SG11201702359PA - Refrigerant intermediary device, cooling device including the same, and cooling method - Google Patents

Refrigerant intermediary device, cooling device including the same, and cooling method

Info

Publication number
SG11201702359PA
SG11201702359PA SG11201702359PA SG11201702359PA SG11201702359PA SG 11201702359P A SG11201702359P A SG 11201702359PA SG 11201702359P A SG11201702359P A SG 11201702359PA SG 11201702359P A SG11201702359P A SG 11201702359PA SG 11201702359P A SG11201702359P A SG 11201702359PA
Authority
SG
Singapore
Prior art keywords
cooling
refrigerant
same
device including
cooling method
Prior art date
Application number
SG11201702359PA
Inventor
Arihiro Matsunaga
Masanori Sato
Akira Shoujiguchi
Masaki Chiba
Minoru Yoshikawa
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Publication of SG11201702359PA publication Critical patent/SG11201702359PA/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0258—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with means to remove contaminants, e.g. getters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D19/00—Degasification of liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00—Fluid-circulation arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B43/00—Arrangements for separating or purifying gases or liquids; Arrangements for vaporising the residuum of liquid refrigerant, e.g. by heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
SG11201702359PA 2014-09-26 2015-09-15 Refrigerant intermediary device, cooling device including the same, and cooling method SG11201702359PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014196362 2014-09-26
PCT/JP2015/004698 WO2016047098A1 (en) 2014-09-26 2015-09-15 Refrigerant relay device, cooling device using same, and cooling method

Publications (1)

Publication Number Publication Date
SG11201702359PA true SG11201702359PA (en) 2017-04-27

Family

ID=55580648

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201702359PA SG11201702359PA (en) 2014-09-26 2015-09-15 Refrigerant intermediary device, cooling device including the same, and cooling method

Country Status (6)

Country Link
US (1) US20170303432A1 (en)
EP (1) EP3199897A4 (en)
JP (1) JP6604330B2 (en)
CN (1) CN107076522A (en)
SG (1) SG11201702359PA (en)
WO (1) WO2016047098A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6904704B2 (en) * 2014-08-27 2021-07-21 日本電気株式会社 Phase change cooling device and phase change cooling method
US10677536B2 (en) * 2015-12-04 2020-06-09 Teledyne Scientific & Imaging, Llc Osmotic transport system for evaporative cooling
WO2018164084A1 (en) * 2017-03-08 2018-09-13 Ｎｅｃプラットフォームズ株式会社 Cooling device and gas-liquid separation tank
WO2018164085A1 (en) * 2017-03-08 2018-09-13 Ｎｅｃプラットフォームズ株式会社 Cooling device and gas-liquid separation tank
JP6424936B1 (en) * 2017-10-04 2018-11-21 日本電気株式会社 Gas-liquid separation device, rear door, cooling device, and gas-liquid separation method
JP6579633B2 (en) * 2017-10-20 2019-09-25 Ｎｅｃプラットフォームズ株式会社 apparatus
US10907910B2 (en) * 2018-01-19 2021-02-02 Asia Vital Components Co., Ltd Vapor-liquid phase fluid heat transfer module
JP7251070B2 (en) * 2018-08-03 2023-04-04 いすゞ自動車株式会社 cooling system
CN109631433A (en) * 2018-12-07 2019-04-16 珠海格力电器股份有限公司 A kind of separator
JP6756020B1 (en) * 2019-08-20 2020-09-16 株式会社フジクラ Cooling system
US11477913B2 (en) * 2021-01-07 2022-10-18 Baidu Usa Llc Integrating thermal storage system in electronics cooling

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4331200A (en) * 1979-12-26 1982-05-25 Hughes Aircraft Company Passive flow mixing for osmotically pumped heat pipes
JP2841975B2 (en) * 1991-11-08 1998-12-24 松下電器産業株式会社 Heat exchanger
US5444987A (en) * 1993-07-02 1995-08-29 Alsenz; Richard H. Refrigeration system utilizing a jet enthalpy compressor for elevating the suction line pressure
US5507858A (en) * 1994-09-26 1996-04-16 Ohio University Liquid/gas separator and slug flow eliminator and process for use
DE19944189C1 (en) * 1999-09-15 2001-04-05 Bosch Gmbh Robert Device for separating gas and liquid from a gas / liquid mixture flowing in a line and method for separating the same
JP2003240385A (en) * 2002-02-19 2003-08-27 Daikin Ind Ltd Air-conditioner
US8611083B2 (en) * 2007-11-28 2013-12-17 Hewlett-Packard Development Company, L.P. System and method for cooling a computer
NO346524B1 (en) * 2008-09-24 2022-09-19 Equinor Energy As Gas liquid separator
CN101814469A (en) * 2009-02-20 2010-08-25 王玉富 Gravity circulation evaporation cooling semiconductor power device package
AU2010266750B2 (en) * 2009-06-29 2013-04-18 John Bean Technologies Ab Device and method for providing additional head to support a refrigeration liquid feed system
US9727101B2 (en) * 2010-03-30 2017-08-08 Nec Corporation Cooling apparatus and cooling system for electronic-device exhaustion
JP5589666B2 (en) * 2010-08-18 2014-09-17 富士通株式会社 Semiconductor device
TWI404904B (en) * 2010-11-19 2013-08-11 Inventec Corp Separable liquid-cooling heat-dissipation module
JP2013130332A (en) * 2011-12-21 2013-07-04 Toshiba Corp Bubble-driven cooling device
US9958519B2 (en) * 2011-12-22 2018-05-01 General Electric Company Thermosiphon cooling for a magnet imaging system
US9459031B2 (en) * 2012-02-14 2016-10-04 Nec Corporation Cooling apparatus and cooling system

Also Published As

Publication number Publication date
CN107076522A (en) 2017-08-18
WO2016047098A1 (en) 2016-03-31
JPWO2016047098A1 (en) 2017-07-20
JP6604330B2 (en) 2019-11-13
EP3199897A1 (en) 2017-08-02
EP3199897A4 (en) 2018-05-23
US20170303432A1 (en) 2017-10-19

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