JP6256523B2 - Handler and parts inspection device - Google Patents

Description

  The present invention relates to a handler that conveys a component, and more particularly, to a handler having a temperature adjusting unit that adjusts the temperature of a component, and a component inspection apparatus including the handler.

  In general, a component inspection apparatus that inspects the electrical characteristics of an electronic component uses a handler that conveys the electronic component before or after the inspection between the tray on the base and the inspection socket. Some of such component inspection apparatuses inspect the electrical characteristics of an electronic component after setting the electronic component to a low temperature state of 0 ° C. or lower.

  Conventionally, as a method for cooling an electronic component to a low temperature state, for example, a technique as described in Patent Document 1 is known. In Patent Document 1, a tray that accommodates a plurality of electronic components is placed on a stage. An internal passage is disposed inside the stage. Then, the compressed air in the dry state is cooled, and the cooled compressed air is supplied to the internal passage of the stage. Thereby, the tray is cooled through the stage, and the electronic component is cooled through the tray.

JP 2004-347329 A

  Incidentally, as a method of cooling the electronic component, there is a method of supplying liquid nitrogen to the internal passage of the stage in addition to the method described in Patent Document 1. In this method, although the stage can be rapidly cooled, a part of the liquid nitrogen may be vaporized in the internal passage of the stage. When liquid nitrogen is vaporized under atmospheric pressure, its volume increases by about 700 times. Therefore, the stage with an internal passage and the discharge path through which liquid nitrogen is exhausted can withstand pressure fluctuations accompanying the vaporization of liquid nitrogen. It is necessary to have sufficient pressure resistance. In addition, although the supply amount of liquid nitrogen is controlled so that the stage temperature becomes the target temperature, the stage is excessively cooled by the heat of vaporization when the liquid nitrogen is vaporized in the internal passage of the stage. It was sometimes done.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a handler capable of suppressing pressure fluctuations caused by vaporization of liquefied gas and excessive cooling of the stage, and component inspection including the handler. To provide an apparatus.

  The handler of the present invention includes a robot that transports a component, a stage on which the component is supported, a supply unit that is supplied with a liquefied gas that is a liquefied gas, and a supply that connects the supply unit and a passage in the stage. A path, a valve for opening and closing the supply path, a heater for heating the stage, a temperature sensor for detecting the temperature of the stage, and an output of the heater and a temperature detected by the temperature sensor so as to reach a predetermined temperature A control unit that controls opening and closing of the valve; and a vaporization container that is interposed in the middle of the supply path and that has a larger channel cross-sectional area than the supply path and vaporizes the liquefied gas.

  According to the handler of the present invention, the stage can be adjusted to a predetermined temperature, and the liquefied gas enters the vaporization container before reaching the stage. Since the vaporization container has a larger channel cross-sectional area than the supply channel, the inner area and volume of the channel are larger than the supply channel. Therefore, the liquefied gas that has entered the vaporization vessel is vaporized and expanded by being exposed to the inside of the vaporization vessel having a temperature higher than the boiling point of the liquefied gas. At this time, pressure fluctuations accompanying the vaporization of the liquefied gas will occur inside the vaporization vessel, but since the inside of the vaporization vessel is filled with the vaporized gas, the subsequent vaporization of the liquefied gas will occur. The accompanying pressure fluctuation can be reduced. And since the gas vaporized by the vaporization container is supplied to the channel | path in a stage, vaporization of the liquefied gas in this channel | path is suppressed. As a result, it is possible to suppress an excessive temperature drop of the stage caused by the heat of vaporization of the liquefied gas. Therefore, pressure fluctuation and excessive cooling of the stage due to vaporization of the liquefied gas can be suppressed.

In this handler, the valve is disposed upstream of the supply path with respect to the vaporization container.
According to this handler, the supply path is provided with a valve upstream of the vaporization container. Here, when the valve is disposed downstream of the vaporization container, the vaporization container between the supply unit and the valve is in a sealed state when the valve is maintained in the closed state. For this reason, it is assumed that a part of the liquefied gas is vaporized to increase the pressure in the vaporization container, and the vaporization container is required to have a pressure resistance enough to withstand the pressure. In this regard, according to the above-described aspect, it is possible to avoid the vaporization container from being hermetically sealed even when the valve is maintained in the closed state, so that the pressure resistance required for the vaporization container is reduced. Can do.

The handler includes a storage container in which the stage is stored, and a discharge path that connects the passage in the stage and the storage container.
According to this handler, since the gas supplied to the passage in the stage has a moisture content close to 0, by supplying the gas discharged from the passage in the stage into the storage container, It is possible to make it dry. As a result, it is possible to suppress the occurrence of condensation on the stage cooled to a low temperature state and the parts supported on the stage.

In this handler, a check valve that restricts the inflow of gas into the passage in the stage is disposed in the discharge path.
According to this handler, for example, during a period in which the valve is maintained in a closed state, it is possible to suppress the air having a higher water content than the liquefied gas from flowing into the passage in the stage and the vaporization container through the discharge path. . As a result, when the cooling of the stage is resumed, it is possible to suppress the occurrence of condensation in the passage in the stage and the vaporization container.

  In this handler, the passage has a first internal passage and a second internal passage, the vaporization container has a first vaporization chamber and a second vaporization chamber, and the first internal passage is the first internal passage. Connected to the vaporization chamber, the second internal passage is connected to the second vaporization chamber.

  According to this handler, the gas vaporized in the first vaporization chamber is supplied to the first internal passage. The gas vaporized in the second vaporization chamber is supplied to the second internal passage. As a result, by supplying different amounts of liquefied gas to the first and second vaporization chambers, different amounts of gas can be supplied to the first and second internal passages.

  In this handler, the discharge path includes a first discharge path and a second discharge path, the check valve includes a first check valve and a second check valve, and the first discharge path includes: The first check valve is disposed in the first discharge passage, the second discharge passage is connected to the second internal passage, and is connected to the first discharge passage. Is provided with a second check valve which is the other check valve.

  According to this handler, for example, during the period when the cooling of the stage is stopped, air having a higher moisture content than the liquefied gas flows into the first internal passage and the first vaporization chamber through the first discharge passage. Can be suppressed. Similarly, it is possible to prevent air having a moisture content higher than that of the liquefied gas from flowing into the second internal passage and the second vaporization chamber through the second discharge path. As a result, it is possible to suppress the occurrence of condensation in the first and second internal passages and the first and second vaporization chambers when the cooling of the stage is resumed.

In this handler, the second discharge path is connected to the first discharge path, and the first check valve is arranged upstream of a connection portion with the second discharge path in the first discharge path. Established.
According to this handler, it is possible to suppress the gas discharged from the first internal passage from flowing into the second internal passage, the gas discharged from the second internal passage from flowing into the first internal passage, and the like. .

In this handler, the first discharge path is provided with a temperature raising portion that raises the temperature of the gas flowing through the first discharge path on the downstream side of the connection portion with the second discharge path.
According to this handler, since the gas heated by the temperature raising unit is introduced into the storage container, the temperature in the storage container is lower than when the gas that has not been heated is introduced into the storage container. Get higher. As a result, since the temperature in the storage container is easily maintained at a temperature higher than the dew point, it is possible to suppress the occurrence of condensation in the storage container.

In this handler, a third check valve for restricting the inflow of gas to the temperature raising part is disposed in the first discharge path downstream of the temperature raising part.
According to this handler, for example, during the period when the cooling of the stage is stopped, it is possible to suppress the air having a higher water content than the liquefied gas from flowing into the heating unit through the discharge path. As a result, when the cooling of the stage is resumed, it is possible to prevent moisture from condensing in the temperature raising portion.

  The component inspection apparatus of the present invention includes a transfer robot for transferring a component, a stage on which the component is supported, a supply unit to which a liquefied gas that is a liquefied gas is supplied, the supply unit, and a passage in the stage. A supply path connecting the supply path, a valve for opening and closing the supply path, a heater for heating the stage, a temperature sensor for detecting the temperature of the stage, and the heater so that the detected temperature of the temperature sensor becomes a predetermined temperature A control unit that controls the output of the valve and the opening and closing of the valve, a vaporization container that is interposed in the middle of the supply path, has a flow passage cross-sectional area larger than the supply path, and vaporizes liquefied gas, and inspects the components And a tester to perform.

  According to the component inspection apparatus of the present invention, the stage can be adjusted to a predetermined temperature, and the liquefied gas is vaporized in the vaporization container before reaching the stage. The pressure fluctuation accompanying this vaporization is relieved in the vaporization container. And since the gas vaporized with the vaporization container is supplied to the channel | path in a stage, the excessive cooling of the stage resulting from the vaporization heat of liquefied gas is suppressed. Therefore, pressure fluctuation and excessive cooling of the stage due to vaporization of the liquefied gas can be suppressed.

The block diagram which shows the whole structure about one Embodiment of the handler and component inspection apparatus which actualized this invention. The schematic block diagram which showed typically the schematic structure of the cooling unit of the embodiment. The block diagram which shows a part of electrical structure in the handler of the embodiment. The figure which showed the stage in a modification typically.

  Hereinafter, an embodiment embodying a handler and a component inspection apparatus of the present invention will be described with reference to FIGS. The component inspection apparatus includes a handler that conveys an electronic component, and a tester that is an apparatus separate from the handler and inspects the electrical characteristics of the electronic component.

[Configuration of handler and parts inspection equipment]
First, the overall configuration of a handler and a component inspection apparatus including the handler will be described with reference to FIG. As shown in FIG. 1, the base 11 of the handler 10 is provided with a mounting surface 11 a on which various robots are mounted as an upper surface, and most of the mounting surface 11 a is covered with a cover member 12. In the conveyance space, which is a space surrounded by the cover member 12 and the mounting surface 11a, humidity and temperature are maintained at predetermined values by dry air supplied from the outside.

  On the mounting surface 11 a of the base 11, four conveyors C <b> 1 to C <b> 4 that convey the electronic component T between the outer side and the inner side of the cover member 12 are arranged. Among these, on one side of the X direction that is the arrangement direction of the conveyors, a supply conveyor C1 that conveys the electronic component T before inspection from the outside to the inside of the cover member 12 is laid, and on the other side in the X direction. Is provided with recovery conveyors C2, C3, C4 for conveying the inspected electronic component T from the inside to the outside of the cover member 12. In these conveyors C1-C4, the some electronic component T is conveyed in the state accommodated in the device trays C1a-C4a on each conveyor.

  In addition, a rectangular opening 13 penetrating the mounting surface 11a is formed in the mounting surface 11a substantially at the center of the conveyance space. A tester test head 14 is attached to the opening 13. The test head 14 has an inspection socket 14a into which the electronic component T is fitted on its upper surface, and is electrically connected to an inspection circuit in the tester for inspecting the electronic component T. In this tester, one stage is configured by the test head 14 and the inspection socket 14a.

  Furthermore, in the Y direction orthogonal to the X direction on the mounting surface 11a, the first shuttle 15 and the second shuttle 16 on which the electronic parts T before and after the inspection are temporarily placed on both sides of the opening 13 are provided. Are arranged. The shuttles 15 and 16 are formed so as to extend in the X direction, and a plurality of accommodation pockets 17 and 18 for accommodating the electronic components T before inspection are formed on the supply conveyor C1 side on the upper surface thereof. The supply shuttle plates 15a and 16a are fixed. On the other hand, recovery shuttle plates 15b and 16b for storing the electronic components T after inspection are fixed to the recovery conveyors C2 to C4 on the upper surfaces of the shuttles 15 and 16, respectively. The shuttles 15 and 16 are respectively connected to shuttle guides 15c and 16c that are fixed to the mounting surface 11a and extend in the X direction, and move forward and backward along the X direction. In the handler 10, one stage is constituted by the first shuttle 15 and the supply shuttle plate 15a, and one stage is constituted by the second shuttle 16 and the supply shuttle plate 16a.

  On the mounting surface 11a of the base 11, a robot mechanism for carrying the electronic component T is mounted on each of the inspection socket 14a, the supply shuttle plates 15a and 16a, and the recovery shuttle plates 15b and 16b. The above-described shuttles 15 and 16 move along the shuttle guides 15c and 16c in accordance with the operations of the supply robot 20, the transport robot 30, and the collection robot 40 that constitute the robot mechanism.

  The supply robot 20 is a robot that transports the electronic component T before inspection from the device tray C1a on the supply conveyor C1 to the supply shuttle plates 15a and 16a on the shuttles 15 and 16, and the Y direction of the supply conveyor C1 Is arranged. Specifically, the supply robot 20 includes a supply-side fixed guide 21 which is a fixed shaft extending in the Y direction, and a supply-side movable guide 22 connected to the supply-side fixed guide 21 so as to be able to move forward and backward in the Y direction. And a supply hand unit 23 connected to the supply side movable guide 22 so as to be movable forward and backward in the X direction. Further, the supply hand unit 23 has a suction portion that sucks the electronic component T at the lower end thereof, and is connected to the supply-side movable guide 22 so as to be lowered and raised with respect to the mounting surface 11a. As the supply-side movable guide 22 and the supply hand unit 23 move, the electronic component T placed on the device tray C1a is sucked and conveyed by the suction portion of the supply hand unit 23, and the supply shuttle plate 15a. , 16a.

  The collection robot 40 is a robot that conveys the electronic components T after inspection from the collection shuttle plates 15b and 16b on the shuttles 15 and 16 to the device trays C2a to C4a on the collection conveyors C2 to C4. It arrange | positions in the Y direction of C2-C4. Specifically, the collection robot 40 is connected to the collection side fixed guide 41 that is a fixed shaft extending in the Y direction and the collection side fixed guide 41 so that the collection robot 40 can move forward and backward in the Y direction, like the supply robot 20 described above. The collection-side movable guide 42 and the collection-side hand unit 43 connected to the collection-side movable guide 42 so as to be able to move forward and backward in the X direction. The collection hand unit 43 has a suction part that sucks the electronic component T at the lower end thereof, and is connected to the collection-side movable guide 42 so as to be able to descend and rise with respect to the mounting surface 11a. Then, by the movement of the collection-side movable guide 42 and the collection hand unit 43, the electronic component T placed on the collection shuttle plates 15b and 16b is sucked and conveyed by the suction portion of the collection hand unit 43, and the device Placed on the trays C2a to C4a.

  The transfer robot 30 includes a transfer guide 31 that is a fixed shaft extending in the Y direction and is installed at a substantially center of the transfer space, and a first transfer unit that is connected to the transfer guide 31 so as to be able to move forward and backward in the Y direction. 32 and a second transport unit 33. Among these, the first transport unit 32 reciprocates between the first shuttle 15 and the test head 14, and the second transport unit 33 reciprocates between the second shuttle 16 and the test head 14. . Each of the first transport unit 32 and the second transport unit 33 has a suction portion that sucks the electronic component T at the lower end thereof, and is connected to the transport guide 31 so as to be able to descend and rise with respect to the mounting surface 11a. .

  Then, the first transport unit 32 sucks and transports the electronic component T before inspection placed on the supply shuttle plate 15 a on the first shuttle 15 to the suction portion and transports it to the inspection socket 14 a of the test head 14. Fit with a predetermined pressing force. A plurality of female terminals that can be engaged with the male terminals of the electronic component T are recessed in the bottom surface of the inspection socket 14a, and the male terminals of the electronic component T are fitted into the female terminals of the inspection socket 14a. Thus, the electrical characteristics of the electronic component T can be inspected by a tester. The tester receives an inspection start command from the handler 10 and starts an inspection of the electronic component T, and outputs a signal indicating the end of the inspection to the handler 10 together with the inspection result. When the inspection of the electronic component T is thus completed, the first transport unit 32 transports the electronic component T after the inspection from the inspection socket 14a of the test head 14 to the recovery shuttle plate 15b on the first shuttle 15.

  Similarly, the second transport unit 33 sucks and transports the electronic component T before inspection placed on the supply shuttle plate 16a on the second shuttle 16 to the suction portion, and transports the inspection socket 14a of the test head 14. Is fitted with a predetermined pressing force. When the inspection of the electronic component T by the tester is completed, the second transport unit 33 transports the electronic component T after the inspection from the inspection socket 14a of the test head 14 to the recovery shuttle plate 16b on the second shuttle 16. To do. The electronic parts T are transported alternately to the test head 14 by the first transport unit 32 and the second transport unit 33, and the electronic parts T are sequentially inspected by a tester.

  The supply hand unit 23, the recovery hand unit 43, the first transport unit 32, and the second transport unit 33 simultaneously hold and hold a plurality of electronic components. It is configured as an end effector capable of sucking and gripping the component T.

  Here, in the present embodiment, as a storage container having a room for storing the first shuttle 15, the supply shuttle plate 15a, and the recovery shuttle plate 15b around the first shuttle 15 in the transfer space. A storage box 50 is provided. Similarly, an inspection box 51 as an accommodation container having a room for accommodating the test head 14 and the inspection socket 14a around the opening 13 and the test head 14 attached to the opening 13 is isolated in the transfer space. Is arranged. Further, around the second shuttle 16, a storage box 52 is disposed as a storage container that is isolated within the transfer space and has a room for storing the second shuttle, the supply shuttle plate 16 a and the recovery shuttle plate 16 b. Has been. The electronic component T is cooled in each of the storage box 50, the inspection box 51, and the storage box 52.

[Configuration of cooling unit]
The configuration of the cooling unit that cools the electronic component T will be described with reference to FIG. The component inspection apparatus includes a cooling unit for cooling the electronic components T accommodated in the accommodating pockets 17 and 18 of the supply shuttle plates 15a and 16a, and an electronic component T accommodated in the inspection socket 14a of the test head 14. Although a cooling unit for cooling is mounted, in the present embodiment, description will be made using a cooling unit for cooling the electronic component T housed in the housing pocket 17 of the supply shuttle plate 15a.

  As shown in FIG. 2, one cooling unit cools the electronic component T housed in the two housing pockets 17a and 17b among the plurality of housing pockets 17 formed in the supply shuttle plate 15a. The cooling unit uses nitrogen gas obtained by vaporizing liquid nitrogen, which is a liquefied gas, and cools the storage pockets 17a and 17b in the supply shuttle plate 15a so that the temperature of the storage pockets 17a and 17b is, for example, -45 ° C.

  In the cooling unit, a first supply path 61 is connected via a common path 56 to a storage tank 55 serving as a supply unit in which liquid nitrogen is stored. The first supply path 61 is a pipe having substantially the same flow-sectional cross-sectional area, and is connected to a first internal passage 62 formed in the first shuttle 15 so as to pass directly under the accommodation pocket 17a. A first valve 63 (hereinafter simply referred to as a valve 63) is disposed in the first supply path 61, and the valve 63 opens and closes the first supply path 61 to form liquid nitrogen for the first vaporization chamber 71. Control the amount of supply.

  Further, a second supply path 66 is connected to the storage tank 55 via a common path 56. The second supply path 66 is a pipe having a channel cross-sectional area substantially equal to that of the first supply path 61, and is connected to a second internal passage 67 formed in the first shuttle 15 so as to pass directly under the accommodation pocket 17b. Has been. The second supply path 66 is provided with a second valve 68 (hereinafter simply referred to as a valve 68). The valve 68 opens and closes the second supply path 66 to liquid nitrogen with respect to the second vaporization chamber 72. Control the amount of supply.

  A heat exchanger 70 is disposed in the first and second supply paths 61 and 66. The heat exchanger 70 is a so-called plate heat exchanger, and is disposed on the downstream side of the valves 63 and 68 and covered with a heat insulating material 73. First and second supply paths 61 and 66 are connected to the heat exchanger 70 so that the flows in the heat exchanger 70 are parallel flows, and the first supply path 61 is connected to the first vaporization chamber 71. The second supply path 66 is connected to the second vaporization chamber 72. Since the first and second vaporization chambers 71 and 72 are formed to have a flow passage cross-sectional area larger than that of the first and second supply passages 61 and 66, the first and second supply passages 61, It has a flow passage area and volume larger than 66. The liquid nitrogen flowing into the first and second vaporization chambers 71 and 72 is exposed to the inside of the heat exchanger 70 having a temperature higher than the boiling point of the liquid nitrogen, thereby becoming nitrogen gas having a temperature lower than the target temperature. It flows out of the heat exchanger 70. That is, the heat exchanger 70 does not expand the refrigerant to lower the temperature of the refrigerant, nor does it actively absorb the heat around the heat exchanger 70 into the refrigerant, and vaporizes liquid nitrogen. Functions as a vaporization container. Then, the low-temperature nitrogen gas vaporized in the heat exchanger 70 flows into the first and second internal passages 62 and 67 formed in the first shuttle 15, and the accommodation pockets 17a and 17b in the supply shuttle plate 15a. Cool down.

  Further, inside the first shuttle 15, heaters 74 and 75 (hereinafter simply referred to as heaters 74 and 75) are provided immediately below the respective accommodation pockets 17 a and 17 b formed in the supply shuttle plate 15 a. . The heaters 74 and 75 heat the accommodation pockets 17a and 17b. Each storage pocket 17a, 17b is provided with temperature sensors 77, 78 for detecting the temperature of the storage pockets 17a, 17b. Then, the receiving pockets 17a and 17b are controlled to the target temperature by the cooperation of the cooling by the nitrogen gas flowing through the internal passages 62 and 67 and the heating by the heaters 74 and 75.

  On the other hand, a first discharge path 81 is connected to the discharge port of the first internal passage 62. The first discharge path 81 is connected to the storage box 50, and introduces nitrogen gas discharged from the first internal passage 62 into the storage box 50. A second discharge path 82 is connected to the discharge port of the second internal passage 67. The second discharge path 82 is connected to the first discharge path 81, and discharges the nitrogen gas discharged from the second internal path 67 to the first discharge path 81. That is, nitrogen gas discharged from the first and second internal passages 62 and 67 is introduced into the storage box 50.

  A first check valve 83 that restricts the inflow of gas into the first internal passage 62 is disposed in the first discharge passage 81 on the upstream side of the connection portion with the second discharge passage 82. Similarly, a second check valve 84 that restricts the inflow of gas into the second internal passage 67 is disposed in the second discharge path 82.

  In addition, the first exhaust path 81 has a heat exchanger as a temperature raising unit that raises the temperature of nitrogen gas flowing through the first exhaust path 81 to the downstream side of the connection portion with the second exhaust path 82. 85 is arranged. The heat exchanger 85 is a so-called plate heat exchanger, in which nitrogen gas flowing through the first discharge path 81 flows into the low temperature fluid chamber 86 and dry air generated by the dry air supply source 87 flows into the high temperature fluid chamber 88. To do. These nitrogen gas and dry air circulate in the heat exchanger 85 so as to be in parallel flow. The dry air supply source 87 is composed of a compressor and a dryer, and the dry air from the dry air supply source 87 is raised to a temperature higher than normal temperature by an air heater 89. The dry air is introduced into the storage box 50 after the temperature is lowered to about room temperature by heat exchange with the nitrogen gas in the first discharge path 81 in the heat exchanger 85. The first exhaust path 81 is provided with a third check valve 90 that restricts the inflow of gas into the cryogenic fluid chamber 86 on the downstream side of the heat exchanger 85.

[Electric configuration of handler and parts inspection equipment]
Next, the electrical configuration of the handler and the component inspection apparatus will be described with reference to FIG. 3 focusing on the electrical configuration of the handler 10. The control device 95 that constitutes the control unit provided in the handler 10 is configured mainly by a microcomputer having a central processing unit (CPU), a nonvolatile memory (ROM), and a volatile memory (RAM). Based on the various data and programs stored in the ROM and RAM, the control device 95 performs various controls related to the handler 10 including the operations of the robot mechanisms such as the supply robot 20, the transfer robot 30, and the collection robot 40 described above. It is conducted comprehensively. In addition, a tester 98 is electrically connected to the control device 95, and a signal indicating the start and end of the inspection of the electronic component T is input to and output from the tester 98. Here, a mode of control related to the cooling unit corresponding to the accommodation pockets 17a and 17b of the supply shuttle plate 15a in the control by the control device 95 will be described.

  As shown in FIG. 3, a cooling unit drive unit 96 having a valve drive unit 96 a and a heater drive unit 96 b is electrically connected to the control device 95. Based on the target temperature input from the control device 95 and the temperature input from the temperature sensors 77 and 78, the valve drive unit 96a sets the temperature of the accommodation pockets 17a and 17b in the supply shuttle plate 15a to the target temperature. As described above, the opening / closing time of each of the valves 63 and 68 is set, and a signal indicating the opening / closing time is output to each of the valves 63 and 68. The valves 63 and 68 adjust the supply amount of nitrogen gas to each of the first and second internal passages 62 and 67 by opening and closing according to the input signal.

  Further, the heater driving unit 96b is configured so that the temperature of the accommodation pockets 17a and 17b becomes the target temperature based on the target temperature input from the control device 95 and the temperature input from the temperature sensors 77 and 78. Drive power is generated for each of 74 and 75, and the drive power is output to each heater 74 and 75 to drive the heaters 74 and 75.

  Similar to the cooling unit driving unit 96, the cooling unit corresponding to the other storage pocket 17 of the supply shuttle plate 15a, the storage pocket 18 of the supply shuttle plate 16a, and the inspection socket 14a of the test head 14 is also used. A cooling unit driving unit is provided for each cooling unit. That is, the control device 95 controls each cooling unit in an independent manner.

[Action]
Next, the operation of the handler and component inspection apparatus of this embodiment will be described.
In the handler and component inspection device of the present embodiment, in the cooling unit, liquid nitrogen supplied from the storage tank 55 to the first supply path 61 eventually flows into the first vaporization chamber 71 of the heat exchanger 70. Since the flow passage cross-sectional area of the first vaporization chamber 71 is larger than the flow passage area of the first supply passage 61, the liquid nitrogen flowing into the first vaporization chamber 71 has a temperature higher than the boiling point of the liquid nitrogen. The contact area with respect to is increased and the transition to nitrogen gas is promoted. Then, the nitrogen gas flows into the first internal passage 62 and cools the accommodation pocket 17 a, and then is discharged to the first discharge path 81.

  Similarly, liquid nitrogen supplied from the storage tank 55 to the second supply path 66 flows into the second vaporization chamber 72 of the heat exchanger 70 and is transferred to nitrogen gas. The nitrogen gas flows into the second internal passage 67 and cools the periphery of the accommodation pocket 17 b, and then is discharged to the first discharge passage 81 through the second discharge passage 82.

  Then, the controller 95 drives the amount of nitrogen gas supplied to the internal passages 62 and 67 and the heater 74 and 75 so that the temperature input from the temperature sensors 77 and 78 becomes the target temperature. Control with power. Thereby, the electronic component T accommodated in each accommodation pocket 17a, 17b is controlled to target temperature.

  In the series of processes described above, the vaporization chambers 71 and 72 are filled with nitrogen gas obtained by vaporizing the preceding liquid nitrogen, and have a larger volume than the first and second supply paths 61 and 66. Therefore, even if the pressure fluctuation accompanying the subsequent vaporization of liquid nitrogen occurs, the pressure fluctuation is alleviated in the vaporization chambers 71 and 72.

  Further, since liquid nitrogen is vaporized in the heat exchanger 70, nitrogen gas flows into the internal passages 62 and 67 instead of liquid nitrogen. For this reason, it is possible to suppress excessive cooling of part of the storage pockets 17a and 17b due to vaporization of liquid nitrogen in the internal passages 62 and 67.

  The nitrogen gas discharged from the first and second internal passages 62 and 67 to the first discharge path 81 flows into the low temperature fluid chamber 86 of the heat exchanger 85. The dry air heated to a temperature higher than the normal temperature by the air heater 89 flows into the high temperature fluid chamber 88 of the heat exchanger 85. The nitrogen gas is heated to about room temperature by heat exchange with dry air in the heat exchanger 85 and then introduced into the storage box 50. Further, the dry air is cooled to about room temperature by heat exchange with nitrogen gas, and then introduced into the storage box 50.

  The nitrogen gas is vaporized liquid nitrogen, has a moisture content close to 0, and the dry air has a lower moisture content than the air around the handler. Therefore, by introducing these nitrogen gas and dry air into the storage box 50, the storage box 50 is filled with a gas having a low water content. That is, it is possible to suppress the occurrence of condensation in the storage box 50. As a result, it is possible to suppress the occurrence of dew condensation on the supply shuttle plate 15a and the electronic component T accommodated in the supply shuttle plate 15a and the failure of the electronic component T.

  Further, nitrogen gas heated to about room temperature by the heat exchanger 85 is introduced into the storage box 50. Therefore, compared with the case where the nitrogen gas discharged from the internal passages 62 and 67 is introduced into the storage box 50 without being heated, the temperature in the storage box 50 is easily maintained at a temperature higher than the dew point. . As a result, not only the supply shuttle plate 15a in the storage box 50 but also the recovery shuttle plate 15b and the electronic component T stored in the recovery shuttle plate 15b are dewed and the electronic component T fails. Can be suppressed.

  Then, nitrogen gas for cooling the supply shuttle plate 15a and dry air for raising the temperature of the nitrogen gas to about room temperature are used as gas for preventing condensation in the storage box 50. For this reason, it is possible to simplify the configuration of the cooling unit and to reduce the amount of gas to be used, as compared with a case where a gas for preventing condensation is separately prepared.

  On the other hand, each valve | bulb 63 and 68 is arrange | positioned upstream from the heat exchanger 70 which vaporizes liquid nitrogen. If the valve 63 is disposed downstream of the heat exchanger 70 in the first supply path 61 and the valve 63 is maintained in the closed state, the first supply path 61 is located between the storage tank 55 and the valve 63. The first vaporization chamber 71 of the heat exchanger 70 is in a sealed state. For this reason, it is assumed that the pressure in the first vaporization chamber 71 increases due to the vaporization of a part of the liquid nitrogen, and the heat exchanger 70 is required to have a pressure resistance enough to withstand the pressure. In this regard, the valve of the present embodiment is disposed on the upstream side of the heat exchanger 70 in the supply path. Therefore, even if the liquid nitrogen remaining on the downstream side of the valve 63 is vaporized when the valve 63 is maintained in the closed state, a part of the vaporized nitrogen gas remains in the first internal passage 62 and the first first gas. It will be introduced into the storage box 50 through the discharge path 81. As a result, the pressure resistance required for the heat exchanger 70 can be reduced as compared with the case where the valve is disposed downstream of the heat exchanger 70.

  On the other hand, a first check valve 83 is disposed in the first discharge path 81 on the upstream side of the connection portion with the second discharge path 82, and the second internal path 67 is provided in the second discharge path 82. A second check valve 84 is disposed on the downstream side. Therefore, the nitrogen gas discharged from the first internal passage 62 flows into the second internal passage 67 through the second discharge passage 82, and the nitrogen gas discharged from the second internal passage 67 passes through the first discharge passage 81 to the first The flow into the internal passage 62 can be suppressed. That is, since the accommodation pockets 17a and 17b are cooled only by the nitrogen gas supplied to the internal passages 62 and 67, the accommodation pockets 17a and 17b can be cooled with higher accuracy.

  Further, a third check valve 90 is disposed in the first discharge path 81 on the downstream side of the heat exchanger 85. Therefore, during the period in which the valves 63 and 68 are closed, the nitrogen gas is supplied from the storage box 50 to the heat exchanger 85, the first and second internal passages 62 and 67, and the heat exchanger 70 through the first discharge path 81. In addition, it is possible to suppress the flow of air having a higher moisture content than dry air. As a result, it is possible to suppress the occurrence of condensation in the heat exchanger 85, the first and second internal passages 62 and 67, and the heat exchanger 70 when the valves 63 and 68 are controlled to be opened again.

  In the heat exchanger 70, liquid nitrogen is vaporized and heat exchange between the nitrogen gas in the first vaporization chamber 71 and the nitrogen gas in the second vaporization chamber 72 is possible. Therefore, for example, when the valve 63 is opened and the valve 68 is closed, the nitrogen gas remaining in the second vaporization chamber 72 can be cooled by the nitrogen gas flowing through the first vaporization chamber 71. is there. As a result, when the valve 68 in the closed state is again controlled to be in the open state, the nitrogen gas maintained at a low temperature is immediately supplied to the second internal passage 67, so that the accommodation pocket 17b It is possible to shorten the time required until the battery is cooled to the target temperature.

  In addition, since the heat exchanger 70 is covered with the heat insulating material 73, the temperature of the nitrogen gas in the heat exchanger 70 is easily maintained at a low temperature. As a result, it is possible to suppress thermal loss when supplying the cooling nitrogen gas to the first and second internal passages 62 and 67.

As described above, according to the handler and the component inspection apparatus of the present embodiment, the effects listed below can be obtained.
(1) Since each of the vaporization chambers 71 and 72 of the heat exchanger 70 is formed to have a larger flow path cross-sectional area than the first and second supply paths 61 and 66, the first and second supply paths 61 and 66. It has a larger flow passage area and volume. As a result, liquid nitrogen can be vaporized in the vaporization chambers 71 and 72, and pressure fluctuations accompanying the vaporization can be reduced in the vaporization chambers 71 and 72.

(2) Moreover, it can suppress that the storage pockets 17a and 17b are cooled too much by having liquid nitrogen vaporize in each vaporization chamber 71 and 72 of the heat exchanger 70. FIG.
(3) Since the valves 63 and 68 are disposed on the upstream side of the heat exchanger 70, heat is generated compared to the case where the valves 63 and 68 are disposed on the downstream side of the heat exchanger 70. The pressure resistance required for the exchanger 70 can be lowered.

  (4) Since the nitrogen gas used for cooling the storage pockets 17a and 17b is introduced into the storage box 50, the moisture content of the gas that fills the storage box 50 can be reduced. As a result, it is possible to suppress the occurrence of dew condensation on the supply shuttle plate 15a and the electronic component T accommodated in the supply shuttle plate 15a and the failure of the electronic component T.

  (5) Since the supply amount of liquid nitrogen to each of the first and second vaporization chambers 71 and 72 is controlled by the valves 63 and 68, different amounts of nitrogen are supplied to the first and second internal passages 62 and 67. Gas can be supplied.

  (6) First and second check valves 83 and 84 are arranged in the first and second discharge passages 81 and 82. Therefore, it is possible to suppress the flow of air having a moisture content higher than that of nitrogen gas through the first and second exhaust passages 81 and 82 with respect to the first and second internal passages 62 and 67 and the heat exchanger 70. it can. As a result, it is possible to suppress the occurrence of condensation in the heat exchanger 85, the first and second internal passages 62 and 67, and the heat exchanger 70.

  (7) A first check valve 83 is disposed in the first discharge path 81 on the upstream side of the connection portion with the second discharge path 82, and the second check path 83 has a second check valve. A valve 84 is provided. Therefore, the nitrogen gas discharged from the first internal passage 62 flows into the second internal passage 67 through the second discharge passage 82, and the nitrogen gas discharged from the second internal passage 67 passes through the first discharge passage 81 to the first The flow into the internal passage 62 can be suppressed.

  (8) Further, since the second discharge path 82 is connected to the first discharge path 81, the first discharge path 81 and the second discharge path 82 are individually connected to the storage box 50. The configuration can be simplified.

  (9) The first exhaust path 81 is provided with a heat exchanger 85 that raises the temperature of the nitrogen gas discharged from the first and second internal paths 62 and 67 to about room temperature. As a result, the temperature in the storage box 50 is easily maintained at a temperature higher than the dew point, so that condensation occurs in the recovery shuttle plate 15b and the electronic component T stored in the recovery shuttle plate 15b. It is possible to suppress the failure of T.

  (10) Nitrogen gas for cooling the supply shuttle plate 15a and dry air for raising the temperature of the nitrogen gas to about room temperature are used as dew condensation countermeasure gas in the storage box 50. Therefore, it is possible to reduce the amount of gas used for suppressing the occurrence of condensation in the storage box 50.

  (11) Since the third check valve 90 is disposed downstream of the heat exchanger 85, when the valves 63 and 68 are maintained in the closed state, the heat exchanger 85, the first and first 2 It is possible to suppress the flow of air having a moisture content higher than that of nitrogen gas into the internal passages 62 and 67 and the heat exchanger 70. As a result, the occurrence of dew condensation in the heat exchanger 85, the first and second internal passages 62 and 67, and the heat exchanger 70 can be suppressed.

  (12) Since the vaporization container having the first and second vaporization chambers 71 and 72 is the heat exchanger 70, for example, when the valve 63 is maintained in the open state and the valve 68 is maintained in the closed state, the second The nitrogen gas staying in the vaporizing chamber 72 is maintained in a low temperature state by heat exchange with the nitrogen gas flowing through the first vaporizing chamber 71. As a result, when the valve 68 is opened, the time required for the accommodation pocket 17b to be cooled to the target temperature can be shortened.

(13) Since the heat exchanger 70 is covered with the heat insulating material 73, it is possible to suppress thermal loss when supplying the cooling nitrogen gas to the first and second internal passages 62 and 67. it can.
(14) The heat exchanger 85 is disposed on the downstream side of the connection portion between the first supply path 61 and the second discharge path 82. Therefore, the number of installed heat exchangers 85 can be reduced as compared with the case where such heat exchangers 85 are disposed in both the first and second discharge paths 81 and 82.

  (15) Nitrogen gas and dry air circulate in the heat exchanger 85 so as to be in parallel flow. Therefore, the temperature difference between the nitrogen gas and the dry air immediately after passing through the heat exchanger 85 can be reduced as compared with the case where the nitrogen gas and the dry air circulate so as to be opposed to each other in the heat exchanger 85. . That is, the temperature distribution in the storage box 50 into which the nitrogen gas and dry air are introduced can be made uniform.

In addition, said embodiment can also be suitably changed and implemented as follows.
In the first discharge path 81, the third check valve 90 may be omitted. Even in such a configuration, since the first check valve 83 is disposed in the first discharge path 81 and the second check valve 84 is disposed in the second discharge path 82, the first and second internal passages are provided. It is possible to prevent air from flowing into the heat exchangers 62 and 67 and the heat exchanger 70 through the first discharge path 81.

  A configuration in which the heat exchanger 85 that raises the temperature of the nitrogen gas discharged from the first and second internal passages 62 and 67 is omitted may be employed. At this time, although the temperature in the storage box 50 is lowered, since nitrogen gas having a moisture content close to 0 is introduced into the storage box 50, it is possible to suppress the occurrence of condensation in the storage box 50.

-The nitrogen gas discharged | emitted from the 1st and 2nd internal channel | paths 62 and 67 may be heated not only with the heat exchanger 85 but with an air heater etc., for example.
The first and second discharge paths 81 and 82 may be individually connected to the storage box 50. In this case, the heat exchanger 85 and the third check valve 90 may be disposed in each of the first and second discharge paths 81 and 82.

The dry air that has flowed out of the high-temperature fluid chamber 88 of the heat exchanger 85 may be discharged into the cover member 12 or the atmosphere.
The configuration may be such that at least one of the first check valve 83 in the first discharge path 81 and the second check valve 84 in the second discharge path 82 is omitted. That is, a configuration in which at least one of the first and second internal passages 62 and 67 and the storage box 50 are always in communication may be employed.

  -In one cooling unit, the aspect which the nitrogen gas which flowed out from the vaporization container flows in into one internal channel | path may be sufficient. At this time, only one vaporization chamber need be formed in the vaporization container. Moreover, in one cooling unit, the aspect which the nitrogen gas which flowed out from the vaporization container flows in into three or more internal passages may be sufficient. That is, an aspect in which three or more internal passages are connected in parallel to the vaporization container may be employed. At this time, it is only necessary that vaporization chambers corresponding to the respective internal passages are formed in the vaporization container.

Further, in one cooling unit, a plurality of internal passages may be connected in series with respect to one supply path.
The first internal passage 62 and the second internal passage 67 may be internal passages arranged on different stages. In this case, for example, if the second internal passage 67 is disposed in the second shuttle 16, the nitrogen gas discharged from the second internal passage 67 is preferably introduced into the storage box 52.

-The nitrogen gas discharged | emitted from the 1st and 2nd internal channel | paths 62 and 67 may be discharged | emitted not only in the storage box 50 but in air | atmosphere.
The handler 10 may have a configuration in which the storage boxes 50 and 52 and the inspection box 51 are omitted. At this time, the first and second discharge paths 81 and 82 may be connected to the cover member 12.

  The valves 63 and 68 may be disposed on the downstream side of the heat exchanger 70. Even with this configuration, the amount of nitrogen gas supplied to the first and second internal passages 62 and 67 can be adjusted.

  The internal passage only needs to be arranged inside the stage, and may be arranged in the supply shuttle plate 15a instead of the first shuttle 15, or the first shuttle 15 and the supply shuttle. The aspect arrange | positioned in both in the plate 15a may be sufficient.

  The storage tank 55 may be provided outside the handler 10. In this case, for example, a connection portion provided in the common path 56 of the handler 10 and connected to a pipe connected to the storage tank 55 functions as a supply portion.

The liquefied gas is not limited to liquid nitrogen but may be liquid oxygen, liquid hydrogen, liquid helium, or the like.
In the above embodiment, the stage is configured by the test head 14 attached to the opening 13 penetrating the base 11 and the inspection socket 14 a on the upper surface of the test head 14. Instead, as shown in FIG. 4, a pedestal 103 including an internal passage 100 through which nitrogen gas flows, a heater 101, and an accommodating portion 102 in which an inspection socket 14a is accommodated is installed on the base 11, The pedestal 103 may be a stage. In this case, the inspection socket 14 a is mounted on the handler 10 by being accommodated in the accommodating portion 102 of the pedestal 103. And the electronic component accommodated in the socket 14a for an inspection is cooled by the base 103 being cooled.

  Since the handler and the tester constituting the part inspection apparatus are separate apparatuses, when the test head 14 and the inspection socket 14a are used as a stage, a nitrogen gas is previously applied to the test head 14 of the tester separately from the configuration on the handler side. It is necessary to provide a flow path and a heater. In this regard, according to the above-described configuration, it is possible to cool the electronic component T accommodated in the inspection socket 14a without requiring the test head 14 including the internal flow path and the heater.

  As long as the temperature of the stage can be detected, the temperature sensor may be mounted on the pedestal 103 or may be mounted on the inspection socket 14a. In addition, although one accommodation portion 102 is formed in the pedestal 103 illustrated in FIG. 4, the number of accommodation portions 102 formed in the pedestal 103 may be two or more. Further, the test head 14 and the inspection socket 14a may be accommodated in the accommodating portion 102 of the pedestal 103. In short, as long as the stage that supports the electronic component is used, any member that indirectly touches the electronic component with the heat conducting member interposed therebetween may be cooled.

  In addition, the stage can be arbitrarily set as long as it is a part that supports the electronic component T on the mounting surface 11a of the base 11 or above the base 11 in the transport space covered by the cover member 12. It is. For example, the supply shuttle plate 15a and the recovery shuttle plate 15b may be provided as separate stages, and cooling may be provided by providing separate cooling units for these stages. In addition, a stage is provided at the lower end suction portion of the first transfer unit 32 and the second transfer unit 33 in the transfer robot 30, and a cooling unit is provided at the lower end of each of the first transfer unit 32 and the second transfer unit 33. You may do it. In short, if it is a part where the electronic component T is supported, the cooling unit can be provided using that part as a stage. It should be noted that when the electronic component T is transported between the cooling units, the electronic component T may be transferred by opening and closing a part of the container.

  T ... electronic component, C1 ... conveyor for supply, C2, C3, C4 ... conveyor for collection, C1a, C2a, C3a, C4a ... device tray, 10 ... handler, 11 ... base, 11a ... mounting surface, 12 ... cover member , 13 ... opening, 14 ... test head, 14a ... inspection socket, 15 ... first shuttle, 15a ... supply shuttle plate, 15b ... recovery shuttle plate, 15c ... shuttle guide, 16 ... second shuttle, 16a ... Supply shuttle plate, 16b ... Recovery shuttle plate, 16c ... Shuttle guide, 17, 17a, 17b, 18 ... Storage pocket, 20 ... Supply robot, 21 ... Supply side fixed guide, 22 ... Supply side movable guide, 23 ... Supply Hand unit, 30 ... transport robot, 31 ... transport guide, 32 ... first transport unit, 33 ... 2 transport unit, 40 ... collection robot, 41 ... collection side fixed guide, 42 ... collection side movable guide, 43 ... collection hand unit, 50 ... storage box, 51 ... inspection box, 52 ... storage box, 55 ... storage tank, 56 ... Common path, 61 ... First supply path, 62 ... First internal path, 63 ... First valve, 66 ... Second supply path, 67 ... Second internal path, 68 ... Second valve, 68 ... Valve, 70 ... heat exchanger, 71 ... first vaporization chamber, 72 ... second vaporization chamber, 73 ... heat insulating material, 74, 75 ... heater, 77, 78 ... temperature sensor, 81 ... first discharge path, 82 ... second discharge Path 83 first check valve 84 second check valve 85 heat exchanger 86 cold fluid chamber 87 dry air supply source 88 hot fluid chamber 89 air heater 90 first 3 check valves, 95 ... control device, 96 ... cooling unit Gate drive unit, 96a ... valve drive section, 96b ... Heater driver, 98 ... tester, 100 ... inner passage, 101 ... heater, 102 ... accommodation unit, 103 ... pedestal.

Claims (10)

A shuttle carrying electronic components,
A robot mechanism for conveying the electronic component;
A refrigerant supply unit capable of supplying the refrigerant;
A dry air supply unit capable of supplying dry air;
The electronic component is a can be placed, a stage in which the refrigerant has a can flow passage,
A storage container capable of storing the stage;
A refrigerant supply path through which the refrigerant can flow from the refrigerant supply section to the passage;
A cryogenic fluid chamber connected to the passage and filling the refrigerant in the container;
A refrigerant discharge passage having the cryogenic fluid chamber, having one end connected to the passage and the other end connected to the storage container;
A high-temperature fluid chamber that is connected to the dry air supply unit and fills the container with the dry air;
A dry air supply path having the high-temperature fluid chamber, one end connected to the dry air supply, and the other end connected to the storage container;
With
Wherein the low temperature fluid compartment and the hot fluid chambers, handler the said refrigerant cryogen chamber and the hot fluid chambers wherein the dry air is characterized in that it is arranged so that heat can be exchanged, transporting the electronic component. The cold fluid chamber and the hot fluid chamber are included in a heat exchanger;
The handler for conveying an electronic component according to claim 1 , wherein the heat exchanger is a plate heat exchanger. The handler for conveying an electronic component according to claim 1 or 2 , wherein a dry air heating unit capable of heating the dry air is disposed between the dry air supply unit and the high-temperature fluid chamber. A temperature sensor capable of detecting the temperature of the stage;
The handler which conveys an electronic component of any one of Claims 1-3 provided with the heater which can heat the said stage. The handler for conveying an electronic component according to any one of claims 1 to 4 , wherein the refrigerant is nitrogen gas . In the refrigerant discharge path, between said passage and said cold fluid chambers, any one of the preceding claims, characterized in that it comprises a possible regulatory check valve the flow of fluid into the passageway A handler for transporting electronic components as described in 1. In the refrigerant discharge path, between the container and the cryogenic fluid chamber, one of the claims 1-6, characterized in that it comprises a possible regulatory check valve the flow of fluid to the cold fluid chamber A handler for conveying an electronic component according to claim 1 . A plurality of the passages are arranged,
A first vaporization chamber is provided between one of the passages and the refrigerant supply unit,
A second vaporization chamber is provided between the other passage and the refrigerant supply unit,
The handler for conveying an electronic component according to any one of claims 1 to 7, wherein the first vaporization chamber and the second vaporization chamber are arranged so as to be able to exchange heat. The first vaporization chamber and the second vaporization chamber are included in a heat exchanger,
The handler for transporting an electronic component according to claim 8 , wherein the heat exchanger is a plate heat exchanger. A shuttle carrying electronic components,
A robot mechanism for conveying the electronic component;
A tester for inspecting the electronic component;
A refrigerant supply unit capable of supplying the refrigerant;
A dry air supply unit capable of supplying dry air;
The electronic component is a can be placed, a stage in which the refrigerant has a can flow passage,
A storage container capable of storing the stage;
A refrigerant supply path through which the refrigerant can flow from the refrigerant supply section to the passage;
A cryogenic fluid chamber connected to the passage and filling the refrigerant in the container;
A refrigerant discharge passage having the cryogenic fluid chamber, having one end connected to the passage and the other end connected to the storage container;
A high-temperature fluid chamber that is connected to the dry air supply unit and fills the container with the dry air;
A dry air supply path having the high-temperature fluid chamber, one end connected to the dry air supply, and the other end connected to the storage container;
With
The low temperature fluid chamber and the high temperature fluid chamber are arranged so that heat exchange is possible between the refrigerant in the low temperature fluid chamber and the dry air in the high temperature fluid chamber .

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