JP2017044593A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2017044593A5 JP2017044593A5 JP2015167518A JP2015167518A JP2017044593A5 JP 2017044593 A5 JP2017044593 A5 JP 2017044593A5 JP 2015167518 A JP2015167518 A JP 2015167518A JP 2015167518 A JP2015167518 A JP 2015167518A JP 2017044593 A5 JP2017044593 A5 JP 2017044593A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- cooling
- heating
- conveying apparatus
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims 9
- 238000010438 heat treatment Methods 0.000 claims 7
- 239000012530 fluid Substances 0.000 claims 1
- 238000007689 inspection Methods 0.000 claims 1
- 239000003507 refrigerant Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Claims (8)
前記電子部品載置部材が載置され、前記電子部品を冷却する冷却部材と、
前記電子部品を加熱する加熱部材と、を有し、
前記冷却部材は、前記電子部品載置部材と前記加熱部材との間に配置される電子部品搬送装置。
An electronic component placement member on which the electronic component is placed;
Wherein the electronic component mounting member is placed, and a cooling member for cooling the electronic components,
A heating member for heating the electronic component,
It said cooling member, said to be electronic component conveying device disposed between the electronic component mounting member and the heating member.
The cooling member, the electronic component transporting apparatus according to comprised claim 1 in the first member and the second member.
前記溝は、前記第１部材に設けられる請求項２に記載の電子部品搬送装置。
The cooling member has a groove through which the refrigerant flows,
The electronic component conveying apparatus according to claim 2, wherein the groove is provided in the first member.
Electronic component conveying apparatus according to claim 3 in which the sealing member is disposed between the first member and the second member.
5. The electronic component conveying apparatus according to claim 2, wherein the second member is disposed between the first member and the heating member.
The thickness of the said 2nd member is an electronic component conveying apparatus of any one of Claim 2 thru | or 5 thicker than the thickness of the said 1st member.
The electronic component conveying apparatus according to claim 1, wherein the cooling member is cooled by a fluid.
前記電子部品載置部材が載置され、前記電子部品を冷却する冷却部材と、
前記電子部品を加熱する加熱部材と、
前記電子部品を検査する検査部と、を有し、
前記冷却部材は、前記電子部品載置部材と前記加熱部材との間に配置される電子部品検査装置。 An electronic component placement member on which the electronic component is placed;
Wherein the electronic component mounting member is placed, and a cooling member for cooling the electronic components,
A heating member for heating the electronic component;
An inspection unit for inspecting the electronic component,
It said cooling member, said to be electronic component inspecting device arranged between the electronic component mounting member and the heating member.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015167518A JP6597059B2 (en) | 2015-08-27 | 2015-08-27 | Electronic component conveying device and electronic component inspection device |
| TW105127119A TWI600911B (en) | 2015-08-27 | 2016-08-24 | Electronic parts conveying apparatus and electronic parts inspection apparatus |
| CN201610726317.2A CN106483440A (en) | 2015-08-27 | 2016-08-25 | Electronic component conveying device and electronic component inspection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015167518A JP6597059B2 (en) | 2015-08-27 | 2015-08-27 | Electronic component conveying device and electronic component inspection device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017044593A JP2017044593A (en) | 2017-03-02 |
| JP2017044593A5 true JP2017044593A5 (en) | 2018-09-13 |
| JP6597059B2 JP6597059B2 (en) | 2019-10-30 |
Family
ID=58209757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015167518A Expired - Fee Related JP6597059B2 (en) | 2015-08-27 | 2015-08-27 | Electronic component conveying device and electronic component inspection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6597059B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6336163B1 (en) | 2017-03-09 | 2018-06-06 | 株式会社アマダホールディングス | Cooling water supply system and cooling water supply method for laser processing head |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01163570A (en) * | 1987-12-17 | 1989-06-27 | Kobe Steel Ltd | Low-temperature test apparatus for ic device |
| US6668570B2 (en) * | 2001-05-31 | 2003-12-30 | Kryotech, Inc. | Apparatus and method for controlling the temperature of an electronic device under test |
| KR100436657B1 (en) * | 2001-12-17 | 2004-06-22 | 미래산업 주식회사 | Apparatus for heating and cooling semiconductor in handler for testing semiconductor |
| JP2007248317A (en) * | 2006-03-17 | 2007-09-27 | Sumitomo Electric Ind Ltd | Heating and cooling module |
| JP6236957B2 (en) * | 2013-07-23 | 2017-11-29 | セイコーエプソン株式会社 | Electronic component conveying device, electronic component inspection device, and cooling system |
-
2015
- 2015-08-27 JP JP2015167518A patent/JP6597059B2/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| IL273104A (en) | Heat sink, heat sink arrangement and module for liquid immersion cooling | |
| EP3213612A4 (en) | A mounting apparatus, for mounting at least one heat dissipating electrical device, optionally including a heat sink body for solid, gas and fluid heat exchange, and circuit board assembly providing interface between circuits | |
| HK1249608A1 (en) | Content creation using electronic input device on non-electronic surfaces | |
| KR20180084893A (en) | Magnetic calorie heat pump, cooling device and operating method thereof | |
| EP3531811A4 (en) | Heat dissipation panel, heat dissipation device and electronic apparatus | |
| EP3512318A4 (en) | Heat dissipation structure for electronic device, and electronic device | |
| EP3141094A4 (en) | Heat dissipating apparatus and electronic device having the same | |
| WO2014145293A3 (en) | Thermoelectric device | |
| DK3384364T3 (en) | FLUID COOLING SYSTEM AND PROCEDURE FOR ELECTRONIC EQUIPMENT | |
| KR20180084819A (en) | A semiconductor device, a display device having the semiconductor device, and an electronic device having the semiconductor device | |
| EP3558562A4 (en) | Integrated casting core-shell structure for making cast component with cooling holes in inaccessible locations | |
| EP3255358A4 (en) | Heat exchange apparatus and semi-conductor cooling refrigerator provided with same | |
| EP3717777A4 (en) | Scroll type device having liquid cooling through idler shafts | |
| PT3339023T (en) | Laminate, method for manufacturing the laminate, semiconductor device, and method for manufacturing the semiconductor device | |
| TWI562192B (en) | Substrate liquid processing device and flow abnormality detection method | |
| GB2563144B (en) | Plate-type heat transport device, electronic device, and method for manufacturing plate-type heat transport device | |
| GB201917022D0 (en) | Cooling arrangements in device or components with windings | |
| GB2565486B (en) | Heat exchanger and refrigeration cycle apparatus | |
| WO2016196929A3 (en) | Micro-hoses for integrated circuit and device level cooling | |
| SG11201702359PA (en) | Refrigerant intermediary device, cooling device including the same, and cooling method | |
| EP3144623A3 (en) | Heat exchanger and cooling system for generator electronics cooling | |
| SG11201603436RA (en) | A sheet for exchange of heat or mass transfer between fluid flows, a device comprising such a sheet, and a method of manufacturing the sheet | |
| GB2515378B (en) | Evaporative cooler apparatus and method for evaporative cooling | |
| PL3397782T3 (en) | Device for treating metal workpieces with cooling gas | |
| GB201507792D0 (en) | Fluid flow device on a porous substrate and method for making the same |