JP2010064172A - Suction holding hand, carrying apparatus control method, carrying apparatus, and inspection apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a suction holding hand and the like, capable of being configured compactly and of smoothly switching the holding state of an IC device between non-contact holding and suction holding while maintaining the holding state. <P>SOLUTION: The suction holding hand and the like includes: a dedicated Bernoulli chuck 62a for non-contact-holding the IC device 1; a shared Bernoulli chuck 62b for selectively non-contact-holding or suction-holding the IC device 1; a dedicated tube 111a connecting the dedicated Bernoulli chuck 62a and a gas supply source 101; a shared tube connecting the shared Bernoulli chuck 62b and the gas supply source 101; a vacuum suction flow passage connecting the shared Bernoulli chuck 62b and a vacuum suction source 102; a branch on-off valve 125 inserted in a second gas supply flow passage; a vacuum on-off valve 126 inserted in the vacuum suction flow passage; and a control device 105 for controlling both on-off means 125, 126. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a suction holding hand that holds electronic components in a non-contact state by using a negative pressure generated at the center of a swirling flow, a control method for a transport device, a transport device, and an inspection device.

Conventionally, as this type of transfer device (suction holding hand), four Bernoulli nozzles that hold a thin workpiece such as a wafer in a non-contact state, four vacuum suction nozzles that hold the workpiece in a suction state, and 4 There is known a plate-like plate-like member that holds each Bernoulli nozzle and four vacuum suction nozzles so that their suction surfaces are located on the same plane (see Patent Document 1).
In this transport device, the work is picked up from the cassette, transported once to the position measurement area, where the position information of the work is acquired by the camera, and then the work is transported to the pasting area, based on the above position information, The work is pasted (dropped) on an adhesive tape provided in the pasting area.
In this case, in the conveyance of the workpiece from the pickup to the position measurement area, the four Bernoulli nozzles are operated to hold the workpiece in a non-contact manner, and the workpiece is conveyed from the acquisition of the position information in the position measurement area to the application area, and Until the lowering in the pasting area, the four vacuum suction nozzles are operated to suck and hold the workpiece, and when the last drop, the workpiece is held again in a non-contact manner. Thereby, the work is positioned with high accuracy and stuck to the adhesive tape while preventing the work from being damaged.
JP 2004-193195 A

  However, in such a conventional transport device, the Bernoulli nozzle that is held in a non-contact state and the vacuum suction nozzle that is held in a suction state are provided as dedicated nozzles, respectively, so the nozzle arrangement area is inevitably It gets bigger. For this reason, when a small workpiece is conveyed in a non-contact state, there is a problem that the holding surface of the workpiece is displaced from the suction surface of the Bernoulli nozzle due to inertia and falls. Further, if the operation of the Bernoulli nozzle and the operation of the vacuum suction nozzle are not smoothly switched, there is a possibility that the workpiece may fall at the time of switching.

  The present invention provides a suction holding hand that can be configured compactly and that can smoothly switch the holding mode between non-contact holding and suction holding while maintaining the holding state of the electronic component, and control of the conveying device It is an object of the present invention to provide a method, a transport device, and an inspection device.

  The suction holding hand of the present invention includes a plurality of dedicated Bernoulli chucks that are supplied with gas for sucking and holding electronic components in a non-contact manner with respect to the swirl flow generation chamber, and a non-contact electronic component with respect to the swirl flow generation chamber. The multiple Bernoulli chucks that selectively supply the gas for sucking and holding the gas and the suction of the gas for sucking and holding the electronic components are connected to one or more dedicated Bernoulli chucks and the other end is the gas. A first gas supply channel connected to a supply source, a second gas supply channel whose one end is connected to a plurality of combined Bernoulli chucks, and the other end connected to a gas supply source, and one end of a plurality of combined Bernoulli chucks A vacuum suction flow path connected to the vacuum suction source, a second supply flow path opening / closing means interposed in the second gas supply flow path, and a vacuum interposed in the vacuum suction flow path Channel opening and closing means; And control means for controlling the supply flow path opening and closing means and the suction flow path opening and closing means, characterized by comprising a.

  According to this configuration, the second gas supply passage is closed by the second supply passage opening / closing means, and the vacuum suction passage is opened by the suction passage opening / closing means, so that the electronic component is not contacted in the dual Bernoulli chuck. The holding form can be changed from holding to suction holding. At this time, since the electronic component is sucked and held by the dedicated Bernoulli chuck, the electronic component does not fall, and the electronic component can be strongly held after the holding form is changed. Further, from this state, the vacuum suction flow path is closed by the suction flow path opening / closing means, and the second gas supply flow path is opened by the second supply flow path opening / closing means, whereby the electronic component is changed from suction holding to non-contact holding. The holding form can be changed. At that time, since the electronic parts are sucked and held by the dedicated Bernoulli chuck, the electronic parts do not fall, and after changing the holding form, the electronic parts can be held with freedom in movement in the plane. it can. In this case, the combined Bernoulli chuck can be used for both non-contact holding and suction holding, so the suction area (installation area for both Bernoulli chucks) required for the suction of electronic components can be reduced, and the whole It can be configured as a compact. Further, when switching between non-contact holding and suction holding, the electronic component does not fall, and the electronic component holding mode can be smoothly switched between non-contact holding and suction holding.

  Another suction holding hand of the present invention includes a plurality of dedicated Bernoulli chucks to which gas for sucking and holding electronic components in a non-contact manner is supplied to the swirl flow generation chamber, and electronic components to the swirl flow generation chamber. Multiple dual-purpose Bernoulli chucks for selectively supplying gas for non-contact suction and holding and for sucking and holding electronic components, and one end connected to multiple dedicated Bernoulli chucks and the other end A first gas supply channel connected to a gas supply source, a supply / suction combined channel whose one end is connected to a plurality of dual-purpose Bernoulli chucks and the other end is connected to a gas supply source and a vacuum suction source, and a supply A flow path switching means interposed in the suction / common flow path for switching the flow path between the vacuum suction source and the gas supply source, and a control means for controlling the flow path switching means. Features provided To.

  According to this configuration, the supply / suction combined flow path connected to the gas supply source is closed by the flow path switching means, and the supply / suction combined flow path connected to the vacuum suction source is opened, whereby the combined Bernoulli In the chuck, the holding form of the electronic component can be changed from non-contact holding to suction holding. At this time, since the electronic component is sucked and held by the dedicated Bernoulli chuck, the electronic component does not fall, and the electronic component can be strongly held after the holding form is changed. Also, from this state, the supply / suction combined flow path connected to the vacuum suction source is closed by the flow path switching means, and the supply / suction shared flow path connected to the gas supply source is opened by the flow path switching means. Thus, it is possible to change the holding form of the electronic component from suction holding to non-contact holding. At that time, since the electronic parts are sucked and held by the dedicated Bernoulli chuck, the electronic parts do not fall, and after changing the holding form, the electronic parts can be held with freedom in movement in the plane. it can. In this case, the combined Bernoulli chuck can be used for both non-contact holding and suction holding, so the suction area (installation area for both Bernoulli chucks) required for the suction of electronic components can be reduced, and the whole It can be configured as a compact. Further, when switching between non-contact holding and suction holding, the electronic component does not fall, and the electronic component holding mode can be smoothly switched between non-contact holding and suction holding.

  In this case, it is preferable to further include a holder that integrally holds the plurality of dedicated Bernoulli chucks and the plurality of combined Bernoulli chucks.

  According to this configuration, a plurality of dedicated Bernoulli chucks, a plurality of dual-purpose Bernoulli chucks, and a holder are unitized, whereby a flow path or the like can be shared, and further downsizing can be promoted.

  In this case, it is preferable that a plurality of dedicated Bernoulli chucks and a plurality of dual-purpose Bernoulli chucks are arranged in a matrix on the holder in a mixed state.

  According to this configuration, it is possible to centrally arrange a plurality of dedicated Bernoulli chucks and a plurality of dual-purpose Bernoulli chucks while maintaining a balance of holding forces in non-contact holding and suction holding. Therefore, compactification can be further promoted.

  In this case, the holder includes a dedicated gas chamber dedicated to gas supply that communicates with each swirl flow generation chamber in the plurality of dedicated Bernoulli chucks, and a gas supply and gas that communicates with each swirl flow generation chamber in the plurality of combined Bernoulli chucks. It is preferable that a dual-purpose gas chamber that is also used for suction is formed.

  According to this configuration, pressure loss in gas supply and gas suction can be suppressed, and complicated routing of the flow path can be prevented.

  In this case, the plurality of dedicated Bernoulli chucks are composed of at least a pair of swirling flow different in the forward and reverse directions, and the plurality of combined Bernoulli chucks are composed of at least a pair of swirling flow different in the forward and reverse directions. It is preferable.

  According to this configuration, the electronic component is held by at least a pair of Bernoulli chucks in which the swirling direction of the swirling flow is different in the forward and reverse directions during non-contact holding. Therefore, the force in the θ direction does not act on the held electronic component, and the electronic component can be stably sucked and held in the plane.

  The control method of the transport device of the present invention includes a non-contact holding operation in which the second gas supply channel is opened and the vacuum suction channel is closed by the control unit, and the electronic component is sucked and held without contact. The second gas supply channel is “closed” and the vacuum suction channel is “open”, and the electronic component is received from the receiving unit by using the above suction holding hand for sucking and holding the electronic component. A receiving step for raising the electronic component to a position directly above the receiving portion, a moving step for horizontally moving the electronic component from a position immediately above the receiving portion to a position immediately above the receiving portion after the receiving step, and a transferring portion after the moving step. And a delivery process for delivering to the delivery unit by lowering the position directly above the transfer unit, wherein a non-contact holding operation is performed in the delivery process and the delivery process, and an adsorption maintenance is performed in the movement process. Which comprises carrying out the operation.

  In the transfer device of the present invention, the control means sets the second gas supply channel to “open” and the vacuum suction channel to “closed”, and performs non-contact holding operation for sucking and holding electronic components in a non-contact manner, and the second gas With the above suction holding hand configured to perform the suction holding operation for holding the electronic component by suction, holding the supply channel “closed” and the vacuum suction channel “open”, and the suction holding hand, A receiving operation for receiving an electronic component from the receiving unit and raising it to a position directly above the receiving unit; a moving operation for horizontally moving the electronic component from a position directly above the receiving unit to a position directly above the delivery unit after the receiving operation; And a transfer means for lowering the electronic component from the position directly above the delivery section and delivering it to the delivery section, and the control means performs a non-contact holding operation in the delivery operation and the delivery operation. , In dynamic operation, which comprises carrying out the suction holding operation.

  According to these configurations, the electronic component is held in a non-contact manner during the receiving operation (receiving step) and during the transferring operation (delivery step), so that the electronic component can be prevented from being damaged and the electronic component can be easily positioned. It can be carried out. On the other hand, during the moving operation (moving step), the electronic component is firmly sucked and held, so that the electronic component can be prevented from dropping due to inertia at the start or stop of movement. Therefore, the electronic component can be quickly conveyed while preventing damage to the electronic component.

  The control method of the transport apparatus of the present invention includes a non-contact holding operation in which electronic parts are sucked and held in a non-contact manner by switching the supply / suction flow path to a gas supply source by a control means, and a supply / suction combined use Switch the flow path to the vacuum suction source and use the above suction holding hand to perform suction holding operation to hold the electronic parts by suction, and receive the electronic parts from the receiving part and ascend to the position directly above the receiving part Receiving step, and after the receiving step, a moving step of horizontally moving the electronic component from a position directly above the receiving portion to a position directly above the transferring portion, and after the moving step, the electronic component is lowered from the position directly above the transferring portion and then transferred. And a delivery process for delivering to a section, a method for controlling a transfer device, wherein a non-contact holding operation is performed in the receiving process and the delivery process, and an adsorption holding operation is performed in the moving process And wherein the door.

  The transport device of the present invention is configured to switch the supply / suction combined flow path to a gas supply source by the control means, and to perform the non-contact holding operation for sucking and holding the electronic component in a non-contact manner, and the supply / suction combined flow path. By switching the flow path to the vacuum suction source, the suction holding operation for sucking and holding the electronic component, and the electronic component received from the receiving unit via the suction holding hand configured as described above and the suction holding hand A receiving operation for raising the position to a position directly above the receiving section, a moving operation for horizontally moving the electronic component from a position directly above the receiving section to a position directly above the receiving section after the receiving operation, and an electronic component after the moving operation A transfer means that lowers the position directly above and transfers it to the transfer section, and the control means performs a non-contact holding operation in the receiving operation and the transfer operation, and in the moving operation Which comprises carrying out the suction holding operation.

  According to these configurations, the electronic component is held in a non-contact manner during the receiving operation (receiving step) and during the transferring operation (delivery step), so that the electronic component can be prevented from being damaged and the electronic component can be easily positioned. It can be carried out. On the other hand, during the moving operation (moving step), the electronic component is firmly sucked and held, so that the electronic component can be prevented from dropping due to inertia at the start or stop of movement. Therefore, the electronic component can be quickly conveyed while preventing damage to the electronic component.

  In the inspection apparatus of the present invention, the electronic component is an IC device having a plurality of lead terminals, the receiving unit is a supply tray on which a plurality of IC devices are mounted, and the delivery unit is connected to the plurality of lead terminals. The above-mentioned transport device, which is an inspection stage for inspecting an IC device placed through a plurality of probes, is transferred from the supply tray to the inspection stage, and the IC device It is characterized by conducting an electrical inspection.

  According to this configuration, the IC device held in a non-contact manner from the supply tray can be switched to suction holding and conveyed onto the inspection stage at high speed. And after switching to non-contact holding | maintenance again, it mounts so that a lead terminal may connect with a probe. Therefore, by holding the IC device once, it is possible to carry from the supply tray to the inspection stage, so that the inspection time (cycle time) as a whole can be greatly reduced.

  Hereinafter, with reference to the accompanying drawings, an inspection apparatus to which the suction holding hand and the transfer device of the present invention are applied will be described. In this inspection apparatus, an electronic component (IC device) in which an IC chip is packaged in an SOP package is brought into an inspection stage (delivery part) from a supply tray (receiving part) by a transfer robot using a Bernoulli chuck as a chuck head. It is an electrical inspection to determine whether or not it operates normally. First, the IC device to be inspected will be described.

  As shown in FIG. 1, the IC device 1 is of a surface mount type in which an IC chip 2 is accommodated in a flat rectangular case 3, and a plurality of crank-shaped lead terminals 4 are provided on both long sides of the case 3, respectively. Are projected at equal intervals. Although the IC device 1 of the embodiment is a so-called SOP package, it can be a test target even if it is a package of another form such as QFP.

  As shown in FIG. 2, the inspection apparatus 11 includes a main apparatus for inspection in a clean room 12, and includes a component carry-in section 13 and a component carry-out section 14 provided in the clean room 12. A large number of IC devices 1 before inspection are loaded on the plurality of loading / unloading trays 15 and loaded into the component loading unit 13. On the other hand, a large number of inspected IC devices 1 are mounted on a plurality of carry-in / carry-out trays 15 and carried out from the component carry-out unit 14.

  On the material supply side of the clean room 12, a pair of hot plates 21 that are positioned near the component carry-in portion 13 and that heat the IC device 1 to the inspection temperature are disposed, and an IC handler ( The “inspection device” 22) described in the claims is provided. Further, a pair of shuttle transport mechanisms 24 each having a feed tray 23 are disposed between the pair of hot plates 21 and the IC handler 22. The pair of shuttle transport mechanisms 24 are heated by the hot plate 21. The IC devices 1 thus supplied are supplied alternately to the IC handlers 22 through the supply tray 23.

  On the other hand, a plurality of conveyor transport mechanisms 31 are provided on the material removal side of the clean room 12 so as to face the component carry-out unit 14, and the empty carry-in / carry-out tray 15 brought into the component carry-out unit 14 is used as the clean room 12. The IC device 1 after inspection is transported to the component unloading section 14 via the loading / unloading tray 15. A first transfer robot 33 is provided between the component carry-in unit 13 and the pair of hot plates 21, and a second transfer robot 34 is provided between the pair of hot plates 21 and the pair of shuttle transfer mechanisms 24. However, the third transfer robot 35 is disposed between the IC handler 22 and the material removal area 32. Further, the IC handler 22 incorporates a transport robot 37 that transports the IC device 1 between the inspection stage 36 that inspects the IC device 1 and the both shuttle transport mechanisms 24.

  The pair of hot plates 21 are alternately operated, the first transfer robot 33 transfers the IC device 1 to one hot plate 21 in the operation stop state, and the second transfer robot 34 completes heating the IC device 1. Transport is performed from one hot plate 21 to one shuttle transport mechanism 24 in a standby state. The pair of shuttle transport mechanisms 24 face the IC handler 22 alternately. In response to the inspection result of the IC handler 22, the third transfer robot 35 divides the IC device 1 into non-defective products and defective products and transfers them to the carry-in / carry-out tray 15 in the material removal area 32.

  The IC handler 22 includes an inspection stage 36 having a plurality of probes 56 for inspecting the IC device 1, and a transfer robot 37 (transfer apparatus) that transfers the IC device 1 between the inspection stage 36 and both shuttle transfer mechanisms 24. ) And a main body (not shown) with a keyboard and a display. Although details are not shown, the transfer robot 37 is of a ceiling type, and a suction holding hand 61 for sucking and holding the IC device 1 is attached to the tip of the robot arm via a chuck head (not shown). It is installed. On the other hand, a plurality of receiving grooves 41 are formed in the supply tray 23 mounted on the shuttle transport mechanism 24, and the IC device 1 is loaded with the lead terminals 4 facing downward in the receiving grooves 41. The transport robot 37 causes the suction holding hand 61 to approach the housing groove 41 from above, sucks and holds the IC device 1 in the housing groove 41, picks up the IC device 1 from the supply tray 23 in this state, and further performs inspection. The IC device 1 is moved to the top right of the stage 36 and moved downward to place the IC device 1 on the inspection stage 36.

  As shown in FIG. 3, the supply tray 23 has a plurality of receiving grooves 41 and is integrally formed. Each housing groove 41 includes an opening 42 provided so as to penetrate the central portion, a flat portion 43 provided so as to surround the opening 42, and a pair of support protrusions 44 provided outside the flat portion 43, And a pair of step portions 45 provided on the outside of each support protrusion 44. The IC device 1 is configured such that the base portions of the lead terminals 4 on both sides are supported by a pair of support protrusions 44, the main body portion is slightly lifted from the flat portion 43, and the tip portions of the lead terminals 4 on both sides are paired with a pair of steps. It is accommodated in a state slightly lifted from the portion 45.

  As shown in FIG. 4, the inspection stage 36 includes a positioning guide 52 erected on the periphery of the stage main body 51, and a central portion of the stage main body 51 that is positioned inside the positioning guide 52, and is an IC device. And a set unit 53 in which 1 is set. The positioning guide 52 is composed of a plurality of positioning guide pieces 54 formed at a total of four locations, one on each side so as to be positioned at one diagonal, and a set portion 53 where the positioning guide pieces 54 do not exist. The working air of the Bernoulli chuck 62, which will be described later, escapes from the peripheral edge of the. Each positioning guide piece 54 has a connection slope 55 that inclines from the outside to the inside of the inspection stage 36, and the lower end of the IC device 1 (the lower end of the lead terminal 4) is mounted by the connection slope 55. It is guided toward the placement position while the position is corrected so as to be the placement posture at the time of placement (see FIG. 4B). In addition, a plurality of probes 56 with which the lead terminals 4 of the set IC device 1 are brought into contact (conducted) are embedded in the set portion 53, and are set at the mounting position while being guided by the connection slope 55. The IC device 1 has its lead terminal 4 in contact with the probe 56 with high accuracy.

  The transport robot (transport device) 37 includes a suction holding hand 61 that sucks and holds the IC device 1, a robot arm that moves the IC device 1 via the suction holding hand 61, and a robot body that supports the robot arm (both not shown). ) And. Then, the transfer robot 37 operates to receive the IC device 1 from the supply tray 23, transfer it to the inspection stage 36 at high speed, and deliver it to the inspection stage 36. Although details will be described later, the suction holding hand 61 of the present embodiment is configured to be able to switch the holding state of the IC device 1 between non-contact holding and suction holding. 1 is held in a non-contact manner, and the IC device 1 is held by suction during high-speed conveyance.

  As shown in FIGS. 5 and 6, the suction holding hand 61 includes a plurality (four in the illustrated example) of Bernoulli chucks 62 for holding the IC device 1 by suction, a chuck holder 63 for holding the Bernoulli chuck 62, An apparatus mounting portion 64 for supporting the chuck holder 63. The suction holding hand 61 controls the working piping system 103 connected to the gas supply source 101 for supplying non-contacting holding air and the vacuum suction source 102 for sucking suction holding air. And a control device (control means) 105 linked to the robot controller 104 of the transfer robot 37.

  The four Bernoulli chucks 62 are all the same, but are divided by function, and two dedicated Bernoulli chucks 62a that hold the IC device 1 in a non-contact manner and the IC device 1 in a non-contact manner. It comprises two dual Bernoulli chucks 62b that are selectively held and sucked and held (details will be described later). For this reason, the gas supply source 101 communicates with the two dedicated Bernoulli chucks 62 a via the working piping system 103, and the gas supply source via the working piping system 103 communicates with the two dual-purpose Bernoulli chucks 62 b. 101 and the vacuum suction source 102 communicate selectively.

  The working piping system 103 includes a dedicated tube (first gas supply channel) 111 a used for supplying compressed air from the gas supply source 101, supply of compressed air from the gas supply source 101, and air suction to the vacuum suction source 102. A dual-purpose tube 111b. The dedicated tube 111a is for branching to connect the upstream main supply tube 112 on the gas supply source 101 side, the downstream main supply tube 113 on the chuck holder 63 side, and the upstream main supply tube 112 and the downstream main supply tube 113. And a T-shaped joint 114.

  The dual-purpose tube 111b includes a vacuum tube 121 on the vacuum suction source 102 side, a shared tube 122 on the chuck holder 63 side, a T-joint 114 for joining the vacuum tube 121 and the shared tube 122, and a T for this joining. And a branch supply tube 123 disposed between the T-shaped joint 114 and the T-shaped joint 114 for branching. The upstream main supply tube 112 is provided with a supply part opening / closing valve 124, and the branch supply tube 123 is provided with a branching part opening / closing valve 125. Further, a vacuum part opening / closing valve 126 is interposed in the vacuum tube 121.

  The supply section opening / closing valve 124, the branch section opening / closing valve 125, and the vacuum section opening / closing valve 126 are connected to the control device 105. Note that the “supply / suction combined flow path” referred to in the claims is composed of a shared tube 122, and the “flow path switching means” is composed of a branching section opening / closing valve 125 and a vacuum section opening / closing valve 126. Therefore, instead of the branch portion opening / closing valve 125 and the vacuum portion opening / closing valve 126, a three-way valve (flow path switching means) may be provided at the position of the merging T-shaped joint 114.

  When the suction holding hand 61 is actuated (during the chucking operation), the supply section opening / closing valve 124 is always “open”, and the air supplied from the gas supply source 101 through the dedicated tube 111a is the chuck holder 63. To the dedicated Bernoulli chuck 62a. In this state, when the branching part opening / closing valve 125 is set to “open” and the vacuum part opening / closing valve 126 is set to “closed”, the compressed air supplied through the branching supply tube 123 and the common tube 122 is supplied to the chuck holder 63. Is also supplied to the combined Bernoulli chuck 62b (non-contact holding operation). That is, the two dedicated Bernoulli chucks 62a and the two dual-purpose Bernoulli chucks 62b operate so as to suck and hold the IC device 1 without contact.

  On the other hand, when the supply section opening / closing valve 124 is in the “open” state, the branch section opening / closing valve 125 is set to “closed”, and the vacuum section opening / closing valve 126 is set to “open”, the shared tube 122 and the vacuum tube 121 are opened from the dual Bernoulli chuck 62b. Air is sucked into the vacuum suction source 102 through the air. That is, the two combined Bernoulli chucks 62b operate to suck and hold the IC device 1 (sucking and holding operation). In this case, compressed air is continuously supplied to the dedicated Bernoulli chuck 62a. However, since the pressure of the air flowing out from the dedicated Bernoulli chuck 62a is weak, when the dual-purpose Bernoulli chuck 62b performs a suction operation, the IC device 1 is shared. The state is sucked and held by the Bernoulli chuck 62b.

  The device attachment portion 64 is formed in a substantially cylindrical shape, and a large-diameter attachment hole 71 is formed inside the upper half portion, and a small attachment hole 72 is formed inside the lower half portion. The mounting hole 71 and the mounting hole 72 are coaxially arranged, and the mounting hole 71 functions as a part for mounting the suction holding hand 61 to the robot arm of the transport robot. It is plugged in. 5 is an upper screw hole for a set screw for attaching the suction holding hand 61 to the robot arm, and reference numeral 74 is a lower screw hole for a set screw for fixing the joint member 67. .

  The chuck holder 63 supports a holder main body (holder) 65 that directly holds the four Bernoulli chucks 62 downward, a component guide 66 that supports the holder main body 65 vertically, and supports the holder main body 65 and the component guide 66 vertically. The joint member 67 is configured to overlap on the same axis. In this case, the four Bernoulli chucks 62 and the holder main body 65 are unitized, and a component guide 66 corresponding to the IC device 1 having a different shape is combined therewith. Thereby, a flow path etc. can be shared and the Bernoulli chuck 62 and the holder main body 65 can be used as general purpose parts. The working piping system 103 is connected to the joint member 67.

  The joint member 67 includes an upper half mounting portion 81 having a small diameter and a lower half hanging portion 82 having a large diameter. The mounting portion 81 is formed with a string-like flat portion 43 against which the set screw is abutted. The mounting portion 81 is fitted into the mounting hole 72 of the device mounting portion 64, and the set screw is inserted into the lower screw hole. The joint member 67 is attached to the device mounting portion 64 by being screwed from 74.

  A dedicated tube 111a is connected to the interior of the hanging portion 82, and an “L” -shaped dedicated joint channel 91a connected to the dedicated Bernoulli chuck 62a and a dual-purpose tube 111b are connected to the dual-purpose Bernoulli chuck 62b. A continuous “L” -shaped joint joint channel 91b is formed. Further, a substantially rectangular pedestal 131 with chamfered corners protrudes from the lower end surface of the hanging portion 82, and the component guide 66 is fitted to the pedestal 131 so as to be positioned and fixed. ing.

  The dedicated joint channel 91a is composed of a dedicated vertical channel 132a drilled from the lower end surface in the axial center of the hanging portion 82 and a dedicated horizontal channel 133a drilled from the outer peripheral surface toward the upper end of the dedicated vertical channel 132a. ing. Further, the upstream end of the dedicated joint section flow path 91 a is connected to a dedicated tube 111 a that is continuous with the gas supply source 101, and the downstream end is connected to the component guide 66. The compressed air supplied through the dedicated joint portion flow path 91a is guided to the holder main body 65 and supplied from the holder main body 65 to the dedicated Bernoulli chuck 62a.

  Similarly, the dual-purpose joint section flow path 91b is drilled from the lower end surface to a position eccentric from the axial center of the hanging section 82 and from the outer peripheral surface toward the upper end section of the dual-purpose vertical flow path 132b. It is comprised from the combined horizontal flow path 133b. Further, the upstream end of the dual purpose joint channel 91 b is connected to the dual purpose tube 111 b that is connected to the gas supply source 101 and the vacuum suction source 102, and the downstream end is connected to the holder main body 65 via the component guide 66. Yes. The compressed air supplied through the dual-purpose joint channel 91b is guided to the holder main body 65 and supplied from the holder main body 65 to the dual-purpose Bernoulli chuck 62b. On the other hand, the air sucked from the dual-purpose Bernoulli chuck 62b is guided from the holder main body 65 to the vacuum suction source 102 through the dual-purpose joint portion flow path 91b.

  The component guide 66 includes a guide main body 141 formed in a substantially square thick plate shape, and a plurality (four in the drawing) guide pieces 142 projecting downward on the peripheral edge of the lower surface of the guide main body 141. It is integrally formed. Further, a seat portion 143 on which the pedestal 131 is seated is recessed in the upper surface of the component guide 66, and the pedestal 131 formed on the lower end surface of the joint member (hanging portion 82) 67 on the same axis. The seating portion 143 is engaged and fixed.

  Four guide pieces 142 are provided, one on each side so as to be positioned at one diagonal, and each guide slope 142 is provided with the respective guide slopes 144 facing inward (see FIG. 4). A square area connecting the four guide slopes 144 substantially matches the outer shape of the IC device 1, and the four guide pieces 142 correct the planar posture of the IC device 1 to a predetermined position. It comes to be sucked into. In addition, a dedicated through flow channel 151a communicating with the dedicated vertical flow channel 132a is formed at the center position (axial center position) of the component guide 66, and the above-mentioned combined vertical flow is formed at one corner portion thereof. A combined through flow path 151b communicating with the path 132b is formed. As shown in FIG. 6, the combined through-flow channel 151 b is formed in a substantially elliptical shape when viewed from the upper surface of the guide main body 141, and is formed in a circular shape when viewed from the lower surface. That is, the combined through-flow channel 151b is composed of an elliptical through-flow channel 152 whose upper half is formed in an elliptical column shape, and a circular through-hole 153 whose lower half is formed in a cylindrical shape, through which air passes. The shaft center is configured to be shifted laterally.

  The holder main body 65 includes a main body case 161 and a lid case 162 that is airtightly joined to the main body case 161. The holder main body 65 is connected to a dedicated air chamber (dedicated gas chamber) 163a connected to the dedicated Bernoulli chuck 62a and a combined Bernoulli chuck 62b. A dual-purpose air chamber (a dual-purpose gas chamber) 163b is formed. The lid case 162 is bonded so as to be fitted to a projecting frame portion 164 (see FIG. 6) provided at the peripheral edge of the main body case 161, and at the center position (axial center position), the dedicated through flow channel 151a. A dedicated introduction hole 165a that communicates with the dual-purpose through-flow channel 151b is formed at one corner. On the other hand, the main body case 161 is formed with a dedicated air groove 166a for forming the dedicated air chamber 163a and a dual-purpose air groove 166b for forming the dual-purpose air chamber 163b (see FIG. 7). .

  The main body case 161 integrally holds the Bernoulli chuck 62 so that the Bernoulli chuck 62 protrudes downward and the lower ends of the swirling flow generation chambers 181 are located in the same plane. Specifically, the main body case 161 has four substantially oval fixed mounting holes 167 formed in a matrix, and the Bernoulli chuck 62 is fitted into the fixed mounting hole from the lower side. In this way, it is bonded and fixed (see FIG. 5). Of the four Bernoulli chucks 62, the two Bernoulli chucks 62 positioned diagonally are the dedicated Bernoulli chucks 62 a having different swirling directions, and the two Bernoulli chucks positioned on the other diagonal. 62 is a dual-purpose Bernoulli chuck 62b in which the swirling direction of the swirling flow is different in the forward and reverse directions. That is, in the main body case 161, two dedicated Bernoulli chucks 62a and two dual-purpose Bernoulli chucks 62b are arranged in a matrix in a mixed state. As a result, when the holding mode of the IC device 1 is switched, a holding force due to non-contact or suction is applied evenly to the IC device 1, so that the IC device 1 can be held stably. In addition, two dedicated Bernoulli chucks 62a and two dual-purpose Bernoulli chucks 62b can be centrally arranged.

  The combined Bernoulli chuck 62b functions as the original Bernoulli chuck 62 by supplying compressed air, but functions as a simple suction collet in the case of air suction.

  Next, the Bernoulli chuck 62 will be described with reference to FIG. The Bernoulli chuck 62 is connected to a cylindrical swirling flow generation chamber 181, a suction holding surface 182 that sucks and holds the IC device 1, and an inner peripheral surface 184 of the swirling flow generation chamber 181. A pair of gas flow channels 183 that generate a swirl flow by jetting compressed air to the gas flow, and a pair of chamber flows that communicate with the upstream end of each gas jet flow channel 183 and supply compressed air from the gas supply source 101 And a path 185. The compressed air supplied from the gas supply source 101 flows into the pair of chamber flow paths 185 at the same time, and is ejected to the swirl flow generation chamber 181 through the gas ejection flow paths 183, respectively.

  The swirl flow generation chamber 181 is formed in a columnar shape with one end of the inner peripheral surface 184 closed, and a pair of gas ejection flow paths 183 are formed on the closed side of the swirl flow generation chamber 181. The compressed air that has flowed into the swirl flow generation chamber 181 flows along the inner peripheral surface 184, becomes a strong swirl flow, and eventually flows to the side from the open end. A negative pressure is generated at the center of the swirling flow according to Bernoulli's theorem, and the IC device 1 is sucked by this negative pressure.

  The suction holding surface 182 is connected to the opening side end of the swirling flow generation chamber 181 and is formed to be orthogonal to the swirling axis of the swirling flow. The swirl flow generated in the swirl flow generation chamber 181 becomes a vortex flow from the inner periphery side toward the outer periphery side along the suction holding surface 182 by the centrifugal force at the next moment when the swirl flow generation chamber 181 reaches the open end. Flow out. The gap between the IC device 1 and the suction holding surface 182 is maintained by the air flowing out on the suction holding surface 182. The swirling flow generating chamber 181 may have a bell mouth shape so that the opening end gradually expands, or a vortex-shaped groove that maintains the vortex flow may be formed on the suction holding surface 182.

  The pair of chamber flow paths 185 in the two dedicated Bernoulli chucks 62a among the Bernoulli chucks 62 thus configured communicate with the dedicated air chamber 163a, respectively, and a pair in the two dual-purpose Bernoulli chucks 62b. The chamber flow path 185 communicates with the dual-purpose air chamber 163b.

  Here, a control method of the transfer robot 37 and the suction holding hand 61 in the transfer operation of the IC device 1 that receives the IC device 1 from the supply tray 23 and transfers it to the inspection stage 36 will be described. This control method is performed by the control device 105 linked to the robot controller 104, and receives the IC device 1 from the supply tray 23 and raises it to a position directly above the supply tray 23, and the reception process. Thereafter, the IC device 1 is moved horizontally from the position immediately above the supply tray 23 to the position immediately above the inspection stage 36 (moving operation), and after the movement process, the IC device 1 is lowered from the position immediately above the inspection stage 36. And a delivery process (delivery operation) for delivery to the inspection stage 36.

  In the receiving process, the transport robot 37 lowers the suction holding hand 61, holds the IC device 1 in the suction holding hand 61, and then raises it. At that time, the suction holding hand 61 performs non-switching by switching the valve so that the branch opening / closing valve 125 is “open” and the vacuum opening / closing valve 126 is “closed” while the supply opening / closing valve 124 is “open”. Perform contact holding operation. That is, the working air flows into the dedicated Bernoulli chuck 62a and the dual-purpose Bernoulli chuck 62b, whereby the suction holding hand 61 sucks and holds the IC device 1 in a non-contact manner, and effectively prevents the IC device 1 from being damaged. can do. Further, since the suction holding hand 1 guides and holds the IC device 1 with the guide piece 142, the suction holding hand 1 can hold the IC device 1 while being positioned with respect to the Bernoulli chuck 62.

  In the moving process, the transport robot 37 transports the IC device 1 at high speed horizontally from a position directly above the supply tray 23 to a position directly above the inspection stage 36. In this high-speed conveyance, the IC device 1 is translated while maintaining its posture. At this time, the suction holding hand 61 opens the branch opening / closing valve 125 with the supply opening / closing valve 124 open. The suction holding operation is performed by switching the valve to “close” and switching the vacuum section opening / closing valve 126 to “open”. That is, although the working air is supplied to the dedicated Bernoulli chuck 62a, the air is strongly sucked from the dual-purpose Bernoulli chuck 62b. As a result, the suction holding hand 61 firmly holds the IC device 1 by suction, and can prevent the IC device 1 from dropping due to inertia at the start or stop of movement.

  In the delivery step, the transfer robot 37 lowers the IC device 1 from a position directly above the inspection stage 36 and delivers the IC device 1 to the inspection stage 36 so that the lead terminal 4 contacts the probe 56. At that time, valve switching is performed again to switch from the adsorption holding operation to the non-contact holding operation. Thereby, the IC device 1 can be delivered while being positioned with respect to the inspection stage 36.

  According to the above configuration, the dedicated Bernoulli chuck 62a and the combined Bernoulli chuck 62b are used to switch between the non-contact holding operation and the suction holding operation according to the stage of the transport operation of the IC device 1, The IC device 1 held in the positioned state can be conveyed at high speed from the material tray 23 to the inspection stage 36, and the inspection time (cycle time) as a whole can be greatly shortened. Further, since the dual-purpose Bernoulli chuck 62b can be used for both non-contact holding and suction holding, the suction area required for suction of the IC device 1 can be reduced, and the suction holding hand 1 is compact as a whole. Can be configured. In addition, the holding form of the IC device 1 can be smoothly switched between non-contact holding and suction holding.

  Although not particularly illustrated, the flow path connecting the gas supply source 101 and the Bernoulli chuck 62 and the vacuum suction flow path connecting the vacuum suction source 102 and the combined Bernoulli chuck 62b may be separate flow paths. In such a case, the dedicated tube 111a is bifurcated on the downstream side, and one is connected to the joint member 67 as a second gas supply channel. A branching part opening / closing valve 125 is provided in the second gas supply channel, and a vacuum part opening / closing valve 126 is provided in the vacuum suction passage. Further, in the component guide 66, a flow path communicating with the branched secondary dedicated tube is formed so that the downstream end is connected to the dual-purpose air chamber 163b.

It is a perspective view showing an IC device typically. It is a schematic diagram of an IC handler. It is a cross-sectional schematic diagram of a feed tray. It is a cross-sectional schematic diagram of an inspection stage. It is the disassembled perspective view which looked at the suction holding hand from diagonally downward. It is the disassembled perspective view which looked at a part of suction holding hand from diagonally upward. It is a top view of a main body case. It is an external appearance perspective view of Bernoulli chuck.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... IC device 4 ... Lead terminal 23 ... Feed tray 36 ... Inspection stage 37 ... Transfer robot 56 ... Probe 61 ... Suction holding hand 62 ... Bernoulli chuck 62a ... Dedicated Bernoulli chuck 62b ... Dual Bernoulli chuck 101 ... Gas supply source 102 ... Vacuum suction source 105 ... Control device 111a ... Dedicated tube 111b ... Double-use tube 112 ... Upstream side main supply tube 113 ... Downstream side main supply tube 122 ... Shared tube 124 ... Supply part opening / closing valve 125 ... Branch part opening / closing valve 126 ...・ Vacuum part opening / closing valve 163a ... dedicated air chamber 163b ... combined air chamber 181 ... swirl flow generating chamber

Claims (11)

A plurality of dedicated Bernoulli chucks that are supplied with gas for sucking and holding electronic components in a non-contact manner with respect to the swirl flow generation chamber;
A plurality of Bernoulli chucks for selectively supplying gas for sucking and holding the electronic component in a non-contact manner and sucking gas for sucking and holding the electronic component to the swirl flow generation chamber;
A first gas supply flow path having one end connected to the plurality of dedicated Bernoulli chucks and the other end connected to a gas supply source;
A second gas supply flow path having one end connected to the plurality of combined Bernoulli chucks and the other end connected to the gas supply source;
A vacuum suction flow path having one end connected to the plurality of combined Bernoulli chucks and the other end connected to a vacuum suction source;
Second supply flow path opening / closing means interposed in the second gas supply flow path;
A suction channel opening and closing means interposed in the vacuum suction channel;
A suction holding hand comprising: the second supply flow path opening / closing means and the control means for controlling the suction flow path opening / closing means. A plurality of dedicated Bernoulli chucks that are supplied with gas for sucking and holding electronic components in a non-contact manner with respect to the swirl flow generation chamber;
A plurality of Bernoulli chucks for selectively supplying gas for sucking and holding the electronic component in a non-contact manner and sucking gas for sucking and holding the electronic component to the swirl flow generation chamber;
A first gas supply flow path having one end connected to the plurality of dedicated Bernoulli chucks and the other end connected to a gas supply source;
A supply / suction combined flow path having one end connected to the plurality of combined Bernoulli chucks and the other end connected to the gas supply source and the vacuum suction source;
A flow path switching means that is interposed in the supply / suction combined flow path and switches the supply / suction shared flow path between the vacuum suction source and the gas supply source;
And a control means for controlling the flow path switching means.   The suction holding hand according to claim 1, further comprising a holder that integrally holds the plurality of dedicated Bernoulli chucks and the plurality of combined Bernoulli chucks.   The suction holding hand according to claim 3, wherein the plurality of dedicated Bernoulli chucks and the plurality of dual-purpose Bernoulli chucks are arranged in a matrix in the holder. In the holder, a dedicated gas chamber dedicated to gas supply communicating with each of the swirl flow generating chambers in the plurality of dedicated Bernoulli chucks,
The suction holding hand according to claim 3 or 4, wherein a gas supply and gas suction combined use gas chamber communicating with each of the swirl flow generation chambers in the plurality of combined Bernoulli chucks is formed. . The plurality of dedicated Bernoulli chucks are composed of at least a pair of different swirling directions of the swirl flow, forward and reverse,
The suction holding hand according to any one of claims 1 to 5, wherein the plurality of dual-purpose Bernoulli chucks are configured by at least a pair of different swirling directions. The control means sets the second gas supply flow path to “open” and the vacuum suction flow path to “closed” to perform non-contact holding operation for sucking and holding the electronic component in a non-contact manner; and the second gas supply flow The suction holding hand according to claim 1, wherein the suction holding operation for sucking and holding the electronic component is performed by setting the path to “closed” and the vacuum suction flow path to “open”.
A receiving step of receiving the electronic component from the receiving portion and raising it to a position directly above the receiving portion; and a moving step of horizontally moving the electronic component from a position immediately above the receiving portion to a position directly above the delivery portion after the receiving step. And, after the moving step, a transfer step of lowering the electronic component from a position directly above the transfer unit and transferring the electronic component to the transfer unit,
In the receiving step and the delivery step, the non-contact holding operation is performed,
In the moving step, the suction holding operation is performed. The control means switches the supply / suction flow path to the gas supply source to perform non-contact holding operation for sucking and holding the electronic component in a non-contact manner, and the supply / suction flow path is the vacuum. The suction holding hand according to claim 2, wherein the suction holding operation is performed by switching the flow path to a suction source and sucking and holding the electronic component.
A receiving step of receiving the electronic component from the receiving portion and raising it to a position directly above the receiving portion; and a moving step of horizontally moving the electronic component from a position immediately above the receiving portion to a position directly above the delivery portion after the receiving step. And, after the moving step, a transfer step of lowering the electronic component from a position directly above the transfer unit and transferring the electronic component to the transfer unit,
In the receiving step and the delivery step, the non-contact holding operation is performed,
In the moving step, the suction holding operation is performed. The control means sets the second gas supply flow path to “open” and the vacuum suction flow path to “closed” to perform non-contact holding operation for sucking and holding the electronic component in a non-contact manner; and the second gas supply flow The suction holding hand according to claim 1, wherein the suction holding operation configured to suction and hold the electronic component by setting the path to “closed” and the vacuum suction flow path to “open”;
A receiving operation for receiving the electronic component from the receiving portion via the suction holding hand and raising the electronic component to a position directly above the receiving portion; and after the receiving operation, the electronic component is moved from a position directly above the receiving portion to the delivery portion. A transfer unit that horizontally moves to a position immediately above, and a transfer unit that lowers the electronic component from a position directly above the transfer unit and transfers the electronic component to the transfer unit after the move operation, and
The control means performs the non-contact holding operation in the receiving operation and the delivery operation,
In the moving operation, the suction holding operation is performed. The control means switches the supply / suction flow path to the gas supply source to perform non-contact holding operation for sucking and holding the electronic component in a non-contact manner, and the supply / suction flow path is the vacuum. The suction holding hand according to claim 2, wherein the suction holding operation for switching the flow path to a suction source and sucking and holding the electronic component is possible.
A receiving operation for receiving the electronic component from the receiving portion via the suction holding hand and raising the electronic component to a position directly above the receiving portion; and after the receiving operation, the electronic component is moved from a position directly above the receiving portion to the delivery portion. A transfer unit that horizontally moves to a position immediately above, and a transfer unit that lowers the electronic component from a position directly above the transfer unit and transfers the electronic component to the transfer unit after the move operation, and
The control means performs the non-contact holding operation in the receiving operation and the delivery operation,
In the moving operation, the suction holding operation is performed. The electronic component is an IC device having a plurality of lead terminals, the receiving unit is a supply tray on which the plurality of IC devices are mounted, and the delivery unit is a plurality of terminals to which the plurality of lead terminals are connected. It is an inspection stage for inspecting the IC device placed via the plurality of probes, comprising the transport apparatus according to claim 9 or 10,
An inspection apparatus, wherein the IC device is transferred from the supply tray to the inspection stage to perform an electrical inspection of the IC device.

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