CN101814469A - Gravity circulation evaporation cooling semiconductor power device package - Google Patents
Gravity circulation evaporation cooling semiconductor power device package Download PDFInfo
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- CN101814469A CN101814469A CN 200910009142 CN200910009142A CN101814469A CN 101814469 A CN101814469 A CN 101814469A CN 200910009142 CN200910009142 CN 200910009142 CN 200910009142 A CN200910009142 A CN 200910009142A CN 101814469 A CN101814469 A CN 101814469A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
The invention discloses a gravity circulation evaporation cooling semiconductor power device package, which is characterized by comprising a plate metal mounting platform; a tubular metal is integrally configured on the plate metal mounting platform to form an evaporation chamber with the plate metal mounting platform; a semiconductor power device die is welded on the lower surface of the plate metal mounting platform; and output and control leads which are led out of the mounting platform and the semiconductor power device die are fixed under the package by using resins and plastics.
Description
Technical field
The invention belongs to the semiconductor power device encapsulation field, be specifically related to a kind of gravity circulation evaporation cooling semiconductor power device encapsulation.
Background technology
Modern power electronics technology based on semiconductor power device, microelectronics and computer technology is the core and the key of energy-saving and emission-reduction, exploitation green energy resource.And semiconductor power device gets electrical characteristics and thermal characteristics is the core of core, crucial key.On the one hand the mankind that are applied as of semiconductor power device have saved a large amount of energy, in addition unavoidable thermal effect and to cause losing efficacy be the main cause that each quasi-converter damages in its course of work of aspect.The working temperature of most of semiconductor power device optimization is below 50 ℃, and a lot of devices just were easy to lose efficacy in time more than 75 ℃.Therefore, will reduce the loss of device on the one hand, for example technology such as conduction voltage drop device, soft switch are hanged down in development at a high speed, will improve the heat dispersion of device simultaneously, and are indispensable.
The heat radiation of power device mainly contains air cooling, three kinds of modes of water cooling and evaporative cooling.Along with the close increase of power, dynamical evaporative cooling more and more causes people's attention in recent years, has carried out a large amount of research.Disclose separately as Chinese patent 200320102854.8 and CN1851908A and to have related to the semiconductor power device evaporation-cooled device, be made up of the evaporative cooling for heat radiation device and the condenser that are used for installing device, power semiconductor is the outer panel that base that power electronic device is used for distribute heat is installed in the evaporative cooling for heat radiation device.The encapsulation of semiconductor power device mainly contains two kinds of patterns, i.e. the power model that contacts with the metal heat transfer base plate by insulation such as potteries of the plastic packaging single tube of single die and metal heat transfer base plate Direct Bonding and multitube core.Because the semiconductor power device heating has very high power density, the contact condition of device and radiator, promptly the evenness of contact-making surface and pressure size have very big influence to thermal resistance.The module heat by tube core to radiator at least through the combination interface of two insulators and metal, an intermetallic pressing interface, do not consider that electric insulation also will be through an intermetallic pressing interface, this has not only increased thermal resistance greatly, and has brought very big technology uncertainty.Have document statistics to point out, the bad power device that causes of heat conduction lost efficacy for accounting for more than 50% of total failure rate due to the assembly problem.
The printed circuit board (PCB) assembling is because its many-sided superiority makes it become the mode of production that electronic product has absolute predominance.Semiconductor power device in the major loop of various converters and heat abstractor thereof become the biggest obstacle of printed circuit board (PCB) assembling.The terminal line fit of tradition electromechanical equipment is not only bad for large batch of industrial production, and since between power model and filter capacitor stray inductance big, make module impacted by overvoltage.Chinese patent CN2409612Y discloses a kind of heat-pipe radiating apparatus of semiconductor power device, solves the heat radiation of device preferably, but makes it to be unfavorable for more the printed board assembling.
Summary of the invention
The object of the present invention is to provide a kind of gravity circulating and evaporating cooling technology scheme, make the encapsulation of semiconductor power device not only have better thermal conduction characteristic, and be suitable for the printed board assembling.
In order to solve these problems of the prior art, technical scheme provided by the invention is as follows:
A kind of gravity circulation evaporation cooling semiconductor power device encapsulation, it is characterized in that described semiconductor power device wrapper rubbing board shape metal mounting platform, the top integrated configuration tubular metal of described plate-shape metal mounting platform, constitute vaporization chamber with described plate-shape metal mounting platform, the semiconductor power device tube core is welded in the lower surface of described plate-shape metal mounting platform, the output that will draw by described mounting platform and semiconductor power device tube core with resin or plastics and control lead-in wire be fixed in encapsulation below.Vaporization chamber is made by the metal of good heat conductivity, preferably copper or copper alloy.
Described tubular metal stretches out the upper surface of sealing material, and at upper end configuration hose coupling.Select refrigerant for use, realize the electric insulation of power device by compatible with it plastic flexible pipe with good electrical insulation property.
Between several sometimes semiconductor power devices, 4 of single-phase rectification bridge diodes for example, 6 diodes of three-phase bridge, two IGBT of brachium pontis have electrical communication closely, suitable one encapsulation.Described semiconductor power device encapsulation then comprises a plurality of top integrated plate-shape metal mounting platforms that dispose tubular metal, the semiconductor power device tube core all is welded below each described metal mounting platform, all described tubular metal cavitys are connected by the seal channel of electric insulation, dispose the output channel that communicates with the peak of described seal channel on the upper surface or the top of encapsulation.Because encapsulation itself has solved the Insulation Problems of tube core, described output channel outer end can be provided with flexible pipe or copper pipe joint.
The cold coal latent heat of vaporization commonly used can reach every gram 200-300 card, has very strong thermal heat transfer capability, and one is not very thick pipeline, 4-12mm preferably, when the caloric value of power device can satisfy when not being very big steam bubble up with the descending requirement of liquid.When the caloric value of power device is very big, the up and descending pipeline of liquid of gas can be set respectively.
Whole cooling system also should include condenser, and condenser should be higher than all vaporization chambers, and when condenser and evaporator distance was far away, system also should be provided with vapor-liquid separation chamber.Vapor-liquid separation chamber should try one's best near vaporization chamber, so that form net gas by vaporization chamber up steam bubble or steam water two phase flow separation, very little pressure can reach very high speed, to such an extent as near sonic limit.
Beneficial effect of the present invention
Technical solution of the present invention adopts gravity circulating and evaporating cooling principle to carry out the semiconductor power device encapsulation of heat dissipation design, structurally, the evaporation-cooled device of technical scheme of the present invention adopts the inside of vaporization chamber at device, semiconductor element directly is welded on vaporization chamber, has realized best heat transmission.The further miniaturization of device, the printed board that is more conducive to electronic product on the structure is assembled.
Description of drawings
Below in conjunction with drawings and Examples the present invention is further described:
Fig. 1 is the structural representation of embodiment of the invention gravity circulation evaporation cooling semiconductor power device encapsulation;
Fig. 2 cools off a plurality of semiconductor power device tube core one encapsulation schematic diagrames for embodiment of the invention gravity circulating and evaporating;
Fig. 3 cools off a plurality of semiconductor power device tube core one encapsulation for embodiment of the invention gravity circulating and evaporating, and has the descending pipeline of the cold coal of liquid and the stream-liquid two-phase flow up-hill line schematic diagram of separation;
The embodiment of Fig. 4 is for to be assemblied in the printed board by a plurality of gravity circulation evaporation cooling semiconductor power device packaged device of the present invention, with the evaporative cooling changer system connection diagram of circulating line, vapor-liquid separation chamber, condenser formation;
Wherein, among Fig. 1,1 is packed semiconductor power device tube core, 2 is the plate-shape metal mounting platform, and shape can be round, also can be square, 3 are and the incorporate tubular metal of metal mounting platform, for well, 4 is the lead-out wire that links to each other with tube core to cross section with circle, and 5 is the lead-out wire that links to each other with mounting platform, 6 and 7 is the control lead-out wire of device, 8 is potting resin or plastics, and 9 is hose coupling, and 10 is flexible pipe.Among Fig. 2,11 is packed semiconductor power device tube core, 12 is another packed semiconductor power device tube core, 21 is the plate-shape metal mounting platform of semiconductor power device tube core 11,31 be semiconductor power device tube core 11 with the incorporate tubular metal of metal mounting platform, 22 is the plate-shape metal mounting platform of semiconductor power device tube core 12,32 be semiconductor power device tube core 12 with metal mounting platform 21 incorporate tubular metals, 4 is the lead-out wire that links to each other with tube core 12,5 is the lead-out wire that links to each other with mounting platform 21,54 is the interconnector of tube core 11 and mounting platform 22,61,71,62,72 is the control lead-out wire of device, 8 is potting resin or plastics, 81 are the connection tubular metal 31 that is made of potting resin or plastics and 32 passage, 83 is the output channel of passage 81, and 9 is flexible pipe or copper pipe joint, and 10 is flexible pipe or copper pipe.Among Fig. 3,11,12,13 is packed semiconductor power device tube core, 21,22,23 are respectively semiconductor power device tube core 11,12,13 plate-shape metal mounting platform, 31,32,33 are respectively semiconductor power device tube core 11,12,13 metal mounting platform 21,22,23 incorporate tubular metals, 4 are and tube core 11,12,13 lead-out wires that link to each other, 51,52,53 for respectively with mounting platform 21,22,23 interconnectors that link to each other, 61,71,62,72,63,73 is the control lead-out wire of device, 8 is potting resin or plastics, 81 is the connection tubular metal 31 that is made of potting resin or plastics, 32 and 33 passage, 83 is the output channel of passage 81,91,93,92,94 is flexible pipe or copper pipe joint, 95 is the stream-liquid two-phase flow up-hill line, 96 is the descending pipeline of cold coal liquid, 82 is vapor-liquid separation chamber, 85 is the stream-liquid two-phase flow inlet of vapor-liquid separation chamber, 86 is the cold coal liquid outlet of vapor-liquid separation chamber, 84 is the cold coal liquid inlet of vapor-liquid separation chamber, and 88 is the gas outlet of vapor-liquid separation chamber.Among Fig. 4 11,12,13,14 is the power device of gravity circulation evaporation cooling semiconductor power package of the present invention, 66 are printed board, 41 is vapor-liquid separation chamber, 51 is condenser, 21 is by the RL road of vapor-liquid separation chamber to semiconductor power device, 23 is cold coal perfusing hole, 31 is by the stream-liquid two-phase flow pipeline of semiconductor power device to vapor-liquid separation chamber, 22 is by the RL road of condenser to vapor-liquid separation chamber, 32 is that 401 is the liquid level observation window by the cold coal gas pipeline of vapor-liquid separation chamber to condenser, and 33 is residual air, the steam floss hole, 502 for condenser divides steam pipe, and 501 is the condenser collector tube.
Embodiment
For the technical scheme of more detailed statement foregoing invention, the following inventor lists specific embodiment and comes the explanation technology; It is emphasized that these embodiment are used to the present invention is described and do not limit the scope of the invention.
The encapsulation of embodiment 1 singulated dies gravity circulation evaporation cooling semiconductor power device.
As shown in Figure 1, this gravity circulation evaporation cooling semiconductor power device encapsulation comprises packed semiconductor power device tube core 1, plate-shape metal mounting platform 2, tubular metal 3, lead-out wire 4,5, the control lead-out wire 6,7 of device, potting resin or plastics 8, hose coupling 9, flexible pipe 10.Plate-shape metal mounting platform 2 and tubular metal 3 should be selected the good metal of thermal conductivity for use, and the alloy of preferably copper or copper, plate-shape metal mounting platform 2 be down, and tubular metal 3 is last, integrally casting or integrally welded formation vaporization chamber.Semiconductor power device tube core 1 is welded in the lower surface of plate-shape metal mounting platform 2, and the heat of its generation directly heats the cold coal in the tubular metal 3 above it by plate-shape metal mounting platform 2 during work, makes it evaporator strip and walks heat.Lead-out wire 4,5, the control lead-out wire 6,7 of device, be fixed in the same plane, bottom of encapsulation by potting resin or plastics 8, make things convenient for the assembling of power device to printed board, tubular metal 3 stretches out the upper surface of sealing material, and the upper end is furnished with hose coupling 9, and assembled hose 10, gas by flexible pipe 10 evaporations is up, and cold coal liquid is descending, has realized good heat transmission when guaranteeing electric insulation.
Several semiconductor power device tube cores, 4 of single-phase rectification bridge diodes for example, 6 diodes of three-phase bridge, two IGBT of brachium pontis have electrical communication closely, suitable one encapsulation.As shown in Figure 2, described semiconductor power device encapsulation comprises a plurality of integrated tubular metals (31 that dispose, 32) plate-shape metal mounting platform 21,22, semiconductor power device tube core 11 all is welded below each described metal mounting platform, 12, tubular metal cavity 31,32 is communicated with by the passage 81 that the sealing resin or the plastics 8 of electric insulation constitute, at the top of passage configuration output channel 83, since pipeline 83 with the semiconductor element electric insulation, the pipe joint 9 and the pipeline 10 of its upper end can be hose coupling and flexible pipe, also can be copper pipe joint and copper pipe.Interconnector 54 is used to realize two electrical connections between tube core.Electrical output lead 4,5 and device control lead-out wire 61,71,62,72 place the bottom of encapsulation.
If when the caloric value of semiconductor power device was very big, the cold coal liquid down pipe that separation is set more helped thermal cycle.As shown in Figure 3, described semiconductor power device encapsulation comprises a plurality of integrated tubular metals (31 that dispose, 32,33) plate-shape metal mounting platform 21,22,23, semiconductor power device tube core (11 all is welded below each described metal mounting platform, 12,13), except the peak configuration output channel 83 of the passage 81 that constitutes at sealing resin or plastics 8 and, also the minimum point at passage 81 disposes input channel 87; Output channel 83, flexible pipe or copper pipe joint 91,93, flexible pipe or copper pipe 95, pipeline 85 constitutes the stream-liquid two-phase flow up-hill lines jointly, passes to the top of vapor-liquid separation chamber; Flexible pipe or copper pipe joint 92,94, flexible pipe or copper pipe 96, pipeline 86,87 constitutes the descending pipeline of liquid jointly, is connected to the bottom of passage 81 by the bottom of vapor-liquid separation chamber.
Embodiment shown in Figure 4 is a gravity circulating and evaporating cooling power electronic converter system, the power device 11,12,13,14 that comprises gravity circulation evaporation cooling semiconductor power device encapsulation of the present invention, printed board 66, vapor-liquid separation chamber 41, condenser 51, descending pipeline 21 of cold coal liquid between power device 11,12,13,14 and the vapor-liquid separation chamber 41 and stream-liquid two-phase flow up-hill line 31, cold coal gas pipeline up-hill line 32 between vapor-liquid separation chamber 41 and the condenser 51 and the descending pipeline 22 of cold coal liquid.The heat that produces during power device 11,12,13,14 work forms stream-liquid two-phase flow with the cold coal evaporation of its inside, collects and be sent to vapor-liquid separation chamber 41 by up-hill line 31.The net gas that vapor-liquid separation forms in vapor-liquid separation chamber 41 is delivered to condenser 51 through cold coal gas pipeline up-hill line 32.In condenser 51, cold coal gas is emitted heat and is converted into liquid, collected by condenser collector tube 501, deliver to vapor-liquid separation chamber 41 through the descending pipeline 22 of cold coal liquid, the cold coal liquid in the vapor-liquid separation chamber 41 is distributed to semiconductor power device 11,12,13,14 through descending pipeline 21.23 is cold coal perfusing hole, and cold coal was by perfusing hole 23 perfusions when system initialization maybe need replenish.401 is the liquid level observation window, and normal liquid level is advisable to 2/3 at 1/2 of vapor-liquid separation chamber's 41 height.33 is residual air, steam floss hole, and suitable selection work pressure is greater than the refrigerant of atmospheric pressure, and during system initialization, original air is compressed in the system, discharges thus.
By transpiration-cooled method, adopt gravity circulation theory advantages of simplicity and high efficiency that the heat of various high power semi-conductor power devices is directly derived, encapsulating structure has not only solved the technical barrier of heat radiation, and has reduced volume, weight, makes it to be adapted to the printed board assembling.Those of ordinary skills are according to content of the present invention; and the embodiment that provides above; select decision according to the demand of reality, in every case based on the combination of several modes in the rights protection scope of the present invention and do not break away from that claim aim of the present invention changes all should be within protection scope of the present invention.
Claims (5)
1. gravity circulation evaporation cooling semiconductor power device encapsulation, it is characterized in that described semiconductor power device wrapper rubbing board shape metal mounting platform, the top integrated configuration tubular metal of described plate-shape metal mounting platform, constitute vaporization chamber with described plate-shape metal mounting platform, the semiconductor power device tube core is welded in the lower surface of described plate-shape metal mounting platform, the output that will draw by described mounting platform and semiconductor power device tube core with resin or plastics and control lead-in wire be fixed in encapsulation below.
2. gravity circulation evaporation cooling semiconductor power device encapsulation according to claim 1 is characterized in that the vaporization chamber of described device is made by the metal of good heat conductivity, preferably copper or copper alloy.
3. gravity circulation evaporation cooling semiconductor power device encapsulation according to claim 1 is characterized in that described tubular metal stretches out the upper surface of sealing material, and at upper end configuration hose coupling.
4. gravity circulation evaporation cooling semiconductor power device encapsulation, it is characterized in that described semiconductor power device encapsulation comprises a plurality of top integrated plate-shape metal mounting platforms that dispose tubular metal, the semiconductor power device tube core all is welded below each described metal mounting platform, all described tubular metal cavitys are connected by the seal channel of electric insulation, upper surface or top in encapsulation dispose the output channel that communicates with the peak of described seal channel, and the outer end of described output channel is furnished with flexible pipe or copper pipe joint.
5. gravity circulation evaporation cooling semiconductor power device encapsulation according to claim 4, it is characterized in that being furnished with the input channel that communicates with the minimum point of described seal channel, be used for liquid coolant and flow into, the outer end of described input channel is furnished with flexible pipe or copper pipe joint.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN 200910009142 CN101814469A (en) | 2009-02-20 | 2009-02-20 | Gravity circulation evaporation cooling semiconductor power device package |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200910009142 CN101814469A (en) | 2009-02-20 | 2009-02-20 | Gravity circulation evaporation cooling semiconductor power device package |
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| CN101814469A true CN101814469A (en) | 2010-08-25 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016047098A1 (en) * | 2014-09-26 | 2016-03-31 | 日本電気株式会社 | Refrigerant relay device, cooling device using same, and cooling method |
| WO2018164084A1 (en) * | 2017-03-08 | 2018-09-13 | Ｎｅｃプラットフォームズ株式会社 | Cooling device and gas-liquid separation tank |
| WO2018164085A1 (en) * | 2017-03-08 | 2018-09-13 | Ｎｅｃプラットフォームズ株式会社 | Cooling device and gas-liquid separation tank |
| JP6424936B1 (en) * | 2017-10-04 | 2018-11-21 | 日本電気株式会社 | Gas-liquid separation device, rear door, cooling device, and gas-liquid separation method |
| EP3364140A4 (en) * | 2015-10-15 | 2019-06-19 | NEC Platforms, Ltd. | Cooling device and cooling system |
| US11609035B2 (en) * | 2015-12-21 | 2023-03-21 | Nec Corporation | Refrigerant circulating apparatus and method of circulating refrigerant |
-
2009
- 2009-02-20 CN CN 200910009142 patent/CN101814469A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016047098A1 (en) * | 2014-09-26 | 2016-03-31 | 日本電気株式会社 | Refrigerant relay device, cooling device using same, and cooling method |
| CN107076522A (en) * | 2014-09-26 | 2017-08-18 | 日本电气株式会社 | Refrigerant middle device, the cooling device comprising refrigerant middle device and cooling means |
| US20170303432A1 (en) * | 2014-09-26 | 2017-10-19 | Nec Corporation | Refrigerant intermediary device, cooling device including the same, and cooling method |
| EP3199897A4 (en) * | 2014-09-26 | 2018-05-23 | Nec Corporation | Refrigerant relay device, cooling device using same, and cooling method |
| EP3364140A4 (en) * | 2015-10-15 | 2019-06-19 | NEC Platforms, Ltd. | Cooling device and cooling system |
| US11609035B2 (en) * | 2015-12-21 | 2023-03-21 | Nec Corporation | Refrigerant circulating apparatus and method of circulating refrigerant |
| WO2018164084A1 (en) * | 2017-03-08 | 2018-09-13 | Ｎｅｃプラットフォームズ株式会社 | Cooling device and gas-liquid separation tank |
| WO2018164085A1 (en) * | 2017-03-08 | 2018-09-13 | Ｎｅｃプラットフォームズ株式会社 | Cooling device and gas-liquid separation tank |
| JP6424936B1 (en) * | 2017-10-04 | 2018-11-21 | 日本電気株式会社 | Gas-liquid separation device, rear door, cooling device, and gas-liquid separation method |
| JP2019066136A (en) * | 2017-10-04 | 2019-04-25 | 日本電気株式会社 | Gas-liquid separation device, rear door, cooling device, and gas-liquid separation method |
| US10801786B2 (en) | 2017-10-04 | 2020-10-13 | Nec Corporation | Gas-liquid separation device, rear door, cooling device, and gas-liquid separating method |
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Application publication date: 20100825 |