JP2017100051A - Electronic component transportation device and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component transportation device capable of stably performing cleaning with a simple configuration, and an electronic component inspection device.SOLUTION: An electronic component transportation device includes: a device supply section 14 serving as a placing section having a placing surface 142 on which an IC device 90 being an electronic component is placed; and a first suction section 3A sucking air G and performing cleaning of at least the placing surface 142. Further, the first suction section 3A can be disposed vertically above the placing surface 142. Furthermore, a direction of flow of the air G sucked by the first suction section 3A is a direction inclined against a Z direction (vertical direction).SELECTED DRAWING: Figure 5

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, there is known an electronic component inspection apparatus that inserts an electronic component such as a semiconductor element into an inspection socket and inspects (tests) the electrical characteristics of the electronic component (for example, see Patent Document 1). In the electronic component inspection apparatus described in Patent Document 1, the inside of the recess of the inspection socket into which the electronic component is inserted is cleaned with a cleaning member (for example, a wiping sheet), that is, foreign matters such as dust and dust are removed. It is configured to be able to.

JP 09-325172 A

  However, in the electronic component inspection apparatus described in Patent Document 1, for example, when a foreign object enters the corner of the recess of the inspection socket, the cleaning member may not reach that point, so the foreign object must be sufficiently removed. I can't. Further, the cleaning member is worn out if it is continuously used, and needs to be replaced. Furthermore, a mechanism for driving the cleaning member is also required, and the mechanism is likely to be complicated.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as follows.

An electronic component transport apparatus according to the present invention includes a placement unit having a placement surface on which an electronic component is placed;
And a suction part for sucking air and cleaning the mounting surface.

  Thereby, with a simple configuration of sucking air, foreign matters such as dust and dust accumulated on the placement surface of the placement portion are sucked together with air, and the placement surface is stably cleaned. be able to.

  In the electronic component transport device of the present invention, it is preferable that the suction part can be arranged vertically above the placement surface.

  Thereby, the suction force from the suction unit can be sufficiently exerted on the mounting surface, and thus foreign matter such as dust or dust accumulated on the mounting surface of the mounting unit can be sucked together with air. .

  In the electronic component transport device of the present invention, it is preferable that the direction of the air flow sucked by the suction unit is a direction inclined with respect to the vertical direction.

  Thereby, for example, an injection unit for injecting air can be provided adjacent to the suction unit, and thus the flow of air used for cleaning can be ensured in one direction.

In the electronic component conveying apparatus of the present invention, it is preferable to have an ejection unit that ejects air.
Thereby, foreign matters such as dust and dust accumulated on the placement surface of the placement unit can be blown off. Then, the foreign matter blown off is sucked by the suction portion.

  In the electronic component transport device according to the aspect of the invention, it is preferable that the amount of air sucked by the suction unit is larger than the amount of air ejected by the ejection unit.

  Thereby, the foreign matter such as dust or dust blown off by the injection from the injection unit can be sucked with a margin.

In the electronic component transport device of the present invention, the suction part has a suction port for sucking air,
The injection unit has an injection port for injecting air,
It is preferable that the suction port and the ejection port have a slit shape.

  As a result, the portion to be cleaned can be secured as wide as possible so as to extend not only to the placement surface but also to the periphery thereof.

  In the electronic component conveying apparatus of the present invention, it is preferable that the temperature of the air ejected from the ejection unit can be adjusted.

  For example, when an electrical inspection is performed on an electronic component, it is necessary to set the temperature to be suitable for inspection (hereinafter referred to as “inspection temperature”) by heating or cooling the electronic component before the inspection. . In this case, it is preferable to keep the surface temperature of the mounting surface as close as possible to the inspection temperature. And by being able to adjust the temperature of the air ejected from the ejection unit, even if the temperature-adjusted electronic component is placed on the placement surface, temperature change in the electronic component is prevented or suppressed Can do.

  In the electronic component conveying apparatus of the present invention, it is preferable that the air ejected from the ejecting unit can be ionized.

  Thereby, the surface of the electronic component may be charged with static electricity, for example, during the transportation of the electronic component. For this reason, it is necessary to remove the static electricity. Then, it can neutralize by spraying the ionized air on the surface of an electronic component.

  In the electronic component transport device according to the aspect of the invention, it is preferable that the suction part and the ejection part are arranged via a wall part.

  As a result, the flow of air used for cleaning can be ensured in one direction, so that foreign matters such as dust and dirt accumulated on the placement surface of the placement portion can be removed without excess or deficiency. it can.

In the electronic component transport device of the present invention, the wall portion partitions a space,
It is preferable that the suction part is disposed outside the space, and the injection part is disposed inside the space.
Thereby, it becomes easy to ensure the air flow in one direction described above.

In the electronic component transport device of the present invention, it is preferable that the placement unit is an inspection unit that inspects the electronic component.
Thereby, for example, an electrical inspection can be performed on an electronic component.

  In the electronic component conveying apparatus of the present invention, it is preferable that the placing section is supported so as to be movable.

  Thereby, an electronic component can be stably conveyed, for example from a predetermined position to another predetermined position.

  In the electronic component transport apparatus according to the present invention, it is preferable that the cleaning is performed when the electronic component transport apparatus is activated.

  Thereby, the mounting surface is cleaned in a state where the electronic component is not yet mounted. If the normal electronic component is transported after the cleaning, the electronic component is preferably placed on the placement surface from which foreign matter has been removed.

  In the electronic component transport apparatus of the present invention, it is preferable that the cleaning is performed at a predetermined time when the electronic component transport apparatus is operating.

  Thereby, the interval at which cleaning is performed can be set, for example, every time one or more lots are completed, or can be set every time a certain time elapses.

An electronic component inspection apparatus according to the present invention includes a placement portion having a placement surface on which an electronic component is placed;
A suction part that sucks air and cleans the mounting surface;
And an inspection unit for inspecting the electronic component.

  Thereby, with a simple configuration of sucking air, foreign matters such as dust and dust accumulated on the placement surface of the placement portion are sucked together with air, and the placement surface is stably cleaned. be able to.

FIG. 1 is a schematic perspective view of a first embodiment of an electronic component inspection apparatus according to the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection apparatus shown in FIG. FIG. 3 is an enlarged view of the inspection area and its periphery of the electronic component inspection apparatus shown in FIG. 4 is a vertical cross-sectional view (a diagram showing an operating state) seen from the direction of arrow A in FIG. FIG. 5 is a vertical sectional view (a diagram showing an operating state) seen from the direction of arrow A in FIG. 3. 6 is a vertical cross-sectional view (a diagram showing an operating state) seen from the direction of arrow A in FIG. FIG. 7 is a vertical cross-sectional view showing the inspection region and its periphery of the electronic component inspection apparatus (second embodiment) of the present invention. FIG. 8 is a vertical cross-sectional view showing the inspection region and its periphery of the electronic component inspection apparatus (third embodiment) of the present invention.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<First Embodiment>
FIG. 1 is a schematic perspective view of a first embodiment of an electronic component inspection apparatus according to the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection apparatus shown in FIG. FIG. 3 is an enlarged view of the inspection area and its periphery of the electronic component inspection apparatus shown in FIG. 4 to 6 are vertical sectional views (views showing the operating state) seen from the direction of arrow A in FIG. In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. Moreover, the upper side in FIGS. 1 and 4 to 6 (the same applies to FIGS. 7 and 8) may be referred to as “upper (or upper)” and the lower side may be referred to as “lower (or lower)”. In addition, the term “horizontal” in the specification of the present application is not limited to complete horizontal, and includes a state slightly inclined (for example, less than about 5 °) with respect to the horizontal as long as transportation of electronic components is not hindered.

  The inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 and FIG. 2 conveys electronic components such as an IC device that is a BGA (Ball Grid Array) package, and inspects and tests the electrical characteristics during the conveyance process. (Hereinafter simply referred to as “inspection”). In the following, for convenience of explanation, the case where an IC device is used as the electronic component will be described as a representative, and this will be referred to as “IC device 90”.

  As shown in FIG. 2, the inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter simply referred to as “collection area”). Say) A4 and tray removal area A5. Then, the IC device 90 passes through the respective areas in order from the tray supply area A1 to the tray removal area A5, and the inspection is performed in the intermediate inspection area A3. As described above, the inspection apparatus 1 includes the electronic component conveyance device (handler) that conveys the IC device 90 in each region, the inspection unit 16 that performs inspection in the inspection region A3, and the control unit 800. . In addition, the inspection apparatus 1 includes a monitor 300, a signal lamp 400, and an operation panel 700 (see FIG. 1).

  In the inspection apparatus 1, the direction in which the tray supply area A1 and the tray removal area A5 are arranged (the lower side in FIG. 2) is the front side, and the opposite side, that is, the direction in which the inspection area A3 is arranged (FIG. 2 is used as the back side.

  The tray supply area A1 is a material supply unit to which a tray (mounting member) 200 in which a plurality of uninspected IC devices 90 are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

  The supply area A2 is an area where a plurality of IC devices 90 arranged on the tray 200 from the tray supply area A1 are supplied to the inspection area A3. Note that tray transport mechanisms 11A and 11B that transport the trays 200 one by one in the horizontal direction are provided so as to straddle the tray supply area A1 and the supply area A2. The tray transport mechanism 11 </ b> A is a moving unit that can move the tray 200 to the positive side in the Y direction together with the IC device 90 placed on the tray 200. Thereby, the IC device 90 can be stably fed into the supply area A2. The tray transport mechanism 11B is a moving unit that can move the empty tray 200 to the negative side in the Y direction, that is, from the supply area A2 to the tray supply area A1.

  In the supply area A2, a temperature adjusting unit 12, a device transport head 13, and a tray transport mechanism 15 are provided.

  The temperature adjustment unit 12 can collectively cool or heat the plurality of IC devices 90 and is sometimes referred to as a “soak plate”. With the soak plate, the IC device 90 before being inspected by the inspection unit 16 can be cooled or heated in advance and adjusted to a temperature suitable for the inspection. In the configuration shown in FIG. 2, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried (conveyed) from the tray supply area A1 by the tray transport mechanism 11A is transported to one of the temperature adjustment units 12.

  The device transport head 13 is supported so as to be movable in the X and Y directions and further in the Z direction within the supply area A2. As a result, the device transport head 13 transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and between the temperature adjustment unit 12 and a device supply unit 14 described later. It is possible to carry the IC device 90.

  The tray transport mechanism 15 is a mechanism that transports the empty tray 200 from which all IC devices 90 have been removed to the positive side in the X direction within the supply area A2. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, an inspection unit 16 and a device transport head 17 are provided. In addition, a device supply unit 14 that moves so as to straddle the supply region A2 and the inspection region A3 and a device recovery unit 18 that moves so as to straddle the inspection region A3 and the recovery region A4 are also provided. Further, a first cleaning unit (supply side cleaning unit) 10A is provided between the supply area A2 and the inspection area A3, and a second cleaning unit (recovery side) is provided between the inspection area A3 and the recovery area A4. Cleaning unit) 10B is provided.

  The device supply unit 14 is a mounting unit on which the IC device 90 temperature-adjusted by the temperature adjusting unit 12 is mounted and can transport (move) the IC device 90 to the vicinity of the inspection unit 16. Sometimes referred to as “shuttle plate”. As shown in FIG. 3, the device supply unit 14 has recesses (pockets) 141 arranged in a matrix of 2 rows and 2 columns. Each recess 141 accommodates one IC device 90 before being inspected by the inspection unit 16.

  The device supply unit 14 is supported so as to be movable in the horizontal direction along the X direction between the supply region A2 and the inspection region A3. In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to one of the device supply units 14. The device supply unit 14 is configured to maintain the temperature adjusted state of the temperature-adjusted IC device 90. Thereby, the IC device 90 can be cooled or heated, and thus the temperature adjustment state of the IC device 90 can be maintained.

  The inspection unit 16 is a mounting unit that mounts the IC device 90 and inspects and tests the electrical characteristics of the IC device 90. As shown in FIG. 3, the inspection unit 16 has recesses (pockets) 161 arranged in a matrix of 2 rows and 2 columns. Each recess 161 houses one IC device 90 to be inspected. In addition, a plurality of probe pins that are electrically connected to the terminal portions of the IC device 90 in a state in which the IC device 90 is housed are provided inside each recess 161. Then, the terminal portion of the IC device 90 and the probe pin are electrically connected (contacted), and the IC device 90 is inspected via the probe pin. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16. In the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be cooled or heated to adjust the IC device 90 to a temperature suitable for the inspection.

  The device transport head 17 is supported so as to be movable in the Y direction and the Z direction within the inspection area A3. Thereby, the device transport head 17 can transport and place the IC device 90 on the device supply unit 14 carried in from the supply area A2 onto the inspection unit 16. The device transport head 17 can also cool or heat the IC device 90 to adjust the IC device 90 to a temperature suitable for inspection.

  The device collection unit 18 is a placement unit on which the IC device 90 that has been inspected by the inspection unit 16 is placed, and the IC device 90 can be transported (moved) to the collection region A4. Sometimes called “shuttle plate”. As shown in FIG. 3, the device collection unit 18 has recesses (pockets) 181 arranged in a matrix of 2 rows and 2 columns. Each recess 181 accommodates one IC device 90 after being inspected by the inspection unit 16.

  The device collection unit 18 is supported so as to be movable in the horizontal direction along the X direction between the inspection area A3 and the collection area A4. In the configuration shown in FIG. 2, two device collection units 18 are arranged in the Y direction, similarly to the device supply unit 14, and the IC device 90 on the inspection unit 16 is one of the device collection units 18. Are transported to and placed. This transport is performed by the device transport head 17.

  Moreover, as shown in FIGS. 3-6, in the inspection apparatus 1, one device supply part 14 and one device collection | recovery part 18 are connected by the X direction via the connection part 23, and are the same direction. A shuttle unit that moves all at once. In the following, the lower shuttle unit in FIG. 3, that is, the front side (Y direction negative side) shuttle unit is referred to as “first shuttle unit 24A”, and the upper side, that is, the rear side (Y direction negative side) shuttle unit. This is referred to as “second shuttle unit 24B”.

  The first cleaning unit 10 </ b> A is a unit that cleans the device supply unit 14, and the second cleaning unit 10 </ b> B is a unit that cleans the device collection unit 18. Details of these units will be described later.

  The collection area A4 is an area in which a plurality of IC devices 90 that have been inspected are collected. In the collection area A4, a collection tray 19, a device conveyance head 20, and a tray conveyance mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4.

  The collection tray 19 is a placement unit on which the IC device 90 inspected by the inspection unit 16 is placed, and is fixed so as not to move in the collection region A4. As a result, the inspected IC device 90 can be stably placed on the collection tray 19 even in the collection area A4 where a relatively large number of various movable parts such as the device transport head 20 are arranged. Become. In the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction.

  Three empty trays 200 are also arranged along the X direction. This empty tray 200 is also a placement unit on which the IC device 90 inspected by the inspection unit 16 is placed. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is conveyed and placed on either the recovery tray 19 or the empty tray 200. Thereby, the IC device 90 is classified and collected for each inspection result.

  The device transport head 20 is supported so as to be movable in the X and Y directions and further in the Z direction within the collection area A4. Accordingly, the device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.

  The tray transport mechanism 21 is a mechanism for transporting an empty tray 200 carried from the tray removal area A5 in the X direction within the collection area A4. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200.

  The tray removal area A5 is a material removal unit from which the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

  Further, tray transport mechanisms 22A and 22B for transporting the tray 200 one by one in the Y direction are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a moving unit that can move the tray 200 in the Y direction. Thus, the inspected IC device 90 can be transported from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a moving unit that can move an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

  The control unit 800 has, for example, a drive control unit. The drive control unit includes, for example, tray transport mechanisms 11A and 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, an inspection unit 16, and a device transport head 17. The drive of each part of the device collection | recovery part 18, the device conveyance head 20, the tray conveyance mechanism 21, tray conveyance mechanism 22A, 22B, 1st cleaning unit 10A, and 2nd cleaning unit 10B is controlled.

  The test control unit of the tester inspects the electrical characteristics of the IC device 90 arranged in the test unit 16 based on a program stored in a memory (not shown), for example.

  The operator can set or confirm the operating conditions of the inspection apparatus 1 via the monitor 300. The monitor 300 includes a display screen (display unit) 301 configured by, for example, a liquid crystal screen, and is disposed at the upper part on the front side of the inspection apparatus 1. As shown in FIG. 1, on the right side of the tray removal area A5 in the figure, there is provided a mouse table 600 on which a mouse used for operating a screen displayed on the monitor 300 is placed.

  An operation panel 700 is disposed on the lower right side in FIG. The operation panel 700 commands the inspection apparatus 1 to perform a desired operation separately from the monitor 300.

  Further, the signal lamp 400 can notify the operating state or the like of the inspection apparatus 1 by a combination of colors that emit light. The signal lamp 400 is arranged on the upper part of the inspection apparatus 1. Note that the inspection device 1 has a built-in speaker 500, and the operation state of the inspection device 1 can also be notified by the speaker 500.

  As shown in FIG. 2, in the inspection apparatus 1, the tray supply area A1 and the supply area A2 are separated (partitioned) by the first partition wall 61, and the supply area A2 and the inspection area A3 are separated. It is divided by the second partition wall 62, the inspection area A3 and the collection area A4 are separated by the third partition wall 63, and the collection area A4 and the tray removal area A5 are separated by the fourth partition wall 64. ing. The supply area A2 and the collection area A4 are also separated by the fifth partition wall 65. Among these partitions (wall portions), the second partition 62 and the third partition 63 in particular have a function of maintaining the airtightness of the inspection area A3. As shown in FIGS. 4 to 6, the second partition 62 has an opening 621 through which the device supply unit 14 passes, and the third partition 63 has an opening 631 through which the device collection unit 18 passes. Is formed.

  The outermost exterior of the inspection apparatus 1 is covered with a cover, and examples of the cover include a front cover 70, a side cover 71, a side cover 72, a rear cover 73, and a top cover 74.

  By the way, there are cases where, for example, dust, dust, and other fine pieces of resin material constituting the exterior of the IC device 90 (hereinafter collectively referred to as “foreign matter”) are attached to the IC device 90. . Such foreign matter may fall in the process of transporting the IC device 90 and remain, for example, in the recess 141 of the device supply unit 14 or the recess 181 of the device collection unit 18. In this case, depending on the size of the foreign matter, the IC device 90 may be misaligned in the concave portion 141 or the concave portion 181, or the IC device 90 may be damaged.

  Conventionally, when foreign matter remains, the inspection apparatus 1 is temporarily stopped and the operator blows off the foreign matter using an air gun. This work was troublesome for the operator. Further, during this work, since the inspection apparatus 1 is temporarily stopped, the operation rate of the inspection apparatus 1 is also lowered. Further, the foreign matter blown off by the air gun is not removed from the transport area where the IC device 90 such as the supply area A2 is transported, but is scattered and dropped to other parts. And when the fall destination is the other recessed part 141, for example, there exists a possibility that the same position shift may arise.

  Therefore, as shown in FIGS. 3 to 6, the inspection apparatus 1 includes a first cleaning unit 10 </ b> A and a second cleaning unit 10 </ b> B that remove foreign matter.

  The first cleaning unit 10 </ b> A includes a first ejection unit 3 </ b> A that ejects air G and a first suction unit 4 </ b> A that sucks air G. The first injection unit 3 </ b> A and the first suction unit 4 </ b> A are disposed via the second partition wall 62.

  The second cleaning unit 10B includes a second ejection unit 3B that ejects air G and a second suction unit 4B that sucks air G. The second injection unit 3B and the second suction unit 4B are disposed via the third partition wall 63.

  The first injection unit 3 </ b> A and the second injection unit 3 </ b> B are connected to the compression pump 52 via the pipe 51. The compression pump 52 is not particularly limited, and for example, a compressor can be used. The first suction unit 4 </ b> A and the second suction unit 4 </ b> B are connected to a suction pump 54 via a pipe 53. The suction pump 54 is not particularly limited, and for example, a vacuum pump can be used.

  In the present embodiment, the first injection unit 3A and the first suction unit 4A that constitute the first cleaning unit 10A, and the second injection unit 3B and the second suction unit 4B that constitute the second cleaning unit 10B Since the configuration is the same except that is different, the first cleaning unit 10A will be described as a representative.

  As illustrated in FIG. 3, the first injection unit 3A includes a long box body 31 that is disposed along the Y direction so as to straddle the first shuttle unit 24A and the second shuttle unit 24B. The box 31 is installed above the opening 621 of the second partition wall 62. Further, as shown in FIG. 4 (the same applies to FIGS. 5 and 6), the box 31 is opened downward, and this opening functions as the injection port 311. Then, by operating the compression pump 52, the air G can be injected from the injection port 311.

  The ejection port 311 has a slit shape formed along the Y direction. Accordingly, in both the first shuttle unit 24A and the second shuttle unit 24B, when the device supply unit 14 passes directly below the ejection port 311, the air G from the ejection port 311 causes the inside of the recess 141, particularly the recess 141. The foreign matter on the mounting surface 142 on which the IC device 90 is mounted can be blown away (see FIG. 5). The blown-out foreign matter is sucked by the first suction unit 4A.

  As shown in FIG. 3, the first suction part 4A is a long piece arranged along the Y direction so as to straddle the first shuttle unit 24A and the second shuttle unit 24B, similarly to the first injection part 3A. A box 41 is provided. The box 41 is installed at the same height as the box 31 of the first injection unit 3A. As shown in FIG. 4, the box body 41 opens downward, and this opening functions as a suction port 411. The air G can be sucked from the suction port 411 by operating the suction pump 54.

  The suction port 411 has a slit shape formed along the Y direction. Thereby, in both the first shuttle unit 24A and the second shuttle unit 24B, when the device supply unit 14 passes directly below the suction port 411, the blown-off foreign matter is sucked together with the air G by the suction port 411.

  As described above, in the first cleaning unit 10A, the mounting surface 142 and its surroundings are cleaned by the synergistic effect of the injection of the air G in the first injection unit 3A and the suction of the air G in the first suction unit 4A. Can be performed stably. Thereby, the position shift etc. of the IC device 90 in the recessed part 141 resulting from a foreign material can be prevented. Moreover, the foreign substance removal work by the operator mentioned above can also be omitted. Furthermore, since the cleaning can be performed without stopping the inspection apparatus 1, it is possible to prevent a reduction in the operating rate of the inspection apparatus 1.

  As described above, in the first cleaning unit 10 </ b> A, the first injection unit 3 </ b> A (box body 31) and the first suction unit 4 </ b> A (box body 41) are above the opening 621 of the second partition wall 62. It arrange | positions through the 2nd partition 62 (refer FIGS. 4-6). With such an arrangement, it is possible to ensure the flow of the air G used for removing foreign substances in one direction. In other words, the air G that is used for removing foreign substances is injected while being inclined with respect to the Z direction (vertical direction) from the first injection unit 3A toward the opening 621, passes through the opening 621, and then Absorption is performed by inclining with respect to the Z direction so as to go from the opening 621 toward the first suction part 4A. Such a flow of the air G in one direction is a preferable flow for once blowing out the foreign matter and immediately absorbing the foreign matter.

  The first suction unit 4A is disposed inside the inspection region A3 having the smallest volume among the supply region A2, the inspection region A3, and the recovery region A4 where temperature and humidity can be managed, and the first injection unit 3A These are disposed outside the inspection area A3, that is, in the supply area A2. Thereby, for example, it becomes easy to ensure the flow of the air G in one direction described above.

  The suction amount of the air G sucked by the first suction unit 4A is set to be larger than the injection amount of the air G jetted by the first injection unit 3A. The following is preferable, and about 5 times is more preferable. As a result, the foreign matter that has been swept up (blowed off) by the injection from the first injection unit 3A can be sucked with a margin. Such a magnitude relationship can be set, for example, by appropriately selecting the compression pump 52 or the suction pump 54 having an output suitable for the setting.

  In the second cleaning unit 10B, the same operation and effect as those in the first cleaning unit 10A can be obtained with respect to the mounting surface 182 of the device recovery unit 18 (recessed portion 181) and the foreign matter around it. .

  As shown in FIGS. 4 to 6, the pipe 51 is provided with a temperature adjustment unit 55 that adjusts the temperature of the air G on the way to the first injection unit 3 </ b> A and the second injection unit 3 </ b> B. Thereby, the temperature of the air G injected from each injection part can be adjusted. As described above, when the IC device 90 is inspected, it is necessary to set the temperature suitable for inspection (hereinafter referred to as “inspection temperature”) by heating or cooling the IC device 90. In this case, it is preferable that the surface temperature of the mounting surface 142 on which the IC device 90 is mounted be as close as possible to the inspection temperature. Thereby, even if the temperature-adjusted IC device 90 is placed on the placement surface 142, the temperature change in the IC device 90 can be prevented or suppressed. Therefore, the temperature adjustment unit 55 has an effective configuration. The temperature adjusting unit 55 is not particularly limited, and for example, a unit incorporating a Peltier element can be used.

  Examples of the timing for performing the cleaning by the first cleaning unit 10A and the second cleaning unit 10B include the following timings.

  The first timing is immediately after a state in which the power supply of the inspection apparatus 1 is turned off and the operation is stopped, that is, when the inspection apparatus 1 is started. Thus, the first shuttle unit 24A and the second shuttle unit 24B are cleaned in an empty state where the IC device 90 is not yet accommodated. If the normal IC device 90 is transported after the cleaning, the IC device 90 is preferably placed on the first shuttle unit 24A or the second shuttle unit 24B from which foreign matter has been removed.

  The second timing is a predetermined timing when the inspection apparatus 1 is operating and transporting the IC device 90 (during the middle). The predetermined time is not particularly limited. For example, the predetermined time can be set every time one or more lots are completed, or can be set every time a certain time elapses. As a result, for example, the foreign matter can be removed before the foreign matter to the extent that affects the positional deviation of the IC device 90 and the damage of the IC device 90 is accumulated.

Second Embodiment
FIG. 7 is a vertical cross-sectional view showing the inspection region and its periphery of the electronic component inspection apparatus (second embodiment) of the present invention.

  Hereinafter, the second embodiment of the electronic component transport device and the electronic component inspection device according to the present invention will be described with reference to this drawing. However, the description will focus on differences from the above-described embodiment, and the same matters will be described. Is omitted.

  This embodiment is the same as the first embodiment except that the directions of the first injection unit and the second injection unit are different.

  As described in the first embodiment, foreign matter may adhere to the IC device 90. The foreign matter may fall in the process of transporting the IC device 90 and remain in the recess 161 of the inspection unit 16. In this case as well, although it depends on the size of the foreign matter as in the first embodiment, it may cause misalignment of the IC device 90 in the recess 161, poor contact between the IC device 90 and the inspection unit 16, and the like. is there.

  Therefore, in the present embodiment, as shown in FIG. 7, the injection port 311 of the first injection unit 3A and the injection port 311 of the second injection unit 3B face the inspection unit 16 side. Thereby, the foreign substance on the mounting surface 162 in which the IC device 90 is mounted in the recessed part 161 of the test | inspection part 16, especially the bottom face of the recessed part 161 can be blown off with the air G from each injection port 311. . Thereby, the position shift of the IC device 90 in the recessed part 161 resulting from a foreign material, a contact failure, etc. can be prevented.

  Of the blown-out foreign matter, the foreign matter that has come out from the opening 621 of the second partition wall 62 is sucked by the first suction part 4A, and the foreign matter that has come out from the opening 631 of the third partition wall 63 is 2 sucked by the suction unit 4B.

  The pipe 51 connected to the first injection unit 3A and the second injection unit 3B is connected to the ion generation unit 57 via the switching valve 56 on the upstream side. The ion generator 57 is an ionizer that ionizes dry air to generate the ionized dry air. In addition, it does not specifically limit as the ion generation part 57, For example, what utilized corona discharge, what utilized ionizing radiation, etc. can be used.

  Then, by operating the switching valve 56, the first injection unit 3A and the second injection unit 3B take the first state connected to the compression pump 52 and the second state connected to the ion generation unit 57. obtain. The first state is set during cleaning.

  In the second state, the air G injected from each of the first injection unit 3A and the second injection unit 3B is ionized. The surface of the IC device 90 may be charged with static electricity, for example, while the IC device 90 is being transported. For this reason, it is necessary to remove the static electricity. Therefore, the ionized air G can be discharged by blowing it onto the surface of the IC device 90.

<Third Embodiment>
FIG. 8 is a vertical cross-sectional view showing the inspection region and its periphery of the electronic component inspection apparatus (third embodiment) of the present invention.

Hereinafter, the third embodiment of the electronic component transport device and the electronic component inspection device of the present invention will be described with reference to this drawing. However, the difference from the above-described embodiment will be mainly described, and the same matters will be described. Is omitted.
This embodiment is the same as the first embodiment except that a foreign object detection unit is provided.

  As shown in FIG. 8, in the present embodiment, the inspection apparatus 1 includes a first foreign object detector 8A and a second foreign object detector 8B. As the first foreign object detector 8A and the second foreign object detector 8B, for example, a CCD (Charge Coupled Device) camera can be used.

  The first foreign object detector 8A is installed above the supply area A2, and detects foreign objects in the device supply units 14 of the first shuttle unit 24A and the second shuttle unit 24B.

  The second foreign object detector 8B is installed above the collection area A4 and detects foreign substances in the device collection units 18 of the first shuttle unit 24A and the second shuttle unit 24B.

  When a foreign matter is detected by the first foreign matter detection unit 8A, the device supply unit 14 in which the foreign matter is detected can be cleaned by the first cleaning unit 10A. Further, when a foreign matter is detected by the second foreign matter detection unit 8B, the device recovery unit 18 from which the foreign matter has been detected can be cleaned by the second cleaning unit 10B.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

  Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  Further, the first cleaning unit may be supported so that one or both of the first injection unit and the first suction unit can rotate about an axis parallel to the Y direction. Similarly, the second cleaning unit may be supported so that one or both of the second ejection unit and the second suction unit can rotate about an axis parallel to the Y direction.

  In the first cleaning unit, the first suction part can be omitted, and in the second cleaning unit, the second suction part can be omitted.

  Moreover, although the installation location of the 1st cleaning unit was the 2nd partition in each said embodiment, it is not limited to this, For example, it can also be set as a 1st wall part.

  Moreover, although the installation location of the 2nd cleaning unit was the 3rd partition in each said embodiment, it is not limited to this, For example, it can also be set as a 4th wall part.

  In addition, the first cleaning unit and the second cleaning unit both perform cleaning on the portion where the IC device is not yet placed in each embodiment, but the present invention is not limited to this. You may clean with respect to the part in which the device was mounted.

  DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus (electronic component inspection apparatus), 10A ... 1st cleaning unit (supply side cleaning unit), 10B ... 2nd cleaning unit (collection side cleaning unit), 11A ... Tray conveyance mechanism, 11B ... Tray conveyance mechanism, 12 DESCRIPTION OF SYMBOLS ... Temperature adjustment part, 13 ... Device conveyance head, 14 ... Device supply part, 141 ... Concave part (pocket), 142 ... Loading surface, 15 ... Tray conveyance mechanism, 16 ... Inspection part, 161 ... Concave part (pocket), 162 ... Placement surface, 17 ... Device transport head, 18 ... Device recovery unit, 181 ... Recess (pocket), 182 ... Placement surface, 19 ... Recovery tray, 20 ... Device transport head, 21 ... Tray transport mechanism, 22A ... Tray Transport mechanism, 22B ... Tray transport mechanism, 23 ... Connector, 24A ... First shuttle unit, 24B ... Second shuttle Knit, 3A ... 1st injection part, 3B ... 2nd injection part, 31 ... Box body, 311 ... Injection port, 4A ... 1st suction part, 4B ... 2nd suction part, 41 ... Box body, 411 ... Suction port, DESCRIPTION OF SYMBOLS 51 ... Piping, 52 ... Compression pump, 53 ... Piping, 54 ... Suction pump, 55 ... Temperature control part, 56 ... Switching valve, 57 ... Ion generation part, 61 ... 1st partition, 62 ... 2nd partition, 621 ... Opening 63, 3rd partition, 631 ... opening, 64 ... 4th partition, 65 ... 5th partition, 70 ... front cover, 71 ... side cover, 72 ... side cover, 73 ... rear cover, 74 ... top cover, 8A ... 1st foreign matter detection part, 8B ... 2nd foreign matter detection part, 90 ... IC device, 200 ... Tray (mounting member), 300 ... Monitor, 301 ... Display screen, 400 ... Signal lamp, 500 ... Speaker, 600 ... Mouse Stand, 700 ... operation Nell, 800 ... control unit, A1 ... tray supply area, A2 ... device supply area (supply area), A3 ... examination region, A4 ... device collection area (recovery area), A5 ... tray removal area, G ... air

Claims (15)

A mounting portion having a mounting surface for mounting electronic components;
An electronic component transport apparatus comprising: a suction unit that sucks air to clean the mounting surface.   The electronic component transport apparatus according to claim 1, wherein the suction unit can be disposed vertically above the placement surface.   The electronic component transport apparatus according to claim 1, wherein a direction of air flow sucked by the suction unit is a direction inclined with respect to a vertical direction.   The electronic component conveying apparatus according to any one of claims 1 to 3, further comprising an injection unit that injects air.   The electronic component conveying apparatus according to claim 4, wherein a suction amount of air sucked by the suction unit is larger than an injection amount of air ejected by the ejection unit. The suction part has a suction port for sucking air;
The injection unit has an injection port for injecting air,
The electronic component conveying apparatus according to claim 4, wherein the suction port and the ejection port have a slit shape.   The electronic component conveying apparatus according to claim 4, wherein the temperature of the air ejected from the ejection unit can be adjusted.   The electronic component conveying apparatus according to claim 4, wherein the air ejected from the ejection unit can be ionized.   The electronic component conveying apparatus according to claim 4, wherein the suction unit and the ejection unit are disposed via a wall portion. The wall portion partitions the space,
The electronic component transport apparatus according to claim 9, wherein the suction unit is disposed outside the space, and the ejection unit is disposed inside the space.   The electronic component transport apparatus according to claim 1, wherein the placement unit is an inspection unit that inspects the electronic component.   The electronic component carrying device according to claim 1, wherein the placement unit is supported so as to be movable.   The electronic component transport apparatus according to claim 1, wherein the cleaning is performed when the electronic component transport apparatus is activated.   The electronic component conveying apparatus according to claim 1, wherein the cleaning is performed at a predetermined time when the electronic component conveying apparatus is operating. A mounting portion having a mounting surface for mounting electronic components;
A suction part that sucks air and cleans the mounting surface;
An electronic component inspection apparatus comprising: an inspection unit that inspects the electronic component.

Images