CN106483440A - Electronic component conveying device and electronic component inspection device - Google Patents

Electronic component conveying device and electronic component inspection device Download PDF

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Publication number
CN106483440A
CN106483440A CN201610726317.2A CN201610726317A CN106483440A CN 106483440 A CN106483440 A CN 106483440A CN 201610726317 A CN201610726317 A CN 201610726317A CN 106483440 A CN106483440 A CN 106483440A
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CN
China
Prior art keywords
mentioned
flow path
cooling
cold
component
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610726317.2A
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Chinese (zh)
Inventor
桐原大辅
前田政己
下岛聪兴
中村敏
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Seiko Epson Corp
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Seiko Epson Corp
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Filing date
Publication date
Priority claimed from JP2015167518A external-priority patent/JP6597059B2/en
Priority claimed from JP2015167517A external-priority patent/JP2017044592A/en
Priority claimed from JP2016014068A external-priority patent/JP2017133948A/en
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of CN106483440A publication Critical patent/CN106483440A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The present invention provides electronic component conveying device and electronic component inspection device, on cooling-part, electronic unit uniformly can be cooled down.Electronic component inspection device (1) has the temperature adjustment portion (12) of the cooling-part as cooling electronic unit.Temperature adjustment portion (12) has and connects and supply, for the first flow path (37) that cold-producing medium (RF) flows into, the second flow path (38) that cold-producing medium (RF) flows out with first flow path (37).And, in the case of overlooking temperature adjustment portion (12), first flow path (37) is configured in the way of surrounding a part for second flow path (38).

Description

Electronic component conveying device and electronic component inspection device
Technical field
The present invention relates to electronic component conveying device and electronic component inspection device.
Background technology
In the past, it was known to the electronic component inspection device checking the electrical characteristics of electronic unit such as semiconductor element, in this electricity It is built-in with subassembly check device and during electronic unit is transported to inspection portion, this electronic unit is maintained in advance The sheet material of desired temperature.
For example, in the electronic component inspection device that patent documentation 1 is recorded, coldplate has (continuous S font) shape of crawling The flowing groove becoming.And be configured to, liquid nitrogen flows down in flowing groove, thus on the cooling plate electronic unit is cooled down.
In addition, being built-in with above-mentioned coldplate in the electronic component inspection device that patent documentation 1 is recorded and heating electricity in advance Subassembly in the case of being maintained at the desired heating plate of temperature, heating plate has the heater by electrified regulation, and Overlapping on the cooling plate, become the state with respect to electronic unit configuration in the position nearer than coldplate for the heating plate.
In addition, as conventional electronic component inspection device, having and cool down electronic unit and to this ministry of electronics industry within the chamber The device (for example, referring to patent documentation 2) that part is checked.In the electronic component inspection device that patent documentation 2 is recorded, to chamber Indoor supply sub-cooled gas and constitute.
Patent documentation 1：Japanese Unexamined Patent Publication 2003-194874 publication
Patent documentation 2：Japanese Unexamined Patent Publication 2008-107014 publication
However, in the electronic component inspection device that patent documentation 1 is recorded, coldplate has its peripheral part to be more easy to than central part In the trend of the turnover of heat, therefore, liquid nitrogen is only made to flow down it is impossible to carry out uniformly cold on the cooling plate in the flowing groove of bending But.
In addition, in the electronic component inspection device that patent documentation 1 is recorded, if being energized to heater, earlier generating heat Heating plate because near electronic unit and utilize the rapid heating electronic component of this heat.On the other hand, in the flowing groove of coldplate The liquid nitrogen flowing down generally by the supply for receptacles of the outside being arranged at electronic component inspection device, so reach coldplate before cold But ability reduce, further, since coldplate than heating plate away from electronic unit it is difficult to rapidly cool down electronic unit.
Therefore, compare the thermal efficiency (energy loss) of coldplate and heating plate, the thermal efficiency ratio heating plate of coldplate is low, I.e., there is the high trend of energy loss it is difficult to efficiently cool down.
In addition, in the electronic component inspection device that patent documentation 2 is recorded, above-mentioned sub-cooled gas is gas, so For example pyroconductivity is extremely low compared with metal, water etc..Therefore, in the electronic component inspection device that patent documentation 1 is recorded, for example In the case that the electronic unit that the temperature remains within the normal range is moved within the chamber, exists and cannot utilize sub-cooled gas this electricity sufficiently cool Subassembly and be unable to maintain that the such problem of its state of cooling.
Content of the invention
The present invention is in order to solve at least a portion of above-mentioned problem and to complete, and can be accomplished by.
Application examples 1
Should use-case electronic component conveying device it is characterized in that, there is the cooling-part of cooling electronic unit, on State cooling-part to have for the first flow path of cold-producing medium inflow and connect with above-mentioned first flow path and supply above-mentioned cold-producing medium to flow out Second flow path, in the case of overlooking above-mentioned cooling-part, above-mentioned first flow path is to surround a part for above-mentioned second flow path Mode configures.
Thus, the temperature of the cold-producing medium flowing down in the first flow path positioned at outside is less than than this first flow path more in the inner part The temperature of cold-producing medium that flows down of second flow path.Therefore, even if cooling-part has peripheral part and is easier to heat than central part The trend of turnover, it is also possible to prevent the reduction of the refrigerating function of first flow path, can play sufficient refrigerating function.Accordingly, it is capable to Enough on cooling-part, electronic unit is uniformly cooled down.
Application examples 2
Should in the electronic component conveying device of use-case, preferably, above-mentioned cooling-part have first while, second while, 3rd while and when the 4th, above-mentioned first while, above-mentioned second while and above-mentioned 3rd side, in the feelings overlooking above-mentioned cooling-part Under condition, above-mentioned first flow path is configured at the outside of above-mentioned second flow path.
Thus, the temperature of the cold-producing medium flowing down in the first flow path positioned at outside is substantially less than and is more leaning on than this first flow path The temperature of the cold-producing medium that the second flow path of inner side flows down.Therefore, even if cooling-part has peripheral part and is easier to heat than central part The trend of the turnover of amount, also can prevent the reduction of the refrigerating function of first flow path well, can play more fully cooling work( Energy.Therefore, it is possible to, on cooling-part, uniformly be cooled down to electronic unit.
Application examples 3
Should be in the electronic component conveying device of use-case, preferably, above-mentioned first is opposed while with above-mentioned second, above-mentioned 3rd is opposed while with the above-mentioned 4th.
Thus, cooling-part becomes fairly simple outer shape, thus applying machining from the mother metal of metallic plate When obtaining cooling-part, can easily carry out this machining.
Application examples 4
Should in the electronic component conveying device of use-case, preferably, above-mentioned cooling-part be have above-mentioned first side and Above-mentioned first in parallel above-mentioned second with above-mentioned first in orthogonal the above-mentioned 3rd parallel with above-mentioned 3rd side The rectangle on four sides, is configured with the inflow entrance flowing into above-mentioned first flow path for above-mentioned cold-producing medium and for above-mentioned on above-mentioned 4th side The flow export that cold-producing medium flows out from above-mentioned second flow path.
Thereby, it is possible to make inflow entrance adjacent with flow export and as far as possible near such that it is able to connect using such as one manifold Head, carries out the supply of cold-producing medium and the discharge of cold-producing medium to cooling-part.
Application examples 5
Should in the electronic component conveying device of use-case, preferably, above-mentioned first while and length when above-mentioned second Than the above-mentioned 3rd while and length when the above-mentioned 4th long.
Thus, cooling-part becomes fairly simple outer shape, thus applying machining from the mother metal of metallic plate When obtaining cooling-part, can easily carry out this machining.
Application examples 6
Should be in the electronic component conveying device of use-case, preferably, above-mentioned first flow path be connected with above-mentioned second flow path Be partially configured to for above-mentioned 3rd side and more to lean on above-mentioned 4th avris.
Thereby, it is possible to guarantee the total length of first flow path as long as possible, thus contributing to the uniform cooling to electronic unit.
Application examples 7
Preferably, should have two above-mentioned cooling-parts, one above-mentioned cold in the electronic component conveying device of use-case But the above-mentioned 4th of part while by with another above-mentioned cooling-part the above-mentioned 4th while opposed in the way of configure.
Thereby, it is possible to the inboard between a cooling-part and another cooling-part, configuration unification is to each cooling end Part carries out the supply of cold-producing medium and the manifold fittings of the discharge of cold-producing medium.
Application examples 8
Should be in the electronic component conveying device of use-case, preferably, above-mentioned first flow path and above-mentioned second flow path have one Part is set up in parallel.
Thus, the bulk temperature of cooling-part itself also can be very uniform, thus contributing to the uniform cooling to electronic unit.
Application examples 9
Should be in the electronic component conveying device of use-case, preferably, the inside of cooling-part on the other hand has Cold-producing medium is made to flow into the 3rd stream of above-mentioned first flow path and the 4th stream of the cold-producing medium inflow for flowing out from above-mentioned second flow path Road.
Arranging direction thereby, it is possible to make the 3rd stream and the 4th stream is identical direction, thus constituting each stream The pipe distribution operation of pipe becomes easy.
Application examples 10
Should be in the electronic component conveying device of use-case, preferably, above-mentioned cooling-part be to the above-mentioned electricity before checking The temperature-uniforming plate that subassembly is cooled down in advance.
Thus, in the case of electronic unit being pre-cooled on temperature-uniforming plate before inspection, can equably be carried out this cold But.
Application examples 11
Should be in the electronic component conveying device of use-case, preferably, above-mentioned cooling-part be can be by drive division Shuttle plate mobile and that above-mentioned electronic unit can be carried.
Thus, in the case of carrying and cool down electronic unit using shuttle plate, this cooling can equably be carried out.
Application examples 12
The electronic component inspection device of use-case should be characterised by having：The cooling-part of cooling electronic unit, its In, above-mentioned cooling-part is had for the first flow path of cold-producing medium inflow and is connected with above-mentioned first flow path and supply above-mentioned cold-producing medium The second flow path flowing out；And check the inspection portion of above-mentioned electronic unit, and in the case of overlooking above-mentioned cooling-part, above-mentioned the One stream is configured in the way of surrounding a part for above-mentioned second flow path.
Thus, the temperature of the cold-producing medium flowing down in the first flow path positioned at outside is less than than this first flow path more in the inner part The temperature of cold-producing medium that flows down of second flow path.Therefore, even if cooling-part has peripheral part and is easier to heat than central part The trend of turnover, also can prevent the reduction of the refrigerating function of first flow path, can play sufficient refrigerating function.Therefore, it is possible to On cooling-part, electronic unit is uniformly cooled down.
Application examples 13
The electronic component conveying device of use-case should be characterised by having and can configure the electronic unit of electronic unit and carry Put part, can load above-mentioned electronic unit load part and can cool down above-mentioned electronic unit cooling-part and can Heat the heater block of above-mentioned electronic unit, above-mentioned cooling-part is configured at above-mentioned electronic unit mounting part and above-mentioned heating part Between part.
, there is the thermal effect of cooling-part in the relatively cooling-part and heater block thermal efficiency (energy loss) to electronic unit Rate is lower than the thermal efficiency of heater block, i.e. the high situation of energy loss.In this case, by cooling-part is configured at electronics Part load structure between part and heater block, will the high cooling-part of energy loss configure near electronic unit and The structure that heater block low for energy loss is configured away from cooling-part, thus, it is possible to carry out to electronic unit rapidly respectively Cooling and heating.
Application examples 14
In the electronic component conveying device that above-mentioned application examples 13 is recorded, preferably, above-mentioned cooling-part is by first component It is laminated with second component and constitute.
Thus, the face opposed with first component of the first component face opposed with second component or second component, Or the face of both sides forms groove, this groove can be used as the stream that is for example provided as under the fluid stream of cold-producing medium.Therefore, it is possible to save Go in addition to arrange the part constituting stream, cooling-part can be made to become simple structure.
Application examples 15
In the electronic component conveying device that above-mentioned application examples 14 is recorded, preferably, above-mentioned cooling-part has and is provided as The stream of the flow of fluid of cold-producing medium, the groove that above-mentioned stream is formed from above-mentioned first component and passes through for above-mentioned fluid is constituted.
Constitute the part of stream thereby, it is possible to save other setting such that it is able to make cooling-part become simple structure.
Application examples 16
Above-mentioned application examples 15 record electronic component conveying device in, preferably, configuration keep above-mentioned first component with Fluid tight or bubble-tight seal member between above-mentioned second component.
Thereby, it is possible to prevent the fluid during stream flows down from spilling between first component and second component.
Application examples 17
In electronic component conveying device any one of in above-mentioned application examples 14～16, preferably, above-mentioned second Part is configured between above-mentioned first component and above-mentioned heater block.
Thus, in the case that electronic unit is heated, second component is produced by heater block as temporary transient storage Heat heat storage unit function such that it is able to one by one (one by one) carry come electronic unit sustainedly and stably heat.
Application examples 18
In electronic component conveying device any one of in above-mentioned application examples 14～17, preferably, above-mentioned second The thickness of part is thicker than the thickness of above-mentioned first component.
Thus, even if first component bending, also can eliminate this bending regardless of whether the size of this bending how.
Application examples 19
In electronic component conveying device any one of in above-mentioned application examples 13～18, preferably, above-mentioned cooling end Part is cooled down by fluid.
Thus, liquid nitrogen for example can be used as the fluid of cooling.Liquid nitrogen is due to cooling effectiveness (cooling capacity) Relatively higher, so being applied to the cooling of electronic unit.
Application examples 20
In the electronic component conveying device that above-mentioned application examples 19 is recorded, preferably, above-mentioned cooling-part has for above-mentioned The stream of flow of fluid.
Thus, liquid nitrogen for example can be used as the fluid of cooling.And, the formation state of stream is different, can Make liquid nitrogen throughout the entirety of cooling-part, can efficiently cool down multiple electronic units.
Application examples 21
The electronic component inspection device of use-case should be characterised by having and can configure the electronic unit of electronic unit and carry Put part, above-mentioned electronic unit mounting part can be loaded and the cooling-part of above-mentioned electronic unit can be cooled down, can heat The heater block of above-mentioned electronic unit and the above-mentioned electronic unit inspection portion of inspection, above-mentioned cooling-part is configured at above-mentioned electronics Between part mounting part and above-mentioned heater block.
, there is the thermal effect of cooling-part in the relatively cooling-part and heater block thermal efficiency (energy loss) to electronic unit Rate is lower than heater block, i.e. the high situation of energy loss.In this case, by cooling-part is configured at electronic unit mounting Structure between part and heater block, will the high cooling-part of energy loss near electronic unit configure and by energy loss The structure that low heater block configures away from cooling-part, thus, it is possible to carrying out rapidly the cooling to electronic unit respectively and adding Heat.
Application examples 22
Should the electronic component conveying device of use-case be characterised by, possess mounting electronic unit the first mounting portion and Load the second mounting portion of above-mentioned electronic unit, above-mentioned first mounting portion has the liquid that confession can cool down above-mentioned electronic unit The first flow path that cold-producing medium passes through, the cold-producing medium that above-mentioned second mounting portion has the gas that confession can cool down above-mentioned electronic unit leads to The second flow path crossed.
Thus, for example, in the case of checking electrical characteristics to electronic unit, electronic unit is in the position being moved to inspection Midway, first, be placed in cold-producing medium for liquid by the first mounting portion and be cooled rapidly.Thus, electronic unit is fast Speed is adjusted to the inspection temperature being suitable to check.Then, electronic unit is placed in second that the cold-producing medium of supplied gas passes through Mounting portion.Thus, the second mounting portion maintains temperature to be adjusted to check the state of temperature, until being moved to the position of inspection.
Application examples 23
In the electronic component conveying device that above-mentioned application examples 22 is recorded, preferably, the cold-producing medium of aforesaid liquid is fluorine class Cold-producing medium.
Thus, for example, in the case of checking electronic unit at a temperature of the inspection lower than room temperature, room temperature will can be in Electronic unit is cooled fast near this inspection temperature.
Application examples 24
In the electronic component conveying device that above-mentioned application examples 23 is recorded, preferably, above-mentioned fluorine class cold-producing medium is Vertrel Sinera (バ ト レ Le シ ネ ラ (registered trade mark)).
Thus, the thermalization coefficient of fluorine class cold-producing medium is little, and in addition versatility is high, it is possible to use the material being readily obtained.
Application examples 25
In electronic component conveying device any one of in above-mentioned application examples 22～24, preferably, above-mentioned gas system Cryogen is dry air.
Thus, for example, after the cold-producing medium of gas is used for the cooling of electronic unit of the second mounting portion, it is further used for In the case of filling in the space of electronic component conveying device, prevent the generation of the condensation in this space.
Application examples 26
In electronic component conveying device any one of in above-mentioned application examples 22～25, preferably, above-mentioned gas The specific heat of cold-producing medium is less than the specific heat of the cold-producing medium of aforesaid liquid.
Thus, the cold-producing medium of gas can for example be used air as, in this case, Expenses Cost just can not obtain, Contribute to suppressing the operating cost of electronic component conveying device.
Application examples 27
In electronic component conveying device any one of in above-mentioned application examples 22～26, preferably, above-mentioned second The temperature of the cold-producing medium than the aforesaid liquid in above-mentioned first flow path for the temperature of the cold-producing medium of the above-mentioned gas in road is low.
Thus, even if the specific heat of the cold-producing medium of gas is less than the specific heat of the cold-producing medium of liquid, if by the gas in second flow path The temperature of the cold-producing medium of body is set to corresponding amount lower than the temperature of the cold-producing medium of the liquid in first flow path, then also can utilize The cold-producing medium of this gas suitably cools down electronic unit.
Application examples 28
The feature of electronic component conveying device of use-case should be placed in, possess mounting electronic unit and can cool down above-mentioned First mounting portion of electronic unit and load above-mentioned electronic unit and the second mounting portion of above-mentioned electronic unit can be cooled down, on State the high cooling capacity than above-mentioned second mounting portion for the cooling capacity of the first mounting portion.
Thus, for example, in the case of checking electrical characteristics for electronic unit, electronic unit is in the position being moved to inspection The midway put, first, the first high mounting portion being placed in cooling capacity is cooled rapidly.Thus, electronic unit is rapidly by temperature Degree is adjusted to the inspection temperature being suitable to check.Then, electronic unit is placed in repressed second mounting portion of cooling capacity.By This, the second mounting portion maintains temperature to be adjusted to check the state of temperature, is transported to the position of inspection always.
Application examples 29
In electronic component conveying device any one of in above-mentioned application examples 22～28, preferably, the above-mentioned ministry of electronics industry Part, after being placed in above-mentioned first mounting portion, is placed in above-mentioned second mounting portion.
Carry out to the quick cooling of electronic unit and the maintenance of this state of cooling thereby, it is possible to smooth.
Application examples 30
In electronic component conveying device any one of in above-mentioned application examples 22～29, preferably, above-mentioned first load The portion of putting is fixing.
On the other hand, if in the case that the first mounting portion can move, the degree of its movement is different, worries such as liquid Medium spill.In this case, the medium of liquid can soak the mechanism of periphery, electronic unit etc..However, by the first mounting portion Fixing, thus, it is possible to reduce the worry spilling of (suppression) first mounting portion.
Application examples 31
In the electronic component conveying device that above-mentioned application examples 30 is recorded, preferably, above-mentioned first mounting portion is to adjust The temperature-uniforming plate of the temperature of whole above-mentioned electronic unit.
Thus, for example, in the case of the electrical characteristics checking electronic unit, electronic unit, energy are pre-cooled before this inspection Enough it is adjusted to the temperature being suitable to this inspection (low temperature inspection).
Application examples 32
In electronic component conveying device any one of in above-mentioned application examples 22～31, preferably, above-mentioned second load The portion of putting can move.
Thereby, it is possible to electronic unit is transported to other assigned positions from assigned position.
Application examples 33
In the electronic component conveying device that above-mentioned application examples 32 is recorded, preferably, above-mentioned second mounting portion is to adjust The temperature of whole above-mentioned electronic unit, and the shuttle part by one of the in the horizontal direction direction carrying of above-mentioned electronic unit.
Thus, for example, in the case of being cooled down by the first mounting portion in electronic unit and adjusting temperature, it is able to maintain that this temperature Adjustment state and by electronic unit one of in the horizontal direction direction carrying.
Application examples 34
In the electronic component conveying device that above-mentioned application examples 32 is recorded, preferably, above-mentioned second mounting portion is to adjust The temperature of whole above-mentioned electronic unit and by above-mentioned electronic unit at least in the horizontal direction or vertical carrying operating member.
Thus, for example, in the case of being cooled down by the first mounting portion in electronic unit and adjusting temperature, it is able to maintain that this temperature Adjustment state and by electronic unit in the horizontal direction or vertical carrying.
Application examples 35
Should the feature of electronic component inspection device of use-case be placed in, possess mounting electronic unit the first mounting portion, Load the second mounting portion of above-mentioned electronic unit, checking the inspection portion of above-mentioned electronic unit, above-mentioned first mounting portion has energy supply Enough cool down the first flow path that the cold-producing medium of the liquid of above-mentioned electronic unit passes through, above-mentioned second mounting portion has confession and can cool down State the second flow path that the cold-producing medium of the gas of electronic unit passes through.
Thus, for example, in the case of the electrical characteristics checking electronic unit, electronic unit is in the position being transported to inspection Halfway, first, be placed in cold-producing medium for liquid by the first mounting portion and be cooled rapidly.Thus, electronic unit is rapid It is adjusted to the inspection temperature being suitable to check.Then, electronic unit is placed in the second load that the cold-producing medium of supplied gas passes through Put portion.Thus, the second mounting portion maintains temperature to be adjusted to check the state of temperature, is transported to the position of inspection always.
Brief description
Fig. 1 is the electronic component inspection device brief perspective views observing embodiments of the present invention 1 from face side.
Fig. 2 is the schematic top of the electronic component inspection device shown in Fig. 1.
Fig. 3 is the piping diagram with the supply destination of liquid nitrogen for the supply source linking liquid nitrogen.
Fig. 4 is the top view representing the configuration status of two temperature-uniforming plates in Fig. 2.
Fig. 5 is the horizontal cross of the temperature-uniforming plate of the minus side of the Y-direction in Fig. 4.
Fig. 6 is the line A-A sectional view (mounting has altered the state of external member) in Fig. 4.
Fig. 7 is to represent that liquid nitrogen is arranged to the supply line of two temperature-uniforming plate supplies in Fig. 2 and liquid nitrogen from two temperature-uniforming plates The horizontal cross of the discharge line going out.
Fig. 8 is the horizontal cross of one of Fig. 2 supply shuttle plate.
Fig. 9 is the brief perspective views of the electronic component inspection device from face side observation embodiments of the present invention 2.
Figure 10 is the schematic top of the electronic component inspection device shown in Fig. 9.
Figure 11 is the piping diagram with the supply destination of liquid nitrogen for the supply source linking liquid nitrogen.
Figure 12 is the top view representing the configuration status of two temperature-uniforming plates in Figure 10.
Figure 13 is the horizontal cross of the temperature-uniforming plate of the minus side of the Y-direction in Figure 12.
Figure 14 is the line A-A sectional view (mounting has altered the state of external member) in Figure 12.
Figure 15 be represent liquid nitrogen to the supply line of the two temperature-uniforming plates supply in Figure 10 and liquid nitrogen from two temperature-uniforming plates The horizontal cross of the discharge line discharged.
Figure 16 is the brief perspective views of the electronic component inspection device from face side observation embodiments of the present invention 3.
Figure 17 is the schematic top of the operating state representing the electronic component inspection device shown in Figure 16.
Figure 18 is the circuit diagram of the first cold-producing medium of the cold-producing medium as liquid.
Figure 19 is the circuit diagram of the second refrigerant of the cold-producing medium as gas.
Specific embodiment
Describe electronic component conveying device and the electricity of the present invention below according to preferred implementation referring to the drawings in detail Subassembly check device.
Additionally, in the following embodiments, for convenience of description, the three mutually orthogonal axles of diagram are set to X-axis, Y Axle and Z axis.In addition, comprising X-axis and the X/Y plane of Y-axis is level, Z axis are vertical.In addition, also by the direction parallel with X-axis Referred to as " X-direction ", the direction parallel with Y-axis is referred to as " Y-direction ", the direction parallel with Z axis is referred to as " Z-direction ".In addition, each side To arrow institute direction direction be " just ", its rightabout be " bearing ".In addition, " level " described in present specification Being not limited to completely level, as long as not hindering the carrying of electronic unit, also comprising with respect to level somewhat (e.g., less than 5 ° left sides Right) state that tilts.
In addition, the check device (electronic component inspection device) of following embodiment is e.g. used for carrying BGA (Ball Grid array) the IC element such as package, LGA (Land grid array) package, LCD (Liquid Crystal Display), The electronic units such as CIS (CMOS Image Sensor), and check in this handling process, test (hereinafter referred to as " checking ") The device of electrical characteristics.Additionally, below for convenience of description, IC element is used as the situation of checked above-mentioned electronic unit To illustrate for representing, as " IC element 90 ".
Additionally, the check device of following embodiment is divided into pallet supply area A1, component feeding region (hereinafter referred to as For " supply area ") A2, inspection area A3, element recovery zone (hereinafter referred to as " recovery zone ") A4, pallet remove region A5.And, IC element 90 removes region A5 (each region A1～A5) via from pallet supply area A1 to pallet successively, in midway Inspection area A3 checked.
In addition, the check device of following embodiment by being configured with pallet supply area A1, pallet removes region A5 As face side, by its contrary side, that is, (Y-direction is just to be configured with the side of inspection area A3 for one side (minus side of Y-direction) Side) use as rear side.
Embodiment 1
The electronic component inspection device of embodiment 1 is below described.
Fig. 1 is the brief perspective views of the electronic component inspection device from face side observation embodiments of the present invention 1.Fig. 2 It is the schematic top of the electronic component inspection device shown in Fig. 1.Fig. 3 is the supply with liquid nitrogen for the supply source linking liquid nitrogen The piping diagram of destination.Fig. 4 is the top view representing the configuration status of two temperature-uniforming plates in Fig. 2.Fig. 5 is the Y-direction in Fig. 4 The temperature-uniforming plate of minus side horizontal cross.Fig. 6 is the line A-A sectional view (mounting has altered the state of external member) in Fig. 4.Fig. 7 It is to represent the discharge line that liquid nitrogen is discharged from two temperature-uniforming plates to supply line and the liquid nitrogen of two temperature-uniforming plate supplies in Fig. 2 Horizontal cross.Fig. 8 is the horizontal cross of one of Fig. 2 supply shuttle plate.
As shown in Figure 1 and Figure 2, the check device 1 of embodiment 1 possesses the electricity carrying IC element 90 in each region A1～A5 Subassembly Handling device, the inspection portion 16 being checked in the A3 of inspection area, control unit 800.In addition, check device 1 possesses Monitor 300 and signal lighties 400.
A1 supply in pallet supply area is arranged with the pallet (arrangement components) 200 of multiple IC elements 90 of non-inspection state Piece supplying portion.In pallet supply area A1, multiple pallets 200 can be laminated.
Supply area A2 is by the multiple IC elements 90 being configured on pallet 200 moved into from pallet supply area A1 respectively It is supplied to the region of inspection area A3.Additionally, in the way of crossing over pallet supply area A1 and supply area A2, being provided with and will hold in the palm Tray conveying mechanism 11A, 11B that disk 200 is carried one by one in the horizontal direction.Tray conveying mechanism 11A be can make pallet 200 with The IC element 90 being placed in this pallet 200 is together to the move portion of the positive side shifting of Y-direction.Thereby, it is possible to will be steady for IC element 90 Surely send into supply area A2.In addition, tray conveying mechanism 11B be can by minus side from empty pallet 200 to Y-direction, that is, from confession To move portion from region A2 to the A1 movement of pallet supply area.
Supply area A2 is provided with temperature adjustment portion 12, COMPONENT HANDLING head 13, tray conveying mechanism (the first carrying dress Put) 15.
Temperature adjustment portion 12 is the cooling-part that can unify to cool down multiple IC elements 90, sometimes referred to as " temperature-uniforming plate (example Son) (English：soak plate；Japanese：ソークプレート)”.Using this temperature-uniforming plate, pre-cool and check in inspection portion 16 Front IC element 90, can be adjusted to be suitable to the temperature of this inspection.In structure shown in Fig. 2, temperature adjustment portion 12 is along Y Direction configures, is fixed with 2.And, moved into the pallet of (carrying comes) from pallet supply area A1 by tray conveying mechanism 11A IC element 90 on 200 is moved to arbitrary temperature adjustment portion 12.
Additionally, multiple IC elements 90 are with being referred to as of the variety exchanging according to IC element 90 so-called " change external member " Electronic unit loads the state that the recessed pocket (recess) 101 of part 100 is respectively configured, and is placed in the temperature adjustment portion as temperature-uniforming plate On 12 (with reference to Fig. 6).And, multiple IC elements 90 are cooled together with the electronic unit mounting part 100 of this temperature-uniforming plate.
COMPONENT HANDLING head 13 is supported to move in the A2 of supply area.Thus, COMPONENT HANDLING head 13 can be undertaken The carrying of the IC element 90 between the pallet 200 that pallet supply area A1 moves into and temperature adjustment portion 12 and temperature adjustment portion The carrying of the IC element 90 between 12 and component feeding portion 14 described later.
Tray conveying mechanism 15 is the pallet 200 of the sky of the state being removed whole IC elements 90 in supply area A2 The mechanism of the interior positive side carrying towards X-direction.And, after this carrying, empty pallet 200 passes through tray conveying mechanism 11B from supply Region A2 returns pallet supply area A1.
Inspection area A3 is the region checking IC element 90.It is provided with component feeding portion 14, checks in this inspection area A3 Portion 16, COMPONENT HANDLING head 17, element recoverer 18.
Component feeding portion 14 is can to load temperature controlled IC element 90 and this IC element 90 is carried (movement) arrive Move portion near inspection portion 16, also referred to as " supply shuttle plate ".This component feeding portion 14 is supported to can be in supply Between region A2 and inspection area A3 in X direction and move in the horizontal direction.In addition, in the structure shown in Fig. 2, component feeding Portion 14 is configured with 2 along Y-direction, and the IC element 90 in temperature adjustment portion 12 is moved to any element supply unit 14.
Additionally, component feeding portion 14 is identical with temperature adjustment portion 12, be also for mounting according to IC element 90 species more The change external member changed the cooling-part by the unified cooling together with this change external member of multiple IC elements 90.
Inspection portion 16 is the unit of the electrical characteristics checking, testing IC element 90.It is provided with inspection portion 16 and maintaining IC The multiple probes electrically connecting with the terminal of this IC element 90 in the state of element 90.And, the terminal of IC element 90 is electric with probe Connect (contact), carry out the inspection of IC element 90 via probe.The inspection of IC element 90 is according in the inspection being connected with inspection portion 16 The program testing storage in the inspection control unit that device possesses is carried out.Additionally, inspection portion 16 is identical with temperature adjustment portion 12, Neng Gouleng But IC element 90, this IC element 90 is adjusted to the temperature (with reference to Fig. 3) being suitable to check.
COMPONENT HANDLING head 17 is supported to move in the A3 of inspection area.Thus, COMPONENT HANDLING head 17 can by from The IC element 90 in component feeding portion 14 that supply area A2 moves into is carried and is placed in inspection portion 16.Additionally, COMPONENT HANDLING 17 is also the cooling-part that can cool down IC element 90.
Element recoverer 18 is that the IC element 90 checking end for inspection portion 16 loads and this IC element 90 is carried (shifting Dynamic) to recovery zone A4 move portion, also referred to as " recovery shuttle plate ".This element recoverer 18 is supported to can be in inspection Look between region A3 and recovery zone A4 in X direction and move in the horizontal direction.In addition, in the structure shown in Fig. 2, element returns Receipts portion 18 is identical with component feeding portion 14, is configured with 2 along Y-direction, and the IC element 90 in inspection portion 16 is handled upside down, is placed in and appoints One element recoverer 18.This carrying is carried out by COMPONENT HANDLING head 17.
Additionally, element recoverer 18, inspection portion 16 are also identical with temperature adjustment portion 12, for mounting according to IC element 90 The change external member of variety exchanging.
Recovery zone A4 is to reclaim the region checking the multiple IC elements 90 terminating.In this recovery zone, A4 is provided with recovery With pallet 19, COMPONENT HANDLING head 20, tray conveying mechanism (the second Handling device) 21.In addition, being also prepared for sky in recovery zone A4 Pallet 200.
Recovery pallet 19 is the mounting portion of mounting IC element 90, is fixed in the A4 of recovery zone, the structure shown in Fig. 2 In, it is configured with 3 in X direction.In addition, the pallet 200 of sky is also the mounting portion of mounting IC element 90, it is configured with 3 in X direction Individual.And, it is handled upside down to the IC element 90 on the mobile next element recoverer 18 of recovery zone A4, be placed in above-mentioned recovery support Either one in the pallet 200 of disk 19 and sky.Thus, according to inspection result recovery, classification IC element 90.
COMPONENT HANDLING head 20 is supported to move in the A4 of recovery zone.Thus, COMPONENT HANDLING head 20 can be by IC Element 90 is carried to recovery pallet 19, empty pallet 200 from element recoverer 18.
Tray conveying mechanism 21 is will to remove the pallet 200 of the sky that region A5 moves into from pallet in the A4 of recovery zone along X The mechanism of direction carrying.And, after this carrying, empty pallet 200 is configured at the position reclaiming IC element 90, becomes above-mentioned Any one of 3 empty pallets 200.
In such check device 1, recovery zone A4 is provided with tray conveying mechanism 21, in addition, in supply area A2 It is provided with tray conveying mechanism 15.Thus, with the carrying for example carrying out the pallet 200 of sky to X-direction using a carrying mechanism Compare, be capable of the raising of productivity ratio (the carrying number of the IC element 90 of time per unit).
Additionally, the structure of tray conveying mechanism 15,21 is not particularly limited, for example, can enumerate and there is adsorbing tray 200 Adsorption element and this adsorption element is supported the structure for supporting devices such as the ball-screws that can move in X direction.
It is to reclaim, remove the pallet 200 being arranged with the multiple IC elements 90 checking the state that finishes that pallet removes region A5 Remove portion.Remove in the A5 of region in pallet, multiple pallets 200 can be laminated.
In addition, in the way of crossing over recovery zone A4 and pallet removing region A5, being provided with pallet 200 one by one along level Tray conveying mechanism 22A, 22B of direction carrying.Tray conveying mechanism 22A is the inspection making pallet 200 with being placed in this pallet 200 Look into the IC element 90 finishing together along the move portion of Y-direction movement.Thereby, it is possible to the IC element 90 finishing being checked from recovery area Domain A4 is carried to pallet and removes region A5.In addition, tray conveying mechanism 22B is to be used for the support of the sky reclaiming IC element 90 Disk 200 removes the mobile move portion to recovery zone A4 of region A5 from pallet.
Control unit 800 for example has drive control part.Drive control part for example controls tray conveying mechanism 11A, 11B, temperature Degree adjustment portion 12, COMPONENT HANDLING head 13, component feeding portion 14, tray conveying mechanism 15, inspection portion 16, COMPONENT HANDLING head 17, unit Part recoverer 18, COMPONENT HANDLING head 20, tray conveying mechanism 21, the driving of each several part of tray conveying mechanism 22A, 22B.
Additionally, the inspection control unit of above-mentioned checker, for example according to the program being stored in memorizer (not shown), is carried out It is configured at the inspection of the electrical characteristics of IC element 90 in inspection portion 16 etc..
Operator set via monitor 300 or confirm temperature conditionss during the action of check device 1 etc..This monitor 300 have the display picture 301 being for example made up of liquid crystal panel, be configured at check device 1 face side top (Z-direction Positive side).As shown in figure 1, the right side (positive side of X-direction) removing the in figure of region A5 in pallet is provided with mounting mouse Mouse table 600, this mouse uses when operation is shown in the picture of monitor 300.
In addition, signal lighties 400 can be by the combination of luminous color, operating state of report check apparatus 1 etc..Signal Lamp 400 is configured at the top of check device 1.Additionally, being built-in with speaker 500 in check device 1 it is also possible to raise one's voice by this Operating state of device 500 report check apparatus 1 etc..
As shown in Fig. 2 being divided by the first next door 61 between the pallet supply area A1 and supply area A2 of check device 1 (separation), divided by the second next door 62 between supply area A2 and inspection area A3, between inspection area A3 and recovery zone A4 Divided by the 3rd next door 63, recovery zone A4 and pallet remove and divided by the 4th next door 64 between the A5 of region.In addition, supply area Divided by the 5th next door 65 between A2 and recovery zone A4.Above-mentioned next door has the bubble-tight work(keeping each region A1～A5 Energy.And, check device 1 outermost layer packaging is covered to be covered, and this lid for example has protecgulum 70, side cover 71, side cover 72, bonnet 73, top Lid 74.Additionally, being configured with inner side next door 66 more in the inner part than bonnet 73.
As described above, temperature adjustment portion 12 is to cool down the cooling-part of IC element 90.This temperature adjustment portion 12 makes system Cryogen RF internally flows down and thus IC element 90 is cooled down and constitute.
Additionally, cold-producing medium RF is, for example, liquid nitrogen (liquid nitrogen), cooling effectiveness (cooling capacity) is relatively higher, it is advantageous to being used for The cooling of IC element 90.As shown in Figure 1 and Figure 2, it is pre-charged with cold-producing medium to the container 700 of the outside being arranged at check device 1 RF.
And, as shown in figure 3, this container 700 is via pipe arrangement 23, it is connected to temperature adjustment portion 12, component feeding portion 14th, COMPONENT HANDLING head 17, inspection portion 16.Thus, cold-producing medium RF is respectively fed to temperature adjustment portion 12, component feeding portion 14, unit Part carrying 17, inspection portion 16.
In addition, being provided with valve 24a in pipe arrangement 23 towards the midway of temperature adjustment portion 12.Control the opening and closing of this valve 24a, thus Allow hand over the stopping of the supply to temperature adjustment portion 12 for the cold-producing medium RF and this supply.Equally, in pipe arrangement 23 towards component feeding The midway in portion 14 is also equipped with valve 24b.Control the opening and closing of this valve 24b, thus, it is possible to switch cold-producing medium RF to component feeding portion 14 Supply and this supply stopping.In addition, being also equipped with valve 24c in pipe arrangement 23 towards the midway of COMPONENT HANDLING head 17.Controlling should The opening and closing of valve 24c, thus, it is possible to switch the stopping of the supply to COMPONENT HANDLING head 17 for the cold-producing medium RF and this supply.In addition, joining Pipe 23 is also equipped with valve 24d towards the midway in inspection portion 16.Control the opening and closing of this valve 24d, thus, it is possible to switch cold-producing medium RF to The supply in inspection portion 16 and the stopping of this supply.
As shown in figure 4, being provided with 2 temperature adjustment portions 12 in check device 1, these two temperature adjustment portions 12 are along Y side To that is, along upper and lower (positive side of the Y-direction and minus side) configuration in Fig. 4.Hereinafter, the temperature adjustment portion of side will (be born) under in Fig. 4 12 referred to as " temperature adjustment portion 12A ", and the temperature adjustment portion 12 of upper (just) side is referred to as " temperature adjustment portion 12B ".Temperature adjustment portion , from temperature adjustment portion 12B in addition to allocation position is different, other structures are identical for 12A, so with temperature adjustment portion 12A as representative To illustrate.
As shown in fig. 6, temperature adjustment portion 12A flat first component 3a and flat second component 3b are laminated, Engage and constitute.Thus, in the lower surface 31 of first component 3a or the upper surface 32 of second component 3b, or the face of both sides (lower surface 31 and upper surface 32) forms groove, can use this groove as the stream 33 that cold-producing medium RF flows down.Therefore, it is possible to Save the part that other setting constitutes stream 33, make temperature adjustment portion 12A become simple composition.Additionally, in present embodiment In, form groove in the lower surface 31 of first component 3a, this groove is used as stream 33.In addition, first component 3a and second The joint method of part 3b is using for example using the fastening method of multiple bolts.
In addition, the lower surface 31 in first component 3a is formed with along the parallel groove of stream 33 34.In this groove 34, should with edge The mode of groove 34 is configured with seal member 30.Seal member 30 is made up of elastomeric material, in first component 3a and second component 3b Between become the state compressed.Thereby, it is possible to keep being liquid-tight in stream 33 between first component 3a and second component 3b Property (or air-tightness).Therefore, it is possible to prevent cold-producing medium RF during stream 33 flows down from first component 3a and second Spill between part 3b.
Additionally, the elastomeric material constituting seal member 30 is not particularly limited, for example, can use polyurethane rubber, silicone Various elastomeric materials as rubber, fluorubber.
As described above, the lower surface 31 in first component 3a is formed with the groove using as stream 33.For example because of this groove (stream Road 33) forming region and the total length of groove, the difference of depth, first component 3a monomer (in itself) has and produces slight curvature Situation.
The upper surface 35 mounting electronic unit mounting part 100 of first component 3a, if so first component 3a keeps bending, Then the electronic unit mounting part 100 on upper surface 35 bends also with first component 3a.Utilize COMPONENT HANDLING in this condition 13 hold and are located at IC element 90 pull-up upward that electronic unit loads in the recessed pocket 101 of part 100, due to electronic unit Mounting part 100 bends, so IC element 90 cannot be held completely, that is, exists and holds insufficient situation.
Therefore, in temperature adjustment portion 12, even if first component 3a bending, in order to eliminate this bending, with ratio first component 3a Thick second component 3b engages.Plane for level thereby, it is possible to correct the upper surface 35 of first component 3a, thus, on Electronic unit on surface 35 loads part 100 also becomes the state preventing bending.Load part from the electronic unit of this state 100 can stably lift IC element 90 using COMPONENT HANDLING head 13.
Additionally, the thickness t of second component 3b3bThickness t preferably than first component 3a3aThickness, such as preferably thickness t3a's Less than more than 1.2 times 3 times, more preferably less than more than 1.5 times 2 times.Thereby, it is possible to suppress thickness t3bIncrease and no matter first The size of the bending of part 3a how, can eliminate this bending.
As shown in Figure 4, Figure 5, first component 3a is identical with the shape of the vertical view of second component 3b and size.
First component 3a (second component 3b is similarly) be have first while 361 with first while 361 opposed and parallel Two while 362 with first while 361 the orthogonal the 3rd while 363 with the 3rd while 363 the 4th opposed and parallel sides 364 rectangle (rectangle).In the present embodiment, first component 3a is in the longer rectangle of Y direction, and first when 361 and second 364 length when 363 and the 4th is long than the 3rd for 362 length.By forming so fairly simple outer shape, from When the mother metal applying machining of metallic plate obtains first component 3a, this machining can be carried out easily and at low cost.
The structural material of first component 3a and second component 3b for example can use various metal materials, in this metal material In material, preferably pyroconductivity is higher and the aluminum of easy machining.
However, the coldplate that for example above-mentioned patent documentation 1 is recorded is like that, liquid nitrogen is only made to flow down in the flowing groove of bending, no The uniform cooling on coldplate can be carried out.This is because coldplate has its peripheral part to be easier to becoming of the turnover of heat than central part Gesture.
Therefore, in temperature adjustment portion 12A, the multiple IC elements 90 in this temperature adjustment portion 12A can be carried out all The mode of even cooling is constituted.This structure is below described.
As described above, being provided with, in temperature adjustment portion 12A, the stream 33 flowing down for cold-producing medium RF.As shown in figure 5, stream 33 Have for the first flow path 37 of cold-producing medium RF inflow and connect and supply the second flow path that cold-producing medium RF flows out with first flow path 37 38.
In the case of overlooking temperature adjustment portion 12A, first flow path 37 is flowed into this first flow path 37 with cold-producing medium RF Inflow entrance 371 is starting point, is close to the outer circumferential side of (deflection) temperature adjustment portion 12A as far as possible, according to first when the 361, the 3rd 363rd, second when the 362, the 4th 364 order formed along each side.
In the part on the first side 361 along first flow path 37, from upstream side, downstream side is formed with linearly straight line Shape portion 372, the crank-like portion 373 bending or being bent to crank-like, linearly straight part 374.
And, first flow path 37 first in 361 and the 3rd while 363 corner (corner) the 365 side conversion directions being formed, It is being formed in part with linearly straight part 375 along the 3rd side 363.
In addition, first flow path 37 the 3rd in 363 and second while 362 corner (corner) the 366 side conversion directions being formed, It is being formed in part with linearly straight part 376 along the second side 362.
And, first flow path 37 second in 362 and the 4th while 364 corner (corner) the 367 side conversion directions being formed, It is being formed in part with linearly straight part 377 along the 4th side 364.
Stream 33 in the reflex part 331 turning back as "U" shaped after straight part 377, to than first flow path 37 More in the inner part, enter to the central side of temperature adjustment portion 12A, from the first flow path 37 as outlet, switch to as loop Second flow path 38.This reflex part 331 is the part connecting first flow path 37 and second flow path 38.
In the case of overlooking temperature adjustment portion 12A, second flow path 38 according to inner side, is rewinding first than first flow path 37 Stream 37 and according to the 4th when 364, second the 362, the 3rd while 363, first while 361 order formed along each side.
In second flow path 38 along the part on the 4th side 364, it is formed with linearly straight part 381.Straight part 381 become the state being set up in parallel with the straight part 377 of first flow path 37, the flow direction of cold-producing medium RF also with straight part 377 is contrary.
And, second flow path 38, in corner 367 side conversion direction, in the part along the second side 362, is formed with linearly Straight part 382.Straight part 382 becomes the state being set up in parallel with the straight part 376 of first flow path 37, cold-producing medium RF Flow direction also contrary with straight part 376.
In addition, second flow path 38 is in corner 366 side conversion direction, in the part along the 3rd side 363, it is formed with linearly Straight part 383.Straight part 383 becomes the state being set up in parallel with the straight part 375 of first flow path 37, cold-producing medium RF Flow direction also contrary with straight part 375.
And, second flow path 38, in corner 365 side conversion direction, in the part along the first side 361, is formed with repeatedly to connect Near and far is from the portion 384 and be in the downstream in the portion of crawling 384 of crawling that bends of mode of the straight part 374 of first flow path 37 Linear straight part 385.Portion 384 of crawling becomes the state being set up in parallel with the straight part 374 of first flow path 37, refrigeration The flow direction of agent RF is also contrary with straight part 374.Straight part 385 becomes with the straight part 372 of first flow path 37 simultaneously The state of row setting, the flow direction of cold-producing medium RF is also contrary with straight part 372.
And, the flow export 386 that second flow path 38 flows out from this second flow path 38 in cold-producing medium RF forms terminal.
As described above, stream 33 first while 361, second while the 362, the 3rd in 363 and the 4th while 364, from first-class The straight part 372 on road 37 is configured at the outside of second flow path 38 to straight part 377, from the straight part of this second flow path 38 381 surround the portion of crawling 384 always.And, the temperature of cold-producing medium RF that the first flow path 37 being located at outside at this flows down than The temperature of the cold-producing medium RF that the second flow path 38 of inner side flows down is low.
Thus, even having temperature adjustment portion 12A that peripheral part is easier to the trend of turnover of heat than central part, The reduction of the refrigerating function of first flow path 37 can be prevented, sufficient refrigerating function can be played.Therefore, in temperature adjustment portion 12A On, multiple IC elements 90 uniformly can be cooled down.
Additionally, in the present embodiment, when measuring throughout the mean temperature of the cold-producing medium RF of stream 33 entirety, will be less than The part of mean temperature is set to " first flow path 37 ", and the part exceeding mean temperature is set to " second flow path 38 ", but is not limited to This.It is also possible to be set to " first flow path 37 " by the 1/2 of upstream side for example in stream 33 entirety, the 1/2 of downstream is set to " second flow path 38 ".
As shown in figure 5, inflow entrance 371 and flow export 386 to first when the 361～the 4th 364 in the 4th side 364 lateral deviation To configuration.Thereby, it is possible to make inflow entrance 371 adjacent with flow export 386 and as far as possible near such that it is able to use one described later Manifold fittings 5 (with reference to Fig. 7), carry out the supply of cold-producing medium RF and the discharge of cold-producing medium RF to temperature adjustment portion 12A.
In addition, reflex part 331 is also to the 4th side 364 lateral deviation to configuration.Thus, first flow path 37 is along the first side 361～the Four sides 364, such that it is able to guarantee the total length of this first flow path 37 as far as possible longlyer, contribute to uniform to multiple IC elements 90 Cooling.
As shown in figure 4, temperature adjustment portion 12A and temperature adjustment portion 12B configure in the way of the 4th side 364 is mutually opposing. That is, centered on respective intermediate point, point symmetry ground configures for temperature adjustment portion 12A and temperature adjustment portion 12B.Thus, as Fig. 7 institute Show, manifold fittings 5 can be configured in the inboard (Z-direction minus side) between temperature adjustment portion 12A and temperature adjustment portion 12B.
Manifold fittings 5 have joint 52～joint 57 that manifold bodies 51 are connected with manifold bodies 51.
Manifold bodies 51 have makes cold-producing medium RF from joint 52 towards the internal flow path 511 of joint 53, joint 54；With make system Cryogen RF from joint 55, joint 56 towards joint 57 internal flow path 512.
Joint 52 is connected with the pipe (the 3rd stream) 701 making to flow down from the cold-producing medium RF of container 700.Joint 53 is via pipe 702 inflow entrances 371 being connected to temperature adjustment portion 12A.Joint 54 is connected to the inflow entrance of temperature adjustment portion 12B via pipe 703 371.By such connection, it is respectively fed to temperature adjustment portion 12A and temperature adjustment portion from the cold-producing medium RF of container 700 12B.
Joint 55 is connected to the flow export 386 of temperature adjustment portion 12A via pipe 704.Joint 56 is connected to temperature via pipe 705 The flow export 386 of degree adjustment portion 12B.Joint 57 is connected to discharge opeing portion (not shown) via pipe (the 4th stream) 706.By so Connection, the cold-producing medium RF discharging respectively from temperature adjustment portion 12A and temperature adjustment portion 12B reclaimed by above-mentioned discharge opeing portion.
As described above, component feeding portion 14 is identical with temperature adjustment portion 12, it is the cooling-part that can cool down IC element 90. Referring to Fig. 8, illustrate in component feeding portion 14 identical with temperature adjustment portion 12A it is also possible to carry out to multiple IC elements 90 The uniformly structure of cooling, but by with the difference of temperature adjustment portion 12A centered on to illustrate, omit the explanation of identical item.
Component feeding portion 14 in addition to the plan view shape difference of the stream 830 that flows down for cold-producing medium RF, other structures with Temperature adjustment portion 12A is roughly the same.
As shown in figure 8, component feeding portion 14 also has first component 8a and second component 8b, it is formed with first component 8a Stream 830.In addition, being formed with groove 840 in first component 8a along stream 830.Configure the liquid keeping in stream 830 in this groove 840 The seal member (not shown) of close property (or air-tightness).
In addition, first component 8a (second component 8b is similarly) be have first while 861 with first while 861 opposed and flat Row second while 862 with first while 861 the orthogonal the 3rd while 863 with the 3rd while 863 the 4th opposed and parallel sides 864 length Square.In the present embodiment, first component 8a is in the longer rectangle of X-direction, and first when 861 and second 862 Length than the 3rd, 864 length when 863 and the 4th is long.
As shown in figure 8, stream 830 is had for the first flow path 870 of cold-producing medium RF inflow and is connected with first flow path 870 And the second flow path 880 for cold-producing medium RF outflow.
In the case of overlooking component feeding portion 14, first flow path 870 is flowed into this first flow path 870 with cold-producing medium RF Inflow entrance 871 is starting point, is close to the outer circumferential side in component feeding portion 14 as far as possible, by first when the 361, the 3rd 363, second side 362 order is formed along each side.
In first flow path 870 along the part on the first side 361, it is formed with linear straight part 872.
And, first flow path 870 first in 861 and the 3rd while 863 corner (corner) the 865 side conversion sides being formed To in the part along the 3rd side 863, being formed with linearly straight part 873.
In addition, first flow path 870 the 3rd in 863 and second while 862 corner (corner) the 866 side conversion sides being formed To in the part along the second side 862, being formed with linear straight part 874.
Stream 830 in the reflex part 831 turning back as "U" shaped after straight part 874, to than first flow path 870 enter more in the inner part, i.e. to the central side in component feeding portion 14, from the first flow path 870 as outlet, switch to as loop Second flow path 880.This reflex part 831 is the part connecting first flow path 870 and second flow path 880.
In the case of overlooking component feeding portion 14, second flow path 880 than first flow path 870 more in the inner part, back-roll the One stream 870 and by second when the 862, the 3rd 863, first while 861 order along each while formed.
In second flow path 880 along the part on the second side 862, it is formed with linear straight part 881.Straight part 881 become the state being set up in parallel with the straight part 874 of first flow path 870, the flow direction of cold-producing medium RF also with linearly Portion 874 is contrary.
In addition, second flow path 880 is in corner 866 side conversion direction, in the part along the 3rd side 863, it is formed with linear Straight part 882.Straight part 882 becomes the state being set up in parallel with the straight part 873 of first flow path 870, cold-producing medium The flow direction of RF is also contrary with straight part 873.
And, second flow path 880, in corner 865 side conversion direction, in the part along the first side 861, is formed with repeatedly Crawl portion 883 and the downstream in the portion of crawling 883 bending closer and farther from the mode of the straight part 872 of first flow path 870 Linearly straight part 884.Crawl portion 883 and straight part 884 becomes the straight part 872 with first flow path 870 The state being set up in parallel, the flow direction of cold-producing medium RF is also contrary with straight part 872.
And, the flow export 885 that second flow path 880 flows out from this second flow path 880 in cold-producing medium RF forms terminal.
As described above, stream 830 first while 861, second while the 862, the 3rd side 863, linear from first flow path 870 Portion 872 arrives straight part 874, is configured at the outside of second flow path 880, surrounds from the straight part 881 of this second flow path 880 Straight part 884.And, the temperature of the cold-producing medium RF flowing down in the first flow path 870 outside it is than the second of inner side The temperature of the cold-producing medium RF that stream 880 flows down is low.Thus, there is the trend that peripheral part is easier to the turnover of heat than central part Component feeding portion 14 in it is also possible to prevent the reduction of the refrigerating function of first flow path 870, sufficient cooling work(can be played Energy.Therefore, in component feeding portion 14, multiple IC elements 90 are uniformly cooled down.
Embodiment 2
The electronic component inspection device of embodiment 2 is below described.Additionally, in the following description, to embodiment 1 Identical structure and part mark same reference, omit or simplify their explanation.
Fig. 9 is the brief perspective views of the electronic component inspection device from face side observation embodiment 2.Figure 10 is Fig. 9 institute The schematic top of the electronic component inspection device shown.Figure 11 is the supply destination with liquid nitrogen for the supply source linking liquid nitrogen Piping diagram.Figure 12 is the top view representing the configuration status of two temperature-uniforming plates in Figure 10.Figure 13 is the Y-direction in Figure 12 The horizontal cross of the temperature-uniforming plate of minus side.Figure 14 is the line A-A sectional view (mounting has altered the state of external member) in Figure 12.Figure 15 It is to represent the discharge line that liquid nitrogen is discharged from two temperature-uniforming plates to supply line and the liquid nitrogen of two temperature-uniforming plate supplies in Figure 10 Horizontal cross.
As shown in Figure 9, Figure 10, the check device 1000 of embodiment 2 possesses in each region A1～A5 carrying IC element 90 Electronic component conveying device, the inspection portion 116 being checked in the A3 of inspection area, control unit 800.In addition, check device 1000 possess monitor 300 and signal lighties 400.
Supply area A2 is provided with temperature adjustment portion 120, COMPONENT HANDLING head 13, tray conveying mechanism (the first carrying dress Put) 15.
Temperature adjustment portion 120 has the cooling-part 121 that can unify to cool down multiple IC elements 90 and can unify to heat The heater block 122 (with reference to Figure 14) of multiple IC elements 90, also referred to as " temperature-uniforming plate (example) (English：soak plate；Day Language：ソークプレート)”.Using this temperature-uniforming plate, pre-cool or heat the IC element 90 before inspection portion 116 checks, Can be adjusted to be suitable to the temperature of this inspection.
In structure shown in Figure 10, temperature adjustment portion 120 configures, is fixed with 2 along Y-direction.And, by pallet carrying Mechanism 11A moves into the IC element 90 pallet 200 of (carrying comes) from pallet supply area A1 and is transported to arbitrary temperature adjustment portion 120.
Additionally, multiple IC elements 90 are referred to as so-called " change be respectively arranged at variety exchanging according to IC element 90 The electronic unit of more external member " loads the state of the recessed pocket (recess) 101 of part 100, is placed in the temperature adjustment as temperature-uniforming plate In portion 120 (with reference to Figure 14).And, multiple IC elements 90 are cold together with the electronic unit mounting part 100 of this temperature-uniforming plate But or heating.
COMPONENT HANDLING head 13 is supported to move in the A2 of supply area.Thus, COMPONENT HANDLING head 13 can be undertaken The carrying of the IC element 90 between the pallet 200 that pallet supply area A1 moves into and temperature adjustment portion 120 and temperature adjustment portion The carrying of the IC element 90 between 120 and component feeding portion 114 described later.
Inspection area A3 is the region checking IC element 90.It is provided with component feeding portion 114, checks in this inspection area A3 Portion 116, COMPONENT HANDLING head 117, element recoverer 18.
Component feeding portion 114 is mounting temperature controlled IC element 90 and this IC element 90 is carried (movement) to inspection Move portion near portion 116, also referred to as " supply shuttle plate ".This component feeding portion 114 is supported to can be in drainage area Between domain A2 and inspection area A3 in X direction and move in the horizontal direction.In addition, in the structure shown in Figure 10, component feeding Portion 114 is configured with 2 along Y-direction, and the IC element 90 in temperature adjustment portion 120 is moved to any element supply unit 114.
Additionally, component feeding portion 114 is identical with temperature adjustment portion 120, be also used for load according to IC element 90 species more The change external member changed, has the cooling-part of the unified multiple IC elements 90 of cooling and this change external member and can unify to heat The heater block of multiple IC elements 90.
Inspection portion 116 is the unit of the electrical characteristics checking, testing IC element 90.It is provided with inspection portion 116 to keep IC Multiple probes that the state of element 90 is electrically connected with the terminal of this IC element 90.And, the terminal of IC element 90 and probe are electrically connected Connect (contact), carry out the inspection of IC element 90 via probe.According to the inspection possessing in the checker being connected with inspection portion 116 In control unit, the program of storage carries out the inspection of IC element 90.Additionally, in inspection portion 116, it is identical with temperature adjustment portion 120, IC element 90 can be carried out cooling down, heats, this IC element 90 is adjusted to the temperature being suitable to check.
COMPONENT HANDLING head 117 is supported to move in the A3 of inspection area.Thus, COMPONENT HANDLING head 117 can be by IC element 90 from the component feeding portion 114 that supply area A2 moves into is carried, is placed in inspection portion 116.Additionally, element is removed Fortune 117 also can cool down or heat IC element 90 and constitute.
Element recoverer 18 is that mounting finishes the IC element 90 of inspection in inspection portion 116 and carries this IC element 90 (movement) arrives the move portion of recovery zone A4, also referred to as " recovery shuttle plate ".This element recoverer 18 is supported to can Between inspection area A3 and recovery zone A4 in X direction and move in the horizontal direction.In addition, in the structure shown in Figure 10, Element recoverer 18 is identical with component feeding portion 114, is configured with 2 along Y-direction, the IC element 90 in inspection portion 116 is handled upside down, It is placed in any element recoverer 18.This carrying is carried out by COMPONENT HANDLING head 117.
Additionally, element recoverer 18 and inspection portion 116 are identical with temperature adjustment portion 120, for mounting according to IC element The change external member of 90 variety exchanging.
Control unit 800 for example has drive control part.Drive control part for example controls tray conveying mechanism 11A, 11B, temperature Degree adjustment portion 120, COMPONENT HANDLING head 13, component feeding portion 114, tray conveying mechanism 15, inspection portion 116, COMPONENT HANDLING head 117th, element recoverer 18, COMPONENT HANDLING head 20, tray conveying mechanism 21, the drive of each several part of tray conveying mechanism 22A, 22B Dynamic.
Additionally, the inspection control unit of above-mentioned checker, for example according to the program in memorizer memory storage (not shown), is carried out It is configured at the inspection of the electrical characteristics of IC element 90 in inspection portion 116 etc..
Operator can set, confirm temperature conditionss during the action of check device 1000 etc. via monitor 300.Should Monitor 300 has the display picture 301 being for example made up of liquid crystal panel, is configured at the top of the face side of check device 1000 (positive side of Z-direction).As shown in figure 9, the right side (positive side of X-direction) removing the in figure of region A5 in pallet is provided with mounting Mus Cursor mouse platform 600, this mouse uses when operation is shown in the picture of monitor 300.
In addition, signal lighties 400 can be by the combination of luminous color, operating state of report check apparatus 1000 etc.. Signal lighties 400 are configured at the top of check device 1000.Additionally, be built-in with speaker 500 in check device 1000 it is also possible to Operating state using this speaker 500 report check apparatus 1000 etc..
As shown in Figure 10, by 61 strokes of the first next door between the pallet supply area A1 and supply area A2 of check device 1000 Point (separation), divided by the second next door 62 between supply area A2 and inspection area A3, inspection area A3 and recovery zone A4 it Between divided by the 3rd next door 63, recovery zone A4 and pallet remove and are divided by the 4th next door 64 between the A5 of region.In addition, drainage area Divided by the 5th next door 65 between domain A2 and recovery zone A4.Above-mentioned next door has the bubble-tight work(keeping each region A1～A5 Energy.And, the outermost layer packaging of check device 1000 is covered to be covered, and this lid for example has protecgulum 70, side cover 71, side cover 72, bonnet 73rd, top cover 74.Additionally, being configured with inner side next door 66 more in the inner part than bonnet 73.
As described above, temperature adjustment portion 120 has the cooling-part 121 that can cool down IC element 90 and can heat IC The heater block 122 of element 90.As shown in figure 12, check device 1000 is provided with 2 temperature adjustment portions 120, this two temperature Degree adjustment portion 120 is along Y-direction, i.e. upper and lower (positive side of Y-direction and minus side) configuration in Figure 12.Hereinafter, by under in Figure 12 The temperature adjustment portion 120 of (bearing) side is referred to as " temperature adjustment portion 120A ", and the temperature adjustment portion 120 of upper (just) side is referred to as " temperature tune Whole 120B "., from temperature adjustment portion 120B in addition to allocation position is different, other structures are identical for temperature adjustment portion 120A, institute To be illustrated with temperature adjustment portion 120A for representative.
Cooling-part 121 makes cold-producing medium RF thus internally flow down IC element 90 to be cooled down and constitutes.
Additionally, cold-producing medium RF is, for example, liquid nitrogen (liquid nitrogen), cooling effectiveness (cooling capacity) is relatively higher, it is advantageous to being used for The cooling of IC element 90.As shown in Figure 9, Figure 10, it is pre-charged with refrigeration to the container 700 of the outside being arranged at check device 1000 Agent RF.And, as shown in figure 11, this container 700, via pipe arrangement 23, is connected to temperature adjustment portion 120, component feeding portion 114th, COMPONENT HANDLING head 117, inspection portion 116.Thus, cold-producing medium RF is respectively fed to temperature adjustment portion 120, component feeding portion 114th, COMPONENT HANDLING head 117, inspection portion 116.
In addition, being provided with valve 24a in pipe arrangement 23 towards the midway of temperature adjustment portion 120.Control the opening and closing of this valve 24a, Thus, it is possible to switch the stopping of the supply to temperature adjustment portion 120 for the cold-producing medium RF and this supply.Equally, in pipe arrangement 23 towards unit The midway of part supply unit 114 is provided with valve 24b.Control the opening and closing of this valve 24b, thus, it is possible to switch cold-producing medium RF to component feeding The supply in portion 114 and the stopping of this supply.In addition, being also equipped with valve in pipe arrangement 23 towards the midway of COMPONENT HANDLING head 117 24c.Control the opening and closing of this valve 24c, thus, it is possible to switch cold-producing medium RF to the supply of COMPONENT HANDLING head 117 and stopping of this supply Only.In addition, being also equipped with valve 24d in pipe arrangement 23 towards the midway in inspection portion 116.Control the opening and closing of this valve 24d, thus, it is possible to Switch the stopping of the supply to inspection portion 116 for the cold-producing medium RF and this supply.
As shown in figure 14, cooling-part 121 is by flat first component 3a and in flat second component 3b It is laminated, engage and constitute.Thereby, it is possible in the lower surface 31 of first component 3a or the upper surface 32 of second component 3b or double The face (lower surface 31 and upper surface 32) of side forms groove, and this groove is used as the stream 33 flowing down for cold-producing medium RF.Cause This, can save the part that other setting constitutes stream 33, cooling-part 121 can be made to become simple structure.Additionally, at this In embodiment, form groove in the lower surface 31 of first component 3a, this groove is used as stream 33.In addition, first component 3a Adopt the fastening method for example using multiple bolts with the joint method of second component 3b.
In addition, the lower surface 31 in first component 3a is formed with along the parallel groove of stream 33 34.In this groove 34, should with edge The mode of groove 34 is configured with seal member 30.Seal member 30 is made up of elastomeric material, in first component 3a and second component 3b Between become the state compressed.Thereby, it is possible to keep being liquid-tight in stream 33 between first component 3a and second component 3b Property (or air-tightness).Therefore, it is possible to prevent cold-producing medium RF during stream 33 flows down from first component 3a and second Spill between part 3b.
Additionally, the elastomeric material constituting seal member 30 is not particularly limited, for example, can use polyurethane rubber, silicone Various elastomeric materials as rubber, fluorubber.
As described above, the lower surface 31 in first component 3a is formed with the groove using as stream 33.For example because of this groove (stream Road 33) forming region and the total length of groove, the difference of depth, first component 3a monomer (in itself) has and produces bending somewhat Situation.
The upper surface 35 mounting electronic unit mounting part 100 of first component 3a, if so keeping first component 3a bending, Then the electronic unit mounting part 100 on upper surface 35 bends also with first component 3a.Utilize COMPONENT HANDLING in this condition 13 hold and are located at the IC element 90 that electronic unit loads in the recessed pocket 101 of part 100, and pull-up upward, due to the ministry of electronics industry Part mounting part 100 bends, so IC element 90 cannot be held completely, that is, exists and holds insufficient situation.
Therefore, in cooling-part 121, even if first component 3a bending, in order to eliminate this bending, with ratio first component 3a Thick second component 3b engages.Plane for level thereby, it is possible to correct the upper surface 35 of first component 3a, thus upper table Electronic unit on face 35 loads part 100 also becomes the state preventing bending.Load part 100 from the electronic unit of this state IC element 90 can stably be lifted using COMPONENT HANDLING head 13.
Additionally, the thickness t of second component 3b3bThickness t preferably than first component 3a3aThickness, such as preferably thickness t3a's Less than more than 1.2 times 3 times, more preferably less than more than 1.5 times 2 times.Thereby, it is possible to suppress thickness t3bIncrease and no matter first The size of the bending of part 3a how, can eliminate this bending.
As shown in Figure 12 and Figure 13, first component 3a is identical with the plan view shape of second component 3b and size.
First component 3a (second component 3b is similarly) be have first while 361 with first while 361 opposed and parallel Two while 362 with first while 361 the orthogonal the 3rd while 363 with the 3rd while 363 the 4th opposed and parallel sides 364 rectangle (rectangle).In the present embodiment, first component 3a is in the longer rectangle of Y direction, and first when 361 and second 364 length when 363 and the 4th is long than the 3rd for 362 length.By forming so fairly simple outer shape, from When the mother metal applying machining of metallic plate obtains first component 3a, this machining can be carried out easily and at low cost.
The structural material of first component 3a and second component 3b for example can use various metal materials, in this metal material In material, preferably pyroconductivity is higher and the aluminum of easy machining.
However, the coldplate that for example above-mentioned patent documentation 1 is recorded is like that, liquid nitrogen is only made to flow down in the flowing groove of bending, no The uniform cooling on coldplate can be carried out.This is because coldplate has its peripheral part to be easier to becoming of the turnover of heat than central part Gesture.
Therefore, in temperature adjustment portion 120A, uniformly cold the multiple IC elements 90 on cooling-part 121 can be carried out But mode is constituted.This structure is below described
As described above, being provided with, in cooling-part 121, the stream 33 flowing down for cold-producing medium RF.As shown in figure 13, stream 33 Have for the first flow path 37 of cold-producing medium RF inflow and connect and supply the second flow path that cold-producing medium RF flows out with first flow path 37 38.
In the case of overlooking cooling-part 121, the stream that first flow path 37 is flowed into this first flow path 37 with cold-producing medium RF Entrance 371 is starting point, is close to the outer circumferential side of (deflection) cooling-part 121 as far as possible, by first when the 361, the 3rd 363, second When the 362, the 4th, 364 order is formed along each side.
In first flow path 37 along the part on the first side 361, from upstream side downstream side, it is formed with linearly straight line Shape portion 372, the crank-like portion 373 bending or being bent to crank-like, linearly straight part 374.
And, first flow path 37 first in 361 and the 3rd while 363 corner (corner) the 365 side conversion directions being formed, In the part along the 3rd side 363, it is formed with linearly straight part 375.
In addition, first flow path 37 the 3rd in 363 and second while 362 corner (corner) the 366 side conversion directions being formed, In the part along the second side 362, it is formed with linearly straight part 376.
And, first flow path 37 second in 362 and the 4th while 364 corner (corner) the 367 side conversion directions being formed, In the part along the 4th side 364, it is formed with linearly straight part 377.
Stream 33 in the reflex part 331 turning back as "U" shaped after straight part 377, to than first flow path 37 more in the inner part, enters to the central side of cooling-part 121, from the first flow path 37 as outlet, switchs to as loop Second flow path 38.This reflex part 331 is the part connecting first flow path 37 and second flow path 38.
In the case of overlooking cooling-part 121, than first flow path 37 more in the inner part, back-roll is first-class for second flow path 38 Road 37 and according to the 4th when 364, second the 362, the 3rd while 363, first while 361 order formed along each side.
In second flow path 38 along the part on the 4th side 364, it is formed with linear straight part 381.Straight part 381 Become the state being set up in parallel with the straight part 377 of first flow path 37, the flow direction of cold-producing medium RF also with straight part 377 On the contrary.
And, second flow path 38, in corner 367 side conversion direction, in the part along the second side 362, is formed with linear Straight part 382.Straight part 382 becomes the state being set up in parallel with the straight part 376 of first flow path 37, cold-producing medium RF's Flow direction is also contrary with straight part 376.
In addition, second flow path 38, in corner 366 side conversion direction, in the part along the 3rd side 363, is formed with linear Straight part 383.Straight part 383 becomes the state being set up in parallel with the straight part 375 of first flow path 37, cold-producing medium RF's Flow direction is also contrary with straight part 375.
And, second flow path 38, in corner 365 side conversion direction, in the part along the first side 361, is formed with repeatedly to connect Near and far is from the portion 384 and be in the downstream in the portion of crawling 384 of crawling that bends of mode of the straight part 374 of first flow path 37 Linear straight part 385.Portion 384 of crawling becomes the state being set up in parallel with the straight part 374 of first flow path 37, refrigeration The flow direction of agent RF is also contrary with straight part 374.Straight part 385 becomes with the straight part 372 of first flow path 37 simultaneously The state of row setting, the flow direction of cold-producing medium RF is also contrary with straight part 372.
And, the flow export 386 that second flow path 38 flows out from this second flow path 38 in cold-producing medium RF forms terminal.
As described above, stream 33 first while 361, second while the 362, the 3rd in 363 and the 4th while 364, from first-class The straight part 372 on road 37 is configured at the outside of second flow path 38 to straight part 377, from the straight part of this second flow path 38 381 surround the portion of crawling 384 always.And, the temperature of cold-producing medium RF that the first flow path 37 being located at outside at this flows down than The temperature of the cold-producing medium RF that the second flow path 38 of inner side flows down is low.Thus, even there is peripheral part be easier to heat than central part The cooling-part 121 of the trend of turnover of amount, it is also possible to prevent the reduction of the refrigerating function of first flow path 37, can play fully Refrigerating function.Therefore, on cooling-part 121, multiple IC elements 90 uniformly can be cooled down.
Additionally, in the present embodiment, when measuring throughout the mean temperature of the cold-producing medium RF of stream 33 entirety, will be less than The part of mean temperature is set to " first flow path 37 ", the part exceeding mean temperature is set to " second flow path 38 ", but does not limit In this.For example, it is also possible to be set to " first flow path 37 " by the 1/2 of upstream side in stream 33 entirety, the 1/2 of downstream is set For " second flow path 38 ".
As shown in figure 13, inflow entrance 371 and flow export 386 to first when the 361～the 4th 364 in the 4th side 364 side Deflection configuration.Thereby, it is possible to make inflow entrance 371 adjacent with flow export 386 and as far as possible near such that it is able to use described later one Individual manifold fittings 5 (with reference to Figure 15), carry out the supply of cold-producing medium RF and the discharge of cold-producing medium RF to cooling-part 121.
In addition, reflex part 331 is also to the 4th side 364 lateral deviation to configuration.Thus, first flow path 37 is along the first side 361～the Four sides 364, such that it is able to guarantee the total length of this first flow path 37 as long as possible, contribute to uniformly cold to multiple IC elements 90 But.
As shown in figure 12, the cooling-part 121 of temperature adjustment portion 120A and the cooling-part 121 of temperature adjustment portion 120B with The mutually opposing mode in 4th side 364 configures.That is, temperature adjustment portion 120A and temperature adjustment portion 120B with respective intermediate point are Center, the configuration of point symmetry ground.Thus, as shown in figure 15, can be between temperature adjustment portion 120A and temperature adjustment portion 120B Inboard (Z-direction minus side) configuration manifold fittings 5.
Manifold fittings 5 have manifold bodies 51 and the joint 52～joint 57 being connected with manifold bodies 51.
Manifold bodies 51 have makes cold-producing medium RF towards joint 53, the internal flow path 511 of joint 54 and make system from joint 52 Cryogen RF from joint 55, joint 56 towards joint 57 internal flow path 512.
Joint 52 is connected with the pipe (the 3rd stream) 701 making to flow down from the cold-producing medium RF of container 700.Joint 53 is via pipe The inflow entrance 371 of 702 cooling-parts 121 being connected to temperature adjustment portion 120A.Joint 54 is connected to temperature adjustment via pipe 703 The inflow entrance 371 of the cooling-part 121 of portion 120B.By such connection, the cold-producing medium RF from container 700 is respectively fed to The cooling-part 121 of temperature adjustment portion 120A and the cooling-part 121 of temperature adjustment portion 120B.
Joint 55 is connected to the flow export 386 of the cooling-part 121 of temperature adjustment portion 120A via pipe 704.Joint 56 warp It is connected to the flow export 386 of the cooling-part 121 of temperature adjustment portion 120B by pipe 705.Joint 57 is via pipe (the 4th stream) 706 It is connected to discharge opeing portion (not shown).By such connection, adjust from the cooling-part 121 of temperature adjustment portion 120A and temperature The cold-producing medium RF that the cooling-part 121 of portion 120B is discharged respectively is reclaimed by above-mentioned discharge opeing portion.
Below the cooling-part 121 constituting like that is configured between electronic unit mounting part 100 and heater block 122 (with reference to Figure 14).
This heater block 122 is the rubber heater that can heat IC element 90.Rubber heater is lamellar, by energising Generate heat and constitute.Thus, heater block 122 becomes slim.The power density of the rubber heater using as heater block 122 It is not particularly limited, for example preferably 0.5W/cm2Above, 20W/cm2Hereinafter, more preferably 10W/cm2Above, 15W/cm2With Under.In addition, more than 0.6 times, less than 1.2 times of the vertical view area overlooking area preferably cooling-part 121 of rubber heater, More preferably more than 0.8 times, less than 1 times.
In temperature adjustment portion 120A, if being energized to heater block 122, earlier generate heat, can be fast using this heat Speed heating IC element 90.On the other hand, the cold-producing medium RF flowing down in the stream 33 of cooling-part 121 is as mentioned above to being arranged at inspection The container 700 looking into the outside of device 1000 supplies, so cooling capacity reduces before reaching cooling-part 121.So, compare Heater block 122 and cooling-part 121 thermal efficiency (energy loss) to IC element 90, the thermal efficiency ratio of cooling-part 121 adds Thermal part 122 is low, that is, have the trend that energy loss is high.
Therefore, in temperature adjustment portion 120A, cooling-part 121 high for energy loss is configured near IC element 90, will The low heater block of energy loss 122 configures away from cooling-part 121 and constitutes.By such configuration, can distinguish rapid And efficiently and evenly cool down and heat IC element 90.
In addition, as shown in figure 14, second component 3b becomes the shape being configured between first component 3a and heater block 122 State, lower surface 39 is contacted with heater block 122.Thus, in the case that temperature adjustment portion 120A is to IC element 90 heating, second Part 3b is as the heat storage unit function of heat produced by temporary transient storage heater block 122.Therefore, each to one by one (by One) carry the IC element 90 coming sustainedly and stably to heat.
Embodiment 3
The electronic component inspection device of embodiment 3 is below described.Additionally, in the following description, to above-mentioned enforcement Mode identical structure and part mark same reference, omit or simplify their explanation.
As shown in Figure 16, Figure 17, the check device 2000 of embodiment 3 possesses in each region A1～A5 carrying IC element 90 Electronic component conveying device (automatic letter sorting machine), the inspection portion 216 being checked in the A3 of inspection area, control unit 800.Separately Outward, check device 2000 possesses monitor 300, signal lighties 400, guidance panel 900.
Supply area A2 is provided with temperature adjustment portion (temperature-uniforming plate) 220, COMPONENT HANDLING head 13, tray conveying mechanism 15.
Temperature adjustment portion 220 can load multiple IC elements 90 unified cooling these IC elements 90, also referred to as " samming Plate ".Using this temperature-uniforming plate, the IC element 90 before inspection portion 216 checks can be pre-cooled and be adjusted to be suitable to this inspection Look into the temperature of (low temperature inspection).In structure shown in Figure 17, temperature adjustment portion 220 configures, is fixed with 2 along Y-direction.And And, the IC element 90 pallet 200 of (carrying comes) is moved into from pallet supply area A1 by tray conveying mechanism 11A and is moved to Arbitrary temperature adjustment portion 220.
COMPONENT HANDLING head 13 be supported to can in the A2 of supply area in X direction, Y-direction and Z-direction move.By This, COMPONENT HANDLING head 13 can undertake the IC unit between the pallet 200 that pallet supply area A1 moves into and temperature adjustment portion 220 The carrying of the IC element 90 between the carrying of part 90, temperature adjustment portion 220 and component feeding portion 214 described later.
Inspection area A3 is the region checking IC element 90.This inspection area A3 is provided with inspection portion 216 and element is removed Fortune 217.In addition, be additionally provided with the component feeding portion 214 of movement in the way of crossing over supply area A2 and inspection area A3, with Cross over the element recoverer 218 of the mode movement of inspection area A3 and recovery zone A4.
Component feeding portion 214 is to be positioned in temperature adjustment portion 220 to be adjusted the IC element 90 of temperature and by this IC element 90 The mounting portion near inspection portion 216 is arrived in carrying (movement), also referred to as " supply shuttle plate (or referred to as " supply shuttle ") ".
In addition, component feeding portion 214 be supported to can between supply area A2 and inspection area A3 (water in X direction Square to one of direction) move back and forth.In structure shown in Figure 17, component feeding portion 214 is configured with 2 along Y-direction, IC element 90 in temperature adjustment portion 220 is moved to any element supply unit 214.In addition, component feeding portion 214 is adjusted with temperature Whole 220 is identical, can cool down the IC element 90 being placed in this component feeding portion 214 and constitute.Thereby, it is possible to adjusting in temperature The whole 220 IC elements 90 being adjusted temperature maintain its temperature to adjust state and are transported to the inspection portion 216 of inspection area A3 Near.
COMPONENT HANDLING head 217 is to hold (mounting) to maintain the IC element 90 of said temperature adjustment state and by this IC element 90 The operating member of carrying in the A3 of inspection area.This COMPONENT HANDLING head 217 be supported to can in the A3 of inspection area along Y-direction with And Z-direction moves back and forth, as a part for the mechanism being referred to as " scale arm ".Thus, COMPONENT HANDLING head 217 can be by from confession The IC element 90 in component feeding portion 214 moved into region A2 is carried, is placed in inspection portion 216.Additionally, COMPONENT HANDLING head 217 are supported to move back and forth along Y-direction in the A3 of inspection area, but are not limited thereto it is also possible to be supported to Can move back and forth in X direction.
In addition, COMPONENT HANDLING head 217 is identical with temperature adjustment portion 220, the IC element 90 of holding can be cooled down and constitute.By The temperature adjustment state of IC element 90 can persistently be maintained inspection portion 216 from component feeding portion 214 by this.
Inspection portion 216 is the mounting portion of mounting IC element 90 electrical characteristics checking, testing this IC element 90.In this inspection Portion 216 is provided with the probe that multiple portion of terminal with IC element 90 electrically connect.And, the portion of terminal of IC element 90 and probe are electrically connected Connect (contact), carry out the inspection of IC element 90 via probe.According to the inspection possessing in the checker being connected with inspection portion 216 In control unit, the program of storage carries out the inspection of IC element 90.Additionally, inspection portion 216 is also identical with temperature adjustment portion 220, can This IC element 90 is simultaneously adjusted to the temperature being suitable to check by cooling IC element 90.
In addition, inspection portion 216, temperature adjustment portion 220, component feeding portion 214, COMPONENT HANDLING head 217 may be constructed respectively It is to heat IC element 90 in addition to can cooling down IC element 90.
Element recoverer 218 is can to load the IC element 90 of the inspection terminating in inspection portion 216 and by this IC element 90 The mounting portion of recovery zone A4 is arrived in carrying (movement), also referred to as " reclaims with shuttle plate (or being referred to as " recovery shuttle ") ".
In addition, element recoverer 218 be supported to can between inspection area A3 and recovery zone A4 (water in X direction Square to one of direction) move back and forth.In addition, in the structure shown in Figure 17, element recoverer 218 and component feeding portion 214 is identical, is configured with 2 along Y-direction, and the IC element 90 in inspection portion 216 is handled upside down, is placed in any element recoverer 218. This carrying is carried out by COMPONENT HANDLING head 217.
Recovery zone A4 is the region reclaiming the multiple IC elements 90 terminating to check.In this recovery zone, A4 is provided with recovery With pallet 19, COMPONENT HANDLING head 20, tray conveying mechanism 21.In addition, be ready for the pallet 200 of sky in recovery zone A4.
Recovery pallet 19 is the mounting portion of the IC element 90 that the examined portion 216 of mounting checked, and is fixed to returning Receive in the A4 of region and do not move.Thus, in the recovery zone A4 being configured with the various movable parts such as more COMPONENT HANDLING head 20, also can be On recovery pallet 19, stable mounting checks the IC element 90 finishing.Additionally, in the structure shown in Figure 17, reclaiming and use pallet 19 It is configured with 3 in X direction.
In addition, the pallet 200 of sky is also configured with 3 in X direction.This empty pallet 200 also serves as loading examined portion 216 The mounting portion of the IC element 90 that checked.And, IC element 90 quilt on the mobile next element recoverer 218 of recovery zone A4 Carrying, either one being placed in recovery pallet 19 and the pallet 200 of sky.Thus, according to inspection result classification, reclaim IC Element 90.
COMPONENT HANDLING head 20 be supported to can in the A4 of recovery zone in X direction, Y-direction and Z-direction move.By This, IC element 90 can be carried to recovery pallet 19, empty pallet 200 from element recoverer 218 by COMPONENT HANDLING head 20.
Control unit 800 for example has drive control part.Drive control part for example controls tray conveying mechanism 11A, 11B, temperature Degree adjustment portion 220, COMPONENT HANDLING head 13, component feeding portion 214, tray conveying mechanism 15, inspection portion 216, COMPONENT HANDLING head 217th, element recoverer 218, COMPONENT HANDLING head 20, tray conveying mechanism 21, the drive of each several part of tray conveying mechanism 22A, 22B Dynamic.
Additionally, the program checking control unit such as basis middle storage in memorizer (not shown) of above-mentioned checker, enter Row is configured at the inspection of the electrical characteristics of IC element 90 in inspection portion 216 etc..
Operator can set via monitor 300, confirm operation condition of check device 2000 etc..This monitor 300 have the display picture (display part) 301 being for example made up of liquid crystal panel, and are configured in the face side of check device 2000 Portion.As shown in figure 16, the right side removing the in figure of region A5 in pallet is provided with mounting mouse Mouse table 600, and this mouse is in behaviour Use during the picture being shown in monitor 300.
In addition, being configured with guidance panel 900 in the lower right being located at Figure 16 with respect to monitor 300.Guidance panel 900 phase In addition to check device 2000, desired action is ordered for monitor 300.
In addition, signal lighties 400 pass through the combination of luminous color, it is capable of operating state of report check apparatus 2000 etc.. Signal lighties 400 are configured at the top of check device 2000.Additionally, being built-in with speaker 500 in check device 2000, raised using this Sound device 500 is also capable of operating state of report check apparatus 2000 etc..
As shown in figure 17, by 61 strokes of the first next door between the pallet supply area A1 and supply area A2 of check device 2000 Point (separation), divided by the second next door 62 between supply area A2 and inspection area A3, inspection area A3 and recovery zone A4 it Between divided by the 3rd next door 63, recovery zone A4 and pallet remove and are divided by the 4th next door 64 between the A5 of region.In addition, drainage area Divided by the 5th next door 65 between domain A2 and recovery zone A4.
The outermost layer packaging of check device 2000 is covered to be covered, and this lid for example has protecgulum 70, side cover 71, side cover 72, bonnet 73rd, top cover 74.
As described above, temperature adjustment portion 220, component feeding portion 214, COMPONENT HANDLING head 217 are able to cool down IC element 90 and constitute.Referring to Figure 18, Figure 19, this structure to be described.
As shown in figure 18, two temperature adjustment portions 220, via pipe arrangement 203, are connected to the first cold-producing medium feed unit 8A.? In check device 2000, each temperature adjustment portion 220 is as using the first cold-producing medium from the first cold-producing medium feed unit 8A supply First mounting portion (1 cooling end) of the placed IC element 90 of RF1 cooling.Additionally, below by the Y-direction in Figure 18 The temperature adjustment portion 220 of minus side is referred to as " temperature adjustment portion 220A ", and the temperature adjustment portion 220 positioned at positive side is referred to as " temperature tune Whole 220B ".
Each temperature adjustment portion 220 has the first flow path 221 passed through for the first cold-producing medium RF1 inside it.First flow path 221 in the way of can uniformly cooling down the whole IC elements 90 being placed in temperature adjustment portion 220 as far as possible, in temperature adjustment portion Alternating bending or bending in 220, form throughout the substantially overall of this temperature adjustment portion 220.In addition, the first cold-producing medium RF1 In first flow path 221 alternating bending or bending when, from entrance 222 to outlet 223 gradually change temperature (for example -65 degree Enter entrance 222, be changed into -55 degree etc. in outlet 223), it is formed parallel to outlet and loop thus forming more uniform temperature.
The cold-producing medium of the liquid as the first cold-producing medium RF1 is supplied by the first cold-producing medium feed unit 8A via pipe arrangement 203 To each temperature adjustment portion 220.
This first cold-producing medium feed unit 8A has the container that the first cold-producing medium RF1 stockpiles the state for set point of temperature 81st, it is connected to the cooler 83 of container 81 via pipe arrangement 82.Additionally, the temperature of the first cold-producing medium RF1 in container 81 is than inspection Look into the low temperature of the inspection temperature of the IC element 90 in portion 216, for example, it is preferable to be than the temperature checking low 10～25 degree of temperature.Tool For body, the temperature of this first cold-producing medium RF1 is preferably that -80 degree are above, -50 degree are following, more preferably -65 spend more than, -55 spend Below.As an example, in the case of checking that temperature is -60 degree, the temperature of the first cold-producing medium RF1 is preferably -80～-75 About degree, in the case of checking that temperature is -45 degree, the temperature of the first cold-producing medium RF1 is preferably about -55 degree.
First cold-producing medium RF1 is not particularly limited, for example, can enumerate Vertrel Sinera (バ ト レ Le シ ネ ラ (note Volume trade mark)), GALDEN (ガ Le デ Application (registered trade mark)), Novec (ノ ベ ッ Network), Fluorinert (Off ロ リ Na ト (registration Trade mark)) etc. fluorine class cold-producing medium (fluorine class inert fluid), above-mentioned in preferably use Vertrel Sinera.
Pipe arrangement 203 has second pipe 232, the connection that the first pipe 231 being connected with container 81 side is connected with cooler 83 side 3rd pipe 233 of first pipe 231 and the entrance 222 of the first flow path 221 of temperature adjustment portion 220A, it is connected temperature adjustment portion 220A The 4th pipe 234 of the outlet 223 of first flow path 221 and second pipe 232, be arranged at the 4th pipe 234 midway flow adjustment Valve 304, connect the 5th pipe 235 of first pipe 231 and the entrance 222 of the first flow path 221 of temperature adjustment portion 220B, be connected temperature The outlet 223 of the first flow path 221 of adjustment portion 220B is with the 6th pipe 236 of second pipe 232, the midway that is arranged at the 6th pipe 236 Flow rate regulating valve 306.
And, the first cold-producing medium RF1 after container 81 outflow, successively via first pipe 231, the 3rd pipe 233 the (or the 5th Pipe 235), the first flow path 221 of temperature adjustment portion 220A (or temperature adjustment portion 220B), the 4th pipe 234 (or the 6th pipe 236), second pipe 232, flow into cooler 83.
This first cold-producing medium RF1 is used for the cooling of IC element 90 when by first flow path 221.By this cooling, (1 time cold But), it is cooled fast near above-mentioned inspection temperature for the IC element 90 of room temperature before this.Such quick cooling preferably uses Above-mentioned fluorine class cold-producing medium is as the first cold-producing medium RF1.In addition, utilizing flow rate regulating valve 304, flow rate regulating valve 306, can equalize Adjustment is by the flow of the first cold-producing medium RF1 of each temperature adjustment portion 220.
In addition, the first cold-producing medium RF1 flowing into cooler 83 is cooled to above-mentioned initial temperature by this cooler 83, that is, carry out Heat exchange.Then, the first cold-producing medium RF1 returns container 81 by pipe arrangement 82.
In addition, being provided with the first valve 237 in the midway of first pipe 231, the midway of second pipe 232 is provided with the second valve 238.Thereby, it is possible to switch supply and its stopping of the first cold-producing medium RF1.
As described above, each temperature adjustment portion 220 is fixing.On the other hand, if can move in each temperature adjustment portion 220 In the case of dynamic, due to this movement, worry that the 3rd pipe 233 being for example connected with temperature adjustment portion 220A is tired and rupture, the 3rd The screw loosening of joint (not shown) of the midway of pipe 233 and so that the first cold-producing medium RF1 is spilt.In this case, the first refrigeration Agent RF1 is liquid, so the mechanism of periphery can be soaked etc..However, because each temperature adjustment portion 220 is fixing, thus, it is possible to Reduce the worry spilling of (suppression) first cold-producing medium RF1.
As shown in figure 19, two component feeding portions 214, COMPONENT HANDLING heads 217, via pipe arrangement 204, are connected to the second refrigeration Agent feed unit 8B.In check device 2000, each component feeding portion 214, COMPONENT HANDLING head 217 are respectively as using from second The second mounting portion (2 coolings that the IC element 90 of mounting is cooled down by the second refrigerant RF2 of cold-producing medium feed unit 8B supply Portion).Additionally, following be referred to as " component feeding portion 14A " by the component feeding portion 214 of the minus side of the Y-direction in Figure 19, by position It is referred to as " component feeding portion 14B " in the component feeding portion 214 of positive side.
Each component feeding portion 214 has the second flow path 141 passed through for second refrigerant RF2 inside it.Second flow path 141 in the way of uniformly cooling down the whole IC element 90 being placed in component feeding portion 214 as far as possible, in component feeding portion Alternating bending or be bent in 214, forming throughout the substantially overall of this component feeding portion 214.
COMPONENT HANDLING head 217 also has the second flow path 171 passed through for second refrigerant RF2 inside it.Second flow path 171 in the way of uniformly cooling down the whole IC element 90 being held in COMPONENT HANDLING head 217 as far as possible, in COMPONENT HANDLING head Alternating bending or be bent to and formed in 217.
Second refrigerant feed unit 8B, using the cold-producing medium of the gas as second refrigerant RF2, supplies via pipe arrangement 204 To each component feeding portion 214, COMPONENT HANDLING head 217.
This second refrigerant feed unit 8B has the container being filled with second refrigerant RF2 with the state of set point of temperature 84 and the pump 86 that is connected to container 84 via pipe arrangement 85.Additionally, the temperature of the second refrigerant RF2 in container 84 is container The temperature lower temperature of the first cold-producing medium RF1 in 81, be for example preferably -120 degree above, -80 spend below, more preferably - More than 110 degree, -90 degree below.
Second refrigerant RF2 preferably uses the air of drying regime.Here, " drying regime " is even if refer to second freezes Agent RF2 is discharged into the state of the generation that also can prevent from above-mentioned each region A1～A5 of check device 2000 condensing.
Pipe arrangement 204 is had the first pipe 41 being connected with pump 86 side, connects first pipe 41 and the second of component feeding portion 14A The second pipe 42 of the entrance 142 on road 141, connection first pipe 41 and the entrance 142 of second flow path 141 of component feeding portion 14B 3rd pipe 43,.
And, the second refrigerant RF2 flowing out as compressed gas from pump 86 is successively via first pipe 41, second pipe 42 (or the 3rd pipe 43), the second flow path 141 of component feeding portion 14A (or component feeding portion 14B), from second flow path 141 Outlet 143 discharge.This second refrigerant RF2 is used for the cooling of IC element 90 when by second flow path 141.By this cooling, It is cooled fast to IC element 90 maintenance this temperature adjustment being adjusted temperature near above-mentioned inspection temperature in temperature adjustment portion 220 State.
In addition, pipe arrangement 204 has connects pump 86 side and the 4th of the entrance 172 of second flow path 171 of COMPONENT HANDLING head 217 Pipe 44.And, from pump 86 flow out second refrigerant RF2 successively via the second flow path of the 4th pipe 44, COMPONENT HANDLING head 217 171, discharge from the outlet 173 of second flow path 171.This second refrigerant RF2 is used for IC element 90 when by second flow path 171 Cooling.By this cooling, the temperature maintaining in component feeding portion 214 adjustment state former state can be lasted till by IC element 90 removes Till being transported to inspection portion 216.
In addition, being provided with the first valve 45 in the midway of first pipe 41.Thereby, it is possible to switch to each component feeding portion 214 The supply of second refrigerant RF2 and its stopping.It is also equipped with the second valve 46 in the midway of the 4th pipe 44.Thereby, it is possible to switch to The supply of second refrigerant RF2 of COMPONENT HANDLING head 217 and its stopping.
So in 2 coolings that the temperature maintaining IC element 90 adjusts state, it is less than the first cold-producing medium RF1 using specific heat Second refrigerant RF2.Second refrigerant RF2 is described above as air, so Expenses Cost just can not obtain, contributes to The operating cost of suppression check device 2000.
Additionally, the specific heat of second refrigerant RF2 is less than the first cold-producing medium RF1, so second flow path 141, second flow path 171 Interior temperature is set as lower than the temperature of the first cold-producing medium RF1 in first flow path 221.Maintain IC element thereby, it is possible to abundant 90 temperature adjustment state.
As described above, in check device 2000, IC element 90 in the carrying midway to before inspection portion 216, first by It is placed in the temperature adjustment portion 220 of high cooling capacity and quickly cool down.Thus, by rapid for IC element 90 homoiothermic to be suitable to check Check temperature.Then, IC element 90 is placed in cooling capacity repressed component feeding portion 214, COMPONENT HANDLING head 217.By This, IC element 90 maintains the state (state of cooling) being tempered to checking temperature, till being moved to inspection portion 216.
In addition, component feeding portion 214 is the part of movement, by the second refrigerant RF2 in this component feeding portion 214 it is The light gas than liquid, it is possible to reduce act on the motor of driving source as component feeding portion 214 load (for example plus Vibration producing during deceleration etc.).Equally, COMPONENT HANDLING head 217 is also the part of movement, by this COMPONENT HANDLING head 217 Second refrigerant RF2 is the gas lighter than liquid, it is possible to reducing the horse acting on the driving source as COMPONENT HANDLING head 217 The load (vibration producing during such as acceleration and deceleration etc.) reaching.
As shown in figure 19, the downstream in each component feeding portion 214 and COMPONENT HANDLING head 217 is connected with for the second refrigeration The pipe arrangement 205 that agent RF2 passes through.Pipe arrangement 205 is the second refrigerant RF2 of the cooling by being used for IC element 90, to check device The supply line of supply in 2000 above-mentioned each region (such as recovery zone A4 representative).
This pipe arrangement 205 is had the first pipe 251 being connected with the outlet 143 of the second flow path 141 of component feeding portion 14A, connects Connect the outlet 143 of second flow path 141 of component feeding portion 14B and the second pipe 252 of first pipe 251, connecting element carrying 217 The outlet 173 of second flow path 171 and first pipe 251 the 3rd pipe 253.
In addition, first pipe 251 with outlet 143 contrary sides as discharge second refrigerant RF2 outlet 510, Outlet 510 is nearby provided with the heater 254 of built-in temperature sensor (not shown).And, from the of each outlet 143 outflow Two cold-producing medium RF2 and the interflow in first pipe 251 before reaching heater 254 of the second refrigerant RF2 from outlet 173 outflow, It is heated to the temperature of regulation by this heater 254, i.e. carry out heat exchange.Then, second refrigerant RF2 is from outlet 510 row Go out.Thus, recovery zone A4 becomes the state being filled with second refrigerant RF2, becomes the environment of the generation preventing condensing.? So in check device 2000, second refrigerant RF2, in addition to for cooling, can also be used further to prevent from condensing.
In addition, there was situation nitrogen being used as the gas preventing from condensing being filled in recovery zone A4 in the past.At this In the case of, recovery zone A4 becomes anaerobic condition, needs to detect the anoxia detection sensor of this anaerobic condition.On the other hand, will Second refrigerant RF2 as air is used for preventing from condensing, and thus prevents anoxia in the A4 of recovery zone.Thus, for example needing During maintenance in the A4 of recovery zone, this maintenance can be carried out at once.Furthermore it is possible to omit anoxia detection sensor.
In addition, first pipe 251 as far as possible by outlet 143 sides be provided with flow rate regulating valve 501, in second pipe 252 Midway is provided with flow rate regulating valve 502.Thereby, it is possible to equalize adjustment by the first cold-producing medium RF1's in each component feeding portion 214 Flow.Furthermore it is preferred that being also provided with flow rate regulating valve 503 in the midway of the 3rd pipe 253.
Illustrate electronic component conveying device and the electronic unit inspection of the present invention above in relation to embodiment illustrated Device, but the present invention is not limited to this, and each several part of electronic component conveying device and composition electronic component inspection device is permissible It is replaced into the arbitrary structures that can play identical function.Alternatively, it is also possible to additional arbitrary structures thing.
In the above-described embodiment, temperature adjustment portion has 1 group of first component and second component, but is not limited thereto, Can also have multigroup, these are laminated for multilamellar.In this case, the temperature of temperature adjustment portion integrally more equalizes, i.e. The overall more uniform temperature of temperature adjustment portion.
In addition, first component (second component is similarly) be not limited to rectangle or at least have the first side～ 4th while 4 while other rectangles.Additionally, other rectangles comprise square.
In addition, the cold-producing medium for the cooling of IC element does not limit, it is liquid in the above-described embodiment it is also possible to make Use gas.
The explanation of reference
1 ... check device (electronic component inspection device), 11A ... tray conveying mechanism, 11B ... tray conveying mechanism, 12 ... temperature adjustment portions, 12A ... temperature adjustment portion, 12B ... temperature adjustment portion, 13 ... COMPONENT HANDLING heads, 14 ... component feeding portions, 15 ... tray conveying mechanisms (the first Handling device), 16 ... inspection portions, 17 ... COMPONENT HANDLING heads, 18 ... element recoverers, 19 ... Recovery pallet, 20 ... COMPONENT HANDLING heads, 21 ... tray conveying mechanisms (the second Handling device), 22A ... tray conveying mechanism, 22B ... tray conveying mechanism, 23 ... pipe arrangements, 24a ... valve, 24b ... valve, 24c ... valve, 24d ... valve, 3a ... first component, 3b ... Second component, 30 ... seal members, 31 ... lower surfaces, 32 ... upper surfaces, 33 ... streams, 331 ... reflex parts, 34 ... grooves, 35 ... Upper surface, 361 ... first sides, 362 ... second sides, 363 ... the 3rd sides, 364 ... the 4th sides, 365 ... corners (corner), 366 ... Corner (corner), 367 ... corners (corner), 37 ... first flow path, 371 ... inflow entrances, 372 ... straight part, 373 ... crank-like Portion, 374 ... straight part, 375 ... straight part, 376 ... straight part, 377 ... straight part, 38 ... second flow paths, 381 ... Straight part, 382 ... straight part, 383 ... straight part, 384 ... crawl portion, 385 ... straight part, 386 ... flow exports, 5 ... manifold fittings, 51 ... manifold bodies, 511 ... internal flow paths, 512 ... internal flow paths, 52 ... joints, 53 ... joints, 54 ... connect Head, 55 ... joints, 56 ... joints, 57 ... joints, 61 ... first next doors, 62 ... second next doors, 63 ... the 3rd next doors, 64 ... the 4th Next door, 65 ... the 5th next doors, 66 ... inner side next doors, 70 ... protecgulums, 71 ... side covers, 72 ... side covers, 73 ... bonnets, 74 ... top covers, 8a ... first component, 8b ... second component, 830 ... streams, 831 ... reflex parts, 840 ... grooves, 861 ... first sides, 862 ... second Side, 863 ... the 3rd sides, 864 ... the 4th sides, 865 ... corners (corner), and 866 ... corners (corner), 870 ... first flow path, 871 ... inflow entrances, 872 ... straight part, 873 ... straight part, 874 ... straight part, 880 ... second flow paths, 881 ... straight lines Shape portion, 882 ... straight part, 883 ... crawl portion, 884 ... straight part, 885 ... flow exports, 90 ... IC elements, 100 ... electronics Part loads part, 101 ... recessed pockets, 200 ... pallets (arrangement components), 300 ... monitors, 301 ... display pictures, 400 ... letters Signal lamp, 500 ... speakers, 600 ... Mouse tables, 700 ... containers, 701 ... pipes (the 3rd stream), 702 ... pipes, 703 ... pipes, 704 ... pipes, 705 ... pipes, 706 ... pipes (the 4th stream), 800 ... control units, A1 ... pallet supply area, A2 ... component feeding area Domain (supply area), A3 ... inspection area, A4 ... element recovery zone (recovery zone), A5 ... pallet removes region, and RF ... makes Cryogen, t3a... thickness, t3b... thickness.

Claims (12)

1. a kind of electronic component conveying device it is characterised in that
There is the cooling-part of cooling electronic unit,
Above-mentioned cooling-part is had for the first flow path of cold-producing medium inflow and is connected with above-mentioned first flow path and supply above-mentioned cold-producing medium The second flow path flowing out,
In the case of overlooking above-mentioned cooling-part, above-mentioned first flow path is joined in the way of surrounding a part for above-mentioned second flow path Put.
2. electronic component conveying device according to claim 1 it is characterised in that
Above-mentioned cooling-part have first while, second while, the 3rd while and when the 4th, above-mentioned first while, above-mentioned second while with And above-mentioned 3rd side, in the case of overlooking above-mentioned cooling-part, above-mentioned first flow path is configured at the outside of above-mentioned second flow path.
3. electronic component conveying device according to claim 1 and 2 it is characterised in that
Above-mentioned first is opposed while with above-mentioned second, and the above-mentioned 3rd is opposed while with the above-mentioned 4th.
4. the electronic component conveying device according to Claims 2 or 3 it is characterised in that
Above-mentioned cooling-part be have above-mentioned first while with above-mentioned first parallel above-mentioned second while with above-mentioned first just The rectangle on above-mentioned 3rd parallel the 4th side while with the above-mentioned 3rd handed over,
Above-mentioned 4th side be configured with the inflow entrance flowing into above-mentioned first flow path for above-mentioned cold-producing medium and for above-mentioned cold-producing medium from The flow export that above-mentioned second flow path flows out.
5. the electronic component conveying device according to any one of claim 2～4 it is characterised in that
Above-mentioned first while and length when above-mentioned second than the above-mentioned 3rd while and length when the above-mentioned 4th long.
6. the electronic component conveying device according to any one of claim 2～5 it is characterised in that
What above-mentioned first flow path was connected with above-mentioned second flow path be partially configured to more leans on above-mentioned for above-mentioned 3rd side Four avris.
7. the electronic component conveying device according to any one of claim 2～6 it is characterised in that
There are two above-mentioned cooling-parts, above-mentioned 4th side of an above-mentioned cooling-part with another above-mentioned cooling-part The opposed mode in above-mentioned 4th side configures.
8. the electronic component conveying device according to any one of claim 1～7 it is characterised in that
Above-mentioned first flow path and above-mentioned second flow path some be set up in parallel.
9. the electronic component conveying device according to any one of claim 1～8 it is characterised in that
In the inside of a cooling-part, there is the 3rd stream making cold-producing medium flow into above-mentioned first flow path and supply from above-mentioned second The 4th stream that the cold-producing medium that stream flows out flows into.
10. the electronic component conveying device according to any one of claim 1～9 it is characterised in that
Above-mentioned cooling-part is the temperature-uniforming plate that the above-mentioned electronic unit before checking is cooled down in advance.
11. electronic component conveying devices according to any one of claim 1～9 it is characterised in that
Above-mentioned cooling-part is the shuttle plate that can move and can carry above-mentioned electronic unit by drive division.
A kind of 12. electronic component inspection device it is characterised in that
Have：
Cooling electronic unit cooling-part, wherein, above-mentioned cooling-part have for cold-producing medium flow into first flow path and with upper State first flow path and connect and supply the second flow path that above-mentioned cold-producing medium flows out；And
Check the inspection portion of above-mentioned electronic unit,
In the case of overlooking above-mentioned cooling-part, above-mentioned first flow path is joined in the way of surrounding a part for above-mentioned second flow path Put.
CN201610726317.2A 2015-08-27 2016-08-25 Electronic component conveying device and electronic component inspection device Pending CN106483440A (en)

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JP2015167518A JP6597059B2 (en) 2015-08-27 2015-08-27 Electronic component conveying device and electronic component inspection device
JP2015-167518 2015-08-27
JP2015167517A JP2017044592A (en) 2015-08-27 2015-08-27 Electronic component transportation device and electronic component inspection system
JP2015-167517 2015-08-27
JP2016-014068 2016-01-28
JP2016014068A JP2017133948A (en) 2016-01-28 2016-01-28 Electronic component conveyance device and electronic component inspection device

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Application publication date: 20170308