying device 40, and the loading device 50. The testing device 30 is provided with at least one test circuit board 31 with a test socket 32. For carrying out the electronic component, the carrier device 40 is provided on each side of the testing device 30 with at least one carrier driven by the driving source for carrying the electronic component. In the embodiment, the carrier device 40 is used. The first inlet and outlet loading platforms 41 and 42 are disposed on one side of the testing device 30, and the electronic component placement portion is disposed above the first inlet and outlet loading platforms 41 and 42. The fixtures 411 and 421 are respectively configured to carry the electronic components to be tested/completed, and drive the first inlet and outlet carriers 41 and 42 to drive the first axial displacement (such as X axial displacement). Further, on the other side of the testing device 30, a second inlet and outlet loading table 43, 44 is provided, and the second inlet An electronic component placement portion is disposed above the discharge loading platforms 43 and 44. The electronic component placement portions are fixtures 431 and 441 for respectively carrying the electronic components to be tested/tested and driven by another. The source drives the second inlet and outlet carriers 43 and 44 to perform a first axial displacement (such as X-axis displacement), and the material transfer device 50 is provided with at least one pick-and-placer for testing the test device 30. 32. The electronic component is transferred between the carrier and the carrier of the carrier device 40. In the embodiment, the loading device 50 is provided with a first pick-and-place device capable of performing a second axial displacement (such as a Y-axis displacement). 51 and the second pick-and-place device 52, the first pick-and-place device 51 is connected between the test socket 32 and the first inlet and outlet loading stations 41, 42 to transfer the electronic components to be tested/tested, and the second pick-and-placer 52 Then, the electronic components to be tested/tested are transferred between the test stand 32 and the second inlet and discharge stages 43 and 44.

Referring to FIG. 3, the carrier of the carrier device 40 is provided with a temperature control device, which is a cooling plate or a heating sheet for controlling the temperature of the stage for pre-cooling or preheating the stage. For the use of the electronic components, since the temperature control device on the stage is a conventional technique, it will not be described in detail; wherein the inside of the stage is provided with at least one flow path which can be in a different shape. In the first embodiment, A flow passage having a shape of a continuous turning curve is formed inside the stage, one end of the flow passage is provided with an input port for inputting a cooling fluid, and the other end is provided with an output port for discharging the cooling fluid after the cold heat exchange, and At least one spoiler is disposed in the interior of the flow channel. In the embodiment, the carrier device 40 is disposed inside the first loading stage 41 with a flow path 412 in the shape of a continuous turning curve. One end of the 412 is provided with an input port 413 for inputting a cooling fluid, and the other end is provided with an output port 414 for discharging the cooling fluid after the cold heat exchange, and the cooling fluid may be a low temperature air or a low temperature liquid, and the flow channel 412 is At least one of the interior is provided with a spoiler for the stud 415 In this embodiment, a plurality of protrusions 415 having appropriate spacing are disposed in the inner portion of the flow path 412. The diameter of each of the protrusions 415 is smaller than the width of the flow path 412, and the second load is carried. A flow passage 432 having a continuous turning curve shape is formed in the interior of the table 43. One end of the flow passage 432 is provided with an input port 433 for inputting a cooling fluid, and the other end is provided with an output port for discharging the cooling fluid after the cold heat exchange. 434, the cooling fluid may be a low-temperature air or a low-temperature liquid, and at least one spoiler that is a protrusion 435 is disposed inside the flow channel 432. In this embodiment, a plurality of spurs are disposed inside the flow channel 432. The protrusions 435 are appropriately spaced, and the diameter of each of the protrusions 435 is smaller than the diameter of the flow path 432.

Please refer to FIG. 2 and FIG. 4 . In this embodiment, when the first and second loading stages 41 and 43 are applied to the thermal testing operation to be converted to the normal temperature testing operation, the electronic components are preheated due to the thermal testing operation, and the loading stage is used. The heating piece of the upper temperature control device is actuated to make the stage be in a high temperature state, and before the completion of the thermal measurement operation to perform the normal temperature test operation, the heating piece of the temperature control device must be stopped, so that the first and second feeding stages are enabled. 41, 43 cool down, and during the cooling operation, the cooling fluid is input to each of the input ports 413, 433 of the first and second feeding stages 41, 43, and the cooling fluid is along the first and second feeding stages 41, 43 The path of each of the flow passages 412, 432 flows. Since the first and second feed stages 41, 43 have only a single flow path 412, 432, a cooling fluid having a fast flow rate can be obtained, and when the cooling fluid flows in the flow paths 412, 432 During the inner flow, the first and second feeding stages 41, 43 of the high temperature can be exchanged for cold and heat respectively through the wall surfaces of the contact flow paths 412, 432 to rapidly reduce the first and second feeding stages 41, 43. The temperature is up to the normal temperature, thereby shortening the cooling operation time, and also because of the flow passages 412, 4 Each of the two side walls of the 32 is provided with a plurality of spoilers which are protrusions 415 and 435. After the cooling fluid flows through the columns 415 and 435, a turbulent flow is formed behind the protrusions 415 and 435, and the turbulent flow is caused. The flow rate of the channels 412, 432 at the wall edge increases, causing more heat to be exchanged with the first and second feed stages 41, 43 for rapid heat exchange, thereby rapidly reducing the temperature of the first and second feed stages 41, 43 to normal temperature. Further, the temperature-raising cooling fluid after the heat exchange in each of the flow passages 412 and 432 is discharged from the output ports 414 and 434, thereby greatly shortening the cooling operation time and achieving the practical benefit of improving the cooling performance.

Referring to FIG. 5, when the first and second feeding stages 41, 43 are cooled to normal temperature, they can be used for carrying electronic components in a normal temperature test operation, and the first loading stage 41 of the carrying device 40 is The electronic component 61 to be tested is carried to the side of the test socket 32 of the testing device 30, and the first pick-and-placer 51 of the loading device 50 is attached to the fixture 411 of the first loading carrier 41 to take out the electronic component 61 to be tested. And transferring to the test socket 32 to perform the normal temperature test operation. At this time, the second loading stage 43 carries the next electronic component 62 to be tested to the other side of the test socket 32 for the second take. The device 52 takes out the electronic component 62 to be tested; please refer to FIG. 6. After the test is completed, the first pick-and-place device 51 is taken out of the test socket 32 and the electronic component 61 is taken out and transferred to the first discharge. The fixture 42 of the stage 42 is mounted on the first discharge stage 42. At this time, the second pick-and-place unit 52 transfers the next electronic component 62 to be tested to the test socket 32. Continue to perform the normal temperature test.

Referring to FIG. 7 , the carrier device 40 is provided with at least one flow channel of different shapes in the interior of the stage. In the second embodiment, two continuous turning corners are arranged inside the stage. In the shape flow channel, one end of each flow channel is respectively provided with an input port for inputting a cooling fluid, and the other end is respectively provided with an output port for discharging the cooling fluid after the cold heat exchange, and at least one of the inside of each flow channel is provided. The spoiler is taken as an example. In the embodiment, the carrying device 40 is disposed inside the first loading stage 45 and has two flow paths 452A in the shape of a continuous turning curve. 452B, one end of each flow channel 452A, 452B is respectively provided with input ports 453A, 453B for inputting cooling fluid, and the other end is respectively provided with output ports 454A, 454B for discharging cooling fluid after cold heat exchange, the cooling fluid It can be a low-temperature air or a low-temperature liquid, and at least one spoiler for each of the flow passages 452A and 452B is a spoiler for the protrusions 455A and 455B. In this embodiment, it is inside the respective flow passages 452A and 452B. Protruding a plurality of studs 455A, 455B with appropriate spacing, each convex The diameter of the columns 455A, 455B is smaller than the width of each of the flow passages 452A, 452B; please refer to Fig. 8, the cooling operation of the first loading stage 45 is taken as an example, and the flow is applied to the first loading stage 45. The input ports 453A, 453B of the channels 452A, 452B respectively input cooling fluid, and the cooling fluid flows along the paths of the respective flow channels 452A, 452B, respectively, and is exchanged with the first feeding stage 45 for rapid heat exchange. The temperature of the loading stage 45 is lowered to the normal temperature, thereby greatly shortening the cooling operation time, and a plurality of spoilers for the protrusions 455A and 455B are respectively disposed between the two side walls of each of the flow paths 452A and 452B, and the cooling fluid flow is provided. After the studs 455A, 455B, a turbulent flow is formed behind the studs 455A, 455B, which causes the flow velocity of the flow passages 452A, 452B at the wall edge to increase, causing more heat to be hot and cold with the first feed stage 45. After exchange, the heated and cooled cooling fluid after the cold and heat exchange in each of the flow passages 452A and 452B is discharged from the output ports 454A and 454B, thereby rapidly lowering the temperature of the first loading stage 45 to a normal temperature, and shortening the cooling operation time to reach Practical benefits of improved cooling efficiency.

Referring to FIG. 9, the carrier device 40 is provided with at least one flow channel of different shapes in the interior of the stage. In the third embodiment, a plurality of linear shapes are arranged inside the stage. In the flow channel, one end of each flow channel is respectively provided with an input port for inputting a cooling fluid, and the other end is respectively provided with an output port for discharging the cooling fluid after the cold heat exchange, and at least one spoiler is disposed inside each flow channel. For example, in the embodiment, the carrier device 40 is disposed inside the first loading stage 46 and has a plurality of flow paths 462A, 462B, and 462C in a straight line shape. 462D, one of the flow passages 462A, 462B, 462C, and 462D is respectively provided with input ports 463A, 463B, 463C, and 463D for inputting a cooling fluid, and the other end is respectively provided with an output for discharging the cooling fluid after the cold heat exchange. Ports 464A, 464B, 464C, 464D, the cooling fluid may be a low temperature air or a cryogenic liquid, and at least one of the inside of each of the flow channels 462A, 462B, 462C, 462D is a protrusion 465A, 465B, 465C, 465D. The spoiler, in this embodiment, is attached to each of the flow passages 462A, 462B, 46 A plurality of protrusions 465A, 465B, 465C, and 465D having appropriate spacings are respectively protruded inside the 2C and 462D, and the diameters of the protrusions 465A, 465B, 465C, and 465D are smaller than the flow paths 462A, 462B, 462C, and 462D.寛度; Refer to FIG. 10, taking the cooling operation of the first loading stage 46 as an example, the input ports 463A, 463B of the flow channels 462A, 462B, 462C, and 462D of the first loading stage 46, 463C and 463D respectively input cooling fluid, and the cooling fluid flows along the paths of the respective flow passages 462A, 462B, 462C, and 462D, and is exchanged with the first feed carrier 46 for rapid heat exchange to quickly transfer the first load of the high temperature. The stage 46 is cooled to a normal temperature, thereby greatly shortening the cooling operation time, and a plurality of spoilers for the protrusions 465A, 465B, 465C, and 465D are respectively disposed between the two side walls of each of the flow paths 462A, 462B, 462C, and 462D. After the cooling fluid flows through the studs 465A, 465B, 465C, 465D, a turbulent flow is formed behind the studs 465A, 465B, 465C, 465D, which causes the flow paths of the flow passages 462A, 462B, 462C, 462D to increase at the wall edge. , causing more heat to be exchanged with the first feed stage 46 for cold heat exchange, and then each flow channel 462A The heated cooling fluid after the cold heat exchange in 462B, 462C, and 462D is discharged from the output ports 464A, 464B, 464C, and 464D to rapidly lower the temperature of the first loading stage 46 to a normal temperature, and shorten the cooling operation time to reach Practical benefits of improved cooling efficiency.

Accordingly, the present invention can quickly cool the stage at a low cost, thereby shortening the cooling operation time and improving the work convenience, and is actually a practical and progressive design. However, the same product and publication are not disclosed. Therefore, the requirements for invention patent applications are allowed, and the application is filed according to law.

[Literature]

11. . . Machine

12. . . Loading platform

13. . . Fixture

14. . . Slide group

15. . . Blowing parts

[this invention]

20. . . Machine

30. . . Test device

31. . . Test board

32. . . Test stand

40. . . Carrier

41. . . First feeding stage

411. . . Fixture

412. . . Runner

413. . . Input port

414. . . Output port

415. . . Tab

42. . . First discharge stage

421. . . Fixture

43. . . Second feeding stage

431. . . Fixture

432. . . Runner

433. . . Input port

434. . . Output port

435. . . Tab

44. . . Second discharge stage

441. . . Fixture

45. . . First feeding stage

452A, 452B. . . Runner

453A, 453B. . . Input port

454A, 454B. . . Output port

455A, 455B. . . Tab

46. . . First feeding stage

462A, 462B, 462C, 462D. . . Runner

463A, 463B, 463C, 463D. . . Input port

464A, 464B, 464C, 464D. . . Output port

465A, 465B, 465C, 465D. . . Tab

50. . . Transfer device

51. . . First pick and place

52. . . Second pick and place

61, 62. . . Electronic component

Figure 1: Schematic diagram of the use of a conventional blown cooling stage.

Fig. 2 is a layout view of a carrier device, a test device and a material transfer device of the present invention.

Figure 3 is a schematic view showing a first embodiment of a stage of the carrying device of the present invention.

Fig. 4 is a schematic view showing the cooling use of the first and second feeding stages of the present invention.

Fig. 5 is a schematic view showing the use of the carrying device of the present invention for carrying electronic components in a normal temperature test operation (1).

Figure 6: Schematic diagram of the use of the carrying device of the present invention for carrying electronic components in a normal temperature test operation (2).

Figure 7 is a schematic view showing a second embodiment of the stage of the carrying device of the present invention.

Figure 8 is a schematic view showing the use of the second embodiment of the stage of the present invention.

Figure 9 is a schematic view showing a third embodiment of the stage of the carrying device of the present invention.

Figure 10 is a schematic view showing the use of the third embodiment of the stage of the present invention.

40. . . Carrier

41. . . First feeding stage

412. . . Runner

413. . . Input port

414. . . Output port

415. . . Tab

43. . . Second feeding stage

432. . . Runner

433. . . Input port

434. . . Output port

435. . . Tab

Claims (10)

A carrier device for an electronic component testing machine is disposed on a machine platform including a testing device and a material moving device, and the testing device is provided with at least one test circuit board for testing the test piece for testing electronic components. The loading device is provided with at least one pick-and-place device for transferring electronic components, and the carrying device is provided on at least one side of the testing device with at least one carrier driven by the driving source, above the loading platform An electronic component placement portion is provided for carrying the electronic component; wherein the carrier device is provided with at least one flow channel of different shapes on the carrier, and one end of the flow channel is provided with an input for inputting a cooling fluid The other end is provided with an outlet for discharging the cooling fluid. The carrier device of the electronic component testing machine according to the first aspect of the invention, wherein the carrier is provided with at least one spoiler inside the flow channel. The carrier device of the electronic component testing machine according to the second aspect of the invention, wherein the spoiler is a protruding column, and the diameter of the protruding column is smaller than the diameter of the flow channel. The carrier device of the electronic component testing machine according to the first aspect of the invention, wherein the carrier device is provided with at least one flow path in the shape of a continuous turning curve in the interior of the carrier, and one end of the flow channel An input port for inputting a cooling fluid is provided, and an output port for discharging a cooling fluid is provided at the other end. The carrier device of the electronic component testing machine according to the fourth aspect of the invention, wherein the carrier is provided with at least one spoiler inside the flow channel, the spoiler is a convex column and a convex column The diameter is smaller than the diameter of the flow channel. The carrier device of the electronic component testing machine according to the first aspect of the invention, wherein the carrier device is provided with at least one straight-shaped flow channel inside the carrier, and one end of each flow channel is provided The input port of the cooling fluid can be input, and the other end is provided with an output port for discharging the cooling fluid after the cold heat exchange. The carrier device of the electronic component testing machine according to claim 6, wherein the carrier is provided with at least one spoiler inside the flow channel, and the spoiler is a convex column and a convex column The diameter is smaller than the diameter of the flow channel. The carrier device of the electronic component testing machine according to claim 1, wherein the carrier device is provided with at least one carrier driven by the driving source on two sides of the testing device. The carrier device of the electronic component testing machine according to the first aspect of the invention, wherein the carrier of the carrier device further comprises a temperature control device, wherein the temperature control device is a cooling plate for pre-cooling Electronic components on the stage. The carrier device of the electronic component testing machine according to the first aspect of the invention, wherein the carrier of the carrier device further comprises a temperature control device, wherein the temperature control device is a heating sheet for preheating Electronic components on the stage.